KR101556492B1 - 회로캐리어의 배치방법과 회로캐리어 - Google Patents

회로캐리어의 배치방법과 회로캐리어 Download PDF

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KR101556492B1
KR101556492B1 KR1020147035661A KR20147035661A KR101556492B1 KR 101556492 B1 KR101556492 B1 KR 101556492B1 KR 1020147035661 A KR1020147035661 A KR 1020147035661A KR 20147035661 A KR20147035661 A KR 20147035661A KR 101556492 B1 KR101556492 B1 KR 101556492B1
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smd
circuit carrier
light emitting
reference point
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KR20150013850A (ko
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안드레아스 카르히
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아베 미크로엘렉트로닉 게젤샤프트 미트 베슈렝크터 하프퉁
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Abstract

본 발명은 적어도 하나의 표면실장형 LED(SMD-LED)(2)가 회로캐리어(1)에서 회로캐리어(1)의 하나 이상의 기준점(3)에 대하여 배향되게 배치되는, 상기 적어도 하나의 SMD-LED가 구비된 회로캐리어(1)의 제조를 위한 방법으로서, 적어도 하나의 SMD-LED(2)의 발광영역(4)의 위치가 SMD-LED(2)에서 광학적으로 검출되고 적어도 하나의 SMD-LED(2)가 적어도 하나의 SMD-LED(2)의 발광영역(4)의 검출된 위치에 따라 회로캐리어(1)에 취부되는 회로캐리어의 제조방법에 관한 것이고, 이러한 회로캐리어(1)에 관한 것이다.

Description

회로캐리어의 배치방법과 회로캐리어 {PLACEMENT METHOD FOR CIRCUIT CARRIER AND CIRCUIT CARRIER}
본 발명은 청구범위 제1항의 특징부를 갖는 적어도 하나의 표면실장형 LED(surface-mount LED: SMD-LED)가 구비된 회로캐리어의 제조를 위한 방법과 청구범위 제10항의 특징부를 갖는 회로캐리어에 관한 것이다.
표면실장형 LED(SMD-LED) 소자에 기초하는 광-광학(light-optical)의 적용을 구현하기 위하여, 회로캐리어에 SMD-LED 소자를 고도로 정밀하게 취부하는 것이 요구된다. 이러한 예로서는 광원이 LED인 차량의 전면헤드라이트, 주간주행등, 방향지시등, 액티브 벤딩 라이트(active bending light) 등이 있다.
이와 같은 경우, SMD-LED는 회로캐리어에서 하나 이상의 정의된 기준점에 정확히 취부되어야 하며, 광학계[어태치먼트 렌즈(attachment lens)를 예로 들 수 있다]는 이들 기준점에 대하여 정확한 방향을 향하도록 정확히 배향(配向)될 수 있다.
지금까지 SMD-LED 소자는 소위 "픽 앤 플레이스(Pick & Place)" 방법으로 회로캐리어상에 배치되었고 "리플로(Reflow)" 방법으로 납땜되었다. 이와 같은 경우, LED의 발광영역의 최종위치는 다음의 요인에 의하여 결정된다: - LED 소자의 공차(예를 들어, LED 외형 또는 LED 단자패드의 위치에 대한 발광영역의 위치), - 솔더링 패드(soldering pad)의 위치를 결정하는 회로캐리어의 공차[예를 들어, 회로캐리어의 외형 및/또는 통공에 대한 도체트랙(conductor track)의 위치, 도체트랙 위치에 대한 솔더 마스크(solder mask)의 위치], 및 - 예열영역에서 솔더 페이스트(solder paste)의 "슬럼핑(slumping)" 현상과 용융되었을 때 상부영역(peak zone)에서 솔더의 습윤력(부동상승)에 의한 리플로 솔더링방법에서 SMD-LED의 이동.
SMD-LED 소자의 발광영역에 대하여 이러한 방법으로 얻을 수 있는 배치정확도의 최종레벨은 오로지 SMD-LED와 회로캐리어의 공차만 고려할 때 이미 +/- 110㎛ 이상이다(아직은 리플로 솔더링방법의 영향은 고려하지 않았다).
리플로 솔더링방법의 영향은 특히 SMD-LED 소자에 대하여 각지고 경사진 위치상의 정확성(positional truth)의 영역에서 부가적인 배치 부정확성을 야기한다.
현재의 은소결방법(silver sintering processes)으로 SMD-LED를 취부하는 것은 이러한 방법이 10초 이상의 허용할 수 없는 긴 공정시간이 소요되기 때문에 배제된다.
본 발명의 목적은 상기 언급된 일반적인 유형의 방법을 제공하는 바, 이러한 방법에서 SMD-LED와 회로캐리어의 필연적으로 존재하는 공차가 보정될 수 있고, 특히 회로캐리어상에 SMD-LED의 배치와 취부에 고도의 정확도를 얻을 수 있으며 이와 같이 구비된 회로캐리어를 제공할 수 있도록 하는데 있다.
이러한 본 발명의 목적은 청구범위 제1항의 특징부를 갖는 방법과 청구범위 제10항의 특징부를 갖는 회로캐리어에 의하여 달성된다.
SMD-LED의 발광영역의 위치에 따라서 회로캐리어에 적어도 하나의 SMD-LED를 취부함으로써 LED 소자와 회로캐리어의 공차에 기인하는 이들의 부정확도를 배제하는 것이 가능하다. 이와 같이 함으로써 회로캐리어에 SMD-LED를 배치할 때 +/- 100 ㎛ 이하의 공차를 달성하는 것이 가능하다. 출원인의 시험결과는 +/- 50 ㎛ 보다 작거나 같은 공차를 달성하는 것도 가능함을 보여준다.
환언컨데, 본 발명에 따른 방법으로 SMD-LED와 회로캐리어의 소자고유의 공차를 실질적으로 또는 심지어 완전히 제거하는 것이 가능하다. 환언컨데, 본 발명에 따른 방법으로 얻을 수 있는 공차는 SMD-LED의 발광영역을 위하여 사용되는 검출방법의 정밀성에 의하여서만 현재 실질적으로 제한된다. 프로젝트(project) 요구에 따라서, SMD-LED와 회로캐리어의 구조에 관계없이 충분히 정밀한 검출방법을 선택할 수 있고 이로써 프로젝트에 규정된 공차의 구현이 이루어질 수 있다. 환언컨데, 가격이 더 저렴하거나 더 간단한 소자의 더 큰 공차는 보다 정밀한 검출방법을 이용하여 보정될 수 있다. 보다 정밀한 검출방법은 보다 정밀한 광학카메라 또는 보다 정밀한 "픽 앤 플레이스" 장치를 이용하거나 또는 이들 장치를 함께 이용하여 성취될 수 있다.
적어도 하나의 SMD-LED의 발광영역의 검출은 예를 들어 발광영역의 특징적인 외형을 검출하는 광학카메라를 이용하여 이루어질 수 있다.
본 발명의 유리한 실시형태가 첨부된 청구범위에 열거되어 있다.
