KR101436947B1 - 통합 센서 시스템 - Google Patents

통합 센서 시스템 Download PDF

Info

Publication number
KR101436947B1
KR101436947B1 KR1020127020227A KR20127020227A KR101436947B1 KR 101436947 B1 KR101436947 B1 KR 101436947B1 KR 1020127020227 A KR1020127020227 A KR 1020127020227A KR 20127020227 A KR20127020227 A KR 20127020227A KR 101436947 B1 KR101436947 B1 KR 101436947B1
Authority
KR
South Korea
Prior art keywords
capacitive
capacitive sensors
conductive
capacitive sensor
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020127020227A
Other languages
English (en)
Korean (ko)
Other versions
KR20120102802A (ko
Inventor
귀도 드 보레
요니 요안네스 야코버스 반 바르
카우스투브흐 프라보드흐 파드예
로버트 모셀
니엘스 베르게르
스테인 빌럼 헤르만 카렐 스텐브린크
Original Assignee
마퍼 리쏘그라피 아이피 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마퍼 리쏘그라피 아이피 비.브이. filed Critical 마퍼 리쏘그라피 아이피 비.브이.
Publication of KR20120102802A publication Critical patent/KR20120102802A/ko
Application granted granted Critical
Publication of KR101436947B1 publication Critical patent/KR101436947B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/023—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D3/00—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups
    • G01D3/028—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure
    • G01D3/036—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G01D5/241—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
    • G01D5/2417—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying separation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G03F9/7053—Non-optical, e.g. mechanical, capacitive, using an electron beam, acoustic or thermal waves

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
KR1020127020227A 2009-12-31 2010-12-29 통합 센서 시스템 Expired - Fee Related KR101436947B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29141109P 2009-12-31 2009-12-31
US61/291,411 2009-12-31
PCT/EP2010/070890 WO2011080310A1 (en) 2009-12-31 2010-12-29 Integrated sensor system

Publications (2)

Publication Number Publication Date
KR20120102802A KR20120102802A (ko) 2012-09-18
KR101436947B1 true KR101436947B1 (ko) 2014-09-02

Family

ID=43640437

Family Applications (5)

Application Number Title Priority Date Filing Date
KR1020127020224A Withdrawn KR20120102148A (ko) 2009-12-31 2010-12-29 노출 방법
KR1020147032749A Active KR101577717B1 (ko) 2009-12-31 2010-12-29 용량성 감지 시스템
KR1020127019998A Active KR101454727B1 (ko) 2009-12-31 2010-12-29 차동 쌍들을 가진 용량성 감지 시스템
KR1020127020227A Expired - Fee Related KR101436947B1 (ko) 2009-12-31 2010-12-29 통합 센서 시스템
KR1020127020000A Active KR101676831B1 (ko) 2009-12-31 2010-12-29 용량성 감지 시스템

Family Applications Before (3)

Application Number Title Priority Date Filing Date
KR1020127020224A Withdrawn KR20120102148A (ko) 2009-12-31 2010-12-29 노출 방법
KR1020147032749A Active KR101577717B1 (ko) 2009-12-31 2010-12-29 용량성 감지 시스템
KR1020127019998A Active KR101454727B1 (ko) 2009-12-31 2010-12-29 차동 쌍들을 가진 용량성 감지 시스템

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020127020000A Active KR101676831B1 (ko) 2009-12-31 2010-12-29 용량성 감지 시스템

Country Status (8)

