TW201806097A - 電子部件的製造裝置及其製造方法、以及電子部件 - Google Patents

電子部件的製造裝置及其製造方法、以及電子部件 Download PDF

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Publication number
TW201806097A
TW201806097A TW106103074A TW106103074A TW201806097A TW 201806097 A TW201806097 A TW 201806097A TW 106103074 A TW106103074 A TW 106103074A TW 106103074 A TW106103074 A TW 106103074A TW 201806097 A TW201806097 A TW 201806097A
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TW
Taiwan
Prior art keywords
component
porous metal
resin
substrate
wafer
Prior art date
Application number
TW106103074A
Other languages
English (en)
Chinese (zh)
Inventor
竹内慎
Original Assignee
東和股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東和股份有限公司 filed Critical 東和股份有限公司
Publication of TW201806097A publication Critical patent/TW201806097A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
TW106103074A 2016-02-02 2017-01-25 電子部件的製造裝置及其製造方法、以及電子部件 TW201806097A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-017681 2016-02-02
JP2016017681A JP6639931B2 (ja) 2016-02-02 2016-02-02 電子部品の製造装置及び製造方法並びに電子部品

Publications (1)

Publication Number Publication Date
TW201806097A true TW201806097A (zh) 2018-02-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106103074A TW201806097A (zh) 2016-02-02 2017-01-25 電子部件的製造裝置及其製造方法、以及電子部件

Country Status (4)

Country Link
JP (1) JP6639931B2 (https=)
KR (1) KR101920972B1 (https=)
CN (1) CN107026107B (https=)
TW (1) TW201806097A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111834238A (zh) * 2020-08-10 2020-10-27 李元雄 一种采用凸块与倒装的大功率半导体器件封装方法
TWI844243B (zh) * 2023-01-18 2024-06-01 宏碁股份有限公司 電子封裝結構
TWI864819B (zh) * 2023-06-13 2024-12-01 南茂科技股份有限公司 薄膜覆晶封裝結構
TWI918724B (zh) 2020-11-20 2026-03-21 日商瑞薩電子股份有限公司 半導體裝置及其製造方法

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CN208093541U (zh) * 2017-12-05 2018-11-13 合肥矽迈微电子科技有限公司 封装体
JP2019165173A (ja) * 2018-03-20 2019-09-26 株式会社東芝 半導体装置および半導体装置の製造方法
CN109326527B (zh) * 2018-09-27 2020-10-13 泉州智慧果技术服务有限公司 一种功率元件封装模块及其制备方法
US11037883B2 (en) * 2018-11-16 2021-06-15 Analog Devices International Unlimited Company Regulator circuit package techniques
KR102711765B1 (ko) * 2019-03-06 2024-09-27 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
WO2020188806A1 (ja) * 2019-03-20 2020-09-24 三菱電機株式会社 半導体装置
JP7192970B2 (ja) * 2019-04-15 2022-12-20 株式会社村田製作所 電子部品モジュール
KR102345062B1 (ko) * 2019-11-20 2021-12-30 (주)에이티세미콘 반도체 패키지 및 그 제조 방법
CN218730889U (zh) * 2020-03-06 2023-03-24 株式会社村田制作所 散热构造体以及电子设备
CN111952206B (zh) * 2020-08-14 2022-09-13 深圳市天成照明有限公司 一种电子元器件生产用封装装置
JP7428384B2 (ja) * 2020-10-06 2024-02-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
CN116802795A (zh) * 2021-01-19 2023-09-22 佐佐木贝慈 电子装置及产品
CN113299566B (zh) * 2021-05-20 2023-01-24 合肥速芯微电子有限责任公司 封装结构及其制备方法
CN114496808B (zh) * 2022-01-25 2024-03-12 河北博威集成电路有限公司 倒装式塑封的装配方法、屏蔽系统、散热系统及应用
JP7813591B2 (ja) * 2022-01-27 2026-02-13 ヤマハロボティクス株式会社 樹脂封止装置及び樹脂封止方法
CN114823370B (zh) * 2022-05-10 2022-10-14 山东汉旗科技有限公司 指纹识别芯片封装结构及其封装的方法
JP2024156325A (ja) * 2023-04-24 2024-11-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
CN117457618B (zh) * 2023-12-25 2024-04-09 长电集成电路(绍兴)有限公司 芯片封装结构及芯片封装方法

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Publication number Priority date Publication date Assignee Title
JP3434711B2 (ja) * 1998-09-24 2003-08-11 株式会社巴川製紙所 放熱シート
JP4253992B2 (ja) * 2000-03-16 2009-04-15 株式会社デンソー 樹脂封止型半導体装置
JP4630449B2 (ja) * 2000-11-16 2011-02-09 Ｔｏｗａ株式会社 半導体装置及びその製造方法
CN101587887A (zh) * 2008-05-23 2009-11-25 富准精密工业(深圳)有限公司 发光二极管结构
JP5740995B2 (ja) * 2011-01-17 2015-07-01 富士通株式会社 半導体装置及びその製造方法
JP6169516B2 (ja) * 2014-03-31 2017-07-26 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6017492B2 (ja) * 2014-04-24 2016-11-02 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法、突起電極付き板状部材、及び樹脂封止電子部品
JP6298719B2 (ja) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP5944445B2 (ja) * 2014-07-18 2016-07-05 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法、突起電極付き板状部材、樹脂封止電子部品、及び突起電極付き板状部材の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111834238A (zh) * 2020-08-10 2020-10-27 李元雄 一种采用凸块与倒装的大功率半导体器件封装方法
TWI918724B (zh) 2020-11-20 2026-03-21 日商瑞薩電子股份有限公司 半導體裝置及其製造方法
TWI844243B (zh) * 2023-01-18 2024-06-01 宏碁股份有限公司 電子封裝結構
TWI864819B (zh) * 2023-06-13 2024-12-01 南茂科技股份有限公司 薄膜覆晶封裝結構

Also Published As

Publication number Publication date
CN107026107A (zh) 2017-08-08
KR101920972B1 (ko) 2018-11-21
KR20170092096A (ko) 2017-08-10
CN107026107B (zh) 2020-08-18
JP2017139278A (ja) 2017-08-10
JP6639931B2 (ja) 2020-02-05

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