WO2019093494A1 - 複合銅箔 - Google Patents
複合銅箔 Download PDFInfo
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- WO2019093494A1 WO2019093494A1 PCT/JP2018/041705 JP2018041705W WO2019093494A1 WO 2019093494 A1 WO2019093494 A1 WO 2019093494A1 JP 2018041705 W JP2018041705 W JP 2018041705W WO 2019093494 A1 WO2019093494 A1 WO 2019093494A1
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- Prior art keywords
- copper foil
- composite copper
- composite
- plating
- treatment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/20—Other heavy metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1841—Multistep pretreatment with use of metal first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
- C23C22/63—Treatment of copper or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
- C25D3/08—Deposition of black chromium, e.g. hexavalent chromium, CrVI
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
Definitions
- the present invention relates to a composite copper foil.
- the copper foil used for a printed wiring board is required to have adhesiveness with a resin.
- a method has been used in which the surface of the copper foil is roughened by etching or the like to increase the physical adhesion.
- flattening of the copper foil surface has been required.
- copper surface treatment methods such as performing an oxidation step and a reduction step have been developed (WO 2014/126193 published publication).
- the copper foil is preconditioned and dipped in a chemical solution containing an oxidizing agent to oxidize the copper foil surface to form irregularities of copper oxide, and then dipped in a chemical solution containing a reducing agent, copper oxide Adjust the surface roughness by reducing the surface roughness.
- a method for improving adhesion in the treatment of copper foils using oxidation / reduction a method of adding surface active molecules in the oxidation step (JP-A-2013-534054), an aminothiazole compound etc. after the reduction step
- JP-A-2013-534054 a method of adding surface active molecules in the oxidation step
- an aminothiazole compound etc. after the reduction step A method of forming a protective film on the surface of a copper foil using the following (Japanese Patent Application Laid-Open No. 8-97559) has been developed.
- the surface of the copper conductor pattern on the insulating substrate is roughened, and a method of forming a plating film having metal particles distributed discretely on the surface on which the copper oxide layer is formed (Japanese Patent Laid-Open No. 2000-151096) It is being developed.
- An object of the present invention is to provide a novel composite copper foil.
- One embodiment of the present invention is a composite copper foil in which a metal layer other than copper is formed on at least a part of the surface of copper foil, and at least a part of the surface of the composite copper foil has projections.
- the height of the convex portion is 10 nm or more and 1000 nm or less. The height of the convex portion is measured as the distance between the middle point and the maximum point of the convex portion for a line segment connecting the local minimum points of the concave portions on both sides of the convex portion in the photographed image of the cross section by the scanning electron microscope It is also good.
- the ratio of Cu to the total metal amount at a depth of 6 nm may be 80% or less, and the ratio of Cu to the total metal amount at a depth not containing oxygen may be 90% or more.
- the height of the convex portion may be 50 nm or more and 500 nm or less.
- the convex part 50 nm or more in height may be an average of 15 or more and 100 or less per 3.8 micrometers.
- the metal layer may be uniform and particle-free.
- the Cu / O ratio at a depth where the ratio of Cu is 40 atom% may be 0.9 or more.
- the metal other than copper may be at least one metal selected from the group consisting of Sn, Ag, Zn, Al, Ti, Bi, CrvFe, Co, Ni, Pd, Au and Pt.
- Another embodiment of the present invention is a method for producing a composite copper foil including a first step of oxidizing the copper foil surface and a second step of plating the oxidized copper surface.
- alkali treatment may be performed using an aqueous alkali solution.
- the oxidized copper foil surface may be dissolved with a solvent.
- the plating process may be electroless plating using a catalyst.
- the plating process may be electrolytic plating.
- the composite copper foil has projections on the surface of at least a part of the metal layer.
- the average height of the projections is preferably 10 nm or more, more preferably 50 nm or more, still more preferably 100 nm or more, and preferably 1000 nm or less, preferably 500 nm or less. Is more preferable, and 200 nm or less is more preferable.
