KR100700983B1 - 기판조립체 제조방법 - Google Patents
기판조립체 제조방법 Download PDFInfo
- Publication number
- KR100700983B1 KR100700983B1 KR1020050060608A KR20050060608A KR100700983B1 KR 100700983 B1 KR100700983 B1 KR 100700983B1 KR 1020050060608 A KR1020050060608 A KR 1020050060608A KR 20050060608 A KR20050060608 A KR 20050060608A KR 100700983 B1 KR100700983 B1 KR 100700983B1
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- Prior art keywords
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- electronic component
- solder paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (10)
- 기판조립체 제조방법에 있어서,제1기판 상부면에 솔더페이스트를 도포하는 단계와;상기 솔더페이스트가 도포된 상기 제1기판 상부면에 전자부품을 배치하는 단계와;상기 전자부품의 상측 및 상기 제1기판 상부면에 볼그리드어레이 방식 및 칼럼그리드어레이(Column grid array) 방식 중 적어도 하나의 방식으로 제2기판을 배치하는 단계와;상기 솔더페이스트를 경화하는 단계를 갖는 것을 특징으로 하는 기판조립체 제조방법.
- 제1항에 있어서,상기 제1기판 상부면이 하측으로 향하도록 제1기판을 반전하는 단계와;상기 제1기판 하부면에 솔더페이스트를 도포하는 단계와;상기 솔더페이스트가 도포된 상기 제1기판 하부면에 전자부품을 배치하는 단계와;상기 전자부품의 상측 및 상기 제1기판의 하부면에 제3기판을 배치하는 단계와;상기 솔더페이스트를 경화하는 단계를 갖는 것을 특징으로 하는 기판조립체 제조방법.
- 제2항에 있어서,상기 제2기판 상부면에 솔더페이스트를 도포하는 단계와;상기 솔더페이스트가 도포된 제2기판 상부면에 전자부품을 배치하는 단계와; 상기 솔더페이스트를 경화하는 단계를 더 포함하는 것을 특징으로 하는 기판조립체 제조방법.
- 제3항에 있어서,상기 전자부품의 상측 및 상기 제2기판의 상부면에 제3기판을 배치하는 단계와;상기 솔더페이스트를 경화하는 단계를 더 포함하는 것을 특징으로 하는 기판조립체 제조방법.
- 제1항 내지 제3항 중 어느 한 항에 있어서,상기 전자부품은 플립칩, 각형칩, W-CSP(Wafer-level chip size package) 및 수동소자 중 하나 이상을 포함하는 것을 특징으로 하는 기판조립체 제조방법.
- 기판조립체제조방법에 있어서,제1기판의 상부면 일측에 솔더페이스트를 도포하는 단계와;상기 제1기판의 상부면 타측에 필름을 안착하는 단계와;상기 솔더페이스트가 도포된 상기 제1기판 상부면에 전자부품을 배치하는 단계와;상기 필름이 안착된 상기 제1기판 상부면에 전자부품을 배치하는 단계와;상기 제1기판의 상부면의 상기 필름에 안착된 전자제품과 상기 제1기판을 접합하는 단계와;상기 전자부품의 상측 및 상기 제1기판 상부면에 볼그리드어레이 방식 및 칼럼그리드어레이(Column grid array) 방식 중 적어도 하나의 방식으로 제2기판을 배치하는 단계와;상기 솔더페이스트를 경화하는 단계를 갖는 것을 특징으로 하는 기판조립체 제조방법.
- 제6항에 있어서,상기 제1기판 상부면이 하측으로 향하도록 제1기판을 반전하는 단계와;상기 제1기판 하부면에 솔더페이스트를 도포하는 단계와;상기 솔더페이스트가 도포된 상기 제1기판 하부면에 전자부품을 배치하는 단계와;상기 전자부품의 상측 및 상기 제1기판의 하부면에 제3기판을 배치하는 단계와;상기 솔더페이스트를 경화하는 단계를 갖는 것을 특징으로 하는 기판조립체 제조방법.
- 제7항에 있어서,상기 제2기판 상부면에 솔더페이스트를 도포하는 단계와;상기 솔더페이스트가 도포된 제2기판 상부면에 전자부품을 배치하는 단계와;상기 솔더페이스트를 경화하는 단계를 더 포함하는 것을 특징으로 하는 기판조립체 제조방법.
- 제8항에 있어서,상기 전자부품의 상측 및 상기 제2기판의 상부면에 제3기판을 배치하는 단계와;상기 솔더페이스트를 경화하는 단계를 더 포함하는 것을 특징으로 하는 기판조립체 제조방법.
