CN106312780B - 抛光设备 - Google Patents
抛光设备 Download PDFInfo
- Publication number
- CN106312780B CN106312780B CN201610859516.0A CN201610859516A CN106312780B CN 106312780 B CN106312780 B CN 106312780B CN 201610859516 A CN201610859516 A CN 201610859516A CN 106312780 B CN106312780 B CN 106312780B
- Authority
- CN
- China
- Prior art keywords
- hole
- water
- polishing pad
- spray plate
- water spray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Abstract
Description
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610859516.0A CN106312780B (zh) | 2016-09-28 | 2016-09-28 | 抛光设备 |
PCT/CN2017/096492 WO2018059132A1 (zh) | 2016-09-28 | 2017-08-08 | 抛光设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610859516.0A CN106312780B (zh) | 2016-09-28 | 2016-09-28 | 抛光设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106312780A CN106312780A (zh) | 2017-01-11 |
CN106312780B true CN106312780B (zh) | 2019-04-02 |
Family
ID=57820333
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610859516.0A Active CN106312780B (zh) | 2016-09-28 | 2016-09-28 | 抛光设备 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN106312780B (zh) |
WO (1) | WO2018059132A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106312780B (zh) * | 2016-09-28 | 2019-04-02 | 清华大学 | 抛光设备 |
CN108145610A (zh) * | 2017-12-28 | 2018-06-12 | 上海华力微电子有限公司 | 研磨液分配臂及其化学机械研磨方法 |
CN108301477A (zh) * | 2018-04-23 | 2018-07-20 | 株洲麦格米特电气有限责任公司 | 一种局部大面积清洗的智能马桶喷嘴结构及使用该喷嘴结构的智能马桶 |
CN109904094B (zh) * | 2019-01-17 | 2021-02-19 | 安徽华顺半导体发展有限公司 | 一种多晶硅铸锭硅片清洗设备 |
KR20220073192A (ko) * | 2020-11-26 | 2022-06-03 | 에스케이실트론 주식회사 | 연마 패드 세정 장치 및 연마 장치 |
CN113977458B (zh) * | 2021-11-25 | 2022-12-02 | 中国计量科学研究院 | 抛光液注入装置及抛光系统 |
CN115070605A (zh) * | 2022-06-22 | 2022-09-20 | 北京烁科精微电子装备有限公司 | 一种抛光设备及其工作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102229101A (zh) * | 2011-06-28 | 2011-11-02 | 清华大学 | 化学机械抛光方法 |
CN102553849A (zh) * | 2010-12-29 | 2012-07-11 | 中芯国际集成电路制造(上海)有限公司 | 一种固定研磨粒抛光垫清洗装置及清洗方法 |
CN103878668A (zh) * | 2012-12-20 | 2014-06-25 | 上海华虹宏力半导体制造有限公司 | 一种用于化学机械抛光设备的清洗装置 |
CN104810310A (zh) * | 2015-04-28 | 2015-07-29 | 中国电子科技集团公司第四十五研究所 | 一种晶圆扫描清洗摆臂装置 |
CN105500181A (zh) * | 2014-10-10 | 2016-04-20 | 株式会社荏原制作所 | 抛光处理装置、基板处理装置及抛光处理方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8920214B2 (en) * | 2011-07-12 | 2014-12-30 | Chien-Min Sung | Dual dressing system for CMP pads and associated methods |
JP5932330B2 (ja) * | 2011-12-28 | 2016-06-08 | 株式会社荏原製作所 | 液飛散防止カップ及び該カップを備えた基板処理装置 |
CN102688862A (zh) * | 2012-06-11 | 2012-09-26 | 上海宏力半导体制造有限公司 | 研磨垫清洗用高压去离子水喷射装置及化学机械研磨设备 |
CN204075983U (zh) * | 2014-08-08 | 2015-01-07 | 上海华力微电子有限公司 | 化学机械研磨机台 |
CN106312780B (zh) * | 2016-09-28 | 2019-04-02 | 清华大学 | 抛光设备 |
-
2016
- 2016-09-28 CN CN201610859516.0A patent/CN106312780B/zh active Active
-
2017
- 2017-08-08 WO PCT/CN2017/096492 patent/WO2018059132A1/zh active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102553849A (zh) * | 2010-12-29 | 2012-07-11 | 中芯国际集成电路制造(上海)有限公司 | 一种固定研磨粒抛光垫清洗装置及清洗方法 |
CN102229101A (zh) * | 2011-06-28 | 2011-11-02 | 清华大学 | 化学机械抛光方法 |
CN103878668A (zh) * | 2012-12-20 | 2014-06-25 | 上海华虹宏力半导体制造有限公司 | 一种用于化学机械抛光设备的清洗装置 |
CN105500181A (zh) * | 2014-10-10 | 2016-04-20 | 株式会社荏原制作所 | 抛光处理装置、基板处理装置及抛光处理方法 |
CN104810310A (zh) * | 2015-04-28 | 2015-07-29 | 中国电子科技集团公司第四十五研究所 | 一种晶圆扫描清洗摆臂装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2018059132A1 (zh) | 2018-04-05 |
CN106312780A (zh) | 2017-01-11 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 100084 Beijing City, Haidian District Tsinghua Yuan Applicant after: Tsinghua University Applicant after: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Applicant before: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Applicant before: Tsinghua University |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100084 Beijing City, Haidian District Tsinghua Yuan Co-patentee after: Huahaiqingke Co.,Ltd. Patentee after: TSINGHUA University Address before: 100084 Beijing City, Haidian District Tsinghua Yuan Co-patentee before: TSINGHUA University Patentee before: TSINGHUA University |
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CP01 | Change in the name or title of a patent holder |