- SEM scanning electron microscope
- the height of the convex portion is the minimum point of the concave portion adjacent to the convex portion. The distance between the middle point of the connected line segment and the maximum point of the convex portion between the concave portions can be used.
- the number of convex portions having a height of 50 nm or more is preferably 15 or more per 3.8 ⁇ m on the surface of the object, more preferably 30 or more, and still more preferably 50 or more.
- the number is preferably 100 or less, more preferably 80 or less, and still more preferably 60 or less.
- the number of projections is, for example, the number per 3.8 ⁇ m of those having a height of 50 nm or more in a scanning electron microscope (SEM) image obtained by observing a cross section of a composite copper foil prepared by focused ion beam (FIB) It can count by measuring.
- SEM scanning electron microscope
- FIB focused ion beam
- the type of metal other than copper is not particularly limited, but at least one metal selected from the group consisting of Sn, Ag, Zn, Al, Ti, Bi, Cr, Fe, Co, Ni, Pd, Au and Pt. Is preferred.
- the thickness of the metal layer other than copper is not particularly limited, but is preferably 6 nm or more, more preferably 10 nm or more, and still more preferably 14 nm or more.
- the proportion of metal in the metal layer other than copper is not particularly limited, but the proportion of Cu with respect to the total metal amount at a depth of 6 nm is preferably 80% by weight or less, more preferably 50% by weight or less, It is more preferable that the content is less than%. Further, the ratio of Cu to the total metal amount in the depth not containing oxygen is preferably 90% by weight or more, more preferably 95% by weight or more, and still more preferably 99% by weight or more.
- the Cu / O ratio at a depth at which the atomic composition ratio of Cu is 40% is preferably 0.9 or more, more preferably 2 or more, and still more preferably 5 or more.
- the ratio of Cu to the total amount of metal at a predetermined depth can be measured, for example, using ion sputtering and X-ray photoelectron spectroscopy (XPS).
- the metal layer is preferably a uniform layer without particles.
- uniform means that the thickness of the layer is 5 times the average thickness of the layer, at least 95%, preferably at least 98%, more preferably at least 99%. Not more than, preferably not more than 3 times, more preferably not more than 2 times.
- This composite copper foil can be used as a copper foil used for a printed wiring board. That is, it can be used for producing a laminated board by bonding composite copper foil and resin in layers, and manufacturing a printed wiring board. Moreover, this composite copper foil can be used as a collector used for a secondary battery. That is, a slurry containing an active material such as graphite and a binder resin such as polyvinylidene fluoride can be applied to a composite copper foil and dried to produce an electrode, which can be used to manufacture a secondary battery.
- an active material such as graphite
- a binder resin such as polyvinylidene fluoride
- the composite copper foil as described above has an advantage that it has excellent adhesion and heat resistance while having low roughness.
- One embodiment of the present invention is a method for producing a composite copper foil, comprising: a first step of oxidizing the copper foil surface; and a second step of plating the oxidized copper surface. It is a manufacturing method.
- the copper surface is oxidized with an oxidizing agent to form a copper oxide layer, and an uneven portion is formed on the surface.
- a roughening process such as etching is not necessary before this oxidation process, but may be performed.
- An alkali treatment may be carried out to prevent the acid from being carried into the degreasing washing or oxidation step.
- the method of the alkali treatment is not particularly limited, it is preferably 0.1 to 10 g / L, more preferably 1 to 2 g / L of an aqueous alkaline solution such as aqueous sodium hydroxide at 30 to 50 ° C. for 0.5 to 2 minutes It should be processed to some extent.
- the oxidizing agent is not particularly limited.
- an aqueous solution of sodium chlorite, sodium hypochlorite, potassium chlorate, potassium perchlorate or the like can be used.
- various additives for example, phosphate such as trisodium phosphate dodecahydrate
- surface active molecules may be added.
