TWI543844B - 研磨裝置 - Google Patents
研磨裝置 Download PDFInfo
- Publication number
- TWI543844B TWI543844B TW103103081A TW103103081A TWI543844B TW I543844 B TWI543844 B TW I543844B TW 103103081 A TW103103081 A TW 103103081A TW 103103081 A TW103103081 A TW 103103081A TW I543844 B TWI543844 B TW I543844B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- head cover
- cleaning liquid
- polishing head
- top ring
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims description 210
- 239000007788 liquid Substances 0.000 claims description 170
- 238000004140 cleaning Methods 0.000 claims description 164
- 238000000227 grinding Methods 0.000 claims description 57
- 239000011248 coating agent Substances 0.000 claims description 32
- 238000000576 coating method Methods 0.000 claims description 32
- 239000012530 fluid Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 12
- 230000000630 rising effect Effects 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000005871 repellent Substances 0.000 claims description 4
- 230000001174 ascending effect Effects 0.000 claims description 2
- 230000002940 repellent Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 description 73
- 239000002245 particle Substances 0.000 description 7
- 238000009966 trimming Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 101100495256 Caenorhabditis elegans mat-3 gene Proteins 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009837 dry grinding Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- -1 sulfhydryl organic compound Chemical class 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013017193A JP5927129B2 (ja) | 2013-01-31 | 2013-01-31 | 研磨装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201436947A TW201436947A (zh) | 2014-10-01 |
| TWI543844B true TWI543844B (zh) | 2016-08-01 |
Family
ID=51223441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103103081A TWI543844B (zh) | 2013-01-31 | 2014-01-28 | 研磨裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9174324B2 (enExample) |
| JP (1) | JP5927129B2 (enExample) |
| KR (1) | KR101679905B1 (enExample) |
| CN (1) | CN103962938B (enExample) |
| TW (1) | TWI543844B (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG10201503374QA (en) | 2014-04-30 | 2015-11-27 | Ebara Corp | Substrate Polishing Apparatus |
| JP2016055398A (ja) * | 2014-09-11 | 2016-04-21 | 株式会社荏原製作所 | バフ処理モジュール、基板処理装置、及び、バフパッド洗浄方法 |
| US20180136094A1 (en) * | 2014-11-12 | 2018-05-17 | Illinois Tool Works Inc. | Planar grinder |
| KR102862874B1 (ko) * | 2014-12-19 | 2025-09-19 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 기계적 폴리싱 툴을 위한 컴포넌트들 |
| TWI547348B (zh) * | 2015-08-31 | 2016-09-01 | 力晶科技股份有限公司 | 化學機械研磨裝置與方法 |
| KR102214510B1 (ko) * | 2016-01-18 | 2021-02-09 | 삼성전자 주식회사 | 기판 씨닝 장치, 이를 이용한 기판의 씨닝 방법, 및 반도체 패키지의 제조 방법 |
| JP6758066B2 (ja) * | 2016-03-31 | 2020-09-23 | 株式会社荏原製作所 | 研磨装置 |
| CN108621033B (zh) * | 2017-03-21 | 2020-04-07 | 中芯国际集成电路制造(上海)有限公司 | 研磨垫的研磨方法 |
| JP7098238B2 (ja) * | 2018-08-10 | 2022-07-11 | 株式会社ディスコ | 光デバイスウェーハの加工方法 |
| CN109159020B (zh) * | 2018-10-26 | 2021-05-11 | 长江存储科技有限责任公司 | 研磨装置 |
| CN110125794A (zh) * | 2019-06-25 | 2019-08-16 | 吉姆西半导体科技（无锡）有限公司 | 晶圆平坦化设备 |
| CN110170916A (zh) * | 2019-06-25 | 2019-08-27 | 吉姆西半导体科技（无锡）有限公司 | 晶圆平坦化设备研磨头旋转机构 |
| TWI695741B (zh) * | 2019-10-01 | 2020-06-11 | 力晶積成電子製造股份有限公司 | 研磨後清潔裝置 |
