KR101783081B1 - 임프린트 장치, 임프린트 방법, 검출 방법 그리고 디바이스를 제조하는 방법 - Google Patents

임프린트 장치, 임프린트 방법, 검출 방법 그리고 디바이스를 제조하는 방법 Download PDF

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KR101783081B1
KR101783081B1 KR1020140120855A KR20140120855A KR101783081B1 KR 101783081 B1 KR101783081 B1 KR 101783081B1 KR 1020140120855 A KR1020140120855 A KR 1020140120855A KR 20140120855 A KR20140120855 A KR 20140120855A KR 101783081 B1 KR101783081 B1 KR 101783081B1
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mold
substrate
pattern
imprint material
contact
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KR20150031202A (ko
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히로시 사토
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7065—Production of alignment light, e.g. light source, control of coherence, polarization, pulse length, wavelength
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J9/00—Measuring optical phase difference; Determining degree of coherence; Measuring optical wavelength
    • G01J9/02—Measuring optical phase difference; Determining degree of coherence; Measuring optical wavelength by interferometric methods
    • G01J2009/0234—Measurement of the fringe pattern

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020140120855A 2013-09-13 2014-09-12 임프린트 장치, 임프린트 방법, 검출 방법 그리고 디바이스를 제조하는 방법 Active KR101783081B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013190477A JP6282069B2 (ja) 2013-09-13 2013-09-13 インプリント装置、インプリント方法、検出方法及びデバイス製造方法
JPJP-P-2013-190477 2013-09-13

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KR1020170121858A Division KR101879549B1 (ko) 2013-09-13 2017-09-21 임프린트 장치, 임프린트 방법, 검출 방법 그리고 디바이스를 제조하는 방법

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KR20150031202A KR20150031202A (ko) 2015-03-23
KR101783081B1 true KR101783081B1 (ko) 2017-09-28

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KR1020140120855A Active KR101783081B1 (ko) 2013-09-13 2014-09-12 임프린트 장치, 임프린트 방법, 검출 방법 그리고 디바이스를 제조하는 방법
KR1020170121858A Active KR101879549B1 (ko) 2013-09-13 2017-09-21 임프린트 장치, 임프린트 방법, 검출 방법 그리고 디바이스를 제조하는 방법

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US (2) US10042249B2 (https=)
JP (1) JP6282069B2 (https=)
KR (2) KR101783081B1 (https=)
TW (1) TWI625219B (https=)

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JP6472189B2 (ja) * 2014-08-14 2019-02-20 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6674218B2 (ja) * 2014-12-09 2020-04-01 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
US10747106B2 (en) * 2014-12-09 2020-08-18 Canon Kabushiki Kaisha Imprint apparatus
US10248018B2 (en) * 2015-03-30 2019-04-02 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
JP6553926B2 (ja) * 2015-04-09 2019-07-31 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6403627B2 (ja) * 2015-04-14 2018-10-10 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6562707B2 (ja) * 2015-05-13 2019-08-21 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP2016225542A (ja) 2015-06-02 2016-12-28 キヤノン株式会社 インプリント装置、インプリント方法、および、物品の製造方法
US10386737B2 (en) 2015-06-10 2019-08-20 Canon Kabushiki Kaisha Imprint apparatus and method for producing article
JP6282298B2 (ja) * 2015-06-10 2018-02-21 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
US10642171B2 (en) 2015-06-10 2020-05-05 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and method for producing article
JP6799397B2 (ja) * 2015-08-10 2020-12-16 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6541518B2 (ja) * 2015-09-04 2019-07-10 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6643022B2 (ja) * 2015-09-28 2020-02-12 キヤノン株式会社 インプリント装置、インプリント方法、異物検出方法および物品製造方法
JP2017152673A (ja) * 2015-11-05 2017-08-31 ボード・オブ・リージェンツ， ジ・ユニバーシティー・オブ・テキサス・システム ジェット・アンド・フラッシュ・インプリントリソグラフィにおけるマルチフィールドオーバーレイ制御
JP6655988B2 (ja) * 2015-12-25 2020-03-04 キヤノン株式会社 インプリント装置の調整方法、インプリント方法および物品製造方法
JP6942491B2 (ja) * 2016-03-15 2021-09-29 キヤノン株式会社 インプリント装置、および物品の製造方法
WO2018056995A1 (en) * 2016-09-23 2018-03-29 Hewlett-Packard Development Company, L.P. Fluid ejection device and particle detector
US11454883B2 (en) 2016-11-14 2022-09-27 Canon Kabushiki Kaisha Template replication
JP6978859B2 (ja) * 2017-06-15 2021-12-08 キヤノン株式会社 インプリント装置、および物品の製造方法
US11175598B2 (en) * 2017-06-30 2021-11-16 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
JP7043199B2 (ja) * 2017-08-03 2022-03-29 キヤノン株式会社 インプリント方法、プログラム、インプリント装置及び物品の製造方法
JP7015147B2 (ja) * 2017-11-06 2022-02-02 キヤノン株式会社 インプリント装置および物品製造方法
JP7022615B2 (ja) * 2018-02-26 2022-02-18 キヤノン株式会社 インプリント方法、インプリント装置、モールドの製造方法、および、物品の製造方法
JP7262939B2 (ja) 2018-07-20 2023-04-24 キヤノン株式会社 クリーニング装置、インプリント装置、リソグラフィ装置、および、クリーニング方法
JP7225030B2 (ja) * 2019-05-31 2023-02-20 キヤノン株式会社 インプリント方法、及び、物品の製造方法
JP7041699B2 (ja) * 2020-01-31 2022-03-24 キヤノン株式会社 インプリント装置の情報出力方法、インプリント装置、情報出力方法および装置
JP7433949B2 (ja) * 2020-02-06 2024-02-20 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP7401396B2 (ja) * 2020-06-04 2023-12-19 キヤノン株式会社 インプリント装置、物品の製造方法、及びインプリント装置のための測定方法
US20220197134A1 (en) * 2020-12-23 2022-06-23 Canon Kabushiki Kaisha System and Method of Determining Shaping Parameters Based on Contact Line Motion
US11614693B2 (en) * 2021-06-30 2023-03-28 Canon Kabushiki Kaisha Method of determining the initial contact point for partial fields and method of shaping a surface
JP7361831B2 (ja) * 2021-07-30 2023-10-16 キヤノン株式会社 情報処理装置、成形装置、成形方法及び物品の製造方法
TWI906524B (zh) * 2021-07-30 2025-12-01 日商佳能股份有限公司 資訊處理設備、成型設備、成型方法及物品製造方法
JP7721736B1 (ja) 2024-05-14 2025-08-12 キヤノン株式会社 平坦化装置、平坦化方法、および物品の製造方法

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Also Published As

Publication number Publication date
KR20170115010A (ko) 2017-10-16
JP2015056589A (ja) 2015-03-23
TW201518068A (zh) 2015-05-16
TWI625219B (zh) 2018-06-01
KR101879549B1 (ko) 2018-07-17
JP6282069B2 (ja) 2018-02-21
US20180292748A1 (en) 2018-10-11
US10303050B2 (en) 2019-05-28
KR20150031202A (ko) 2015-03-23
US10042249B2 (en) 2018-08-07
US20150076724A1 (en) 2015-03-19

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