- 제6항 내지 제8항 중 어느 한 항에 있어서,상기 필름이 안착된 상기 제1기판 및 상기 제2기판 중 적어도 하나의 상부면에 배치되는 상기 전자부품은 플립칩을 포함하며,상기 필름은 ACF 및 NCF 중 어느 하나인 것을 특징으로 하는 기판조립체 제조방법.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050060608A KR100700983B1 (ko) | 2005-07-06 | 2005-07-06 | 기판조립체 제조방법 |
US11/325,308 US20070007322A1 (en) | 2005-07-06 | 2006-01-05 | Board assembly apparatus having electronic components disposed in a space between circuit boards and a manufacturing method thereof |
CNA2006100724850A CN1893775A (zh) | 2005-07-06 | 2006-04-17 | 在电路板之间设置有电子元件的板组件装置及其制造方法 |
JP2006184741A JP2007019507A (ja) | 2005-07-06 | 2006-07-04 | 基板組立体製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050060608A KR100700983B1 (ko) | 2005-07-06 | 2005-07-06 | 기판조립체 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070005329A KR20070005329A (ko) | 2007-01-10 |
KR100700983B1 true KR100700983B1 (ko) | 2007-03-29 |
Family
ID=37598151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050060608A KR100700983B1 (ko) | 2005-07-06 | 2005-07-06 | 기판조립체 제조방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070007322A1 (ko) |
JP (1) | JP2007019507A (ko) |
KR (1) | KR100700983B1 (ko) |
CN (1) | CN1893775A (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10085680B2 (en) * | 2007-03-07 | 2018-10-02 | Becton, Dickinson And Company | Safety blood collection assembly with indicator |
KR101191075B1 (ko) * | 2011-06-15 | 2012-10-16 | (주)에프씨아이 | 에스아이피 구현을 위한 패키지 및 그 제조방법 |
KR102218895B1 (ko) | 2015-06-30 | 2021-02-23 | 삼성전기주식회사 | 리드프레임 및 이를 포함하는 적층 패키지 모듈 |
KR102117469B1 (ko) * | 2015-07-13 | 2020-06-01 | 삼성전기주식회사 | 전자 소자 모듈 및 그 제조 방법 |
US10348695B1 (en) * | 2016-05-26 | 2019-07-09 | VYRTY Corporation | Secure access to individual information |
DE102018215672A1 (de) * | 2018-09-14 | 2020-03-19 | Continental Automotive Gmbh | Verfahren zur Herstellung einer Leiterplattenanordnung und Leiterplattenanordnung |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07111378A (ja) * | 1993-10-12 | 1995-04-25 | Nippon Telegr & Teleph Corp <Ntt> | 両面実装基板の実装構造 |
JPH09214097A (ja) * | 1996-02-06 | 1997-08-15 | Toshiba Corp | プリント回路基板 |
JPH11103147A (ja) | 1997-09-26 | 1999-04-13 | Toshiba Corp | 回路モジュール及び回路モジュールを内蔵した電子機器 |
JPH11112121A (ja) | 1997-09-30 | 1999-04-23 | Toshiba Corp | 回路モジュール及び回路モジュールを内蔵した電子機器 |
KR20060074260A (ko) * | 2004-12-27 | 2006-07-03 | 삼성전자주식회사 | 휴대 단말기의 인쇄회로기판 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5715144A (en) * | 1994-12-30 | 1998-02-03 | International Business Machines Corporation | Multi-layer, multi-chip pyramid and circuit board structure |
US6735539B2 (en) * | 2001-10-31 | 2004-05-11 | Agilent Technologies, Inc. | Fourier transform for timestamped network data |
-
2005
- 2005-07-06 KR KR1020050060608A patent/KR100700983B1/ko active IP Right Grant
-
2006
- 2006-01-05 US US11/325,308 patent/US20070007322A1/en not_active Abandoned
- 2006-04-17 CN CNA2006100724850A patent/CN1893775A/zh active Pending
- 2006-07-04 JP JP2006184741A patent/JP2007019507A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07111378A (ja) * | 1993-10-12 | 1995-04-25 | Nippon Telegr & Teleph Corp <Ntt> | 両面実装基板の実装構造 |
JPH09214097A (ja) * | 1996-02-06 | 1997-08-15 | Toshiba Corp | プリント回路基板 |
JPH11103147A (ja) | 1997-09-26 | 1999-04-13 | Toshiba Corp | 回路モジュール及び回路モジュールを内蔵した電子機器 |
JPH11112121A (ja) | 1997-09-30 | 1999-04-23 | Toshiba Corp | 回路モジュール及び回路モジュールを内蔵した電子機器 |
KR20060074260A (ko) * | 2004-12-27 | 2006-07-03 | 삼성전자주식회사 | 휴대 단말기의 인쇄회로기판 |
Also Published As
Publication number | Publication date |
---|---|
KR20070005329A (ko) | 2007-01-10 |
US20070007322A1 (en) | 2007-01-11 |
CN1893775A (zh) | 2007-01-10 |
JP2007019507A (ja) | 2007-01-25 |
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