- porphyrin As surface active molecules, porphyrin, porphyrin macrocycle, extended porphyrin, ring-reduced porphyrin, linear porphyrin polymer, porphyrin sandwich coordination complex, porphyrin sequence, silane, tetraorgano-silane, aminoethyl-aminopropyl-trimethoxysilane , (3-Aminopropyl) trimethoxysilane, (1- [3- (trimethoxysilyl) propyl] urea) ((l- [3- (Trimethoxysilyl) propyl) urea), (3-aminopropyl) triethoxy Silane, ((3-glycidyloxypropyl) trimethoxysilane), (3-chloropropyl) trimethoxysilane, (3-glycidyloxypropyl) trimethoxysilane, dimethyldichlorosilane, 3- (trimethoxysilyl)
- the oxidation reaction conditions are not particularly limited, but the liquid temperature of the oxidizing agent is preferably 40 to 95 ° C., and more preferably 45 to 80 ° C.
- the reaction time is preferably 0.5 to 30 minutes, more preferably 1 to 10 minutes.
- the oxidized copper foil surface may be dissolved with a solvent to adjust the uneven portion of the oxidized copper foil surface.
- the solubilizer used in this step is not particularly limited, but is preferably a chelating agent, particularly a biodegradable chelating agent, and ethylenediaminetetraacetic acid, diethanolglycine, L-glutamic acid diacetic acid tetrasodium, ethylenediamine-N, N'- Disuccinic acid, sodium 3-hydroxy-2, 2'-iminodisuccinate, trisodium methylglycine diacetate, tetrasodium aspartic acid diacetate, disodium N- (2-hydroxyethyl) iminodiacetate, sodium gluconate, etc. it can.
- a chelating agent particularly a biodegradable chelating agent
- the pH of the solubilizer is not particularly limited, but is preferably alkaline, more preferably pH 8 to 10.5, still more preferably pH 9.0 to 10.5, and pH 9.8 to 10.2. It is further preferred that
- the copper surface is treated until the dissolution rate of copper oxide is 35 to 99%, preferably 77 to 99%, and the thickness of CuO is 4 to 150 nm, preferably 8 to 50 nm. Under this condition, the peel strength with the prepreg becomes high, and the processing unevenness is reduced.
- the copper oxide layer is plated with a metal other than copper to produce a composite copper foil.
- the plating method may be a known technique, and examples of metals other than copper include Sn, Ag, Zn, Al, Ti, Bi, Cr, Fe, Co, Ni, Pd, Au, Pt, or Various alloys can be used.
- the plating step is also not particularly limited, and plating can be performed by electrolytic plating, electroless plating, vacuum evaporation, chemical conversion treatment, or the like.
- electroless nickel plating it is preferable to carry out treatment using a catalyst. It is preferable to use iron, cobalt, nickel, ruthenium, rhodium, palladium, osmium, iridium and salts thereof as the catalyst. By performing treatment using a catalyst, it is possible to obtain a metal layer in which particles are not scattered uniformly. Thereby, the heat resistance of the composite copper foil is improved.
- a reducing agent in which copper and copper oxide do not have catalytic activity as a reducing agent. As reducing agents in which copper and copper oxide do not have catalytic activity, hypophosphites such as sodium hypophosphite are mentioned.
- the composite copper foil which has a convex part can be manufactured by performing a 1st process and a 2nd process with respect to copper foil.
- the Ra of the convex portion is not particularly limited, but is preferably 0.02 ⁇ m or more, more preferably 0.04 ⁇ m or more, and preferably 0.20 ⁇ m or less, more preferably 0.05 ⁇ m or less. Those skilled in the art can easily set conditions such as temperature and time so as to obtain such copper oxide.
- the copper foil produced in these steps may be subjected to a coupling treatment using a silane coupling agent or the like, or an anticorrosion treatment using benzotriazoles or the like.
- an adhesive layer may be provided between the copper foil and the prepreg produced in these steps.
- the method for forming the adhesive layer is not particularly limited.
- an adhesive resin film may be laminated, or the adhesive layer may be formed by applying a resin varnish.
