KR101660201B1 - 전해 구리박과 그 제조 방법 - Google Patents

전해 구리박과 그 제조 방법 Download PDF

Info

Publication number
KR101660201B1
KR101660201B1 KR1020157018249A KR20157018249A KR101660201B1 KR 101660201 B1 KR101660201 B1 KR 101660201B1 KR 1020157018249 A KR1020157018249 A KR 1020157018249A KR 20157018249 A KR20157018249 A KR 20157018249A KR 101660201 B1 KR101660201 B1 KR 101660201B1
Authority
KR
South Korea
Prior art keywords
electrolytic
copper foil
electrolytic copper
metal
foil
Prior art date
Application number
KR1020157018249A
Other languages
English (en)
Korean (ko)
Other versions
KR20150107735A (ko
Inventor
겐사쿠 시노자키
아키토시 스즈키
기미코 후지사와
다케시 에주라
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20150107735A publication Critical patent/KR20150107735A/ko
Application granted granted Critical
Publication of KR101660201B1 publication Critical patent/KR101660201B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Electrolytic Production Of Metals (AREA)
KR1020157018249A 2013-01-24 2014-01-20 전해 구리박과 그 제조 방법 KR101660201B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-011517 2013-01-24
JP2013011517 2013-01-24
PCT/JP2014/050960 WO2014115681A1 (ja) 2013-01-24 2014-01-20 電解銅箔とその製造方法

Publications (2)

Publication Number Publication Date
KR20150107735A KR20150107735A (ko) 2015-09-23
KR101660201B1 true KR101660201B1 (ko) 2016-09-26

Family

ID=51227472

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157018249A KR101660201B1 (ko) 2013-01-24 2014-01-20 전해 구리박과 그 제조 방법

Country Status (5)

Country Link
JP (1) JP5706045B2 (zh)
KR (1) KR101660201B1 (zh)
CN (1) CN104903495B (zh)
TW (1) TWI526579B (zh)
WO (1) WO2014115681A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6489252B1 (ja) * 2018-02-15 2019-03-27 Tdk株式会社 負極集電体、負極及びリチウム二次電池
JP6489251B1 (ja) * 2018-02-15 2019-03-27 Tdk株式会社 負極集電体、負極及びリチウム二次電池
JP6558453B1 (ja) * 2018-02-15 2019-08-14 Tdk株式会社 負極集電体、負極及びリチウム二次電池
CN108823609A (zh) * 2018-06-29 2018-11-16 贵州中鼎高精铜箔制造有限公司 锂离子电池负极集流体双面光电子铜合金箔及其制造工艺
CN109750329A (zh) * 2018-08-06 2019-05-14 新疆中亚新材料科技有限公司 一种透气蜂窝式电解铜箔的生产方法
CN110029373A (zh) * 2019-05-24 2019-07-19 山东金宝电子股份有限公司 一种消除电解铜箔异常粗化结晶的复合添加剂
JP6667840B1 (ja) * 2019-07-22 2020-03-18 テックス・テクノロジー株式会社 電解銅箔の製造方法
CN112323102A (zh) * 2020-11-04 2021-02-05 湖南龙智新材料科技有限公司 一种fpc用电解铜箔及其制备方法
CN112501658A (zh) * 2020-12-08 2021-03-16 九江德福科技股份有限公司 一种高模量铜箔生产工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3238278B2 (ja) 1994-04-12 2001-12-10 株式会社日鉱マテリアルズ 電解銅箔の製造方法
JP2012054198A (ja) 2010-09-03 2012-03-15 Nec Energy Devices Ltd 二次電池用負極およびその製造方法、ならびに非水電解液二次電池
WO2013002279A1 (ja) 2011-06-30 2013-01-03 古河電気工業株式会社 電解銅箔、該電解銅箔の製造方法及び該電解銅箔を集電体とするリチウムイオン二次電池

