KR101867625B1 - 반도체 제조 장치용 부재 - Google Patents

반도체 제조 장치용 부재 Download PDF

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Publication number
KR101867625B1
KR101867625B1 KR1020120026997A KR20120026997A KR101867625B1 KR 101867625 B1 KR101867625 B1 KR 101867625B1 KR 1020120026997 A KR1020120026997 A KR 1020120026997A KR 20120026997 A KR20120026997 A KR 20120026997A KR 101867625 B1 KR101867625 B1 KR 101867625B1
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bonding
power supply
supply member
layer
thermal expansion
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Korean (ko)
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KR20120112036A (ko
Inventor
마사히로 기다
도루 하야세
유지 가츠다
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엔지케이 인슐레이터 엘티디
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ceramic Products (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020120026997A 2011-03-31 2012-03-16 반도체 제조 장치용 부재 Active KR101867625B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011079462 2011-03-31
JPJP-P-2011-079462 2011-03-31

Publications (2)

Publication Number Publication Date
KR20120112036A KR20120112036A (ko) 2012-10-11
KR101867625B1 true KR101867625B1 (ko) 2018-06-15

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ID=46926976

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KR1020120026997A Active KR101867625B1 (ko) 2011-03-31 2012-03-16 반도체 제조 장치용 부재

Country Status (5)

Country Link
US (1) US8908349B2 (enExample)
JP (1) JP5968651B2 (enExample)
KR (1) KR101867625B1 (enExample)
CN (1) CN102738044B (enExample)
TW (1) TWI539551B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8908349B2 (en) * 2011-03-31 2014-12-09 Ngk Insulators, Ltd. Member for semiconductor manufacturing apparatus
JP6084915B2 (ja) * 2012-11-06 2017-02-22 日本碍子株式会社 セラミックス部材と金属部材との接合体及びその製法
JP6234076B2 (ja) * 2013-06-17 2017-11-22 株式会社Maruwa 接合構造体及びこれを用いた半導体製造装置
KR101773749B1 (ko) * 2015-01-20 2017-08-31 엔지케이 인슐레이터 엘티디 샤프트 단부 부착 구조
JP6666717B2 (ja) * 2015-12-28 2020-03-18 日本特殊陶業株式会社 セラミックス部材
JP6560150B2 (ja) * 2016-03-28 2019-08-14 日本碍子株式会社 ウエハ載置装置
JP6693832B2 (ja) * 2016-07-29 2020-05-13 日本特殊陶業株式会社 セラミックス部材
JP6698476B2 (ja) * 2016-08-30 2020-05-27 京セラ株式会社 静電吸着用部材
JP2018139255A (ja) * 2017-02-24 2018-09-06 京セラ株式会社 試料保持具およびこれを用いたプラズマエッチング装置用部品
JP2018203581A (ja) * 2017-06-07 2018-12-27 日本特殊陶業株式会社 セラミックス構造体
JP6871184B2 (ja) * 2018-01-31 2021-05-12 日機装株式会社 半導体発光装置の製造方法
JPWO2020004564A1 (ja) 2018-06-28 2021-07-15 京セラ株式会社 半導体製造装置用部材の製造方法および半導体製造装置用部材
US10957520B2 (en) * 2018-09-20 2021-03-23 Lam Research Corporation Long-life high-power terminals for substrate support with embedded heating elements
WO2020196339A1 (ja) * 2019-03-26 2020-10-01 日本特殊陶業株式会社 電極埋設部材及びその製造方法、静電チャック、セラミックス製ヒーター
EP3992170A4 (en) * 2019-06-26 2023-07-26 Mitsubishi Materials Corporation COPPER/CERAMIC ASSEMBLY BODY, ISOLATION PRINTED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR MAKING ISOLATION PRINTED CIRCUIT BOARD
KR102735423B1 (ko) * 2019-10-18 2024-11-28 교세라 가부시키가이샤 구조체 및 가열 장치
CN216982138U (zh) * 2020-09-08 2022-07-15 苏州珂玛材料科技股份有限公司 陶瓷加热盘引出电极的结构
US12300474B2 (en) * 2020-10-15 2025-05-13 Applied Materials, Inc. Semiconductor substrate support power transmission components
KR102642090B1 (ko) * 2021-08-24 2024-02-29 주식회사 케이엔제이 지지 소켓 및 증착층을 포함하는 부품 제조 방법
CN118339644B (zh) 2021-12-08 2025-03-25 美科陶瓷科技有限公司 基座
JP7623309B2 (ja) 2022-01-12 2025-01-28 日本碍子株式会社 ウエハ載置台
JP7749475B2 (ja) * 2022-01-28 2025-10-06 京セラ株式会社 接合体、締結用部品、碍子および電流導入端子
CN114513869B (zh) * 2022-02-23 2024-03-29 常州联德陶业有限公司 一种氮化铝陶瓷器件用接线端子及其固定工艺
JP7634493B2 (ja) * 2022-03-03 2025-02-21 日本碍子株式会社 給電部材及びウエハ載置台
KR102619089B1 (ko) * 2022-10-31 2023-12-29 주식회사 미코세라믹스 세라믹 서셉터
KR20250037695A (ko) 2023-09-04 2025-03-18 엔지케이 인슐레이터 엘티디 웨이퍼 적재대

