KR101643206B1 - 배선 기판 및 전자 부품 장치 - Google Patents

배선 기판 및 전자 부품 장치 Download PDF

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Publication number
KR101643206B1
KR101643206B1 KR1020090113741A KR20090113741A KR101643206B1 KR 101643206 B1 KR101643206 B1 KR 101643206B1 KR 1020090113741 A KR1020090113741 A KR 1020090113741A KR 20090113741 A KR20090113741 A KR 20090113741A KR 101643206 B1 KR101643206 B1 KR 101643206B1
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South Korea
Prior art keywords
layer
wiring
reinforcing
pattern
wiring board
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Korean (ko)
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KR20100062922A (ko
Inventor
준이치 나카무라
고타로 고다니
미치로 오가와
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신꼬오덴기 고교 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/433—Shapes or dispositions of deformation-absorbing parts, e.g. leads having meandering shapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
KR1020090113741A 2008-12-02 2009-11-24 배선 기판 및 전자 부품 장치 Active KR101643206B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008307810A JP2010135418A (ja) 2008-12-02 2008-12-02 配線基板及び電子部品装置
JPJP-P-2008-307810 2008-12-02

Publications (2)

Publication Number Publication Date
KR20100062922A KR20100062922A (ko) 2010-06-10
KR101643206B1 true KR101643206B1 (ko) 2016-07-27

Family

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Country Status (4)

Country Link
US (3) US8153902B2 (enExample)
JP (1) JP2010135418A (enExample)
KR (1) KR101643206B1 (enExample)
TW (1) TWI461116B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024025401A1 (ko) * 2022-07-29 2024-02-01 엘지이노텍 주식회사 회로기판 및 이를 포함하는 반도체 패키지

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JP2010135418A (ja) 2008-12-02 2010-06-17 Shinko Electric Ind Co Ltd 配線基板及び電子部品装置
AT12325U1 (de) * 2009-06-30 2012-03-15 Austria Tech & System Tech Mehrlagige leiterplatte, insbesondere flammbeständige und/oder rauchgas unterdrückende mehrlagige leiterplatte
TWI388018B (zh) * 2009-10-22 2013-03-01 欣興電子股份有限公司 封裝結構之製法
CN102339760B (zh) * 2010-07-14 2013-05-29 欣兴电子股份有限公司 封装结构的制作方法
JP5392726B2 (ja) * 2010-07-28 2014-01-22 京セラＳｌｃテクノロジー株式会社 集合配線基板
JP5666211B2 (ja) * 2010-09-01 2015-02-12 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 配線基板及び半導体装置の製造方法
JP5579108B2 (ja) 2011-03-16 2014-08-27 株式会社東芝 半導体装置
KR101231274B1 (ko) * 2011-05-20 2013-02-07 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR20130089475A (ko) * 2012-02-02 2013-08-12 삼성전자주식회사 회로 기판 및 이의 제조 방법과 이를 이용한 반도체 패키지
JP6181909B2 (ja) * 2012-04-04 2017-08-16 日本シイエムケイ株式会社 プリント配線板の製造方法
CN102711370A (zh) * 2012-06-08 2012-10-03 镇江华印电路板有限公司 防翘曲刚性印刷线路板
WO2014010329A1 (ja) 2012-07-09 2014-01-16 ソニー株式会社 表示装置および電子機器
US9615447B2 (en) * 2012-07-23 2017-04-04 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic support structure with integral constructional elements
KR20150049084A (ko) * 2013-10-29 2015-05-08 삼성전기주식회사 인쇄회로기판
JP6320231B2 (ja) * 2014-08-04 2018-05-09 株式会社ワコム 位置指示器及びその製造方法
CN105451458B (zh) * 2014-08-19 2018-10-30 宁波舜宇光电信息有限公司 一种控制软硬结合板微量变形的方法及pcb基板半成品
JP6358431B2 (ja) * 2014-08-25 2018-07-18 新光電気工業株式会社 電子部品装置及びその製造方法
TWI551207B (zh) * 2014-09-12 2016-09-21 矽品精密工業股份有限公司 基板結構及其製法
TWI567891B (zh) * 2015-01-30 2017-01-21 矽品精密工業股份有限公司 封裝基板之整版面結構
KR20170000458A (ko) * 2015-06-23 2017-01-03 삼성전자주식회사 기판 스트립
KR102329799B1 (ko) * 2017-08-11 2021-11-22 삼성전자주식회사 반도체 패키지
JP6975422B2 (ja) * 2017-10-12 2021-12-01 大日本印刷株式会社 配線基板
KR102029099B1 (ko) * 2018-02-05 2019-10-07 삼성전자주식회사 반도체 패키지
JP7126878B2 (ja) * 2018-06-26 2022-08-29 新光電気工業株式会社 配線基板
US11596056B2 (en) * 2018-10-02 2023-02-28 Skyworks Solutions, Inc. Methods and devices related to reduced packaging substrate deformation
JP7344639B2 (ja) * 2018-11-16 2023-09-14 新光電気工業株式会社 配線基板及び半導体装置
US11452199B2 (en) * 2019-09-12 2022-09-20 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Electronic module with single or multiple components partially surrounded by a thermal decoupling gap

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JP4768994B2 (ja) * 2005-02-07 2011-09-07 ルネサスエレクトロニクス株式会社 配線基板および半導体装置
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JP4334005B2 (ja) 2005-12-07 2009-09-16 新光電気工業株式会社 配線基板の製造方法及び電子部品実装構造体の製造方法
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JP2008130701A (ja) * 2006-11-20 2008-06-05 Matsushita Electric Ind Co Ltd 配線基板とそれを用いた半導体装置及び半導体装置の製造方法
JP2010135418A (ja) * 2008-12-02 2010-06-17 Shinko Electric Ind Co Ltd 配線基板及び電子部品装置

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Publication number Priority date Publication date Assignee Title
JP2001326429A (ja) * 2000-05-17 2001-11-22 Sony Corp プリント配線基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024025401A1 (ko) * 2022-07-29 2024-02-01 엘지이노텍 주식회사 회로기판 및 이를 포함하는 반도체 패키지

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US20120145437A1 (en) 2012-06-14
JP2010135418A (ja) 2010-06-17
US20100132993A1 (en) 2010-06-03
US8686298B2 (en) 2014-04-01
TW201031290A (en) 2010-08-16
US9257373B2 (en) 2016-02-09
US20140145317A1 (en) 2014-05-29
US8153902B2 (en) 2012-04-10
KR20100062922A (ko) 2010-06-10
TWI461116B (zh) 2014-11-11

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