KR101679905B1 - 연마 장치 - Google Patents

연마 장치 Download PDF

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Publication number
KR101679905B1
KR101679905B1 KR1020140010362A KR20140010362A KR101679905B1 KR 101679905 B1 KR101679905 B1 KR 101679905B1 KR 1020140010362 A KR1020140010362 A KR 1020140010362A KR 20140010362 A KR20140010362 A KR 20140010362A KR 101679905 B1 KR101679905 B1 KR 101679905B1
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KR
South Korea
Prior art keywords
polishing
head cover
polishing head
cleaning liquid
top ring
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KR1020140010362A
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English (en)
Korean (ko)
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KR20140098696A (ko
Inventor
마사오 우메모토
다다카즈 소네
류이치 고스게
히데오 아이자와
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20140098696A publication Critical patent/KR20140098696A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020140010362A 2013-01-31 2014-01-28 연마 장치 Active KR101679905B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013017193A JP5927129B2 (ja) 2013-01-31 2013-01-31 研磨装置
JPJP-P-2013-017193 2013-01-31

Publications (2)

Publication Number Publication Date
KR20140098696A KR20140098696A (ko) 2014-08-08
KR101679905B1 true KR101679905B1 (ko) 2016-11-25

Family

ID=51223441

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140010362A Active KR101679905B1 (ko) 2013-01-31 2014-01-28 연마 장치

Country Status (5)