본 발명은 예를 들어 광원이 LED인 차량의 전면헤드라이트, 주간주행등, 방향지시등, 액티브 벤딩 라이트 등에 사용되는 회로캐리어에 대하여 사용될 수 있다.
기준점 또는 기준점들은 예를 들어 통공(원형공 또는 장공)의 형태일 수 있다. 부가적으로 또는 다른 방식으로 에칭구조 또는 인쇄구조를 이용할 수도 있다.
예를 들어, 회로캐리어에 SMD-LED를 취부하는 것은 SMD-LED의 발광영역의 중심점의 위치에 따라 이루어질 수 있다. 이는 통상적으로 SMD-LED 의 빔경로내에 배치되는 광학계의 배향이 SMD-LED의 발광영역의 중심점에 대하여 이루어지기 때문에 특히 유리하다.
적어도 하나의 기준점이 적어도 하나의 SMD-LED를 위한 광학계를 배치하기 위하여 그리고 좋기로는 고정하기 위하여 사용되는 것이 특히 좋다. 종래의 기술에서는 SMD-LED가 구비된 회로캐리어가 취부과정에서 전용의 공정단계에서 광학계에 대하여 배향되어야 한다. 이러한 것은 본 발명의 우선실시형태에서는 생략될 수 있는데 그 이유는 광학계의 배치를 위하여 적어도 하나의 기준점을 이용하는 것은 광학계가 이미 정확하게 배향된다는 것을 의미하기 때문이다. 만약 적어도 하나의 기준점이 광학계의 배치뿐만 아니라 회로캐리어에 대한 광학계의 고정을 위하여 사용되는 경우(이러한 경우 적어도 하나의 기준점이 예를 들어 광학계를 취부하기 위한 취부공의 형태이다), 이는 최상의 정확도를 제공한다. 많은 경우에 있어서, 적어도 하나의 기준점에 대하여 배향되는, 광학계를 위한 별도의 고정장소를 제공할 수 있다.
추후 회로캐리어의 기준점 또는 기준점들에 대하여 적어도 하나의 SMD-LED를 배향하는 것이 가능하도록 하기 위하여, 회로캐리어의 기준점의 위치를 검출할 필요가 있다. 이는 예를 들어 광학카메라가 기존의 기준점들을 통과하고 소자의 고유공차로 유발되는(arise out of) 목표위치에 대한 각 편차를 확인하는 방식으로 이루어질 수 있다. SMD-LED에 대하여 광학계를 배치하기 위해 추후에 또한 사용되는 이들 기준점의 위치가 사용되는 것이 좋다.
통상적으로 SMD-LED들은 피드 벨트(feed belt)에 제공되고 이들은 종래기술에 해당하는 "픽 앤 플레이스" 시스템, 예를 들어 흡착기[진공피펫(vacuum pipette)]에 의하여 피드 벨트에 배치된 포켓으로부터 이송된다. 종래기술에서 SMD-LED의 외형 또는 단자패드(terminal pad)의 위치는 피드 벨트로부터 이송된 후에 하측으로부터 검출된다. 이것은 SMD-LED의 상측부인 발광영역의 위치가 중요하기 때문에 본 발명의 경우에 있어서는 가능하지 않다. 따라서 진공피펫 시스템을 사용할 때 발광영역의 검출은 흡착기에 의하여 접촉하기 전에 이루어져야 한다. 다른 방식으로 제공되는 SMD-LED의 경우에 있어서는 이러한 요건이 반드시 발생할 필요는 없다.
진공피펫 시스템이 사용될 때 본 발명은 다음과 같이 수행될 수 있다: 벨트로부터 이송될 SMD-LED의 발광영역의 위치가 피드 벨트의 각 포켓을 볼 수 있는 위치에 배치되거나 이러한 위치로 이동가능한 카메라에 의하여 검출된다. 검출된 위치는 포켓내의 SMD-LED의 목표위치와 비교되는 것이 좋으며, 여기에서 SMD-LED는 피드 벨트의 이동방향에 배향된 상태로 포켓의 중앙에 배치되어 있게 한다(Y-방향, X-방향 = 피드 벨트의 평면에서 Y-방향에 직각인 방향). 발광영역의 중심점의 X- 및 Y-방향과 발광영역의 각위치(angular position)에 비교하여 목표위치에 대하여 발광영역의 검출된 위치에 대한 편차가 계산된다. 환언컨데, 피드 벨트의 포켓에서 SMD-LED의 임의위치가 확인되고 목표위치와 비교된다.
발광영역의 위치의 검출은 LED 스펙트럼에 적응된 파장을 갖는 광원으로 조명되는 SMD-LED 에 의하여 보다 강화될 수 있다. 이와 같이 함으로써 SMD-LED의 발광영역과 남은 영역 사이의 콘트라스트(contrast)가 증가될 수 있다. 적응된 파장은 예를 들어 400 nm 내지 500 nm의 범위, 좋기로는 420 nm 내지 490 nm의 범위일 수 있다.
상기 임의위치는 진공피펫에 의하여 포켓으로부터 이송될 때 더 이상 변경되지 않아야 한다. 이를 위하여 발광영역 또는 SMD-LED의 Z-위치(Z-방향 = X-방향 및 Y-방향에 직각이다)를 확인하는 것이 또한 유리할 수 있는데 그 이유는 이후에 진공피펫에 의한 접촉이 이러한 접촉시에 포켓내에서 SMD-LED의 위치가 변경되지 않는 방식으로 부드럽게 이루어질 수 있기 때문이다.
회로캐리어의 위치는 기준점의 위치를 확인함으로써 알 수 있기 때문에, SMD-LED의 발광영역의 확인된 편차에 의하여 진공피펫이 X- 및 Y-방향에서의 기존 편차 그리고 또한 SMD-LED에 직각인 축선을 중심으로 하는 회전에 의한 기존 편차를 바로잡고 따라서 이 진공피펫이 SMD-LED를 발광영역에 대하여 정확한 위치로 배향하는 방식으로 진공피펫이 작동될 수 있다. 진공피펫에 고정된다는 것은 진공피펫의 축선에 대하여 다른 각도가 관련될 수 없음을 의미하므로 SMD-LED의 경사는 고려할 필요가 없다.
이후 설명되는 것은 정확한 위치로 배향된 SMD-LED가 정확한 위치에서 회로캐리어에 취부될 수 있는 두 방법에 관한 것이다.
적어도 하나의 SMD-LED를 회로캐리어에 취부하기 위한 제1 방법에서, 적어도 하나의 SMD-LED가 배향된 후에 SMD-LED에 은소결물질이 배치되고 적어도 하나의 SMD-LED가 은-소결된다.
구비될 회로캐리어 또는 SMD-LED 또는 구비될 회로캐리와 SMD-LED 모두는 온도가 상승되고 이 상승된 온도에서 소결물질이 구비된 SMD-LED를 가압하자마자 그리고 가압함으로써 이 소결물질이 소결되는 것이 좋다.
