CN105557068B - 密封用组合物 - Google Patents

密封用组合物 Download PDF

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Publication number
CN105557068B
CN105557068B CN201580001941.XA CN201580001941A CN105557068B CN 105557068 B CN105557068 B CN 105557068B CN 201580001941 A CN201580001941 A CN 201580001941A CN 105557068 B CN105557068 B CN 105557068B
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CN
China
Prior art keywords
composition
sealing
organic electroluminescent
group
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580001941.XA
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English (en)
Chinese (zh)
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CN105557068A (zh
Inventor
江川智哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chemical Industries Ltd filed Critical Daicel Chemical Industries Ltd
Publication of CN105557068A publication Critical patent/CN105557068A/zh
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Publication of CN105557068B publication Critical patent/CN105557068B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
CN201580001941.XA 2014-01-23 2015-01-09 密封用组合物 Active CN105557068B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-010770 2014-01-23
JP2014010770 2014-01-23
PCT/JP2015/051155 WO2015111525A1 (ja) 2014-01-23 2015-01-09 封止用組成物

Publications (2)

Publication Number Publication Date
CN105557068A CN105557068A (zh) 2016-05-04
CN105557068B true CN105557068B (zh) 2017-06-09

Family

ID=53681329

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580001941.XA Active CN105557068B (zh) 2014-01-23 2015-01-09 密封用组合物

Country Status (5)

Country Link
JP (1) JP5914778B2 (enExample)
KR (1) KR101641480B1 (enExample)
CN (1) CN105557068B (enExample)
TW (1) TW201533144A (enExample)
WO (1) WO2015111525A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3006481A4 (en) * 2013-05-28 2017-01-18 Daicel Corporation Curable composition for sealing optical semiconductor
KR102418079B1 (ko) * 2014-05-20 2022-07-06 세키스이가가쿠 고교가부시키가이샤 유기 일렉트로루미네선스 표시 소자용 밀봉제
JPWO2017094809A1 (ja) * 2015-11-30 2018-09-13 株式会社ダイセル 封止用組成物
JP6022725B1 (ja) 2016-03-31 2016-11-09 Ｌｕｍｉｏｔｅｃ株式会社 有機ｅｌパネル及びその製造方法
KR101922296B1 (ko) * 2016-06-23 2018-11-26 삼성에스디아이 주식회사 고체상 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 포함하는 봉지재 및 반도체 패키지
CN109642134B (zh) 2016-09-07 2021-07-06 琳得科株式会社 粘结剂组合物、密封片和密封体
KR102348192B1 (ko) 2016-09-07 2022-01-06 린텍 가부시키가이샤 접착제 조성물, 봉지 시트, 및 봉지체
TWI645007B (zh) 2016-09-30 2018-12-21 南韓商Ｌｇ化學股份有限公司 黏著劑組成物
WO2018106092A1 (ko) 2016-12-09 2018-06-14 주식회사 엘지화학 밀봉재 조성물
JP6847221B2 (ja) * 2016-12-09 2021-03-24 エルジー・ケム・リミテッド 密封材組成物
KR102017269B1 (ko) 2016-12-09 2019-09-03 주식회사 엘지화학 밀봉재 조성물
US12104075B2 (en) 2016-12-09 2024-10-01 Lg Chem, Ltd. Encapsulating composition
KR102468900B1 (ko) 2017-05-31 2022-11-18 린텍 가부시키가이샤 시트상 접착제, 가스 배리어성 적층체, 및 봉지체
JP6538774B2 (ja) * 2017-07-28 2019-07-03 株式会社ダイセル モノマー混合物、及びそれを含む硬化性組成物
JP6665136B2 (ja) * 2017-07-28 2020-03-13 株式会社ダイセル モノマー混合物、及びそれを含む硬化性組成物
EP3678203B1 (en) * 2017-09-01 2025-06-18 LG Chem, Ltd. Method for preparing organic electronic device
WO2019151079A1 (ja) 2018-01-31 2019-08-08 日本ゼオン株式会社 樹脂フィルム及び有機エレクトロルミネッセンス装置
US11970606B2 (en) 2018-01-31 2024-04-30 Zeon Corporation Resin composition, resin film and organic electroluminescent device
JP6547110B1 (ja) * 2018-05-08 2019-07-24 ナトコ株式会社 活性エネルギー線硬化性インク組成物
KR20210148073A (ko) * 2019-03-27 2021-12-07 덴카 주식회사 조성물
JP7440498B2 (ja) * 2019-04-23 2024-02-28 デンカ株式会社 組成物
CN113454182B (zh) * 2019-07-17 2025-01-17 积水化学工业株式会社 有机el显示元件用密封剂
WO2022210785A1 (ja) * 2021-03-31 2022-10-06 デンカ株式会社 組成物、硬化体及び有機ｅｌ表示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012082266A (ja) * 2010-10-07 2012-04-26 Mitsui Chemicals Inc 封止用組成物及びそれを用いた封止用シート
CN102459406A (zh) * 2009-06-05 2012-05-16 株式会社大赛璐 阳离子聚合性树脂组合物及其固化物
JP2013157204A (ja) * 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス表示素子用封止剤
JP2013170223A (ja) * 2012-02-21 2013-09-02 Sekisui Chem Co Ltd 蒸着用硬化性樹脂組成物、樹脂保護膜、及び、有機光デバイス

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60031238D1 (de) * 1999-08-12 2006-11-23 Mitsui Chemicals Inc Lichthärtbare harzzusammensetzung für dichtungsmaterialien und verfahren zum dichten
JP4384509B2 (ja) 2003-01-09 2009-12-16 積水化学工業株式会社 有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子
JP2007197517A (ja) * 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
KR101453848B1 (ko) * 2010-12-13 2014-10-22 디아이씨 가부시끼가이샤 양이온 경화형 액정 씰제, 및 액정 표시 소자

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102459406A (zh) * 2009-06-05 2012-05-16 株式会社大赛璐 阳离子聚合性树脂组合物及其固化物
JP2012082266A (ja) * 2010-10-07 2012-04-26 Mitsui Chemicals Inc 封止用組成物及びそれを用いた封止用シート
JP2013157204A (ja) * 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス表示素子用封止剤
JP2013170223A (ja) * 2012-02-21 2013-09-02 Sekisui Chem Co Ltd 蒸着用硬化性樹脂組成物、樹脂保護膜、及び、有機光デバイス

Also Published As

Publication number Publication date
JP5914778B2 (ja) 2016-05-11
WO2015111525A1 (ja) 2015-07-30
JPWO2015111525A1 (ja) 2017-03-23
TWI561574B (enExample) 2016-12-11
CN105557068A (zh) 2016-05-04
KR101641480B1 (ko) 2016-07-20
KR20160011228A (ko) 2016-01-29
TW201533144A (zh) 2015-09-01

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