- Example and Comparative Example 1 a DR-WS (manufactured by Furukawa Electric Co., Ltd., thickness: 18 ⁇ m) was used as a copper foil, and a shiny surface (a glossy surface, which is flat when compared to the opposite surface) is used. Plating treatment was performed.
- an electrolytic copper foil F2-WS (manufactured by Furukawa Electric Co., Ltd., Thickness: 18 ⁇ m) matte surface was used. The details of the process will be described below.
- Alkali treatment Preconditioning was performed with a 1.2 g / L aqueous sodium hydroxide solution at 40 ° C. for 1 minute. This is for the degreasing and cleaning intended to reduce the unevenness of the oxidation treatment. In addition, about the comparative example 2, the alkali treatment was not performed.
- Example 3 Plating treatment
- the copper foil subjected to the oxidation treatment was subjected to electrolytic plating using a nickel plating electrolytic solution (nickel sulfamate 470 g / L-boric acid 40 g / L).
- electrolytic plating was performed using a chromium plating electrolytic solution (chromic anhydride 100 g / L-sulfuric acid 1 g / L).
- Example 6 an electrolytic solution for zinc plating (zinc oxide 10 g / L-sodium hydroxide 115 g / L-9500 A 5 ml / L (manufactured by Japan Surface Chemistry Co., Ltd.)-9500 B 0.5 ml / L (Japan Surface Chemistry Co., Ltd.) Electrolytic plating was carried out using Hyper-soft 10 ml / L (manufactured by Nippon Surface Chemical Co., Ltd.). The conditions such as temperature, time and current density are as described in Table 1. In Comparative Example 1, the plating process was not performed at all. For Example 4, activation solution (100 mg / L palladium chloride, 0.1 mL) at 30 ° C.
- Example 7 the copper foil obtained in Example 2 was immersed in a 1 wt% aqueous solution of silane coupling agent (KBM-803 made by Shin-Etsu Silicone) at room temperature for 1 minute and then dried in a dryer at 70 ° C. for 1 minute. The copper foil prepared was used.
- a sensitizing solution 1.0 g / L tin chloride, 0.5 to 3.0 mL / L hydrochloric acid
- electroless plating was performed at 90 ° C. for 5 seconds using a Ni—P plating solution (Blue Schumer, Nippon Kanisen Co., Ltd.).
- the copper foil obtained in Example 2 was immersed in a 1 wt% aqueous solution of silane coupling agent (KBM-803 made by Shin-Etsu Silicone) at room temperature for 1 minute and then dried in a dryer at 70 ° C. for 1 minute. The copper foil prepared was used.
- silane coupling agent KBM-803 made by Shin-Etsu Silicon
- the number of convex portions having a height of 50 nm or more per 3.8 ⁇ m was counted in five SEM images, and an average value of five was calculated.
- the surface roughness was calculated as arithmetic mean roughness (Ra).
- the observation results of the scanning electron microscope are shown in FIG. 1 and the measurement results are shown in Table 2. The lower the value of Ra, the smaller the surface roughness of the copper foil surface.
- the amount of metal other than Cu was measured for the copper foils of Examples 1 to 6 plated. Specifically, a plated copper foil and a non-plated copper foil are cut into 3 cm squares, dissolved in a 12% nitric acid aqueous solution, and per one side of the copper foil by high frequency inductively coupled plasma (ICP) analysis. The amount of metal was measured, and the difference was made the amount of metal other than Cu. The results are shown in Table 2.
- Example 8 in the copper foil obtained in Example 2, an adhesive resin layer containing phenylene ether oligomer and an elastomer as an adhesive resin layer was used as a main component in the copper foil obtained in Example 2.
- a measurement sample (Initial) is obtained by sandwiching a film (Namics Co., Ltd., NC 0207) and holding it in vacuum at 210 ° C. for 30 minutes using a vacuum high-pressure press. Further, the peel strength after heat treatment was measured under the same conditions, and the higher the peel strength, the higher the adhesion between the prepreg and the copper foil, and the results are shown in Table 3.