공정시간을 현저히 줄이기 위하여, 은소결물질의 입자크기는 약 100 nm 이하, 좋기로는 약 60 nm 이하이어야 한다. 이와 같이 함으로써, 공정이 시작된 후 1 초 내지 5 초 이하의 접촉시간 내에 소결이 이루어진다. 예를 들어 약 20 nm 내지 약 40 nm 범위의 입자크기를 갖는 소결물질이 사용될 수 있다. 요구된 입자크기의 은소결물질은 다양한 공급자로부터 입수할 수 있다.
SMD-LED 상에 은소결물질을 배치하는 것은 예를 들어 SMD-LED에 은소결물질과 적당한 유기분리제의 페이스트를 도포함으로써 이루어질 수 있다.
예를 들어 제조공급된 페이스트의 침전물에 단자패드를 침지함으로써 진공피펫에 대하여 SMD-LED의 위치를 변경시키지 않고 페이스트가 도포될 수 있다.
또는 은소결물질은 "다이전사필름(Die Transfer Film: DTF)" 방법으로 SMD-LED에 도포될 수 있다. 이 경우에 있어서, 은소결물질은 필름의 형태이다. 이러한 종류의 필름도 상업적으로 입수될 수 있는 것이다.
소결공정이 종료될 때까지 SMD-LED가 진공피펫에 의하여 단단히 고정될 수 있으므로 소결공정에 의하여 SMD-LED의 정확한 위치로 배향된 것에 차후의 변화는 일어나지 않는다. SMD-LED가 진공피펫에 의하여 회로캐리어의 표면에 대하여 가압되므로 SMD-LED는 경사지지 않을 수 있다.
적어도 하나의 SMD-LED를 회로캐리어에 취부하기 위한 제2 방법은 리플로 솔더링방법에 기반한다.
이와 같은 경우 솔더 페이스트가 회로캐리어에 도포되는데, 인쇄하여 도포되는 것이 좋다. 그리고 접착제가 적어도 하나의 SMD-LED의 발광영역의 검출된 위치에 따라 회로캐리어에 도포되는 것이 좋다. SMD-LED가 회로캐리어상에 배치된다. 그리고 접착제가 적어도 부분적으로 경화된다. 이어서 솔더 페이스트의 리플로 솔더링이 이루어질 수 있다.
접착제를 사용함으로써 리플로 솔더링과정에서 SMD-LED가 부동(浮動)하는 것을 방지할 수 있다.
사용된 접착제는 UV-경화형 접착제가 특히 좋다. 이와 같은 경우, 접착제는 UV 광에 노출시켜 적어도 부분적으로 경화될 수 있다. 더욱 특히 좋기로는 UV- 및 온도경화형의 하이브리드 접착제가 사용되는 것이다. 접착제는 추후에 노(furnace)내에서 솔더링 과정중에 경화될 수 있다.
각 개별적인 SMD-LED의 개별적인 조명이 이루어질 수 있으나, 사이클시간을 줄이기 위하여 모든 SMD-LED의 동시조명이 이루어지는 것이 좋다.
본 발명의 다른 이점과 상세한 내용들이 도면과 이러한 도면에 관련된 설명으로부터 명백하게 될 것이다. 도면에서 동일한 구성요소에 대하여서는 동일한 도면부호를 붙였다.
도 1 내지 도 3은 각 개별적인 SMD-LED(2)의 위치상 정확도를 체크하는 테스트 레이아웃(test layout)을 보인 설명도.
도 4a 내지 도 4c는 본 발명의 방법에 따른 단계를 보인 설명도.
도 1 내지 도 3은 각 개별적인 SMD-LED(2)의 위치상 정확도를 체크하는 테스트 레이아웃을 보인 것이다. 회로캐리어(1)는 절연영역(6)에 의하여 서로 절연된 전기 전도면(5)을 갖는다. 전도면(5)에는 단자(7)에 의하여 전력이 공급될 수 있다.
도 1은 6개의 SMD-LED(2)가 구비된 회로캐리어(1)를 보이고 있다. 여기에서는 한편으로는 회로캐리어(1)에서 SMD-LED(2)에 대한 목표위치의 편차를 확인할 수 있도록 하고 다른 한편으로는 SMD-LED(2)에 대하여 광학계(도시하지 않았음)를 고정하기 위하여 또한 사용될 수 있는 두개의 기준점(3)을 볼 수 있다. 광학계는 이 도면에 도시하지 않은 별도의 기준점에 의하여 배향된다.
도 1에서, 취부공정은 종래기술에 따른 "픽 앤 플레이스" 및 리플로 솔더링공정으로 이루어졌다. 본래는 SMD-LED(2)가 기준점(3)에 대하여 이들의 외형에 의하여 배향된다. 리플로 솔더링 공정은 SMD-LED의 위치가 흔들리는 것(blurring)을 포함하므로 이러한 상황은 SMD-LED(2)의 외형의 정연한 배향을 더 이상 포함하지 않는다. SMD-LED(2)의 발광영역(4)에 대한 배향이 전혀 이루어지지 않는다.
도 2는 6개의 SMD-LED(2)가 구비된 회로캐리어(1)를 보인 것으로, 도 1에서 보인 것과 차이가 있다면 SMD-LED(2)가 외형에 대하여 정확한 위치에서 회로캐리어(1)에 취부되지만, SMD-LED(2)의 발광영역(4)에 따라 취부가 이루어지는 것이 아니다. 이러한 회로캐리어(1)는 또한 발광영역(4)의 위치상 정확도에 관련한 조건에 부합되지 않는다.
대조적으로 도 3은 SMD-LED(2)가 회로캐리어(1)에서, 이들의 발광영역(4)에 대하여, 회로캐리어(1)의 기준점(3)에 대해 정확한 위치에 취부된 것을 보인 본 발명의 예에 의한 실시형태를 보인 것이다. 이러한 회로캐리어(1)는 발광영역(4)의 위치상 정확도에 관련된 조건에 부합한다.
도 4는 다음의 단계를 포함하는 본 발명에 따른 방법을 보인 것이다: - 모든 기준점 i(3)에 대하여 기준점 i(3)의 X-방향 및 Y-방향에서 목표위치에 대하여 편차를 확인하는 단계(도 4a), - 이송될 SMD-LED(2)의 발광영역(4)의 X,Y-방향과 각위치에서 그리고 이송될 SMD-LED(2)의 Z-방향에서 목표위치에 대한 편차를 확인하는 단계(도 4b), 및 - 회로캐리어(1)의 기준점 i(3)에 대하여 정확한 위치에서 회로캐리어(1)에 SMD-LED(2)를 취부하는 단계(도 4c).
1: 회로캐리어, 2: SMD-LED, 3: 기준점, 4: 발광영역, 5: 전도면, 6: 절연영역, 7: 단자.

Claims (14)

  1. 적어도 하나의 표면실장형 LED(SMD-LED)(2)가 회로캐리어(1)에서 회로캐리어(1)의 하나 이상의 기준점(3)을 향하도록 배치되는, 상기 적어도 하나의 SMD-LED가 구비된 회로캐리어(1)의 제조를 위한 방법에 있어서, 적어도 하나의 SMD-LED(2)에서 적어도 하나의 SMD-LED(2)의 발광영역(4)의 위치가 광학적으로 검출되고 적어도 하나의 SMD-LED(2)가 적어도 하나의 SMD-LED(2)의 발광영역(4)의 검출된 위치에 따라 회로캐리어(1)에 취부됨을 특징으로 하는 제조방법.