Country Link
US (5) US8638109B2 (enExample)
EP (4) EP2519801B1 (enExample)
JP (5) JP5784630B2 (enExample)
KR (5) KR20120102148A (enExample)
CN (6) CN102753931B (enExample)
RU (4) RU2573447C2 (enExample)
TW (5) TWI512265B (enExample)
WO (4) WO2011080308A1 (enExample)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8151995B2 (en) * 2008-02-04 2012-04-10 Texas Instruments Incorporated Methods and apparatus to prevent mold compound feeder jams in systems to package integrated circuits
US8638109B2 (en) * 2009-12-31 2014-01-28 Mapper Lithography Ip B.V. Capacitive sensing system with differential pairs
US8688393B2 (en) * 2010-07-29 2014-04-01 Medtronic, Inc. Techniques for approximating a difference between two capacitances
GB201016556D0 (en) * 2010-10-01 2010-11-17 Senergy Technology Ltd Methods for providing for correcting data and associated apparatus
JP5353991B2 (ja) * 2010-11-30 2013-11-27 株式会社日本自動車部品総合研究所 静電容量式乗員検知装置
KR20120080923A (ko) * 2011-01-10 2012-07-18 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
TWI571707B (zh) * 2011-04-22 2017-02-21 瑪波微影Ｉｐ公司 用於處理諸如晶圓的標靶的微影系統，用於操作用於處理諸如晶圓的標靶的微影系統的方法，以及使用在此種微影系統的基板
CN103649688B (zh) 2011-06-30 2017-02-22 迈普尔平版印刷Ip有限公司 用于电容式测量系统的有源屏蔽
US8933712B2 (en) 2012-01-31 2015-01-13 Medtronic, Inc. Servo techniques for approximation of differential capacitance of a sensor
JP5909822B2 (ja) * 2012-02-27 2016-04-27 アルプス・グリーンデバイス株式会社 電流センサ及びその作製方法
US8961228B2 (en) * 2012-02-29 2015-02-24 Tyco Electronics Corporation Electrical connector having shielded differential pairs
US9760028B2 (en) 2012-03-08 2017-09-12 Mapper Lithography Ip B.V. Lithography system and method for processing a target, such as a wafer
TWI584334B (zh) 2012-03-08 2017-05-21 瑪波微影Ｉｐ公司 具有準直感測器和射束測量感測器的帶電粒子微影系統
JP5934546B2 (ja) * 2012-03-29 2016-06-15 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法
DE102012205122B4 (de) * 2012-03-29 2024-06-20 Robert Bosch Gmbh Kapazitives Ortungsgerät
JP5981271B2 (ja) * 2012-08-28 2016-08-31 日置電機株式会社 電圧測定用センサおよび電圧測定装置
JP5981270B2 (ja) * 2012-08-28 2016-08-31 日置電機株式会社 電圧測定用センサおよび電圧測定装置
US9692875B2 (en) * 2012-08-31 2017-06-27 Analog Devices, Inc. Grip detection and capacitive gesture system for mobile devices
TWI464371B (zh) * 2012-10-22 2014-12-11 Pixart Imaging Inc 微機電裝置與製作方法
WO2014113936A1 (en) * 2013-01-23 2014-07-31 Nokia Corporation Method and apparatus for limiting a sensing region of a capacitive sensing electrode
US9835573B2 (en) * 2013-03-15 2017-12-05 Ilium Technology Inc. Apparatus and method for measuring electrical properties of matter
TW201504631A (zh) * 2013-07-23 2015-02-01 Mpi Corp 光電元件檢測用之高頻探針卡
NL2013437B1 (en) * 2013-09-07 2016-05-18 Mapper Lithography Ip Bv Target processing unit.
US9739816B2 (en) * 2013-11-27 2017-08-22 Analog Devices, Inc. Capacitive sensor with differential shield