| US11484987B2 (en) | 2020-03-09 | 2022-11-01 | Applied Materials, Inc. | Maintenance methods for polishing systems and articles related thereto |
| US12240078B2 (en) | 2020-06-24 | 2025-03-04 | Applied Materials, Inc. | Cleaning system for polishing liquid delivery arm |
| US11823916B2 (en) * | 2020-11-06 | 2023-11-21 | Applied Materials, Inc. | Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning |
| CN114888722B (zh) * | 2022-05-17 | 2024-11-22 | 华海清科股份有限公司 | 一种化学机械抛光方法 |
| CN115922557B (zh) * | 2023-03-09 | 2023-07-25 | 长鑫存储技术有限公司 | 一种抛光组件及抛光设备 |
| CN117245542B (zh) * | 2023-11-17 | 2024-01-23 | 苏州博宏源机械制造有限公司 | 晶圆双面抛光设备及工艺 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6206760B1 (en) * | 1999-01-28 | 2001-03-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for preventing particle contamination in a polishing machine |
| KR100546288B1 (ko) * | 1999-04-10 | 2006-01-26 | 삼성전자주식회사 | 화학 기계적 폴리싱 장치 |
| JP2000326208A (ja) * | 1999-05-17 | 2000-11-28 | Ebara Corp | ポリッシング装置 |
| KR100304706B1 (ko) * | 1999-06-16 | 2001-11-01 | 윤종용 | 화학기계적 연마장치 및 연마 헤드 내부의 오염 물질 세척방법 |
| JP2001053040A (ja) * | 1999-08-09 | 2001-02-23 | Matsushita Electric Ind Co Ltd | 研磨装置および研磨方法 |
| JP4131898B2 (ja) * | 2000-08-21 | 2008-08-13 | 三菱電機株式会社 | 半導体製造装置及びその製造方法 |
| JP2003145389A (ja) * | 2001-11-09 | 2003-05-20 | Tokyo Seimitsu Co Ltd | 切削装置 |
| JP4197103B2 (ja) * | 2002-04-15 | 2008-12-17 | 株式会社荏原製作所 | ポリッシング装置 |
| JP2003332274A (ja) * | 2002-05-17 | 2003-11-21 | Tokyo Seimitsu Co Ltd | 化学的機械研磨方法及び化学的機械研磨装置 |
| EP2797109B1 (en) * | 2004-11-01 | 2018-02-28 | Ebara Corporation | Polishing apparatus |
| JP2006229100A (ja) * | 2005-02-21 | 2006-08-31 | Seiko Epson Corp | 研磨装置および半導体装置の製造方法 |
| US7052376B1 (en) * | 2005-05-26 | 2006-05-30 | United Microelectronics Corp. | Wafer carrier gap washer |
| JP2007190614A (ja) * | 2006-01-17 | 2007-08-02 | Matsushita Electric Ind Co Ltd | 研磨装置および研磨方法 |
| JP2007245266A (ja) | 2006-03-14 | 2007-09-27 | Daikin Ind Ltd | Ｃｍｐ装置 |
| JP2008296293A (ja) | 2007-05-29 | 2008-12-11 | Tokyo Seimitsu Co Ltd | 研磨部のチャンバ内洗浄装置および洗浄方法 |
| CN101362313B (zh) * | 2007-08-09 | 2010-11-10 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨设备及化学机械研磨方法 |
| JP2009231450A (ja) * | 2008-03-21 | 2009-10-08 | Fujitsu Microelectronics Ltd | 研磨装置及び半導体装置の製造方法 |
| CN103252711B (zh) * | 2008-03-25 | 2016-06-29 | 应用材料公司 | 改良的承载头薄膜 |
| CN201483358U (zh) * | 2009-08-26 | 2010-05-26 | 中芯国际集成电路制造(上海)有限公司 | 用于研磨垫调整装置的机械臂 |
| JP2012055979A (ja) * | 2010-09-06 | 2012-03-22 | Seiko Epson Corp | 研磨装置 |
| JP5628067B2 (ja) * | 2011-02-25 | 2014-11-19 | 株式会社荏原製作所 | 研磨パッドの温度調整機構を備えた研磨装置 |
| KR101689428B1 (ko) * | 2012-10-31 | 2016-12-23 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 장치 및 연마 방법 |
-
2013
- 2013-01-31 JP JP2013017193A patent/JP5927129B2/ja active Active
-
2014
- 2014-01-28 TW TW103103081A patent/TWI543844B/zh active
- 2014-01-28 KR KR1020140010362A patent/KR101679905B1/ko active Active
- 2014-01-29 US US14/167,941 patent/US9174324B2/en active Active
- 2014-01-29 CN CN201410043742.2A patent/CN103962938B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US9174324B2 (en) | 2015-11-03 |
| CN103962938B (zh) | 2016-09-28 |
| KR101679905B1 (ko) | 2016-11-25 |
| TW201436947A (zh) | 2014-10-01 |
| JP5927129B2 (ja) | 2016-05-25 |
| US20140213158A1 (en) | 2014-07-31 |
| JP2014147990A (ja) | 2014-08-21 |
| KR20140098696A (ko) | 2014-08-08 |
| CN103962938A (zh) | 2014-08-06 |
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