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5431803A (en) 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
JPH0967693A (ja) * 1995-08-29 1997-03-11 Nikko Gould Foil Kk 電解銅箔の製造方法
JP3943214B2 (ja) 1997-11-14 2007-07-11 日鉱金属株式会社 銀を含む電解銅箔
JP2000017476A (ja) * 1998-04-30 2000-01-18 Mitsui Mining & Smelting Co Ltd 分散強化型電解銅箔及びその製造方法
JP3670186B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3374127B2 (ja) * 2000-11-27 2003-02-04 古河サーキットフォイル株式会社 金属箔、それを用いた回路基板用の積層板
JP4120806B2 (ja) 2002-10-25 2008-07-16 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
JP4273309B2 (ja) 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
JP5588607B2 (ja) 2007-10-31 2014-09-10 三井金属鉱業株式会社 電解銅箔及びその電解銅箔の製造方法
JP5598700B2 (ja) * 2010-02-25 2014-10-01 福田金属箔粉工業株式会社 電解銅箔及びその製造方法
KR101669087B1 (ko) * 2011-07-29 2016-10-25 후루카와 덴키 고교 가부시키가이샤 전해 동합금박, 그 제조 방법, 그것의 제조에 이용하는 전해액, 그것을 이용한 2차 전지용 음극 집전체, 2차 전지 및 그 전극
JP2013185228A (ja) * 2012-03-09 2013-09-19 Furukawa Electric Co Ltd:The 電解銅箔及び二次電池用負極集電体
JP2013204088A (ja) * 2012-03-28 2013-10-07 Furukawa Electric Co Ltd:The 電解銅箔製箔用電解液及び電解銅箔
CN107587172B (zh) * 2011-10-31 2019-09-24 古河电气工业株式会社 高强度、高耐热电解铜箔及其制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3238278B2 (ja) 1994-04-12 2001-12-10 株式会社日鉱マテリアルズ 電解銅箔の製造方法
JP2012054198A (ja) 2010-09-03 2012-03-15 Nec Energy Devices Ltd 二次電池用負極およびその製造方法、ならびに非水電解液二次電池
WO2013002279A1 (ja) 2011-06-30 2013-01-03 古河電気工業株式会社 電解銅箔、該電解銅箔の製造方法及び該電解銅箔を集電体とするリチウムイオン二次電池

Also Published As

Publication number Publication date
TWI526579B (zh) 2016-03-21
CN104903495B (zh) 2016-12-07
WO2014115681A1 (ja) 2014-07-31
TW201443289A (zh) 2014-11-16
CN104903495A (zh) 2015-09-09
KR20150107735A (ko) 2015-09-23
JP5706045B2 (ja) 2015-04-22
JPWO2014115681A1 (ja) 2017-01-26

Similar Documents

Publication Publication Date Title
KR101660201B1 (ko) 전해 구리박과 그 제조 방법
KR101779653B1 (ko) 고강도, 고내열 전해 동박 및 그 제조방법
JP3332289B2 (ja) 電着銅箔、および、塩化物イオンならびに有機添加剤の制御添加物を含有する電解質溶液を用いる電着銅箔の製造方法
WO2013018773A1 (ja) 電解銅合金箔、その製造方法、それの製造に用いる電解液、それを用いた二次電池用負極集電体、二次電池及びその電極
JP5740052B2 (ja) 電解銅箔及びその製造方法
JP2002053993A (ja) 電解銅箔およびその製造方法
TWI514937B (zh) 佈線電路基板
JP5579350B1 (ja) 電解銅箔、該電解銅箔を用いた電池用集電体、該集電体を用いた二次電池用電極、該電極を用いた二次電池
JP6440656B2 (ja) 電解銅箔
TWI639363B (zh) Copper foil for printed circuit boards
KR102018945B1 (ko) 프린트 배선판용 적층체, 프린트 배선판의 제조 방법 및 전자기기의 제조 방법
JP5740055B2 (ja) 電解銅箔、該電解銅箔を用いたリチウムイオン二次電池用電極、該電極を用いたリチウムイオン二次電池
KR102323903B1 (ko) 연성인쇄회로기판의 치수안정성을 향상시킬 수 있는 동박, 그 제조방법, 및 그것을 포함하는 연성동박적층필름
JP2006052441A (ja) 銅箔及びその製造方法、並びにｔａｂテープ
JP2014101581A (ja) 電解銅合金箔、その製造方法、その製造に用いる電解液、二次電池用負極集電体、二次電池及びその電極
JP3963907B2 (ja) 純銅被覆銅箔及びその製造方法、並びにｔａｂテープ及びその製造方法
JP5697051B2 (ja) 電解銅合金箔、その製造方法、その製造に用いる電解液、二次電池用負極集電体、二次電池及びその電極
JP2008081836A (ja) 強度、導電率、曲げ加工性に優れた銅合金条又は銅合金箔の製造方法、銅合金条又は銅合金箔、並びにそれを用いた電子部品
JP6082609B2 (ja) 高強度、高耐熱電解銅箔及びその製造方法

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
AMND Amendment
E902 Notification of reason for refusal
E601 Decision to refuse application
AMND Amendment
X701 Decision to grant (after re-examination)
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20190903

Year of fee payment: 4