  2. 제1항에 있어서, 발광영역(4)의 위치가 모든 3차원(X, Y, Z)에서 결정되고 각위치가 SMD-LED(2)의 평면에 대하여 직각인 회전축선에 대하여 결정됨을 특징으로 하는 제조방법.
  3. 제1항에 있어서, 회로캐리어(1)에 대한 적어도 하나의 SMD-LED(2)의 취부가 적어도 하나의 SMD-LED(2)의 발광영역(4)의 중심점의 위치에 따라 이루어짐을 특징으로 하는 제조방법.
  4. 제1항에 있어서, 적어도 하나의 기준점(3)이 적어도 하나의 SMD-LED(2)에 대한 광학계의 배치를 위하여 사용됨을 특징으로 하는 제조방법.
  5. 제1항에 있어서, SMD-LED(2)가 LED 스펙트럼에 적응된 파장을 갖는 광원으로 조명됨을 특징으로 하는 제조방법.
  6. 제1항에 있어서, 회로캐리어(1)에 적어도 하나의 SMD-LED(2)를 취부하기 위하여 배향이 이루어진 후에 은소결물질이 적어도 하나의 SMD-LED(2)에 배치되고 적어도 하나의 SMD-LED(2)가 소결됨을 특징으로 하는 제조방법.
  7. 제6항에 있어서, 100 nm 이하의 입자크기를 갖는 은소결물질이 사용됨을 특징으로 하는 제조방법.
  8. 제7항에 있어서, 은소결물질이 20 nm 내지 40 nm 범위의 입자크기를 갖는 것으로 선택됨을 특징으로 하는 제조방법.
  9. 제1항에 있어서, 회로캐리어(1)에 적어도 하나의 SMD-LED(2)를 취부하기 위하여
    - 솔더 페이스트가 회로캐리어(1)에 도포되고,
    - 접착제가 회로캐리어(1)에 도포되며,
    - 회로캐리어(1)에 적어도 하나의 SMD-LED(2)의 배치 후에 접착제가 적어도 부분적으로 경화되고, 그리고
    - 솔더 페이스트의 리플로 솔더링이 이루어짐을
    특징으로 하는 제조방법.
  10. 하나 이상의 기준점(3)과 적어도 하나의 SMD-LED(2)를 갖는 회로캐리어(1)에 있어서, 적어도 하나의 SMD-LED(2)의 발광영역(4)의 위치가 기준점 또는 기준점들(3)을 향하여 배치되는 것을 특징으로 하는 회로캐리어(1).
  11. 제1항에 있어서, 적어도 하나의 기준점(3)이 적어도 하나의 SMD-LED(2)에 대한 광학계를 고정하기 위하여 사용됨을 특징으로 하는 제조방법.
  12. 제1항에 있어서, 회로캐리어(1)에 적어도 하나의 SMD-LED(2)를 취부하기 위하여 배향이 이루어진 후에 은소결물질이 적어도 하나의 SMD-LED(2)에 배치되고, 회로캐리어(1)에 적어도 하나의 SMD-LED(2)를 가압하는 과정 또는 가압한 결과에 의해, 또는 가압하는 과정 및 가압한 결과에 의해 SMD-LED(2)가 소결됨을 특징으로 하는 제조방법.
  13. 제6항에 있어서, 60 nm 이하의 입자 크기를 갖는 은소결물질로 사용됨을 특징으로 하는 제조방법.
  14. 제1항에 있어서, 회로캐리어(1)에 적어도 하나의 SMD-LED(2)를 취부하기 위하여
    - 솔더 페이스트가 인쇄방식으로 회로캐리어(1)에 도포되고,
    - 접착제가 적어도 하나의 SMD-LED(2)의 발광영역(4)의 검출된 위치에 따라 회로캐리어(1)에 도포되며,
    - 회로캐리어(1)에 적어도 하나의 SMD-LED(2)의 배치 후에 접착제가 적어도 부분적으로 경화되고, 그리고
    - 솔더 페이스트의 리플로 솔더링이 이루어짐을
    특징으로 하는 제조방법.
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Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT514599B1 (de) * 2013-07-05 2015-02-15 Melecs Ews Gmbh & Co Kg Verfahren zur Bestückung elektronischer Leiterplatten mit optischen Bauelementen
DE102014215606A1 (de) * 2014-08-06 2016-02-11 Automotive Lighting Reutlingen Gmbh Verfahren zum Befestigen einer SMD-Halbleiterlichtquelle auf einer Leiterplatte eines Kraftfahrzeugscheinwerfers
DE102014224494A1 (de) * 2014-12-01 2016-06-02 Automotive Lighting Reutlingen Gmbh Verfahren zur Herstellung einer Komponente einer Beleuchtungseinrichtung für ein Kraftfahrzeug
AT516638A1 (de) * 2014-12-17 2016-07-15 A B Mikroelektronik Ges Mit Beschränkter Haftung Verfahren zur Herstellung eines Schaltungsträgers und Schaltungsträger
DE102015200393A1 (de) 2015-01-14 2016-07-14 Automotive Lighting Reutlingen Gmbh Verfahren zum Anordnen eines SMD-Halbleiterlichtquellenbauteils einer Beleuchtungseinrichtung eines Kraftfahrzeugs
DE102015207709A1 (de) 2015-04-27 2016-10-27 Automotive Lighting Reutlingen Gmbh Verfahren und Vorrichtung zur Anordnung eines Schaltungsträgers mit einer Halbleiterlichtquelle in einer bestimmten Lage relativ zu einem optischen System einer Beleuchtungseinrichtung
AT517120B1 (de) * 2015-05-04 2020-01-15 Zkw Group Gmbh Verfahren zur positionierung zumindest einer elektronischen komponente auf einer leiterplatte
AT517259B1 (de) 2015-06-09 2020-01-15 Zkw Group Gmbh Verfahren zur positionsgenauen Bestückung eines Schaltungsträgers
DE102015225808B4 (de) 2015-12-17 2022-07-14 Automotive Lighting Reutlingen Gmbh Verfahren zum Anordnen eines SMD-Bauteils in Bezug zu einer Leiterplatte
DE102016201206A1 (de) 2016-01-27 2017-07-27 Automotive Lighting Reutlingen Gmbh Verfahren zur Verarbeitung einer Halteeinrichtung für ein Lichtmodul einer Beleuchtungseinrichtung eines Kraftfahrzeugs
DE102016103368A1 (de) 2016-02-25 2017-08-31 Automotive Lighting Reutlingen Gmbh Verfahren zur Herstellung einer Halteeinrichtung eines Lichtmoduls einer Kraftfahrzeugbeleuchtungseinrichtung
DE102016108260A1 (de) 2016-05-04 2017-11-09 Automotive Lighting Reutlingen Gmbh Verfahren zur Anordnung eines Schaltungsträgers und Vorrichtung zur Anordnung eines Schaltungsträgers
DE102016119792A1 (de) * 2016-10-18 2018-04-19 Automotive Lighting Reutlingen Gmbh Verfahren zur Anordnung eines Schaltungsträgers und Beleuchtungseinrichtung für ein Kraftfahrzeug mit einem nach diesem Verfahren angeordneten Schaltungsträger
DE102016223710B4 (de) * 2016-11-29 2021-01-14 Carl Zeiss Industrielle Messtechnik Gmbh Verfahren und Vorrichtung zur Herstellung einer Beleuchtungseinrichtung
WO2018105051A1 (ja) * 2016-12-07 2018-06-14 ヤマハ発動機株式会社 表面実装機、部品認識装置、部品認識方法
US10765009B2 (en) 2016-12-21 2020-09-01 Lumileds Llc Method for addressing misalignment of LEDs on a printed circuit board
CN110301172B (zh) * 2017-02-20 2022-02-01 株式会社富士 元件安装系统及元件安装方法
JP7189216B2 (ja) * 2018-07-24 2022-12-13 株式会社Fuji 部品実装方法、および作業システム
DE102019106910A1 (de) * 2019-03-19 2020-09-24 HELLA GmbH & Co. KGaA Verfahren zur Anordnung einer Leiterplatte auf einem Kühlkörper
WO2021106056A1 (ja) 2019-11-26 2021-06-03 株式会社Ｆｕｊｉ 部品実装方法および部品実装システム