- the heat resistance deterioration rate was calculated by the following equation.
- Thermal degradation rate (%) 100-((Peel strength after heat resistance / Initials peel strength) x 100) (7) Measurement of Adhesion II Determination of Overflow
- the copper foils of Examples 1 to 6 and Comparative Examples 1 to 2 were mixed with 60N aqueous HCl solution (4N) to check the resistance to acid. C. for 90 minutes to obtain a measurement sample, and subjected to a 90.degree. Peeling test (Japanese Industrial Standard (JIS) C5016). At this time, on the adhesive surface on the copper foil side, the presence or absence of a change in color due to exudation was examined. The results are shown in Table 3.
- Comparative Example 2 In Comparative Example 2 in which neither oxidation treatment nor plating treatment was performed, the height of the convex portion was extremely high, and the surface roughness was also remarkably rough. In Comparative Example 1 in which only the oxidation treatment was performed and the plating treatment was not performed, the surface roughness and the peel strength were both at a level at which there was no problem, but there was bleeding after the acid resistance test, and the heat degradation rate was high.
- Example 1 in which the oxidation treatment and the plating treatment with an appropriate strength were performed, any factor had no problem regardless of the method of the plating treatment and the type of the coated metal. Plating is believed to increase adhesion.
- Example 1 as described in Table 2, although the unevenness was not observed, as described in Table 3, the performance was not a problem.
- the present invention has made it possible to provide a novel composite copper foil.
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Abstract
Description
)が開発されている。また、絶縁基板上の銅導体パターンの表面を粗化し、酸化銅層を形成した表面上に、離散的に分布する金属粒子を有するめっき膜を形成する方法(特開2000-151096号公報)が開発されている。
記銅箔表面が溶解剤で溶解されてもよい。第2の工程において、前記めっき処理が触媒を用いた無電解めっきであってもよい。第2の工程において、前記めっき処理が電解めっきであってもよい。
本出願は、2017年11月10日付で出願した日本国特許出願2017-217777及び2018年3月30日付で出願した日本国特許出願2018-069608及びに基づく優先権を主張するものであり、当該基礎出願を引用することにより、本明細書に含めるものとする。
本発明の一実施態様は、銅箔の少なくとも一部の表面に、銅以外の金属層が形成されている複合銅箔である。この複合銅箔には、少なくとも一部の金属層の表面に凸部がある。
