JP6932164B2 - 電子部品を貼り付ける方法 - Google Patents
電子部品を貼り付ける方法 Download PDFInfo
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- JP6932164B2 JP6932164B2 JP2019160831A JP2019160831A JP6932164B2 JP 6932164 B2 JP6932164 B2 JP 6932164B2 JP 2019160831 A JP2019160831 A JP 2019160831A JP 2019160831 A JP2019160831 A JP 2019160831A JP 6932164 B2 JP6932164 B2 JP 6932164B2
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- H01L24/89—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86
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- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H05K13/04—Mounting of components, e.g. of leadless components
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0186—Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
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- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
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Description
Claims (14)
- 物体の表面に複数の電子部品を貼り付ける方法であって、
支持体上に部品ステンシルを置き、該部品ステンシルは、前記複数の電子部品に対応する複数の開口を有し、
前記複数の電子部品を、前記電子部品の頂面を前記支持体上にして、前記部品ステンシルの対応する前記開口内に配置し、
前記部品ステンシル上にコンタクト材料ステンシルを位置付け、該コンタクト材料ステンシルは、前記複数の電子部品の底面上の複数のコンタクト領域に対応する複数の開口を有し、
前記コンタクト材料ステンシルの対応する前記開口内に配置された前記複数の電子部品の前記複数のコンタクト領域上に、コンタクト材料を塗布し、該コンタクト材料は、電気コンタクトを提供することができ、特に、はんだペースト及び/又は導電性接着剤を有し、
前記コンタクト材料ステンシルを前記部品ステンシルから取り外し、
前記部品ステンシルを前記支持体から取り外し、
前記支持体上に配置された前記複数の電子部品を前記表面に当て、前記コンタクト材料が、前記複数の電子部品を前記物体の前記表面に接続する、
ことを有する方法。 - 前記複数の電子部品は、前記支持体上に取り外し可能に取り付けられ、
特に、前記複数の電子部品は、前記複数の電子部品が前記支持体上に取り外し可能に取り付けられている間に前記表面に当てられる、
請求項1に記載の方法。 - 前記支持体上に取り外し可能に取り付けられている前記複数の電子部品を前記表面に当てることは、前記表面の形状に従うように前記支持体を曲げることを有する、
請求項2に記載の方法。 - 前記表面の形状に従うように及び/又は前記支持体に取り付けられた前記複数の電子部品を前記表面上に配置するように前記支持体を曲げるために、少なくとも1つの保持装置が使用される、
請求項3に記載の方法。 - 前記支持体は、少なくとも1つの所定の曲げ線、特に、材料削減又は目打ち線などの材料を弱くした少なくとも1つの所定の曲げ線を有する、
請求項3又は4に記載の方法。 - 前記複数の電子部品を前記表面に当てることは、前記表面への前記複数の電子部品の電気コンタクトを構築することを有する、
請求項1乃至5のいずれか一項に記載の方法。 - 前記複数の電子部品を前記支持体に取り外し可能に取り付けるために、前記支持体に接着剤が設けられる、
請求項3乃至6のいずれか一項に記載の方法。 - 前記接着剤は、硬化性であり、特にUV硬化性である、
請求項7に記載の方法。 - 前記支持体はポリイミドを有する、
請求項7又は8に記載の方法。 - 前記複数の電子部品を前記表面に当てることに先立って、前記コンタクト材料ステンシルが前記部品ステンシルから取り外され、且つ前記部品ステンシルが前記支持体から取り外される、
請求項1乃至9のいずれか一項に記載の方法。 - 前記表面は、互いに隣り合わせて配置され且つ/或いは互いに角度を付けて配置された少なくとも2つのマウント面を有し、
特に、前記複数の電子部品は、前記支持体上で前記少なくとも2つのマウント面に対応する少なくとも2つのグループにて配置される、
請求項1乃至10のいずれか一項に記載の方法。 - 前記表面は、3つのマウント面を有し、該3つのマウント面のうちの1つが、他の2つのマウント面の間に配置され、特に、他の2つのマウント面に対して実質的に垂直に配置されている、
請求項11に記載の方法。 - 前記複数の電子部品は複数の発光ダイオードを有する、
請求項1乃至12のいずれか一項に記載の方法。 - 請求項1乃至13のいずれか一項に記載の方法で使用されるシステムであって、
支持体であり、複数の電子部品が貼り付けられる表面に形状が従うことができる、支持体と、
複数の電子部品に対応する複数の開口を有する部品ステンシルと、
前記複数の電子部品の複数のコンタクト領域に対応する複数の開口を有するコンタクト材料ステンシルと、
を有するシステム。