JP2023000809A (ja) * 2021-06-18 2023-01-04 スタンレー電気株式会社 車載用灯具、および、その製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100053929A1 (en) 2008-08-26 2010-03-04 Jeffrey Bisberg LED Packaging Methods And LED-Based Lighting Products

Family Cites Families (180)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54105774A (en) 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
JPS55100514A (en) * 1979-01-26 1980-07-31 Nippon Telegr & Teleph Corp <Ntt> Optical communication apparatus
JPS6012786A (ja) 1983-07-01 1985-01-23 Hitachi Ltd 発光装置の製造方法
EP0144717B1 (de) 1983-11-05 1988-10-19 Zevatech AG Verfahren und Vorrichtung zur Positionierung von Bauteilen auf einem Werkstück
JPS60121224A (ja) 1983-12-05 1985-06-28 Toyo Kohan Co Ltd 開缶性に優れたイ−ジ−オ−プン缶用鋼板の製造方法
DE3445625A1 (de) 1984-12-14 1986-06-26 Pulsotronic Merten Gmbh & Co Kg, 5270 Gummersbach Verfahren zum loeten einer beidseitig mit smd-bauelementen bestueckten leiterbahnenplatine und eine nach diesem verfahren geloetete platine
US4772123A (en) 1986-11-24 1988-09-20 American Telephone And Telegraph Company, At&T Bell Laboratories Alignment of optical components
JPS63296391A (ja) * 1987-05-28 1988-12-02 Matsushita Electric Ind Co Ltd 印刷配線基板への部品取付方法
DE3827151A1 (de) 1988-01-11 1989-07-20 Martin Bernhard Dipl Ing Fh Einrichtung zum dosierten auftragen von klebstoff
JPH01209578A (ja) 1988-02-16 1989-08-23 Nec Corp Ｌｅｄアレイチップの搭載装置
DE3806738C1 (ko) 1988-03-02 1989-09-07 Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De
JPH02143491A (ja) * 1988-11-24 1990-06-01 Fujitsu Ltd 表面実装部品の実装方法
JP2679849B2 (ja) 1989-07-26 1997-11-19 松下電器産業株式会社 電子部品の実装方法およびこの方法に用いる接着剤
US4980971A (en) 1989-12-14 1991-01-01 At&T Bell Laboratories Method and apparatus for chip placement
US5173759A (en) 1990-02-06 1992-12-22 Kyocera Corporation Array of light emitting devices or photo detectors with marker regions
US5290986A (en) * 1991-10-22 1994-03-01 International Business Machines Corporation Thermally assisted shorts removal process for glass ceramic product using an RF field
JP3232628B2 (ja) 1992-03-13 2001-11-26 松下電器産業株式会社 電子部品の実装方法
JPH0624040A (ja) * 1992-07-07 1994-02-01 Oki Electric Ind Co Ltd Ｌｅｄアレイの基準パターン認識方法及びこの基準パターン認識方法を用いたｌｅｄアレイの位置検出方法
EP0622837B1 (en) 1993-04-27 2000-10-11 Nec Corporation A method of manufacturing an optical semiconductor device
JP2797958B2 (ja) * 1993-04-27 1998-09-17 日本電気株式会社 光半導体素子接合構造と接合方法
JPH06349892A (ja) * 1993-06-10 1994-12-22 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US5559727A (en) 1994-02-24 1996-09-24 Quad Systems Corporation Apparatus and method for determining the position of a component prior to placement
EP0764978B1 (de) 1995-09-11 2007-10-24 Infineon Technologies AG Verfahren zur Befestigung elektronischer Bauelemente auf einem Substrat durch Drucksintern
US5758942A (en) 1995-12-18 1998-06-02 Micron Technology, Inc. Mechanical vision system using selective wavelength and brightness illumination
JP3258221B2 (ja) 1995-12-26 2002-02-18 沖電気工業株式会社 位置合わせ用の認識マークおよびその形成方法、認識マークおよび発光部の形成の兼用マスク、位置合わせ用の認識マークを用いた位置合わせ方法
DE69724894T2 (de) 1996-03-27 2004-07-08 Assembleon N.V. Bestückungsverfahren von bauelementen auf einem substrat und bestückautomat dafür
US5857767A (en) 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
US6809421B1 (en) * 1996-12-02 2004-10-26 Kabushiki Kaisha Toshiba Multichip semiconductor device, chip therefor and method of formation thereof
DE19711138C2 (de) 1997-03-07 1998-12-17 Siemens Ag Herstellungsverfahren für ein elektrooptisches Modul
US6480223B1 (en) 1997-09-30 2002-11-12 Siemens Aktiengesellschaft Method and device for detecting the position of terminals and/or edge of components
KR100361219B1 (ko) 1997-09-30 2002-11-22 지멘스 악티엔게젤샤프트 부품의 연결부 또는 에지부의 위치를 식별하는 방법 및 장치
US6040895A (en) 1997-10-08 2000-03-21 Siemens Aktiengesellschaft Method and device for controlled illumination of an object for improving identification of an object feature in an image of the object
US6359694B1 (en) 1997-11-10 2002-03-19 Siemens Aktiengesellschaft Method and device for identifying the position of an electrical component or terminals thereof, and equipping head employing same
JP3668383B2 (ja) 1998-02-27 2005-07-06 松下電器産業株式会社 電子部品実装装置
JP2000022396A (ja) 1998-06-30 2000-01-21 Sony Corp 電子部品実装装置
JP3678007B2 (ja) 1998-07-10 2005-08-03 松下電器産業株式会社 電子部品実装装置における電子部品認識装置および電子部品認識方法
JP2000164626A (ja) 1998-09-25 2000-06-16 Fuji Photo Film Co Ltd 部品のボンディング方法および装置
EP1003212A3 (en) 1998-11-18 2003-11-19 Fuji Photo Film Co., Ltd. Method of and apparatus for bonding light-emitting element
JP2000150970A (ja) * 1998-11-18 2000-05-30 Fuji Photo Film Co Ltd 発光素子のボンディング方法および装置
JP2000183404A (ja) 1998-12-14 2000-06-30 Fuji Photo Film Co Ltd 発光素子アレイ、そのボンディング方法および装置
