KR101672157B1 - 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 - Google Patents
검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 Download PDFInfo
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- KR101672157B1 KR101672157B1 KR1020157030359A KR20157030359A KR101672157B1 KR 101672157 B1 KR101672157 B1 KR 101672157B1 KR 1020157030359 A KR1020157030359 A KR 1020157030359A KR 20157030359 A KR20157030359 A KR 20157030359A KR 101672157 B1 KR101672157 B1 KR 101672157B1
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- 238000013461 design Methods 0.000 title claims abstract description 1547
- 238000000034 method Methods 0.000 title claims abstract description 1436
- 238000007689 inspection Methods 0.000 title claims abstract description 955
- 230000007547 defect Effects 0.000 claims description 1979
- 230000008569 process Effects 0.000 claims description 455
- 238000012552 review Methods 0.000 claims description 190
- 238000001514 detection method Methods 0.000 claims description 69
- 230000035945 sensitivity Effects 0.000 claims description 54
- 230000003287 optical effect Effects 0.000 claims description 51
- 238000003384 imaging method Methods 0.000 claims description 29
- 238000010894 electron beam technology Methods 0.000 claims description 24
- 238000012545 processing Methods 0.000 claims description 23
- 230000009466 transformation Effects 0.000 claims description 9
- 238000012634 optical imaging Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 827
- 230000015654 memory Effects 0.000 description 210
- 230000009897 systematic effect Effects 0.000 description 208
- 238000012360 testing method Methods 0.000 description 203
- 230000000875 corresponding effect Effects 0.000 description 122
- 239000010410 layer Substances 0.000 description 94
- 230000008439 repair process Effects 0.000 description 69
- 238000004458 analytical method Methods 0.000 description 63
- 238000003860 storage Methods 0.000 description 49
- 238000013507 mapping Methods 0.000 description 48
- 238000012544 monitoring process Methods 0.000 description 48
- 238000005070 sampling Methods 0.000 description 41
- 238000005259 measurement Methods 0.000 description 39
- 238000004519 manufacturing process Methods 0.000 description 37
- 230000002950 deficient Effects 0.000 description 34
- 230000006870 function Effects 0.000 description 33
- 239000004065 semiconductor Substances 0.000 description 32
- 238000013459 approach Methods 0.000 description 23
- 238000010586 diagram Methods 0.000 description 23
- 238000012913 prioritisation Methods 0.000 description 23
- 230000008859 change Effects 0.000 description 22
- 238000003070 Statistical process control Methods 0.000 description 21
- 238000004088 simulation Methods 0.000 description 21
- 238000004422 calculation algorithm Methods 0.000 description 20
- 239000000523 sample Substances 0.000 description 20
- 238000011960 computer-aided design Methods 0.000 description 18
- 238000012937 correction Methods 0.000 description 18
- 230000002596 correlated effect Effects 0.000 description 18
- 230000008901 benefit Effects 0.000 description 16
- 239000011159 matrix material Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 14
- 230000006835 compression Effects 0.000 description 13
- 238000007906 compression Methods 0.000 description 13
- 230000001965 increasing effect Effects 0.000 description 13
- 238000005457 optimization Methods 0.000 description 13
- 238000001459 lithography Methods 0.000 description 12
- 239000013598 vector Substances 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 11
- 230000002829 reductive effect Effects 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 9
- 230000006399 behavior Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 238000001914 filtration Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000009877 rendering Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 7
- 230000006872 improvement Effects 0.000 description 7
- 238000000926 separation method Methods 0.000 description 7
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 6
- 230000001186 cumulative effect Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 238000012805 post-processing Methods 0.000 description 5
- 230000009885 systemic effect Effects 0.000 description 5
- 238000012795 verification Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000001878 scanning electron micrograph Methods 0.000 description 4
- 238000012549 training Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000007418 data mining Methods 0.000 description 3
- 230000008713 feedback mechanism Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 238000004886 process control Methods 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 238000013519 translation Methods 0.000 description 3
- 244000046052 Phaseolus vulgaris Species 0.000 description 2
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 2
- 238000000441 X-ray spectroscopy Methods 0.000 description 2
