CN103582679B - 可交联有机硅组合物及其交联产物 - Google Patents

可交联有机硅组合物及其交联产物 Download PDF

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Publication number
CN103582679B
CN103582679B CN201280027383.0A CN201280027383A CN103582679B CN 103582679 B CN103582679 B CN 103582679B CN 201280027383 A CN201280027383 A CN 201280027383A CN 103582679 B CN103582679 B CN 103582679B
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carbon atoms
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CN103582679A (zh
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吉武诚
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201280027383.0A 2011-06-16 2012-06-07 可交联有机硅组合物及其交联产物 Active CN103582679B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011134124A JP5992666B2 (ja) 2011-06-16 2011-06-16 架橋性シリコーン組成物及びその架橋物
JP2011-134124 2011-06-16
PCT/JP2012/065181 WO2012173167A1 (en) 2011-06-16 2012-06-07 Cross-linkable silicone composition and cross-linked product thereof

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CN103582679A CN103582679A (zh) 2014-02-12
CN103582679B true CN103582679B (zh) 2015-08-12

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US (1) US8895678B2 (enExample)
EP (1) EP2721108B1 (enExample)
JP (1) JP5992666B2 (enExample)
KR (1) KR101802736B1 (enExample)
CN (1) CN103582679B (enExample)
TW (1) TWI557181B (enExample)
WO (1) WO2012173167A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013139547A (ja) * 2011-12-05 2013-07-18 Jsr Corp 硬化性組成物、硬化物および光半導体装置
EP2935494B1 (en) * 2012-12-21 2019-05-29 Dow Silicones Corporation Hot-melt type curable silicone composition for compression molding or laminating
KR20150097947A (ko) * 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
TW201609350A (zh) * 2014-06-04 2016-03-16 道康寧東麗股份有限公司 光學裝置用熱熔型可固化聚矽氧組合物之壓印方法
KR102370815B1 (ko) * 2014-06-20 2022-03-08 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 핫 멜트성 실리콘 및 경화성 핫 멜트 조성물
KR102419245B1 (ko) * 2014-09-01 2022-07-11 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 실리콘 조성물, 경화성 핫 멜트 실리콘, 및 광 디바이스
KR102404430B1 (ko) * 2016-09-30 2022-06-02 닛산 가가쿠 가부시키가이샤 가교성 오가노폴리실록산 조성물, 그의 경화물 및 led 장치
EP3583155B1 (en) * 2017-02-20 2024-05-08 Dow Silicones Corporation Room-temperature-curable silicone composition and electric/electronic apparatus
JP2019131734A (ja) * 2018-02-01 2019-08-08 信越化学工業株式会社 ２液付加反応硬化型放熱シリコーン組成物及びその製造方法
TWI794401B (zh) 2018-03-21 2023-03-01 美商陶氏有機矽公司 可室溫固化有機聚矽氧烷組成物及電氣/電子設備
JP2021021038A (ja) 2019-07-30 2021-02-18 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、光半導体装置、および光半導体装置の製造方法
CN112300576B (zh) 2019-07-30 2024-05-14 杜邦东丽特殊材料株式会社 热熔性固化性有机硅组合物、密封剂、膜以及光半导体元件
JP7584838B2 (ja) 2020-11-26 2024-11-18 デュポン・東レ・スペシャルティ・マテリアル株式会社 ホットメルト性シリコーン組成物、封止剤、ホットメルト接着剤、及び光半導体装置
JP2024128602A (ja) 2023-03-10 2024-09-24 デュポン・東レ・スペシャルティ・マテリアル株式会社 ホットメルト性硬化性シリコーン組成物、封止材、ホットメルト接着剤、及び光半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102066492A (zh) * 2008-06-18 2011-05-18 道康宁东丽株式会社 可固化的有机基聚硅氧烷组合物和半导体器件

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3732330A (en) * 1972-03-08 1973-05-08 Dow Corning Curable compositions containing hydrogen-functional organopolysiloxanes
US4198131A (en) * 1978-03-23 1980-04-15 Dow Corning Corporation Silicone resin optical devices
JP3899134B2 (ja) * 1993-12-29 2007-03-28 東レ・ダウコーニング株式会社 加熱硬化性シリコーン組成物
JP4009067B2 (ja) * 2001-03-06 2007-11-14 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
US7160972B2 (en) * 2003-02-19 2007-01-09 Nusil Technology Llc Optically clear high temperature resistant silicone polymers of high refractive index
JP2005162859A (ja) * 2003-12-02 2005-06-23 Dow Corning Toray Silicone Co Ltd 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材
JP4801320B2 (ja) * 2003-12-19 2011-10-26 東レ・ダウコーニング株式会社 付加反応硬化型オルガノポリシロキサン樹脂組成物
EP1749860A4 (en) * 2004-05-14 2009-12-23 Dow Corning Toray Co Ltd FREE FILMS MANUFACTURED FROM ORGANOPOLYSILOXANE RESINS, THEIR PRODUCTION PROCESS AND LAMINATED FILMS
JP4647941B2 (ja) * 2004-06-23 2011-03-09 東レ・ダウコーニング株式会社 シリコーンレジンとシリコーンゴムの一体化成形体、その製造方法および硬化性シリコーンレジン組成物
JP4800383B2 (ja) * 2005-05-26 2011-10-26 ダウ・コーニング・コーポレイション 小さい形状を成形するための方法およびシリコーン封止剤組成物
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
CN101389695B (zh) * 2006-02-24 2012-07-04 陶氏康宁公司 用硅氧烷包封的发光器件和用于制备该硅氧烷的可固化的硅氧烷组合物
JP5060074B2 (ja) * 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP5202822B2 (ja) * 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
WO2008020605A1 (en) * 2006-08-14 2008-02-21 Dow Corning Toray Co., Ltd. Silicone rubber composition for coating of woven fabric, and coated woven fabric
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5972512B2 (ja) * 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5469874B2 (ja) * 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
JP2011134124A (ja) 2009-12-24 2011-07-07 Sharp Corp 電子会議システム
JP5413979B2 (ja) * 2010-06-22 2014-02-12 信越化学工業株式会社 画像用シリコーン樹脂レンズ及びその製造方法
JP5170471B2 (ja) * 2010-09-02 2013-03-27 信越化学工業株式会社 低ガス透過性シリコーン樹脂組成物及び光半導体装置
JP5524017B2 (ja) * 2010-10-08 2014-06-18 信越化学工業株式会社 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置
JP5522111B2 (ja) * 2011-04-08 2014-06-18 信越化学工業株式会社 シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
JP5287935B2 (ja) * 2011-06-16 2013-09-11 東レ株式会社 蛍光体含有シート、それを用いたｌｅｄ発光装置およびその製造方法
JP5912600B2 (ja) * 2011-09-16 2016-04-27 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP2013139547A (ja) * 2011-12-05 2013-07-18 Jsr Corp 硬化性組成物、硬化物および光半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102066492A (zh) * 2008-06-18 2011-05-18 道康宁东丽株式会社 可固化的有机基聚硅氧烷组合物和半导体器件

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WO2012173167A1 (en) 2012-12-20
KR20140043744A (ko) 2014-04-10
EP2721108A1 (en) 2014-04-23
KR101802736B1 (ko) 2017-12-28
EP2721108B1 (en) 2017-02-22
US20140221581A1 (en) 2014-08-07
JP2013001794A (ja) 2013-01-07
TWI557181B (zh) 2016-11-11
CN103582679A (zh) 2014-02-12
US8895678B2 (en) 2014-11-25
JP5992666B2 (ja) 2016-09-14
TW201307480A (zh) 2013-02-16

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