DE19859669A1 (de) * 1998-12-23 2000-06-29 Heidenhain Gmbh Dr Johannes Integrierter optoelektronischer Sensor und Verfahren zu dessen Herstellung
JP4328409B2 (ja) 1999-04-12 2009-09-09 富士フイルム株式会社 発光素子のボンディング装置
WO2001065904A1 (de) 2000-03-01 2001-09-07 Siemens Aktiengesellschaft Verfahren und vorrichtung zur bestimmung der abhollage von elektrischen bauteilen in einer bestückvorrichtung
JP2002139451A (ja) 2000-08-04 2002-05-17 Nikon Corp 表面検査装置
JP2002365019A (ja) * 2001-06-06 2002-12-18 Fujitsu Ltd 発光素子の発光点位置検出装置
US6576488B2 (en) * 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
DE10128476C2 (de) 2001-06-12 2003-06-12 Siemens Dematic Ag Optische Sensorvorrichtung zur visuellen Erfassung von Substraten
DE10129743C2 (de) 2001-06-20 2003-05-08 Daimler Chrysler Ag Fahrzeugscheinwerfer, mit einer Anzahl von elektronischen Leuchtelementen als Lichtquelle
JP2003110245A (ja) * 2001-09-28 2003-04-11 Ibiden Co Ltd 光学素子実装用基板の製造方法、光学素子実装用基板及び光学素子
JP2003152260A (ja) * 2001-11-09 2003-05-23 Sharp Corp 半導体レーザ装置およびそれを用いた光ピックアップ装置、ならびに半導体レーザ装置の製造装置および製造方法
DE10162270B4 (de) 2001-12-18 2004-05-13 Siemens Ag Optische Sensorvorrichtung
JP2003298294A (ja) 2002-04-03 2003-10-17 Fuji Mach Mfg Co Ltd 電子回路部品装着システム
US7016525B2 (en) 2002-05-02 2006-03-21 Mitutoyo Corporation Systems and methods for continuously varying wavelength illumination
US8093144B2 (en) * 2002-05-24 2012-01-10 Massachusetts Institute Of Technology Patterning of nanostructures
JP3657930B2 (ja) 2002-07-05 2005-06-08 パイオニアプラズマディスプレイ株式会社 プラズマディスプレイパネルの製造方法、蛍光体層の検査方法及び蛍光体層の検査装置
US9955551B2 (en) * 2002-07-12 2018-04-24 Yechezkal Evan Spero Detector controlled illuminating system
US8100552B2 (en) * 2002-07-12 2012-01-24 Yechezkal Evan Spero Multiple light-source illuminating system
JP2004079750A (ja) 2002-08-16 2004-03-11 Fuji Photo Film Co Ltd 発光装置
JP4357168B2 (ja) 2002-11-20 2009-11-04 株式会社東芝 レーザダイオードの発光点位置の測定方法、測定装置、およびマウント装置
US7084353B1 (en) 2002-12-11 2006-08-01 Emc Corporation Techniques for mounting a circuit board component to a circuit board
JP2004207655A (ja) 2002-12-26 2004-07-22 Matsushita Electric Ind Co Ltd 金属ベース基板および発光ユニット
JP2004219786A (ja) * 2003-01-16 2004-08-05 Hitachi Ltd 半導体光回路装置製造方法および半導体光回路製造装置、および光システム
JP4106301B2 (ja) 2003-04-23 2008-06-25 Ｊｕｋｉ株式会社 部品認識方法及び装置
ATE357061T1 (de) * 2003-05-19 2007-04-15 Fraunhofer Ges Forschung Optoelektronisches bauelement mit einer leuchtdiode und einer mehrzahl von lichtsensoren
JP4356383B2 (ja) * 2003-07-03 2009-11-04 パナソニック電工株式会社 発光装置の製造方法
JP2005064303A (ja) 2003-08-15 2005-03-10 Sony Corp 光電気複合基板装置及びその製造方法
CN100420109C (zh) 2003-09-22 2008-09-17 株式会社村田制作所 用于安装发光元件的方法和设备
JP4792726B2 (ja) * 2003-10-30 2011-10-12 日亜化学工業株式会社 半導体素子用支持体の製造方法
JP4047266B2 (ja) 2003-11-19 2008-02-13 株式会社小糸製作所 灯具
US7688309B2 (en) * 2004-07-06 2010-03-30 Logitech Europe S.A. Optical displacement module and method to reduce the size of an optical pointing device thereof
JP5122062B2 (ja) 2004-09-22 2013-01-16 株式会社光波 発光装置
DE102004056252A1 (de) 2004-10-29 2006-05-04 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung, Kfz-Scheinwerfer und Verfahren zur Herstellung einer Beleuchtungseinrichtung
JP2006138679A (ja) 2004-11-10 2006-06-01 Matsushita Electric Ind Co Ltd 基板形状検出装置およびそれを用いたデバイス実装装置ならびにデバイス実装方法
JP4443397B2 (ja) 2004-12-13 2010-03-31 シチズン電子株式会社 光半導体素子及び光半導体装置並びに光半導体素子の製造方法
DE112005003841B4 (de) * 2004-12-14 2016-03-03 Seoul Viosys Co., Ltd. Licht emittierendes Bauelement mit einer Mehrzahl Licht emittierender Zellen
EP1675453A3 (de) 2004-12-22 2007-07-11 Siemens Aktiengesellschaft Vorrichtung zum Beleuchten von Objekten, Sensorvorrichtung
US7600220B2 (en) * 2005-01-11 2009-10-06 Worksoft, Inc. Extensible execution language
KR20070098953A (ko) 2005-01-28 2007-10-05 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 차량용 헤드램프
DE102005005896B4 (de) * 2005-02-09 2011-01-13 Siemens Electronics Assembly Systems Gmbh & Co. Kg Verwendung einer Beleuchtungsvorrichtung in einem Bestückautomaten
DE102005009317B4 (de) 2005-02-18 2007-05-31 Atmel Germany Gmbh Verfahren und Vorrichtung zur Bestimmung einer Laserschwelle einer Laserdiode
CN101982891A (zh) * 2005-02-28 2011-03-02 电气化学工业株式会社 荧光体及其制造方法及使用了该荧光体的发光元件
EP1864339A4 (en) * 2005-03-11 2010-12-29 Seoul Semiconductor Co Ltd LIGHT-EMITTING DIODE DIODE WITH PHOTO-EMITTING CELL MATRIX
US20060211240A1 (en) * 2005-03-18 2006-09-21 Taiwan Semiconductor Manufacturing Co., Ltd. Method of enhancing adhesion between dielectric layers
KR100702969B1 (ko) * 2005-04-19 2007-04-03 삼성전자주식회사 더미 솔더 볼을 갖는 ｂｇａ형 반도체 칩 패키지의 기판 실장 구조
JP2006310653A (ja) 2005-04-28 2006-11-09 Toyoda Gosei Co Ltd Ｌｅｄランプ、および基板搭載部品の実装方法
US7429786B2 (en) * 2005-04-29 2008-09-30 Stats Chippac Ltd. Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides
JP2007087608A (ja) 2005-09-20 2007-04-05 Sharp Corp 光源装置および表示装置