- INQLNSVYIFCUML-QZTLEVGFSA-N [[(2r,3s,4r,5r)-5-(6-aminopurin-9-yl)-3,4-dihydroxyoxolan-2-yl]methoxy-hydroxyphosphoryl] [(2r,3s,4r,5r)-5-(4-carbamoyl-1,3-thiazol-2-yl)-3,4-dihydroxyoxolan-2-yl]methyl hydrogen phosphate Chemical compound NC(=O)C1=CSC([C@H]2[C@@H]([C@H](O)[C@@H](COP(O)(=O)OP(O)(=O)OC[C@@H]3[C@H]([C@@H](O)[C@@H](O3)N3C4=NC=NC(N)=C4N=C3)O)O2)O)=N1 INQLNSVYIFCUML-QZTLEVGFSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000593 degrading effect Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000012938 design process Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000007717 exclusion Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 208000000044 Amnesia Diseases 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 208000026139 Memory disease Diseases 0.000 description 1
- 244000208734 Pisonia aculeata Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229940086226 cold spot Drugs 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013481 data capture Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000000572 ellipsometry Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 231100000518 lethal Toxicity 0.000 description 1
- 230000001665 lethal effect Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000002595 magnetic resonance imaging Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000006984 memory degeneration Effects 0.000 description 1
- 208000023060 memory loss Diseases 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000013439 planning Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012367 process mapping Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
- 238000009662 stress testing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Data Mining & Analysis (AREA)
- Databases & Information Systems (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Tests Of Electronic Circuits (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73794705P | 2005-11-18 | 2005-11-18 | |
| US73829005P | 2005-11-18 | 2005-11-18 | |
| US60/738,290 | 2005-11-18 | ||
| US60/737,947 | 2005-11-18 | ||
| PCT/US2006/061113 WO2007120280A2 (en) | 2005-11-18 | 2006-11-20 | Methods and systems for utilizing design data in combination with inspection data |
| US11/561,659 | 2006-11-20 | ||
| US11/561,735 | 2006-11-20 | ||
| US11/561,735 US7676077B2 (en) | 2005-11-18 | 2006-11-20 | Methods and systems for utilizing design data in combination with inspection data |
| US11/561,659 US7570796B2 (en) | 2005-11-18 | 2006-11-20 | Methods and systems for utilizing design data in combination with inspection data |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147015035A Division KR101565071B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150123962A KR20150123962A (ko) | 2015-11-04 |
| KR101672157B1 true KR101672157B1 (ko) | 2016-11-02 |
Family
ID=38610775
Family Applications (11)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187021977A KR20180088924A (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020147015035A KR101565071B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020157030359A KR101672157B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020157000055A KR101613048B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020087014775A KR101285967B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및시스템 |
| KR1020167033159A KR101789004B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020177029140A KR101885585B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020137009231A KR101370154B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020137006368A KR101665168B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020137009234A KR101530456B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020157002473A KR101682838B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187021977A KR20180088924A (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020147015035A KR101565071B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
Family Applications After (8)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157000055A KR101613048B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020087014775A KR101285967B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및시스템 |
| KR1020167033159A KR101789004B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020177029140A KR101885585B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020137009231A KR101370154B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020137006368A KR101665168B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020137009234A KR101530456B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| KR1020157002473A KR101682838B1 (ko) | 2005-11-18 | 2006-11-20 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1955225A4 (he) |
| JP (12) | JP5465880B2 (he) |
| KR (11) | KR20180088924A (he) |
| IL (14) | IL191527A (he) |
| WO (2) | WO2007120280A2 (he) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190082911A (ko) * | 2016-11-30 | 2019-07-10 | 케이엘에이-텐코 코포레이션 | 3차원 반도체 구조체들의 검사를 위한 결함 발견 및 레시피 최적화 |
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| KR20190082911A (ko) * | 2016-11-30 | 2019-07-10 | 케이엘에이-텐코 코포레이션 | 3차원 반도체 구조체들의 검사를 위한 결함 발견 및 레시피 최적화 |
| KR102438824B1 (ko) | 2016-11-30 | 2022-08-31 | 케이엘에이 코포레이션 | 3차원 반도체 구조체들의 검사를 위한 결함 발견 및 레시피 최적화 |
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