量%以上であることがより好ましく、99重量%以上であることがさらに好ましい。また、Cuの原子組成の割合が40%である深さにおけるCu/O比は、0.9以上であることが好ましく、2以上であることがより好ましく、5以上であることがさらに好ましい。所定の深さにおける全金属量に対するCuの割合は、例えば、イオンスパッタリングとX線光電子分光法(XPS)を用いて測定することができる。
本発明の一実施態様は、複合銅箔の製造方法であって、銅箔表面を酸化する第1の工程と、酸化した銅表面にめっき処理する第2の工程と、を含む複合銅箔の製造方法である。
ましく、1~10分であることがより好ましい。
厚み:18μm)のマット面を用いた。以下に、その工程の詳細を説明する。
1.2g/Lの水酸化ナトリウム水溶液で40℃、1分間、プレコンディショニングを
行った。これは、酸化処理のムラを軽減することを目的とした脱脂洗浄のためである。なお、比較例2については、アルカリ処理を行わなかった。
アルカリ処理を行った銅箔を、酸化処理用水溶液(NaClO2 130g/L-Na
OH 12g/L)で45℃、1分間、酸化処理を行った。なお、比較例2については、酸化処理を行わなかった。これらの処理後、銅箔を水洗した。
酸化処理を行った銅箔に対し、実施例1~3については、ニッケルめっき用電解液(スルファミン酸ニッケル470g/L-ホウ酸40g/L)を用いて電解めっきを施した。
実施例5については、クロムめっき用電解液(無水クロム酸100g/L-硫酸1g/L)を用いて電解めっきを施した。実施例6については、亜鉛めっき用電解液(酸化亜鉛10g/L-水酸化ナトリウム115g/L-9500A 5ml/L(日本表面化学株式会社製)-9500B 0.5ml/L(日本表面化学株式会社製)-ハイパーソフト10ml/L(日本表面化学株式会社製))を用いて電解めっきを施した。温度、時間、電流密度などの条件については、表1に記載の通りである。比較例1については、めっき処理の工程は一切行わなかった。実施例4については、センシタイジング溶液(1.0g/L塩化スズ、0.5~3.0mL/L塩酸)で30℃、1分間、アクティベーション溶液(100mg/L塩化パラジウム、0.1mL/L塩酸)で30℃、1分間処理を行った後、Ni-Pめっき溶液(ブルーシューマー、日本カニゼン社)を用いて、90℃、5秒間無電解めっきを施した。
実施例7では、実施例2で得られた銅箔に対し、シランカップリング剤(信越シリコーン製KBM-803)1wt%水溶液に室温で1分間浸漬後、70℃の乾燥機内で1分間乾燥して作成した銅箔を用いた。
実施例1~6及び比較例1~2で得られた複合銅箔の凸部の高さ及び数、そして表面粗さを測定した。具体的には、共焦点走査電子顕微鏡コントローラ MC-1000A(レーザーテック株式会社製)を用いて測定した。走査型電子顕微鏡(SEM)画像において、凸部を挟んで隣り合う凹部の極小点を結んだ線分の中点と、凹部の間にある凸部の極大点との距離を凸部の高さとした。5個の独立した場所についてのSEM画像を用い、1画像につき3箇所測定して、その平均値を計算し、凸部の平均の高さとした。次に、5個のSEM画像で、3.8μm当たり、高さが50nm以上の凸部の数を数え、5個の平均値を算出した。表面粗さは、算術平均粗さ(Ra)として算出した。走査電子顕微鏡の観察結果を図1に、各測定結果を表2に示す。なお、Raの値が低いほど、銅箔表面の表面粗さが小さいことを示す。
めっきを施した実施例1~6の銅箔について、Cu以外の金属量を測定した。具体的には、めっきを施した銅箔とめっきを施していない銅箔を3cm角に切断し、それぞれ12%硝酸水溶液に溶かして、高周波誘導結合プラズマ(ICP)分析法によって銅箔片面あたりの金属量を測定し、その差をCu以外の金属量とした。その結果を表2に示す。
実施例1~7及び比較例1~2の各銅箔について、積層後のピール強度及び熱処理後のピール強度を測定した。まず、各銅箔に対し、プリプレグ(R5670KJ(パナソニック株式会社製)を積層し、真空高圧プレス機を用いて真空中で210℃30分間保持することにより、測定試料(Initial)を得た。熱に対する耐性を調べるため、177℃のオーブンに10日間投入し、測定試料(耐熱試験)を得た。これらの測定試料に対して90°剥離試験(日本工業規格(JIS)C5016)によりピール強度(kgf/cm)を求めた。また、実施例8では、実施例2で得られた銅箔に対し、箔とプリプレグとの間に、接着樹脂層としてフェニレンエーテルオリゴマーおよびエラストマーを主成分とする接着フィルム(ナミックス(株)製、NC0207)を挟み、真空高圧プレス機を用いて真空中で210℃30分間保持することにより測定試料(Initial)を得て、さらに、同様の条件で熱処理後のピール強度を測定した。ピール強度が大きいほど、プリプレグと銅箔の密着性が高いことを示す。その結果を表3に示す。
