KR101641480B1 - 밀봉용 조성물 - Google Patents

밀봉용 조성물 Download PDF

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Publication number
KR101641480B1
KR101641480B1 KR1020167000630A KR20167000630A KR101641480B1 KR 101641480 B1 KR101641480 B1 KR 101641480B1 KR 1020167000630 A KR1020167000630 A KR 1020167000630A KR 20167000630 A KR20167000630 A KR 20167000630A KR 101641480 B1 KR101641480 B1 KR 101641480B1
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KR
South Korea
Prior art keywords
group
sealing
composition
component
conductive fiber
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KR1020167000630A
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English (en)
Korean (ko)
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KR20160011228A (ko
Inventor
도모야 에가와
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주식회사 다이셀
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Publication of KR20160011228A publication Critical patent/KR20160011228A/ko
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Publication of KR101641480B1 publication Critical patent/KR101641480B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/06—Polythioethers from cyclic thioethers
    • H01L51/5237—
    • H01L51/56—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C08L2203/162—Applications used for films sealable films

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
KR1020167000630A 2014-01-23 2015-01-09 밀봉용 조성물 Active KR101641480B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-010770 2014-01-23
JP2014010770 2014-01-23
PCT/JP2015/051155 WO2015111525A1 (ja) 2014-01-23 2015-01-09 封止用組成物

Publications (2)

Publication Number Publication Date
KR20160011228A KR20160011228A (ko) 2016-01-29
KR101641480B1 true KR101641480B1 (ko) 2016-07-20

Family

ID=53681329

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167000630A Active KR101641480B1 (ko) 2014-01-23 2015-01-09 밀봉용 조성물

Country Status (5)

Country Link
JP (1) JP5914778B2 (enExample)
KR (1) KR101641480B1 (enExample)
CN (1) CN105557068B (enExample)
TW (1) TW201533144A (enExample)
WO (1) WO2015111525A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019045508A3 (ko) * 2017-09-01 2019-05-02 주식회사 엘지화학 유기전자장치의 제조 방법
US11377518B2 (en) 2016-09-30 2022-07-05 Lg Chem, Ltd. Adhesive composition

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3006481A4 (en) * 2013-05-28 2017-01-18 Daicel Corporation Curable composition for sealing optical semiconductor
KR102418079B1 (ko) * 2014-05-20 2022-07-06 세키스이가가쿠 고교가부시키가이샤 유기 일렉트로루미네선스 표시 소자용 밀봉제
JPWO2017094809A1 (ja) * 2015-11-30 2018-09-13 株式会社ダイセル 封止用組成物
JP6022725B1 (ja) 2016-03-31 2016-11-09 Ｌｕｍｉｏｔｅｃ株式会社 有機ｅｌパネル及びその製造方法
KR101922296B1 (ko) * 2016-06-23 2018-11-26 삼성에스디아이 주식회사 고체상 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 포함하는 봉지재 및 반도체 패키지
CN109642134B (zh) 2016-09-07 2021-07-06 琳得科株式会社 粘结剂组合物、密封片和密封体
KR102348192B1 (ko) 2016-09-07 2022-01-06 린텍 가부시키가이샤 접착제 조성물, 봉지 시트, 및 봉지체
WO2018106092A1 (ko) 2016-12-09 2018-06-14 주식회사 엘지화학 밀봉재 조성물
JP6847221B2 (ja) * 2016-12-09 2021-03-24 エルジー・ケム・リミテッド 密封材組成物
KR102017269B1 (ko) 2016-12-09 2019-09-03 주식회사 엘지화학 밀봉재 조성물
US12104075B2 (en) 2016-12-09 2024-10-01 Lg Chem, Ltd. Encapsulating composition
KR102468900B1 (ko) 2017-05-31 2022-11-18 린텍 가부시키가이샤 시트상 접착제, 가스 배리어성 적층체, 및 봉지체
JP6538774B2 (ja) * 2017-07-28 2019-07-03 株式会社ダイセル モノマー混合物、及びそれを含む硬化性組成物
JP6665136B2 (ja) * 2017-07-28 2020-03-13 株式会社ダイセル モノマー混合物、及びそれを含む硬化性組成物
WO2019151079A1 (ja) 2018-01-31 2019-08-08 日本ゼオン株式会社 樹脂フィルム及び有機エレクトロルミネッセンス装置
US11970606B2 (en) 2018-01-31 2024-04-30 Zeon Corporation Resin composition, resin film and organic electroluminescent device
JP6547110B1 (ja) * 2018-05-08 2019-07-24 ナトコ株式会社 活性エネルギー線硬化性インク組成物
KR20210148073A (ko) * 2019-03-27 2021-12-07 덴카 주식회사 조성물
JP7440498B2 (ja) * 2019-04-23 2024-02-28 デンカ株式会社 組成物
CN113454182B (zh) * 2019-07-17 2025-01-17 积水化学工业株式会社 有机el显示元件用密封剂
WO2022210785A1 (ja) * 2021-03-31 2022-10-06 デンカ株式会社 組成物、硬化体及び有機ｅｌ表示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012082266A (ja) * 2010-10-07 2012-04-26 Mitsui Chemicals Inc 封止用組成物及びそれを用いた封止用シート
JP2013157204A (ja) * 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス表示素子用封止剤
JP2013170223A (ja) 2012-02-21 2013-09-02 Sekisui Chem Co Ltd 蒸着用硬化性樹脂組成物、樹脂保護膜、及び、有機光デバイス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60031238D1 (de) * 1999-08-12 2006-11-23 Mitsui Chemicals Inc Lichthärtbare harzzusammensetzung für dichtungsmaterialien und verfahren zum dichten
JP4384509B2 (ja) 2003-01-09 2009-12-16 積水化学工業株式会社 有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子
JP2007197517A (ja) * 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
JP5457078B2 (ja) * 2009-06-05 2014-04-02 株式会社ダイセル カチオン重合性樹脂組成物、及びその硬化物
KR101453848B1 (ko) * 2010-12-13 2014-10-22 디아이씨 가부시끼가이샤 양이온 경화형 액정 씰제, 및 액정 표시 소자

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012082266A (ja) * 2010-10-07 2012-04-26 Mitsui Chemicals Inc 封止用組成物及びそれを用いた封止用シート
JP2013157204A (ja) * 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス表示素子用封止剤
JP2013170223A (ja) 2012-02-21 2013-09-02 Sekisui Chem Co Ltd 蒸着用硬化性樹脂組成物、樹脂保護膜、及び、有機光デバイス

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11377518B2 (en) 2016-09-30 2022-07-05 Lg Chem, Ltd. Adhesive composition
WO2019045508A3 (ko) * 2017-09-01 2019-05-02 주식회사 엘지화학 유기전자장치의 제조 방법
US11545645B2 (en) 2017-09-01 2023-01-03 Lg Chem, Ltd. Method for preparing organic electronic device

Also Published As

Publication number Publication date
JP5914778B2 (ja) 2016-05-11
WO2015111525A1 (ja) 2015-07-30
CN105557068B (zh) 2017-06-09
JPWO2015111525A1 (ja) 2017-03-23
TWI561574B (enExample) 2016-12-11
CN105557068A (zh) 2016-05-04
KR20160011228A (ko) 2016-01-29
TW201533144A (zh) 2015-09-01

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