KR101574475B1 - 표면 처리 구리박 및 표면 처리 구리박을 사용해서 얻어지는 동장 적층판 - Google Patents

표면 처리 구리박 및 표면 처리 구리박을 사용해서 얻어지는 동장 적층판 Download PDF

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Publication number
KR101574475B1
KR101574475B1 KR1020157024932A KR20157024932A KR101574475B1 KR 101574475 B1 KR101574475 B1 KR 101574475B1 KR 1020157024932 A KR1020157024932 A KR 1020157024932A KR 20157024932 A KR20157024932 A KR 20157024932A KR 101574475 B1 KR101574475 B1 KR 101574475B1
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South Korea
Prior art keywords
copper
copper foil
complex compound
quot
roughened
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KR1020157024932A
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English (en)
Korean (ko)
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KR20150119217A (ko
Inventor
히로아키 즈요시
마코토 호소카와
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미쓰이금속광업주식회사
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Publication of KR20150119217A publication Critical patent/KR20150119217A/ko
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
KR1020157024932A 2013-02-14 2014-02-14 표면 처리 구리박 및 표면 처리 구리박을 사용해서 얻어지는 동장 적층판 KR101574475B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013027059 2013-02-14
JPJP-P-2013-027059 2013-02-14
JPJP-P-2013-195941 2013-09-20
JP2013195941 2013-09-20
PCT/JP2014/053450 WO2014126193A1 (ja) 2013-02-14 2014-02-14 表面処理銅箔及び表面処理銅箔を用いて得られる銅張積層板

Publications (2)

Publication Number Publication Date
KR20150119217A KR20150119217A (ko) 2015-10-23
KR101574475B1 true KR101574475B1 (ko) 2015-12-03

Family

ID=51354192

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157024932A KR101574475B1 (ko) 2013-02-14 2014-02-14 표면 처리 구리박 및 표면 처리 구리박을 사용해서 얻어지는 동장 적층판

Country Status (5)

Country Link
JP (1) JP5809361B2 (zh)
KR (1) KR101574475B1 (zh)
CN (2) CN105102678B (zh)
TW (1) TWI543862B (zh)
WO (1) WO2014126193A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015151935A1 (ja) * 2014-03-31 2015-10-08 三井金属鉱業株式会社 キャリア箔付銅箔、銅張積層板及びプリント配線板
CN107109663B (zh) * 2014-12-05 2020-03-10 纳美仕有限公司 高频信号传输电路形成用表面处理铜箔、覆铜层压板及印刷线路板
JP6342078B2 (ja) * 2015-07-29 2018-06-13 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
CN107002249B (zh) * 2015-09-30 2018-05-22 三井金属矿业株式会社 粗糙化处理铜箔、覆铜层叠板和印刷电路板
JP6087028B1 (ja) * 2015-09-30 2017-03-01 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP6449823B2 (ja) * 2016-01-21 2019-01-09 大成プラス株式会社 銅と樹脂の複合体及び塗料
WO2017150043A1 (ja) 2016-03-03 2017-09-08 三井金属鉱業株式会社 銅張積層板の製造方法
MY186859A (en) * 2016-04-14 2021-08-26 Mitsui Mining & Smelting Co Ltd Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
JP7013003B2 (ja) * 2017-11-10 2022-01-31 ナミックス株式会社 粗面化処理された銅表面を有する物体
WO2019093494A1 (ja) 2017-11-10 2019-05-16 ナミックス株式会社 複合銅箔
JP6985745B2 (ja) 2018-06-20 2021-12-22 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
KR20210121048A (ko) * 2019-01-30 2021-10-07 에이지씨 가부시키가이샤 적층체 및 그 제조 방법, 복합 적층체의 제조 방법, 그리고 폴리머 필름의 제조 방법
JP7352939B2 (ja) * 2019-05-09 2023-09-29 ナミックス株式会社 複合銅部材
JP7409602B2 (ja) * 2019-05-09 2024-01-09 ナミックス株式会社 複合銅部材
JP7456578B2 (ja) * 2019-05-09 2024-03-27 ナミックス株式会社 銅表面の加工装置
US20230142375A1 (en) 2019-10-25 2023-05-11 Namics Corporation Composite copper components
US20230332008A1 (en) 2020-11-20 2023-10-19 Shin-Etsu Chemical Co., Ltd. Phenol compound, conductive paste composition, method for producing conductive paste composition, conductive wire, and method for producing conductive wire
CN116997683A (zh) * 2021-03-26 2023-11-03 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
CN116997684A (zh) * 2021-03-26 2023-11-03 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板

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JP2003293166A (ja) 2002-04-02 2003-10-15 Kobe Steel Ltd 銅又は銅合金管及びその製造方法
JP2006086212A (ja) 2004-09-14 2006-03-30 Fujitsu Ltd 回路基板及びその製造方法
JP2008248269A (ja) 2007-03-29 2008-10-16 Hitachi Chem Co Ltd 銅表面の処理方法およびこの方法を用いた配線基板

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JPS56153797A (en) * 1980-04-28 1981-11-27 Hitachi Chemical Co Ltd Method of manufacturing multilayer printed circuit board substrate
JPH0628941B2 (ja) * 1988-09-20 1994-04-20 株式会社日立製作所 回路基板及びその製造方法
JPH07116640B2 (ja) * 1991-04-12 1995-12-13 株式会社日立製作所 金属銅箔、及びその製造方法
JP2006152329A (ja) * 2004-11-25 2006-06-15 Shin Kobe Electric Mach Co Ltd 銅層の表面処理法および当該処理をした銅層を含む積層板ならびに配線板
EP2224036B1 (en) * 2007-12-14 2016-03-16 Toadenka Corporation Resin-metal bonded article and method for producing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003293166A (ja) 2002-04-02 2003-10-15 Kobe Steel Ltd 銅又は銅合金管及びその製造方法
JP2006086212A (ja) 2004-09-14 2006-03-30 Fujitsu Ltd 回路基板及びその製造方法
JP2008248269A (ja) 2007-03-29 2008-10-16 Hitachi Chem Co Ltd 銅表面の処理方法およびこの方法を用いた配線基板

Also Published As

Publication number Publication date
JPWO2014126193A1 (ja) 2017-02-02
WO2014126193A1 (ja) 2014-08-21
CN105102678B (zh) 2018-06-12
TWI543862B (zh) 2016-08-01
JP5809361B2 (ja) 2015-11-10
KR20150119217A (ko) 2015-10-23
CN105102678A (zh) 2015-11-25
CN107881505A (zh) 2018-04-06
TW201446492A (zh) 2014-12-16

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