100 - ((耐熱試験後のピール強度 / Initialsのピール強度)× 100)
(7)密着性の測定 II 浸み出しの判定
実施例1~6及び比較例1~2の各銅箔について、酸に対する耐性を調べるため、積層後の銅箔をHCl水溶液(4N)に60℃、90分間浸漬し、測定試料を得、90°剥離試験(日本工業規格(JIS)C5016)を行った。この時に、銅箔側の接着面において、染み出しによる色の変化の有無を調べた。その結果を表3に示す。
Claims (13)
- 銅箔の少なくとも一部の表面に、銅以外の金属層が形成されている複合銅箔であって、
少なくとも一部の前記複合銅箔の表面に凸部があり、
前記複合銅箔の断面において、前記凸部の高さが10nm以上1000nm以下である、複合銅箔。 - 深さ6nmにおける全金属量に対するCuの割合が80%以下であり、酸素を含まない深さにおける全金属量に対するCuの割合が90%以上である、請求項1に記載の複合銅箔。
- 前記凸部の高さが50nm以上500nm以下である、請求項1または2に記載の複合銅箔。
- 前記複合銅箔の断面において、高さ50nm以上の凸部が3.8μm当たり平均15個以上100個以下である、請求項1~3のいずれか1項に記載の複合銅箔。
- 前記凸部の高さが、走査電子顕微鏡による断面の撮影像において、凸部の両側の凹部の極小点を結んだ線分について、その中点と凸部の極大点との距離として測定される、請求項1~4に記載の物体。
- 前記金属層が、一様で粒子がない、請求項1~5のいずれか1項に記載の複合銅箔。
- Cuの割合が40atom%である深さにおけるCu/O比が0.9以上である、請求項1~6のいずれか1項に記載の複合銅箔。
- 前記銅以外の金属が、Sn、Ag、Zn、Al、Ti、Bi、Cr、Fe、Co、Ni、Pd、AuおよびPtからなる群から選ばれた少なくとも一種の金属である、請求項1~7のいずれか1項に記載の複合銅箔。
- 銅箔表面を酸化する第1の工程と、
酸化した前記銅表面にめっき処理する第2の工程と、
を含む複合銅箔の製造方法。 - 第1の工程の前に、アルカリ水溶液を用いてアルカリ処理が行われる、請求項9に記載の複合銅箔の製造方法。
- 第1の工程において、酸化された前記銅箔表面が溶解剤で溶解される、請求項9または10に記載の複合銅箔の製造方法。
- 第2の工程において、前記めっき処理が触媒を用いた無電解めっきである、請求項9~11のいずれか1項に記載の複合銅箔の製造方法。
- 第2の工程において、前記めっき処理が電解めっきである、請求項9~12のいずれか1項に記載の複合銅箔の製造方法。
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KR1020207014566A KR102636971B1 (ko) | 2017-11-10 | 2018-11-09 | 복합 구리박 |
JP2019552410A JP7127861B2 (ja) | 2017-11-10 | 2018-11-09 | 複合銅箔 |
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WO2020179183A1 (ja) * | 2019-03-04 | 2020-09-10 | ナミックス株式会社 | 銅箔並びにそれを含むリチウムイオン電池の負極集電体及びその製造方法 |
WO2020179181A1 (ja) * | 2019-03-04 | 2020-09-10 | ナミックス株式会社 | 銅箔並びにそれを含むリチウムイオン電池の負極集電体及びその製造方法 |
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CN111979534A (zh) * | 2020-07-14 | 2020-11-24 | 中国科学院海洋研究所 | 基于液滴自弹跳效应的超疏水表面的制备方法及应用 |
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US11781236B2 (en) | 2023-10-10 |
KR20200087163A (ko) | 2020-07-20 |
EP3708696A4 (en) | 2021-07-21 |
CN111344435A (zh) | 2020-06-26 |
US20200332431A1 (en) | 2020-10-22 |
KR102636971B1 (ko) | 2024-02-16 |
TW201936993A (zh) | 2019-09-16 |
JPWO2019093494A1 (ja) | 2020-09-24 |
TWI775981B (zh) | 2022-09-01 |
EP3708696A1 (en) | 2020-09-16 |
JP7127861B2 (ja) | 2022-08-30 |
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