US9952266B2 (en) 2014-02-14 2018-04-24 Witricity Corporation Object detection for wireless energy transfer systems
JP6452140B2 (ja) 2014-02-19 2019-01-16 本田技研工業株式会社 距離センサ及び計測方法
KR102224824B1 (ko) * 2014-05-30 2021-03-08 삼성전자 주식회사 Ito 전극패턴을 포함하는 전자장치 및 그 전자장치의 제조방법
US10139869B2 (en) 2014-07-23 2018-11-27 Analog Devices, Inc. Capacitive sensors for grip sensing and finger tracking
US9811218B2 (en) 2014-08-16 2017-11-07 Synaptics Incorporated Location based object classification
EP3215869B1 (en) 2014-11-03 2021-12-08 Illinois Tool Works Inc. Transmissive front-face heater for vehicle sensor system
UA114724C2 (uk) * 2014-12-23 2017-07-25 Микола Іванович Єпіфанов Автономний модульний пристрій для підвищення безпеки транспортного засобу і кластерний пристрій для його реалізації
DE112016001348T5 (de) * 2015-03-23 2018-02-15 Iee International Electronics & Engineering S.A. Kapazitives Erfassungssystem mit Gerätediagnosekonzept zur Erfassung einer Sensorunterbrechung
KR101679204B1 (ko) * 2015-04-22 2016-11-25 에이디반도체(주) 감지신호 전달 장치 및 이를 이용한 정전용량 센서 장치
CN105185283B (zh) * 2015-10-23 2017-12-08 京东方科技集团股份有限公司 检测装置、基板架、检测基板架上基板位置的方法
DE102016202456B4 (de) 2016-02-17 2017-10-26 Olympus Winter & Ibe Gmbh Chirurgievorrichtung mit Funktionsvorrichtung
JP6650325B2 (ja) * 2016-04-01 2020-02-19 アルプスアルパイン株式会社 入力装置
US9852833B1 (en) * 2016-06-28 2017-12-26 Alcatel-Lucent Usa Inc. Magnetization alignment in a thin-film device
US9725302B1 (en) * 2016-08-25 2017-08-08 Applied Materials, Inc. Wafer processing equipment having exposable sensing layers
JP6775800B2 (ja) * 2016-10-25 2020-10-28 島根県 静電容量型センサ
CN108007327A (zh) * 2016-10-31 2018-05-08 深圳指瑞威科技有限公司 电容式距离传感器
FR3060733B1 (fr) * 2016-12-16 2019-01-25 Fogale Nanotech Dispositif et procede de detection de l'approche et/ou de contact, et de l'appui d'un objet, relativement a une surface de detection
FR3062205B1 (fr) * 2017-01-23 2020-01-31 Fogale Nanotech Dispositif capacitif de detection d'un objet electriquement flottant
EP3379204B1 (en) * 2017-03-22 2021-02-17 Knowles Electronics, LLC Arrangement to calibrate a capacitive sensor interface
TWI613578B (zh) * 2017-04-10 2018-02-01 友達光電股份有限公司 觸控電極陣列和觸控顯示裝置
US11415685B2 (en) * 2017-04-21 2022-08-16 Hewlett-Packard Development Company, L.P. Sensors calibration
CN107204325B (zh) * 2017-05-25 2023-06-02 成都线易科技有限责任公司 电容器阵列及制造方法
JP6718622B2 (ja) * 2017-05-26 2020-07-08 株式会社京岡 隙間センサおよび隙間測定方法
JP7094513B2 (ja) * 2017-06-19 2022-07-04 ユニパルス株式会社 厚み測定装置
KR101879285B1 (ko) * 2017-08-01 2018-07-17 송청담 고감도 정전 센서 회로
GB2566053A (en) * 2017-08-31 2019-03-06 Weston Aerospace Ltd Sensor and method of manufacturing same
JP7058409B2 (ja) * 2017-09-06 2022-04-22 島根県 設置自由度の高い静電容量型センサ
JP7048043B2 (ja) * 2017-12-26 2022-04-05 島根県 非接触測定システム
KR102394081B1 (ko) * 2018-02-27 2022-05-04 삼성전자주식회사 감지 회로를 이용한 벤딩 정보에 기반하여 동작 모드를 변경하기 위한 방법, 전자 장치 및 저장 매체
CN110221594B (zh) * 2018-03-01 2024-07-12 苏州宝时得电动工具有限公司 电容传感器及自动行走设备