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EP18193210.4 | 2018-09-07 | ||
EP18193210.4A EP3621417B1 (en) | 2018-09-07 | 2018-09-07 | Method for applying electronic components |
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US20230389190A1 (en) * | 2022-04-21 | 2023-11-30 | Skyworks Solutions, Inc. | System and method for normalizing solder interconnects in a circuit package module after removal from a test board |
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JPS631318U (ja) | 1986-06-19 | 1988-01-07 | ||
JPH04123575U (ja) | 1991-04-25 | 1992-11-09 | 株式会社東芝 | チツプ部品半田塗布装置 |
JPH07212015A (ja) * | 1994-01-12 | 1995-08-11 | Matsushita Electric Ind Co Ltd | 電子部品実装方法および電子部品実装機 |
US5797673A (en) * | 1995-11-22 | 1998-08-25 | Nsi Enterprises, Inc. | Emergency lighting unit/exit sign combination |
US6567010B1 (en) * | 2000-03-31 | 2003-05-20 | Fong-Jei Lin | Traffic signal head with multiple LED illumination sources |
DE10121578C2 (de) * | 2001-05-03 | 2003-04-10 | Infineon Technologies Ag | Verfahren und Bestückungssystem zum Bestücken eines Substrats mit elektronischen Bauteilen |
US7156017B1 (en) * | 2006-04-25 | 2007-01-02 | Robert Louis Ingraselino | Method creating a picture by different layered stencils |
DE102006033873A1 (de) * | 2006-07-21 | 2008-01-24 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Strahlungsemittierende Einrichtung mit mehreren strahlungs-emittierenden Bauelementen und Beleuchtungseinrichtung |
JP5136552B2 (ja) * | 2007-06-13 | 2013-02-06 | 富士通株式会社 | キャリアテープから電子部品を取り出す方法 |
CN102143952A (zh) * | 2008-12-25 | 2011-08-03 | 松下电器产业株式会社 | 引线、配线构件、封装元件、附有树脂的金属元件、树脂密封的半导体器件、及它们的制造方法 |
US20130170936A1 (en) * | 2012-01-03 | 2013-07-04 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Self-Aligning Pick and Place Collet for Tape and Reel Machine |
JP6177907B2 (ja) * | 2013-06-11 | 2017-08-09 | 富士機械製造株式会社 | 部品実装機 |
JP6103054B2 (ja) * | 2013-06-18 | 2017-03-29 | 株式会社村田製作所 | 樹脂多層基板の製造方法 |
US20160148472A1 (en) * | 2014-11-25 | 2016-05-26 | Denovo Lighting, Llc | Exit sign illuminated by color leds |
US9865479B2 (en) * | 2016-04-15 | 2018-01-09 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method of attaching components to printed cirucuit board with reduced accumulated tolerances |
US10864766B2 (en) * | 2017-07-18 | 2020-12-15 | Crayola, Llc | Spiral art device |
EP3621417B1 (en) * | 2018-09-07 | 2023-01-11 | Lumileds LLC | Method for applying electronic components |
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CN110890451B (zh) | 2023-05-02 |
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US10999936B2 (en) | 2021-05-04 |
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