JP6082761B2 - 黒色ポリイミドフィルム - Google Patents
黒色ポリイミドフィルム Download PDFInfo
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- JP6082761B2 JP6082761B2 JP2014560840A JP2014560840A JP6082761B2 JP 6082761 B2 JP6082761 B2 JP 6082761B2 JP 2014560840 A JP2014560840 A JP 2014560840A JP 2014560840 A JP2014560840 A JP 2014560840A JP 6082761 B2 JP6082761 B2 JP 6082761B2
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- 229920001721 polyimide Polymers 0.000 title claims description 47
- 239000006229 carbon black Substances 0.000 claims description 38
- 239000003795 chemical substances by application Substances 0.000 claims description 33
- 229920005575 poly(amic acid) Polymers 0.000 claims description 18
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 12
- 150000004985 diamines Chemical class 0.000 claims description 11
- 239000009719 polyimide resin Substances 0.000 claims description 10
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 239000011164 primary particle Substances 0.000 claims description 7
- 238000002834 transmittance Methods 0.000 claims description 7
- 238000007334 copolymerization reaction Methods 0.000 claims description 5
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 3
- 239000004615 ingredient Substances 0.000 claims 1
- 150000004986 phenylenediamines Chemical group 0.000 claims 1
- 239000000243 solution Substances 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 11
- 239000003054 catalyst Substances 0.000 description 9
- 230000015556 catabolic process Effects 0.000 description 8
- 238000012216 screening Methods 0.000 description 8
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000003851 corona treatment Methods 0.000 description 4
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 4
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229940018564 m-phenylenediamine Drugs 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000003880 polar aprotic solvent Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- ILYSAKHOYBPSPC-UHFFFAOYSA-N 2-phenylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C1=CC=CC=C1 ILYSAKHOYBPSPC-UHFFFAOYSA-N 0.000 description 1
- HWZGZWSHHNWSBP-UHFFFAOYSA-N 3-(2,3-diaminophenoxy)benzene-1,2-diamine Chemical compound NC1=CC=CC(OC=2C(=C(N)C=CC=2)N)=C1N HWZGZWSHHNWSBP-UHFFFAOYSA-N 0.000 description 1
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 1
- FJVIHKKXPLPDSV-UHFFFAOYSA-N 4-phenoxybenzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1OC1=CC=CC=C1 FJVIHKKXPLPDSV-UHFFFAOYSA-N 0.000 description 1
- ABQAWYPFZVJRGM-UHFFFAOYSA-N 4-phenoxybenzene-1,3-diamine Chemical compound NC1=CC(N)=CC=C1OC1=CC=CC=C1 ABQAWYPFZVJRGM-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 241000233805 Phoenix Species 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
(a)ポリイミド樹脂;
(b)高温揮発性成分を1.5重量%以下で有し、かつ表面が酸化処理されていないカーボンブラック3.0〜7.5重量%;および