RU2688734C1 (ru) * 2018-04-06 2019-05-22 Общество с ограниченной ответственностью "СБ "Марит" (ООО "СБ "Марит") Емкостное средство обнаружения
ES2950745T3 (es) * 2018-05-16 2023-10-13 Alleima Tube Ab Estructura de tubo metálico con una disposición de sensor
CN108413856B (zh) * 2018-05-30 2020-07-10 华中科技大学 一种基于双变压器远距离隔离传输的电容位移传感装置
CN108562216B (zh) * 2018-05-30 2020-07-10 华中科技大学 一种基于变压器初级远距离传输的电容位移传感装置
EP3594639B1 (de) * 2018-07-13 2022-09-28 Tecan Trading Ag Vorrichtung und verfahren zur kapazitiven füllstandsmessung in flüssigkeitsbehältern
EP3608624B1 (de) * 2018-08-06 2022-06-29 Hexagon Technology Center GmbH Kapazitiver distanzsensor
US10794681B2 (en) * 2018-09-04 2020-10-06 Applied Materials, Inc. Long range capacitive gap measurement in a wafer form sensor system
US11342210B2 (en) 2018-09-04 2022-05-24 Applied Materials, Inc. Method and apparatus for measuring wafer movement and placement using vibration data
US11521872B2 (en) * 2018-09-04 2022-12-06 Applied Materials, Inc. Method and apparatus for measuring erosion and calibrating position for a moving process kit
US10847393B2 (en) * 2018-09-04 2020-11-24 Applied Materials, Inc. Method and apparatus for measuring process kit centering
US11404296B2 (en) * 2018-09-04 2022-08-02 Applied Materials, Inc. Method and apparatus for measuring placement of a substrate on a heater pedestal
ES2949965T3 (es) * 2018-10-30 2023-10-04 Prysmian Spa Junta de cable retráctil y sensor de voltaje
KR102518210B1 (ko) * 2018-11-15 2023-04-04 케이엘에이 코포레이션 웨이퍼 검사를 위한 유연한 전자 장치를 가진 다중 센서 타일형 카메라
US10724964B1 (en) 2019-04-10 2020-07-28 Kla-Tencor Corporation Multi-sensor tiled camera with flexible electronics for wafer inspection
DK3654532T3 (da) * 2018-11-16 2022-06-07 Bently Nevada Llc Proksimitetsregistreringssystem med komponentkompatibilitetstestning
CN109581511B (zh) * 2018-11-23 2020-06-16 辽宁大学 一种基于感应原理的非接触式煤岩带电监测传感器标定系统及方法
KR102700312B1 (ko) * 2018-12-11 2024-08-30 로제 가부시키가이샤 정전 용량 센서
US10809048B2 (en) * 2019-01-08 2020-10-20 Formfactor Beaverton, Inc. Probe systems and methods for calibrating capacitive height sensing measurements
DE102019102965A1 (de) * 2019-02-06 2020-08-06 Physik Instrumente (Pi) Gmbh & Co. Kg Haltevorrichtung für eine optische Faser
US10837803B2 (en) * 2019-04-12 2020-11-17 Kla Corporation Inspection system with grounded capacitive sample proximity sensor
CN110044253A (zh) * 2019-05-27 2019-07-23 中国工程物理研究院电子工程研究所 一种微马达及内嵌式角度测量装置
RU2722167C1 (ru) * 2019-08-11 2020-05-27 Сергей Викторович Тюрин Способ бесконтактного измерения смещения токоведущего проводника от геометрического центра кабельной жилы
US12327700B2 (en) * 2019-08-13 2025-06-10 Saint-Gobain Glass France Composite panel with a sensor assembly on both sides
RU2717904C1 (ru) * 2019-09-13 2020-03-26 Общество С Ограниченной Ответственностью "Конструкторское Бюро "Дорс" (Ооо "Кб "Дорс") Способ измерения при помощи дифференциального датчика
