KR101802736B1 - 가교결합성 실리콘 조성물 및 그의 가교결합 생성물 - Google Patents

가교결합성 실리콘 조성물 및 그의 가교결합 생성물 Download PDF

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KR101802736B1
KR101802736B1 KR1020137032621A KR20137032621A KR101802736B1 KR 101802736 B1 KR101802736 B1 KR 101802736B1 KR 1020137032621 A KR1020137032621 A KR 1020137032621A KR 20137032621 A KR20137032621 A KR 20137032621A KR 101802736 B1 KR101802736 B1 KR 101802736B1
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component
group
sio
silicon
hardness
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KR20140043744A (ko
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마코토 요시타케
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020137032621A 2011-06-16 2012-06-07 가교결합성 실리콘 조성물 및 그의 가교결합 생성물 Active KR101802736B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2011-134124 2011-06-16
JP2011134124A JP5992666B2 (ja) 2011-06-16 2011-06-16 架橋性シリコーン組成物及びその架橋物
PCT/JP2012/065181 WO2012173167A1 (en) 2011-06-16 2012-06-07 Cross-linkable silicone composition and cross-linked product thereof

Publications (2)

Publication Number Publication Date
KR20140043744A KR20140043744A (ko) 2014-04-10
KR101802736B1 true KR101802736B1 (ko) 2017-12-28

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US (1) US8895678B2 (enExample)
EP (1) EP2721108B1 (enExample)
JP (1) JP5992666B2 (enExample)
KR (1) KR101802736B1 (enExample)
CN (1) CN103582679B (enExample)
TW (1) TWI557181B (enExample)
WO (1) WO2012173167A1 (enExample)

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JP2013139547A (ja) * 2011-12-05 2013-07-18 Jsr Corp 硬化性組成物、硬化物および光半導体装置
US9536799B2 (en) 2012-12-21 2017-01-03 Dow Corning Corporation Hot-melt type curable silicone composition for compression molding or laminating
KR20150097947A (ko) * 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
KR20170016889A (ko) * 2014-06-04 2017-02-14 다우 코닝 코포레이션 광학 디바이스를 위한 핫-멜트형 경화성 실리콘 조성물의 임프린팅 공정
EP3159369B1 (en) * 2014-06-20 2024-10-30 Dow Toray Co., Ltd. Silicone exhibiting hot-melt properties, and curable hot-melt composition
KR102419245B1 (ko) * 2014-09-01 2022-07-11 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 실리콘 조성물, 경화성 핫 멜트 실리콘, 및 광 디바이스
CN109790385B (zh) * 2016-09-30 2021-09-21 日产化学株式会社 交联性有机聚硅氧烷组合物、其固化物及led装置
US10865328B2 (en) 2017-02-20 2020-12-15 Dow Silicones Corporation Room-temperature-curable silicone composition and electric/electronic apparatus
JP2019131734A (ja) * 2018-02-01 2019-08-08 信越化学工業株式会社 ２液付加反応硬化型放熱シリコーン組成物及びその製造方法
TWI794401B (zh) 2018-03-21 2023-03-01 美商陶氏有機矽公司 可室溫固化有機聚矽氧烷組成物及電氣/電子設備
JP2021021038A (ja) * 2019-07-30 2021-02-18 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、光半導体装置、および光半導体装置の製造方法
CN112300576B (zh) 2019-07-30 2024-05-14 杜邦东丽特殊材料株式会社 热熔性固化性有机硅组合物、密封剂、膜以及光半导体元件
JP7584838B2 (ja) 2020-11-26 2024-11-18 デュポン・東レ・スペシャルティ・マテリアル株式会社 ホットメルト性シリコーン組成物、封止剤、ホットメルト接着剤、及び光半導体装置
JP2024128602A (ja) 2023-03-10 2024-09-24 デュポン・東レ・スペシャルティ・マテリアル株式会社 ホットメルト性硬化性シリコーン組成物、封止材、ホットメルト接着剤、及び光半導体装置

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JP2010001336A (ja) 2008-06-18 2010-01-07 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物及び半導体装置

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JP2010001336A (ja) 2008-06-18 2010-01-07 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物及び半導体装置

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CN103582679B (zh) 2015-08-12
US8895678B2 (en) 2014-11-25
KR20140043744A (ko) 2014-04-10
EP2721108B1 (en) 2017-02-22
EP2721108A1 (en) 2014-04-23
CN103582679A (zh) 2014-02-12
JP5992666B2 (ja) 2016-09-14
WO2012173167A1 (en) 2012-12-20
TWI557181B (zh) 2016-11-11
JP2013001794A (ja) 2013-01-07
US20140221581A1 (en) 2014-08-07
TW201307480A (zh) 2013-02-16

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