(c)遮蔽剤0.5〜1.5重量%;
を含む黒色ポリイミドフィルムであって、
前記ポリイミド樹脂が、酸二無水物およびジアミンの共重合により製造されたポリアミック酸のイミド化により製造され、
前記フィルムが、可視光線範囲で1.0%以下の光学透過率を有し、60%以下の光沢度、80%以上の伸び率、1015Ω以上の表面抵抗率、および1/100m2以下のピンホール発生率を有するフィルムが提供される。
表1に示す成分の組成に従って、黒色ポリイミドフィルムを製造した。
フィルムがカーボンブラック5.5重量%および遮蔽剤1.2重量%を有したことを除いて実施例1を繰り返し、黒色ポリイミドフィルムを製造した。
フィルムがカーボンブラック6.5重量%および遮蔽剤0.8重量%を有したことを除いて実施例1を繰り返し、黒色ポリイミドフィルムを製造した。
フィルムが遮蔽剤を有さなかったことを除いて実施例1を繰り返し、黒色ポリイミドフィルムを製造した。
フィルムがカーボンブラック8.0重量%を有したことを除いて実施例1を繰り返し、黒色ポリイミドフィルムを製造した。
カーボンブラックとしてMA220(一次粒子径55nmおよび体積平均径520nm、三菱)を使用したことを除いて実施例1を繰り返し、黒色ポリイミドフィルムを製造した。
フィルムが遮蔽剤4重量%を有したことを除いて実施例1を繰り返し、黒色ポリイミドフィルムを製造した。
インストロン(Instron)3365SER測定器を用いてASTM D−882に従い、フィルムの伸び率を測定した。
幅および高さ:15mm×50mm
クロスヘッド速度:200mm/分
ハンター・ラボ(Hunter Lab)CQX3391を用い、透過モードで、フィルムの光学透過率を測定した。
光沢度計を用い、60°にて、フィルムの光沢度を測定した。
測定器:光沢度計
モデル:E406L
製造元:エルコメーター
実施例1〜3および比較例1〜4で製造された黒色ポリイミドフィルムを、コロナ密度250の条件下、コロナ放電ローラ(CT1234、大阪カツラ)を用いたコロナ処理に供した。コロナ処理の後、フィルムを伸び率測定について試験した。コロナ処理の前後でのフィルムの伸び率の差を以下の式Iに従って算出した。
欠陥検出器(ウィントリス)を備えた巻き取り機に0.6m幅のフィルムを1,000m走行させることにより、フィルム100m2あたりのピンホール発生率を測定した。
高抵抗計(4339B、アジレント・テクノロジーズ)を用い、500Vの下で、フィルムの表面抵抗率を測定した。
破壊電圧試験装置(6CC250−5/D149、フェニックス・テクノロジーズ)を用い、ASTM D149に従って、コロナ処理されたフィルムの破壊電圧を測定した。
Claims (3)
- 以下の成分:
(a)ポリイミド樹脂;
(b)高温揮発性成分を1.5重量%以下で有し、かつ表面が酸化処理されていないカーボンブラック3.0〜7.5重量%;および
(c)遮蔽剤0.5〜1.5重量%;
を含む黒色ポリイミドフィルムであって、
前記ポリイミド樹脂が、酸二無水物およびジアミンの共重合により製造されたポリアミック酸のイミド化により製造され、
前記カーボンブラックが、2μm以下の体積平均径、10μm以下の最大径および70〜150nmの一次粒子径を有し、
前記遮蔽剤が0.2〜0.6μmの体積平均径を有し、
前記フィルムが、可視光線範囲で1.0%以下の光学透過率を有し、60%以下の光沢度、80%以上の伸び率、1015Ω以上の表面抵抗率、および1/100m2以下のピンホール発生率を有するフィルム。 - 前記遮蔽剤がTiO2である請求項1に記載の黒色ポリイミドフィルム。
- 前記ジアミンが、フェニレンジアミン、ジアミノジフェニルエーテル、またはそれらの誘導体である請求項1に記載の黒色ポリイミドフィルム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0036253 | 2012-04-06 | ||
KR1020120036253A KR20130113778A (ko) | 2012-04-06 | 2012-04-06 | 블랙 폴리이미드 필름 |
PCT/KR2012/007228 WO2013151215A1 (en) | 2012-04-06 | 2012-09-07 | Black polyimide film |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015509551A JP2015509551A (ja) | 2015-03-30 |
JP6082761B2 true JP6082761B2 (ja) | 2017-02-15 |
Family
ID=49300680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014560840A Active JP6082761B2 (ja) | 2012-04-06 | 2012-09-07 | 黒色ポリイミドフィルム |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6082761B2 (ja) |
KR (1) | KR20130113778A (ja) |
CN (1) | CN104169330B (ja) |
TW (1) | TWI454513B (ja) |
WO (1) | WO2013151215A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014141575A (ja) * | 2013-01-23 | 2014-08-07 | Kaneka Corp | 顔料添加ポリイミドフィルム |
CN105385159A (zh) * | 2015-12-25 | 2016-03-09 | 桂林电器科学研究院有限公司 | 一种黑色亚光聚酰亚胺薄膜及其制备方法 |
CN105566906A (zh) * | 2016-03-18 | 2016-05-11 | 江苏亚宝绝缘材料股份有限公司 | 一种黑色导电聚酰亚胺薄膜 |
KR101908684B1 (ko) * | 2017-05-30 | 2018-10-16 | 에스케이씨코오롱피아이 주식회사 | 초박막 블랙 폴리이미드 필름 및 그 제조방법 |
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