CN110631465B (zh) * 2019-09-16 2021-04-16 太原理工大学 基于电容原理差动式测量的积灰结渣在线监测装置及方法
CN110779965B (zh) * 2019-10-22 2022-08-02 电子科技大学 一种大面积表面损伤柔性探测装置
US11274037B2 (en) 2019-10-30 2022-03-15 Taiwan Semiconductor Manufacturing Co., Ltd. Dual micro-electro mechanical system and manufacturing method thereof
CN112744779B (zh) * 2019-10-30 2024-02-23 台湾积体电路制造股份有限公司 微机电系统及其制造方法
RU197920U1 (ru) * 2020-01-28 2020-06-05 Акционерное общество "ПК Альматек" Печатная плата устройства для предъявления электрических импульсов при транслингвальной нейростимуляции
WO2021214579A1 (en) * 2020-04-24 2021-10-28 Agco Corporation Agricultural machines comprising capacitive sensors, and related methods and apparatus
US11646707B2 (en) * 2020-05-21 2023-05-09 Novatek Microelectronics Corp. Analog front end with pulse width modulation current compensation
US11574530B2 (en) 2020-06-04 2023-02-07 Ecolink Intelligent Technology, Inc. Electronic sensor with flexible sensing device
CN112325980B (zh) * 2020-10-30 2024-03-01 中国航空工业集团公司西安航空计算技术研究所 自平衡交流电桥电容式油量传感器采集装置及方法
US11275312B1 (en) * 2020-11-30 2022-03-15 Waymo Llc Systems and methods for verifying photomask cleanliness
JP2023554388A (ja) * 2020-12-16 2023-12-27 サノフイ 電極システム、電子システム、薬物送達デバイス、および電子システムを製造する方法
US11940336B2 (en) * 2021-03-26 2024-03-26 Sporian Microsystems, Inc. Driven-shield capacitive pressure sensor
CN115267345B (zh) * 2021-04-29 2024-11-01 财团法人工业技术研究院 具校正功能的微机电感测装置
CN113720249A (zh) * 2021-09-14 2021-11-30 上海钊晟传感技术有限公司 一种高精度大量程电容位移传感器
CN114396862A (zh) * 2021-11-30 2022-04-26 安徽见行科技有限公司 一种电容位移传感器及其柔性探头、柔性连接线
TWI790857B (zh) 2021-12-15 2023-01-21 財團法人工業技術研究院 差動式電容裝置與差動式電容校準方法
CN114526144B (zh) * 2022-02-25 2023-03-21 潍柴动力股份有限公司 一种NOx传感器安装位置识别方法、装置、车辆及介质
EP4258320A1 (en) 2022-04-08 2023-10-11 ASML Netherlands B.V. Sensor substrate, apparatus, and method
CN114963998B (zh) * 2022-05-09 2025-05-30 国科大杭州高等研究院 一种用于精密激光干涉测量标定的亚纳米级高精度微位移装置及应用
EP4310885A1 (en) 2022-07-21 2024-01-24 ASML Netherlands B.V. Electron-optical apparatus and method of obtaining topographical information about a sample surface
TWI822621B (zh) * 2023-03-30 2023-11-11 力晶積成電子製造股份有限公司 檢測裝置
US12313664B2 (en) 2023-08-18 2025-05-27 Elite Semiconductor Microelectronics Technology Inc. Capacitance measurement circuit
TWI850116B (zh) * 2023-09-21 2024-07-21 晶豪科技股份有限公司 電容量測電路
CN118991500B (zh) * 2024-10-17 2025-01-07 广州特伏科技有限公司 一种移动式新能源充电桩
CN119311156B (zh) * 2024-12-11 2025-06-03 基合半导体（宁波）有限公司 电容式触摸板及电子设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6249130B1 (en) 1998-12-21 2001-06-19 Agrichem, Inc. Shielded flat-plate proximity/dielectric properties sensor
JP2005175173A (ja) 2003-12-10 2005-06-30 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
JP2007519238A (ja) 2004-01-20 2007-07-12 カール・ツアイス・エスエムテイ・アーゲー マイクロリソグラフィ投影露光装置および投影レンズのための測定装置