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057468A (ja) * 1999-08-18 2001-02-27 Hitachi Ltd はんだ接続構造を有する回路装置およびその製造方法
JP2001237304A (ja) * 2000-02-21 2001-08-31 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
JP2003212670A (ja) * 2002-01-25 2003-07-30 Ngk Insulators Ltd 異種材料の接合体及びその製造方法
JP2004259805A (ja) * 2003-02-25 2004-09-16 Kyocera Corp 静電チャック

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5707715A (en) * 1996-08-29 1998-01-13 L. Pierre deRochemont Metal ceramic composites with improved interfacial properties and methods to make such composites
US6143432A (en) * 1998-01-09 2000-11-07 L. Pierre deRochemont Ceramic composites with improved interfacial properties and methods to make such composites
JP3746594B2 (ja) * 1997-06-20 2006-02-15 日本碍子株式会社 セラミックスの接合構造およびその製造方法
US6439975B1 (en) * 2000-01-28 2002-08-27 Hon Hai Precision Ind. Co., Ltd. Method for forming contact of electrical connector and press die for practicing the method
EP1178705A4 (en) * 2000-02-07 2009-05-06 Ifire Ip Corp SUBSTRATE COMPOSITE AND ELECTROLUMINESCENT ELEMENT THEREOF COMPRISING
JP2002293655A (ja) 2001-03-29 2002-10-09 Ngk Insulators Ltd 金属端子とセラミック部材との接合構造、金属部材とセラミック部材との接合構造および金属端子とセラミック部材との接合材
US7252872B2 (en) * 2003-01-29 2007-08-07 Ngk Insulators, Ltd. Joined structures of ceramics
JP4967447B2 (ja) * 2006-05-17 2012-07-04 株式会社日立製作所 パワー半導体モジュール
US7816155B2 (en) * 2007-07-06 2010-10-19 Jds Uniphase Corporation Mounted semiconductor device and a method for making the same
JP5174582B2 (ja) 2007-08-30 2013-04-03 日本碍子株式会社 接合構造体
TWI450353B (zh) * 2008-01-08 2014-08-21 Ngk Insulators Ltd A bonding structure and a semiconductor manufacturing apparatus
JP2010263050A (ja) * 2009-05-01 2010-11-18 Showa Denko Kk 発光ダイオード及びその製造方法、並びに発光ダイオードランプ
US8908349B2 (en) * 2011-03-31 2014-12-09 Ngk Insulators, Ltd. Member for semiconductor manufacturing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057468A (ja) * 1999-08-18 2001-02-27 Hitachi Ltd はんだ接続構造を有する回路装置およびその製造方法
JP2001237304A (ja) * 2000-02-21 2001-08-31 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
JP2003212670A (ja) * 2002-01-25 2003-07-30 Ngk Insulators Ltd 異種材料の接合体及びその製造方法
JP2004259805A (ja) * 2003-02-25 2004-09-16 Kyocera Corp 静電チャック

Also Published As

Publication number Publication date
CN102738044B (zh) 2016-04-06
TW201240014A (en) 2012-10-01
CN102738044A (zh) 2012-10-17
KR20120112036A (ko) 2012-10-11
TWI539551B (zh) 2016-06-21
JP2012216786A (ja) 2012-11-08
US8908349B2 (en) 2014-12-09
US20120250211A1 (en) 2012-10-04
JP5968651B2 (ja) 2016-08-10

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