US8398448B2 (en) 2005-11-09 2013-03-19 Koninklijke Electronics N.V. Assembling lighting elements onto a substrate
US20070187818A1 (en) * 2006-02-15 2007-08-16 Texas Instruments Incorporated Package on package design a combination of laminate and tape substrate
US7829899B2 (en) 2006-05-03 2010-11-09 Cree, Inc. Multi-element LED lamp package
KR101221683B1 (ko) * 2006-05-10 2013-01-11 덴끼 가가꾸 고교 가부시키가이샤 사이알론 형광체 및 그 제조 방법 및 그것을 이용한 조명기구 및 발광소자
US8735920B2 (en) * 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
AT504577B1 (de) 2006-11-24 2009-06-15 Zizala Lichtsysteme Gmbh Led-lichtquellensystem
JP2008145300A (ja) 2006-12-11 2008-06-26 Sharp Corp 蛍光体層厚み判定方法および発光装置の製造方法
JP4895994B2 (ja) * 2006-12-28 2012-03-14 株式会社日立製作所 金属粒子を用いた接合方法及び接合材料
JP5380774B2 (ja) 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
JP5151150B2 (ja) * 2006-12-28 2013-02-27 株式会社日立製作所 導電性焼結層形成用組成物、これを用いた導電性被膜形成法および接合法
DE102007015492B4 (de) * 2007-01-30 2011-03-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Beleuchtungsvorrichtung für eine Bilderfassungseinrichtung am distalen Ende eines Endoskops
WO2008124397A1 (en) * 2007-04-03 2008-10-16 David Fishbaine Inspection system and method
KR101109988B1 (ko) * 2007-05-22 2012-03-14 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 형광체 및 그의 제조방법, 및 그것을 사용한 발광장치
US7638814B2 (en) 2007-06-19 2009-12-29 Philips Lumileds Lighting Company, Llc Solderless integrated package connector and heat sink for LED
TWM324300U (en) * 2007-06-29 2007-12-21 Chia-Ming Tu Translucent LED array display device
DE102007037822A1 (de) 2007-08-10 2009-02-12 Osram Gesellschaft mit beschränkter Haftung Beleuchtungsvorrichtung
WO2009025016A1 (ja) 2007-08-17 2009-02-26 Fujitsu Limited 部品実装装置及び方法
US8359734B2 (en) 2007-09-05 2013-01-29 Cisco Technology, Inc. Alignment jig for electronic component
WO2009031903A1 (en) 2007-09-05 2009-03-12 Tandberg Telecom As Device and method for mounting an electronic component
EP2185954A1 (en) * 2007-09-07 2010-05-19 Datalogic Scanning Group S.r.l. Image acquisition device and optical component thereof
US9593810B2 (en) 2007-09-20 2017-03-14 Koninklijke Philips N.V. LED package and method for manufacturing the LED package
JP5017040B2 (ja) 2007-09-27 2012-09-05 三菱レイヨン株式会社 プリフォームの製造方法および製造装置
JP4450046B2 (ja) * 2007-10-05 2010-04-14 ソニー株式会社 電子部品基板の製造方法
US7524087B1 (en) * 2007-11-16 2009-04-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Optical device
US7583284B2 (en) * 2008-01-29 2009-09-01 Universal Scientific Industrial Co., Ltd. Method for arranging print head chips
CN100552831C (zh) * 2008-02-27 2009-10-21 中南大学 基于半导体芯片粘结用低温烧结型导电浆料及其制备工艺
JP5055193B2 (ja) 2008-04-24 2012-10-24 日東電工株式会社 光電気混載基板の製造方法
US8742558B2 (en) * 2008-05-21 2014-06-03 General Electric Company Component protection for advanced packaging applications
KR100990641B1 (ko) 2008-06-04 2010-10-29 삼성엘이디 주식회사 Ｌｅｄ 검사 장치 및 그 방법
JP2010010437A (ja) * 2008-06-27 2010-01-14 Stanley Electric Co Ltd 光半導体装置
JP2010044967A (ja) * 2008-08-13 2010-02-25 Sumitomo Electric Ind Ltd 導電性接着剤およびそれを用いたｌｅｄ基板
KR101537795B1 (ko) * 2009-03-31 2015-07-22 서울반도체 주식회사 Ｌｅｄ 패키지 제조 방법 및 그 ｌｅｄ 패키지
US20120081618A1 (en) 2009-06-15 2012-04-05 Sharp Kabushiki Kaisha Light emitting module, illuminating device, display device, and television receiving device
WO2011003948A2 (en) 2009-07-08 2011-01-13 Henkel Ag & Co. Kgaa Electrically conductive adhesives
KR101047151B1 (ko) 2009-07-13 2011-07-07 한국과학기술원 애드혹 네트워크에서의 그룹 협력 전송방법
JP2011040247A (ja) 2009-08-10 2011-02-24 Koito Mfg Co Ltd 車両用前照灯の灯具ユニット
DE102009028499A1 (de) 2009-08-13 2011-02-17 Endress + Hauser Gmbh + Co. Kg Verfahren zur Bestückung und zum Löten von gemischt bestückbaren Leiterplatten
JP5258707B2 (ja) * 2009-08-26 2013-08-07 株式会社東芝 半導体発光素子
US8764220B2 (en) * 2010-04-28 2014-07-01 Cooper Technologies Company Linear LED light module
KR101131605B1 (ko) 2009-12-02 2012-05-24 엔브이에이치코리아(주) 차량용 고흡음성 천정재
CN201629347U (zh) 2010-02-01 2010-11-10 常州欧密格光电科技有限公司 贴片led
US8901583B2 (en) * 2010-04-12 2014-12-02 Cree Huizhou Opto Limited Surface mount device thin package
EP2564112A4 (en) * 2010-04-27 2014-12-31 Cooper Technologies Co NETWORKABLE LINEAR LED SYSTEM
DE102010028949A1 (de) 2010-05-12 2011-11-17 Osram Gesellschaft mit beschränkter Haftung Scheinwerfermodul
TWM393806U (en) * 2010-05-31 2010-12-01 Hon Hai Prec Ind Co Ltd Light emitting diode lead frame
JP5701523B2 (ja) 2010-06-22 2015-04-15 日東電工株式会社 半導体発光装置
DE102010031939B4 (de) 2010-07-22 2012-05-24 Asm Assembly Systems Gmbh & Co. Kg Dispensersystem für einen Bestückautomaten, Bestückautomat sowie Verfahren zum Aufbringen eines Dispensermediums auf Bauelemente
DE102010038405A1 (de) * 2010-07-26 2012-01-26 Osram Opto Semiconductors Gmbh Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
JP5338772B2 (ja) 2010-08-26 2013-11-13 パナソニック株式会社 部品実装用装置および撮像用の照明装置ならびに照明方法