Family Cites Families (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522528A (en) * 1968-02-27 1970-08-04 Trw Inc Noncontacting capacitance distance gauge having a servosystem and a position sensor
SU932208A1 (ru) * 1978-07-17 1982-05-30 Ордена Трудового Красного Знамени Предприятие П/Я А-1742 Устройство дл измерени рассто ний до провод щей поверхности
GB2131176B (en) 1982-10-07 1986-02-19 Rolls Royce Method of manufacturing a capacitance distance measuring probe
US4539835A (en) * 1983-10-28 1985-09-10 Control Data Corporation Calibration apparatus for capacitance height gauges
US4538069A (en) * 1983-10-28 1985-08-27 Control Data Corporation Capacitance height gage applied in reticle position detection system for electron beam lithography apparatus
JPS615317A (ja) * 1984-06-18 1986-01-11 Omron Tateisi Electronics Co 自動焦点合わせ装置
SU1195182A1 (ru) * 1984-07-26 1985-11-30 Институт Электродинамики Ан Усср Емкостный измеритель перемещений
US4766368A (en) * 1986-09-30 1988-08-23 Cox Harold A Capacitive sensor
JP2518301B2 (ja) * 1987-09-11 1996-07-24 株式会社ニコン 間隔測定装置
AT393040B (de) 1988-03-03 1991-07-25 Setec Messgeraete Gmbh Kapazitiver naeherungsgeber
JPH01285801A (ja) * 1988-05-12 1989-11-16 Koko Res Kk 近接距離センサー及び形状判別装置
JP2807827B2 (ja) * 1989-07-03 1998-10-08 直之 大纒 静電容量型距離計
US5337353A (en) * 1992-04-01 1994-08-09 At&T Bell Laboratories Capacitive proximity sensors
JP2516666Y2 (ja) * 1992-10-23 1996-11-06 株式会社ミツトヨ 静電容量式変位測定装置
JPH0682506U (ja) * 1993-04-28 1994-11-25 兼子興産株式会社 非接触厚さ計
US5539323A (en) * 1993-05-07 1996-07-23 Brooks Automation, Inc. Sensor for articles such as wafers on end effector
JP3520881B2 (ja) * 1995-07-03 2004-04-19 株式会社ニコン 露光装置
JP3328710B2 (ja) 1995-08-23 2002-09-30 オムロン株式会社 半導体静電容量型センサ
WO1997029391A1 (en) 1996-02-09 1997-08-14 Scandmec Ab Device for sensing presence of an electrically conducting object
JPH09280806A (ja) * 1996-04-09 1997-10-31 Nissan Motor Co Ltd 静電容量式変位計
US5844486A (en) 1997-01-02 1998-12-01 Advanced Safety Concepts, Inc. Integral capacitive sensor array
US6075375A (en) * 1997-06-11 2000-06-13 Applied Materials, Inc. Apparatus for wafer detection
JP3356043B2 (ja) * 1997-12-26 2002-12-09 三菱電機株式会社 レーザ加工装置用距離検出器
US5990473A (en) * 1998-02-04 1999-11-23 Sandia Corporation Apparatus and method for sensing motion in a microelectro-mechanical system
DE19812626A1 (de) 1998-03-23 1999-09-30 Bayerische Motoren Werke Ag Verfahren zur kapazitiven Objekterkennung bei Fahrzeugen
JP3246726B2 (ja) * 1998-11-13 2002-01-15 株式会社ミツトヨ 静電容量式変位検出器及び測定装置
WO2000050261A2 (en) * 1999-02-24 2000-08-31 Advanced Safety Concepts, Inc. Capacitive sensors for vehicular environments
JP2001091205A (ja) * 1999-07-22 2001-04-06 Sumitomo Metal Ind Ltd 物体搭載装置
JP4872989B2 (ja) * 1999-07-22 2012-02-08 東京エレクトロン株式会社 静電容量型センサ部品、物体搭載体、半導体製造装置および液晶表示素子製造装置
GB0000619D0 (en) * 2000-01-13 2000-03-01 British Aerospace Accelerometer
US6633050B1 (en) 2000-08-15 2003-10-14 Asml Holding Nv. Virtual gauging system for use in lithographic processing
US7561270B2 (en) * 2000-08-24 2009-07-14 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
EP1231515B1 (en) * 2001-02-08 2008-11-05 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US6859260B2 (en) * 2001-04-25 2005-02-22 Asml Holding N.V. Method and system for improving focus accuracy in a lithography system
JP3980387B2 (ja) * 2002-03-20 2007-09-26 富士通株式会社 容量検出型センサ及びその製造方法
US20040207395A1 (en) * 2002-04-08 2004-10-21 Moshe Sarfaty Eddy current-capacitance sensor for conducting film characterization
