KR101728100B1 - 기공을 갖는 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름 - Google Patents

기공을 갖는 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름 Download PDF

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KR101728100B1
KR101728100B1 KR1020150010092A KR20150010092A KR101728100B1 KR 101728100 B1 KR101728100 B1 KR 101728100B1 KR 1020150010092 A KR1020150010092 A KR 1020150010092A KR 20150010092 A KR20150010092 A KR 20150010092A KR 101728100 B1 KR101728100 B1 KR 101728100B1
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South Korea
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particles
pores
polyimide film
film
polyimide
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KR1020150010092A
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Korean (ko)
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KR20160090153A (ko
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조성일
이길남
김성원
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에스케이씨코오롱피아이 주식회사
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Priority to KR1020150010092A priority Critical patent/KR101728100B1/ko
Priority to JP2017536848A priority patent/JP6865687B2/ja
Priority to PCT/KR2016/000131 priority patent/WO2016117856A1/ko
Priority to CN201680004928.4A priority patent/CN107108926B/zh
Priority to TW105101245A priority patent/TWI593726B/zh
Publication of KR20160090153A publication Critical patent/KR20160090153A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/50—Physical properties
    • C08G2261/65—Electrical insulator
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020150010092A 2015-01-21 2015-01-21 기공을 갖는 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름 KR101728100B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020150010092A KR101728100B1 (ko) 2015-01-21 2015-01-21 기공을 갖는 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름
JP2017536848A JP6865687B2 (ja) 2015-01-21 2016-01-07 気孔を有する粒子を用いたポリイミドフィルムの製造方法および低誘電率のポリイミドフィルム
PCT/KR2016/000131 WO2016117856A1 (ko) 2015-01-21 2016-01-07 기공을 갖는 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름
CN201680004928.4A CN107108926B (zh) 2015-01-21 2016-01-07 利用具有气孔的粒子的聚酰亚胺膜的制备方法及低介电常数的聚酰亚胺膜
TW105101245A TWI593726B (zh) 2015-01-21 2016-01-15 用於使用多孔質粒子來製備聚醯亞胺之方法及具有低介電常數之聚醯亞胺膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150010092A KR101728100B1 (ko) 2015-01-21 2015-01-21 기공을 갖는 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름

Publications (2)

Publication Number Publication Date
KR20160090153A KR20160090153A (ko) 2016-07-29
KR101728100B1 true KR101728100B1 (ko) 2017-04-18

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KR1020150010092A KR101728100B1 (ko) 2015-01-21 2015-01-21 기공을 갖는 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름

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JP (1) JP6865687B2 (zh)
KR (1) KR101728100B1 (zh)
CN (1) CN107108926B (zh)
TW (1) TWI593726B (zh)
WO (1) WO2016117856A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200025674A (ko) 2018-08-31 2020-03-10 한국자동차연구원 나노 실리케이트 입자를 이용한 저유전률 폴리이미드 필름 및 그 제조 방법
KR20210131703A (ko) 2020-04-24 2021-11-03 연세대학교 원주산학협력단 고내상 에멀젼을 이용한 저유전율의 폴리이미드 필름 및 이의 제조방법

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WO2018044085A1 (ko) * 2016-09-01 2018-03-08 에스케이씨코오롱피아이 주식회사 절연성능을 갖는 고방열 그래핀-폴리이미드 복합필름 및 이의 제조방법
KR102019928B1 (ko) * 2016-09-01 2019-09-11 에스케이씨코오롱피아이 주식회사 절연성능을 갖는 고방열 그래핀-폴리이미드 복합필름 및 이의 제조방법
KR101851752B1 (ko) * 2016-10-21 2018-04-24 에스케이씨 주식회사 그라파이트 시트의 제조방법
KR20190025072A (ko) * 2017-08-02 2019-03-11 에스케이씨코오롱피아이 주식회사 흄드 실리카 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름
KR102416346B1 (ko) * 2017-11-08 2022-07-06 한국전자통신연구원 신축성 폴리이미드 기판 및 그 제조방법
CN108079803B (zh) * 2017-11-21 2024-05-31 浙江科赛新材料科技有限公司 一种聚四氟乙烯微孔膜
KR102160552B1 (ko) * 2018-02-28 2020-09-28 최영준 절연막 형성 방법 및 절연막 제조장치
KR102164458B1 (ko) * 2018-05-18 2020-10-13 피아이첨단소재 주식회사 저유전율 및 저흡습성을 가지는 폴리이미드 필름 및 그 제조방법
WO2021261607A1 (ko) 2020-06-23 2021-12-30 엘지전자 주식회사 폴리이미드 및 이의 제조방법
KR102688950B1 (ko) * 2020-07-10 2024-07-26 코오롱인더스트리 주식회사 우수한 필러 분산성을 갖는 폴리이미드계 필름 및 이를 포함하는 표시장치
WO2022010298A1 (ko) * 2020-07-10 2022-01-13 코오롱인더스트리 주식회사 우수한 필러 분산성을 갖는 폴리이미드계 필름 및 이를 포함하는 표시장치
CN112266260B (zh) * 2020-10-21 2022-11-15 安徽国风新材料股份有限公司 一种聚酰亚胺石墨膜的制备方法
KR102495220B1 (ko) 2020-11-27 2023-02-07 전북대학교산학협력단 밀리미터파 대역용 저유전 고방열 액정고분자 조성물 및 이의 제조방법
KR102306950B1 (ko) 2021-02-05 2021-09-29 최유경 폴리이미드 필름, 이의 제조방법 및 이를 포함하는 연성인쇄회로기판
CN113248773B (zh) * 2021-05-17 2022-07-08 上海瑞暨新材料科技有限公司 一种聚酰亚胺多孔膜及其制备方法
KR102550250B1 (ko) * 2022-12-02 2023-06-30 (주)상아프론테크 고속통신용 저유전 필름 및 이를 포함하는 동박적층판

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200025674A (ko) 2018-08-31 2020-03-10 한국자동차연구원 나노 실리케이트 입자를 이용한 저유전률 폴리이미드 필름 및 그 제조 방법
KR20210131703A (ko) 2020-04-24 2021-11-03 연세대학교 원주산학협력단 고내상 에멀젼을 이용한 저유전율의 폴리이미드 필름 및 이의 제조방법

Also Published As

Publication number Publication date
CN107108926A (zh) 2017-08-29
KR20160090153A (ko) 2016-07-29
TW201634540A (zh) 2016-10-01
TWI593726B (zh) 2017-08-01
CN107108926B (zh) 2021-05-07
WO2016117856A1 (ko) 2016-07-28
JP2018502964A (ja) 2018-02-01
JP6865687B2 (ja) 2021-04-28

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