JP5526452B2 (ja) 2010-09-10 2014-06-18 スタンレー電気株式会社 車両用灯具ユニット
WO2012057038A1 (ja) * 2010-10-26 2012-05-03 東芝ライテック株式会社 発光モジュール、および照明器具
JP5434884B2 (ja) 2010-10-27 2014-03-05 パナソニック株式会社 電子部品実装装置および電子部品実装方法
KR20110060868A (ko) * 2011-01-25 2011-06-08 삼성엘이디 주식회사 방열 기판과 그 제조 방법, 방열 기판을 구비한 발광다이오드 패키지 모듈과 그 제조 방법
US20120202300A1 (en) * 2011-02-03 2012-08-09 Texas Instruments Incorporated Die bonder including automatic bond line thickness measurement
JP5810553B2 (ja) * 2011-02-28 2015-11-11 三菱マテリアル株式会社 接合用積層体および接合体
JP4940363B1 (ja) * 2011-02-28 2012-05-30 株式会社東芝 半導体発光素子及び半導体発光装置
WO2012116470A1 (en) * 2011-03-02 2012-09-07 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device
JP5658600B2 (ja) 2011-03-07 2015-01-28 スタンレー電気株式会社 発光装置
WO2012128094A1 (ja) 2011-03-18 2012-09-27 シャープ株式会社 発光装置の固定方法および発光装置
EP2689642B1 (en) * 2011-03-22 2018-02-28 Philips Lighting Holding B.V. Light output device and method of manufacturing thereof
KR101856533B1 (ko) 2011-03-28 2018-05-14 삼성전자주식회사 발광소자 검사 장치 및 그 검사 방법
JP2012238410A (ja) 2011-05-10 2012-12-06 Panasonic Corp Ｌｅｄ照明基板の製造方法
JP2012238411A (ja) 2011-05-10 2012-12-06 Panasonic Corp Ｌｅｄ照明基板の製造方法
JP2012248708A (ja) * 2011-05-27 2012-12-13 Ccs Inc Ｌｅｄパッケージ及びｌｅｄパッケージの製造方法
US8546900B2 (en) * 2011-06-09 2013-10-01 Optiz, Inc. 3D integration microelectronic assembly for integrated circuit devices
KR20130000689A (ko) 2011-06-23 2013-01-03 주식회사 케이티 케이블 포설기
KR101248143B1 (ko) * 2011-06-24 2013-03-28 주식회사 에스에프이 영상 처리 모듈 및 이를 이용한 엘이디 칩 본딩 장치
KR20130006970A (ko) 2011-06-28 2013-01-18 (주)세미머티리얼즈 발광소자 및 발광소자의 제조방법
DE102011109226A1 (de) 2011-08-02 2013-02-07 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Verbindungsschicht mit einem Sintermaterial, Verwendung einer Mischung zur Herstellung einer Verbindungsschicht, Verbindungsschicht mit einem Sintermaterial und Bauelement mit einer Verbindungsschicht
AT511761B1 (de) 2011-08-08 2014-02-15 Zizala Lichtsysteme Gmbh Led-lichtquellenmodul für einen fahrzeugscheinwerfer sowie fahrzeugscheinwerfer und fahrzeugscheinwerfersystem
US8780576B2 (en) * 2011-09-14 2014-07-15 Invensas Corporation Low CTE interposer
JP5566359B2 (ja) * 2011-09-29 2014-08-06 株式会社日立ハイテクインスツルメンツ 部品装着装置
AT512545B1 (de) 2012-02-16 2017-05-15 Zkw Group Gmbh Statusanzeige für den Zustand einer betriebsrelevanten Komponente eines Kraftfahrzeugs
DE102012101818B4 (de) * 2012-03-05 2018-11-08 Osram Opto Semiconductors Gmbh Optoelektronisches Modul mit einem Kodierelement in einer Aussparung, Beleuchtungseinrichtung mit diesem Modul und Verfahren zu seiner Herstellung
US10369667B2 (en) * 2012-03-05 2019-08-06 Namics Corporation Sintered body made from silver fine particles
TW201339534A (zh) 2012-03-16 2013-10-01 Hon Hai Prec Ind Co Ltd 發光二極體貼片機及其對位系統
TWI499031B (zh) * 2012-03-22 2015-09-01 Kun Hsin Technology Inc 發光裝置
JP5664625B2 (ja) * 2012-10-09 2015-02-04 三菱マテリアル株式会社 半導体装置、セラミックス回路基板及び半導体装置の製造方法
CN102935518B (zh) * 2012-10-31 2014-08-06 哈尔滨工业大学深圳研究生院 一种芯片贴装用纳米银浆及其制备方法
WO2014123145A1 (ja) * 2013-02-08 2014-08-14 ウシオ電機株式会社 蛍光光源装置
TW201511347A (zh) * 2013-09-10 2015-03-16 Lingsen Precision Ind Ltd 發光二極體封裝結構及其製造方法
DE102013018784B4 (de) 2013-11-08 2016-02-18 Audi Ag Fahrzeug mit Beleuchtungsvorrichtung mit einer längsförmigen Beleuchtungseinrichtung
US20160380172A1 (en) * 2013-11-28 2016-12-29 Osram Opto Semiconductors Gmbh Component arrangement and method for producing a component arrangement
JP6450923B2 (ja) * 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置
DE102014101783B4 (de) * 2014-02-13 2021-08-19 HELLA GmbH & Co. KGaA Verfahren zum Aufbau eines LED- Lichtmoduls
DE102014101901B4 (de) * 2014-02-14 2015-10-15 Asm Assembly Systems Gmbh & Co. Kg Optisches Vermessen eines Bauelementes mit an gegenüberliegenden Seiten vorhandenen strukturellen Merkmalen
US20150311104A1 (en) * 2014-04-24 2015-10-29 Avago Technologies General Ip (Singapore) Pte. Ltd. Method and system for aligning and orienting dies
WO2015195272A1 (en) * 2014-06-20 2015-12-23 Applied Materials, Inc. Methods for reducing semiconductor substrate strain variation
US9666516B2 (en) * 2014-12-01 2017-05-30 General Electric Company Electronic packages and methods of making and using the same
US9633883B2 (en) * 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
US9759851B2 (en) * 2015-04-01 2017-09-12 Microsoft Technology Licensing, Llc Thermal expansion compensated backlight illumination
US11437775B2 (en) * 2015-08-19 2022-09-06 Kyocera Sld Laser, Inc. Integrated light source using a laser diode
US10062588B2 (en) * 2017-01-18 2018-08-28 Rohinni, LLC Flexible support substrate for transfer of semiconductor devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100053929A1 (en) 2008-08-26 2010-03-04 Jeffrey Bisberg LED Packaging Methods And LED-Based Lighting Products

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