Country Link
US (1) US9174324B2 (enExample)
JP (1) JP5927129B2 (enExample)
KR (1) KR101679905B1 (enExample)
CN (1) CN103962938B (enExample)
TW (1) TWI543844B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201503374QA (en) 2014-04-30 2015-11-27 Ebara Corp Substrate Polishing Apparatus
JP2016055398A (ja) * 2014-09-11 2016-04-21 株式会社荏原製作所 バフ処理モジュール、基板処理装置、及び、バフパッド洗浄方法
WO2016077272A2 (en) * 2014-11-12 2016-05-19 Illinois Tool Works Inc. Planar grinder
CN107000158B (zh) 2014-12-19 2020-11-06 应用材料公司 用于化学机械抛光工具的部件
TWI547348B (zh) * 2015-08-31 2016-09-01 力晶科技股份有限公司 化學機械研磨裝置與方法
KR102214510B1 (ko) * 2016-01-18 2021-02-09 삼성전자 주식회사 기판 씨닝 장치, 이를 이용한 기판의 씨닝 방법, 및 반도체 패키지의 제조 방법
JP6758066B2 (ja) * 2016-03-31 2020-09-23 株式会社荏原製作所 研磨装置
CN108621033B (zh) * 2017-03-21 2020-04-07 中芯国际集成电路制造(上海)有限公司 研磨垫的研磨方法
JP7098238B2 (ja) * 2018-08-10 2022-07-11 株式会社ディスコ 光デバイスウェーハの加工方法
CN109159020B (zh) * 2018-10-26 2021-05-11 长江存储科技有限责任公司 研磨装置
CN110125794A (zh) * 2019-06-25 2019-08-16 吉姆西半导体科技（无锡）有限公司 晶圆平坦化设备
CN110170916A (zh) * 2019-06-25 2019-08-27 吉姆西半导体科技（无锡）有限公司 晶圆平坦化设备研磨头旋转机构
TWI695741B (zh) * 2019-10-01 2020-06-11 力晶積成電子製造股份有限公司 研磨後清潔裝置
US11484987B2 (en) 2020-03-09 2022-11-01 Applied Materials, Inc. Maintenance methods for polishing systems and articles related thereto
US12240078B2 (en) 2020-06-24 2025-03-04 Applied Materials, Inc. Cleaning system for polishing liquid delivery arm
US11823916B2 (en) * 2020-11-06 2023-11-21 Applied Materials, Inc. Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning
CN114888722B (zh) * 2022-05-17 2024-11-22 华海清科股份有限公司 一种化学机械抛光方法
CN115922557B (zh) * 2023-03-09 2023-07-25 长鑫存储技术有限公司 一种抛光组件及抛光设备
CN117245542B (zh) * 2023-11-17 2024-01-23 苏州博宏源机械制造有限公司 晶圆双面抛光设备及工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000326208A (ja) * 1999-05-17 2000-11-28 Ebara Corp ポリッシング装置
JP2001053040A (ja) * 1999-08-09 2001-02-23 Matsushita Electric Ind Co Ltd 研磨装置および研磨方法
JP2003145389A (ja) * 2001-11-09 2003-05-20 Tokyo Seimitsu Co Ltd 切削装置
JP2007190614A (ja) * 2006-01-17 2007-08-02 Matsushita Electric Ind Co Ltd 研磨装置および研磨方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6206760B1 (en) * 1999-01-28 2001-03-27 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for preventing particle contamination in a polishing machine
KR100546288B1 (ko) * 1999-04-10 2006-01-26 삼성전자주식회사 화학 기계적 폴리싱 장치
KR100304706B1 (ko) * 1999-06-16 2001-11-01 윤종용 화학기계적 연마장치 및 연마 헤드 내부의 오염 물질 세척방법
JP4131898B2 (ja) * 2000-08-21 2008-08-13 三菱電機株式会社 半導体製造装置及びその製造方法
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
JP2003332274A (ja) * 2002-05-17 2003-11-21 Tokyo Seimitsu Co Ltd 化学的機械研磨方法及び化学的機械研磨装置
CN105904335B (zh) * 2004-11-01 2019-04-30 株式会社荏原制作所 抛光设备
JP2006229100A (ja) * 2005-02-21 2006-08-31 Seiko Epson Corp 研磨装置および半導体装置の製造方法
US7052376B1 (en) * 2005-05-26 2006-05-30 United Microelectronics Corp. Wafer carrier gap washer
JP2007245266A (ja) 2006-03-14 2007-09-27 Daikin Ind Ltd Ｃｍｐ装置
JP2008296293A (ja) 2007-05-29 2008-12-11 Tokyo Seimitsu Co Ltd 研磨部のチャンバ内洗浄装置および洗浄方法
CN101362313B (zh) * 2007-08-09 2010-11-10 中芯国际集成电路制造(上海)有限公司 化学机械研磨设备及化学机械研磨方法
JP2009231450A (ja) * 2008-03-21 2009-10-08 Fujitsu Microelectronics Ltd 研磨装置及び半導体装置の製造方法
WO2009120641A2 (en) * 2008-03-25 2009-10-01 Applied Materials, Inc. Improved carrier head membrane
CN201483358U (zh) * 2009-08-26 2010-05-26 中芯国际集成电路制造(上海)有限公司 用于研磨垫调整装置的机械臂
JP2012055979A (ja) * 2010-09-06 2012-03-22 Seiko Epson Corp 研磨装置
JP5628067B2 (ja) * 2011-02-25 2014-11-19 株式会社荏原製作所 研磨パッドの温度調整機構を備えた研磨装置
TWI577497B (zh) * 2012-10-31 2017-04-11 Ebara Corp Grinding device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000326208A (ja) * 1999-05-17 2000-11-28 Ebara Corp ポリッシング装置
JP2001053040A (ja) * 1999-08-09 2001-02-23 Matsushita Electric Ind Co Ltd 研磨装置および研磨方法
JP2003145389A (ja) * 2001-11-09 2003-05-20 Tokyo Seimitsu Co Ltd 切削装置
JP2007190614A (ja) * 2006-01-17 2007-08-02 Matsushita Electric Ind Co Ltd 研磨装置および研磨方法

Also Published As

Publication number Publication date
CN103962938B (zh) 2016-09-28
JP5927129B2 (ja) 2016-05-25
JP2014147990A (ja) 2014-08-21
TWI543844B (zh) 2016-08-01
CN103962938A (zh) 2014-08-06
KR20140098696A (ko) 2014-08-08
US20140213158A1 (en) 2014-07-31
US9174324B2 (en) 2015-11-03
TW201436947A (zh) 2014-10-01

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