CN100359626C (zh) * 2002-06-15 2008-01-02 Nfab有限公司 粒子束发生器
CN1708672B (zh) * 2002-10-31 2010-05-12 量研科技股份有限公司 电荷转移电容位置传感器
FI115109B (fi) * 2003-01-22 2005-02-28 Nokia Corp Tunnistusjärjestely ja tunnistusjärjestelyn käsittävä matkaviestin
JP4067053B2 (ja) * 2003-03-13 2008-03-26 キヤノン株式会社 静電容量センサ式計測装置
JP4054693B2 (ja) * 2003-02-27 2008-02-27 株式会社ミツトヨ 静電容量式変位測定器
US7114399B2 (en) 2003-03-19 2006-10-03 Ade Corporation Shaped non-contact capacitive displacement sensors for measuring shaped targets
JP4029770B2 (ja) * 2003-05-15 2008-01-09 オムロン株式会社 厚み検出センサ
JP4042973B2 (ja) * 2003-11-07 2008-02-06 株式会社日本自動車部品総合研究所 非接触式車両用接近体検出装置
JP2005156492A (ja) 2003-11-28 2005-06-16 Agilent Technol Inc 可動機構、測定装置、静電容量式距離測定装置、および、位置決め装置
US20050134865A1 (en) * 2003-12-17 2005-06-23 Asml Netherlands B.V. Method for determining a map, device manufacturing method, and lithographic apparatus
JP2005183744A (ja) * 2003-12-22 2005-07-07 Nikon Corp 露光装置及びデバイス製造方法
JPWO2005088686A1 (ja) * 2004-03-16 2008-01-31 株式会社ニコン 段差計測方法及び装置、並びに露光方法及び装置
US6989679B2 (en) 2004-06-03 2006-01-24 General Electric Company Non-contact capacitive sensor and cable with dual layer active shield
JP4356570B2 (ja) * 2004-09-16 2009-11-04 沖電気工業株式会社 静電容量型距離センサ
TW200632576A (en) * 2004-12-02 2006-09-16 Nikon Corp Exposure apparatus, exposure method and manufacturing method of device
KR20060082223A (ko) * 2005-01-11 2006-07-18 삼성전자주식회사 화상인식 반도체 모듈
US7342641B2 (en) * 2005-02-22 2008-03-11 Nikon Corporation Autofocus methods and devices for lithography
US7395717B2 (en) * 2006-02-10 2008-07-08 Milliken & Company Flexible capacitive sensor
US7208960B1 (en) * 2006-02-10 2007-04-24 Milliken & Company Printed capacitive sensor
KR101259218B1 (ko) * 2006-02-21 2013-04-29 싸이버옵틱스 쎄미콘덕터 인코퍼레이티드 반도체 처리 툴의 용량성 거리 감지 장치 및 방법
JP5183495B2 (ja) * 2006-02-27 2013-04-17 エドワーズ ライフサイエンシーズ コーポレイション 基準電極チャネル作製のフレックス回路技術を使用する方法および装置
EP2089969B1 (de) * 2006-03-13 2013-07-10 IDENT Technology AG Kapazitive sensoreinrichtung
JP4828316B2 (ja) * 2006-06-13 2011-11-30 三菱電機株式会社 レーザ加工機用のギャップ検出装置及びレーザ加工システム並びにレーザ加工機用のギャップ検出方法
RU2338997C2 (ru) * 2006-07-13 2008-11-20 Федеральное государственное унитарное предприятие "Центральный научно-исследовательский институт "Электроприбор" Способ измерения зазора между электродами и подвижной массой микромеханического устройства и устройство для его реализации
RU2318183C1 (ru) * 2006-08-09 2008-02-27 Общество С Ограниченной Ответственностью "Диамех 2000" Устройство для измерения воздушного зазора
US20080079920A1 (en) * 2006-09-29 2008-04-03 Heiko Hommen Wafer exposure device and method
JP4609731B2 (ja) 2006-10-31 2011-01-12 株式会社デンソー 静電容量式乗員検知センサ
JP2008111758A (ja) * 2006-10-31 2008-05-15 Yamatake Corp 容量式電磁流量計
NL1036009A1 (nl) * 2007-10-05 2009-04-07 Asml Netherlands Bv An Immersion Lithography Apparatus.
JP2009109208A (ja) * 2007-10-26 2009-05-21 Ono Sokki Co Ltd 測定装置および測定方法
NL1036069A1 (nl) * 2007-10-30 2009-05-07 Asml Netherlands Bv An Immersion Lithography Apparatus.
NL1036547A1 (nl) * 2008-02-20 2009-08-24 Asml Holding Nv Gas gauge compatible with vacuum environments.
NL1036516A1 (nl) * 2008-03-05 2009-09-08 Asml Netherlands Bv Lithographic apparatus and method.
NL1036709A1 (nl) * 2008-04-24 2009-10-27 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
US8872771B2 (en) * 2009-07-07 2014-10-28 Apple Inc. Touch sensing device having conductive nodes
US8638109B2 (en) * 2009-12-31 2014-01-28 Mapper Lithography Ip B.V. Capacitive sensing system with differential pairs

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6249130B1 (en) 1998-12-21 2001-06-19 Agrichem, Inc. Shielded flat-plate proximity/dielectric properties sensor
JP2005175173A (ja) 2003-12-10 2005-06-30 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
JP2007519238A (ja) 2004-01-20 2007-07-12 カール・ツアイス・エスエムテイ・アーゲー マイクロリソグラフィ投影露光装置および投影レンズのための測定装置

Also Published As

Publication number Publication date
EP2519859A1 (en) 2012-11-07
RU2012132633A (ru) 2014-02-10
KR101676831B1 (ko) 2016-11-17
US20110254565A1 (en) 2011-10-20
TWI512265B (zh) 2015-12-11
EP2519801A1 (en) 2012-11-07
CN102782585A (zh) 2012-11-14
KR101454727B1 (ko) 2014-10-27
KR20120102802A (ko) 2012-09-18
TW201140256A (en) 2011-11-16
CN105716630A (zh) 2016-06-29
JP5559359B2 (ja) 2014-07-23
US8841920B2 (en) 2014-09-23
JP2013516602A (ja) 2013-05-13
EP2519800A1 (en) 2012-11-07
RU2012132634A (ru) 2014-02-10
JP5917665B2 (ja) 2016-05-18
US20110193573A1 (en) 2011-08-11
KR20120118024A (ko) 2012-10-25
US20140049276A1 (en) 2014-02-20
US20110261344A1 (en) 2011-10-27
JP2015079979A (ja) 2015-04-23
RU2559993C2 (ru) 2015-08-20
US8513959B2 (en) 2013-08-20
WO2011080308A1 (en) 2011-07-07
RU2012132638A (ru) 2014-02-10
KR20140136533A (ko) 2014-11-28
TWI453549B (zh) 2014-09-21
TW201508243A (zh) 2015-03-01
US8570055B2 (en) 2013-10-29
EP2519859B1 (en) 2017-05-31
US20110193574A1 (en) 2011-08-11
WO2011080310A1 (en) 2011-07-07
WO2011080309A1 (en) 2011-07-07
EP2519858A1 (en) 2012-11-07
US8638109B2 (en) 2014-01-28
JP5784630B2 (ja) 2015-09-24
TW201142241A (en) 2011-12-01
JP2013516601A (ja) 2013-05-13
CN102782444A (zh) 2012-11-14
CN102753931A (zh) 2012-10-24
CN105716630B (zh) 2019-08-23
CN102782444B (zh) 2015-11-25
KR20120102148A (ko) 2012-09-17
RU2012132637A (ru) 2014-02-10
CN102753931B (zh) 2015-08-05
JP5781541B2 (ja) 2015-09-24
JP5599899B2 (ja) 2014-10-01
KR20120115992A (ko) 2012-10-19
RU2532575C2 (ru) 2014-11-10
JP2013516753A (ja) 2013-05-13
JP2013516752A (ja) 2013-05-13
WO2011080308A4 (en) 2011-09-22
CN102782584A (zh) 2012-11-14
EP2519800B1 (en) 2017-04-19
CN108151773A (zh) 2018-06-12
RU2573447C2 (ru) 2016-01-20
WO2011080311A4 (en) 2011-09-01
KR101577717B1 (ko) 2015-12-16
TWI460398B (zh) 2014-11-11
WO2011080311A1 (en) 2011-07-07
TW201142242A (en) 2011-12-01
EP2519801B1 (en) 2018-02-14
TW201142240A (en) 2011-12-01

Similar Documents

Publication Publication Date Title
KR101436947B1 (ko) 통합 센서 시스템
NL2004055C2 (en) Method for measuring target surface topology and lithography system.
NL2004051C2 (en) Capacitive sensor.
NL2004054C2 (en) Lithography system with capacitive sensing system.
NL2004052C2 (en) Capacitive sensing system.

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
A302 Request for accelerated examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20170811

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20180810

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20230828

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20230828