KR101333017B1 - 경화성 실리콘 조성물 - Google Patents

경화성 실리콘 조성물 Download PDF

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Publication number
KR101333017B1
KR101333017B1 KR1020087011060A KR20087011060A KR101333017B1 KR 101333017 B1 KR101333017 B1 KR 101333017B1 KR 1020087011060 A KR1020087011060 A KR 1020087011060A KR 20087011060 A KR20087011060 A KR 20087011060A KR 101333017 B1 KR101333017 B1 KR 101333017B1
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mass
component
curable silicone
units
silicone composition
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KR20080070816A (ko
Inventor
신이치 야마모토
도모코 가토
히로지 에나미
요시쓰구 모리타
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Polymers (AREA)
KR1020087011060A 2005-11-09 2006-11-08 경화성 실리콘 조성물 Active KR101333017B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005324510A JP4965111B2 (ja) 2005-11-09 2005-11-09 硬化性シリコーン組成物
JPJP-P-2005-00324510 2005-11-09
PCT/JP2006/322701 WO2007055395A1 (en) 2005-11-09 2006-11-08 Curable silicone composition

Publications (2)

Publication Number Publication Date
KR20080070816A KR20080070816A (ko) 2008-07-31
KR101333017B1 true KR101333017B1 (ko) 2013-11-27

Family

ID=37685815

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087011060A Active KR101333017B1 (ko) 2005-11-09 2006-11-08 경화성 실리콘 조성물

Country Status (9)

Country Link
US (1) US8044153B2 (enExample)
EP (1) EP1945716B1 (enExample)
JP (1) JP4965111B2 (enExample)
KR (1) KR101333017B1 (enExample)
CN (1) CN101300305B (enExample)
DE (1) DE602006020159D1 (enExample)
MY (1) MY142540A (enExample)
TW (1) TWI402315B (enExample)
WO (1) WO2007055395A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10336913B2 (en) 2013-08-28 2019-07-02 Dow Corning Toray Co., Ltd. Curable silicone composition, cured product thereof, and optical semiconductor device
KR102022949B1 (ko) * 2019-05-31 2019-09-19 한국산전(주) 배전반의 활선접속부에 사용되는 접착제 및 이의 제조방법

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TW200720359A (en) 2005-11-17 2007-06-01 Dow Corning Toray Co Ltd Method of controlling oil-absorbing properties of a silicone rubber powder
CN101663358B (zh) * 2007-02-07 2016-10-26 道康宁东丽株式会社 海绵形成用液体硅橡胶组合物以及由其制得的硅橡胶海绵
TWI458780B (zh) 2007-07-31 2014-11-01 Dow Corning Toray Co Ltd 提供高透明矽酮硬化物之硬化性矽酮組合物
JP5377846B2 (ja) * 2007-11-09 2013-12-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱硬化性シリコーンゴム組成物
US9051445B2 (en) 2008-07-31 2015-06-09 Dow Corning Toray Co., Ltd. Multi-component sponge-forming liquid silicone rubber composition and silicone rubber sponge manufacturing method
JP5568240B2 (ja) * 2009-02-02 2014-08-06 東レ・ダウコーニング株式会社 硬化性シリコーンゴム組成物
JP5475295B2 (ja) 2009-02-02 2014-04-16 東レ・ダウコーニング株式会社 高透明のシリコーン硬化物を与える硬化性シリコーン組成物
JP5475296B2 (ja) * 2009-02-02 2014-04-16 東レ・ダウコーニング株式会社 高透明のシリコーン硬化物を与える硬化性シリコーン組成物
CA2785683C (en) * 2009-12-29 2017-10-03 Dow Corning Toray Co., Ltd. Curable liquid silicone rubber composition for forming a sealing member and sealing member
JP5534977B2 (ja) * 2010-06-29 2014-07-02 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および光半導体装置
JP5680889B2 (ja) 2010-06-29 2015-03-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および光半導体装置
JP6057503B2 (ja) * 2011-09-21 2017-01-11 東レ・ダウコーニング株式会社 光半導体素子封止用硬化性シリコーン組成物、樹脂封止光半導体素子の製造方法、および樹脂封止光半導体素子
JP5819787B2 (ja) 2012-07-19 2015-11-24 信越化学工業株式会社 硬化性シリコーン樹脂組成物
JP6081774B2 (ja) * 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
CN102924927B (zh) * 2012-11-22 2014-03-12 深圳市森日有机硅材料有限公司 全透明液体硅橡胶组合物及其制备方法
KR101588525B1 (ko) 2013-06-18 2016-01-25 주식회사 엘지화학 경화성 조성물
TWI653295B (zh) 2014-02-04 2019-03-11 日商道康寧東麗股份有限公司 硬化性聚矽氧組合物、其硬化物及光半導體裝置
TWI624510B (zh) 2014-02-04 2018-05-21 日商道康寧東麗股份有限公司 硬化性聚矽氧組合物、其硬化物及光半導體裝置
CN104371334B (zh) * 2014-12-10 2015-11-18 深圳市森日有机硅材料有限公司 一种全透明液体硅橡胶组合物
JP6678388B2 (ja) 2014-12-25 2020-04-08 信越化学工業株式会社 硬化性シリコーン樹脂組成物
JP6389145B2 (ja) 2015-06-05 2018-09-12 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物、及び半導体装置
JP6463663B2 (ja) 2015-11-02 2019-02-06 信越化学工業株式会社 接着促進剤、付加硬化型オルガノポリシロキサン樹脂組成物及び半導体装置
CN110268019B (zh) * 2016-12-30 2023-06-30 埃肯有机硅（上海）有限公司 可固化的硅酮组合物
JP6702233B2 (ja) 2017-03-09 2020-05-27 信越化学工業株式会社 付加硬化型オルガノポリシロキサン樹脂組成物、該組成物の硬化物及び該硬化物を有する半導体装置
EP3630892A1 (en) 2017-06-02 2020-04-08 Dow Silicones Corporation Curable silicone composition with reduced mold fouling
TW201946976A (zh) * 2018-05-11 2019-12-16 美商陶氏有機矽公司 可固化聚矽氧組成物及其固化產物
TWI863907B (zh) 2018-05-11 2024-12-01 美商陶氏有機矽公司 製造用於可撓式顯示裝置之聚矽氧背板之方法，可撓式顯示器及電子裝置
JP2020007537A (ja) 2018-06-29 2020-01-16 信越化学工業株式会社 硬化性有機ケイ素樹脂組成物及び半導体装置
WO2020032286A1 (ja) * 2018-08-10 2020-02-13 ダウ・東レ株式会社 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
WO2020032287A1 (ja) * 2018-08-10 2020-02-13 ダウ・東レ株式会社 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
US11987731B2 (en) 2018-08-10 2024-05-21 Dow Toray Co., Ltd. Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
KR102136686B1 (ko) * 2018-09-21 2020-08-13 주식회사 케이씨씨 실리콘 조성물

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235004A (en) * 1991-05-29 1993-08-10 Dow Corning Toray Silicone Co., Ltd. Hexenyl-containing silicone resin and method for its preparation
EP0997498A1 (en) * 1998-10-28 2000-05-03 Dow Corning Corporation Silicone composition, method for the preparation thereof and silicone elastomer
KR20050072123A (ko) * 2002-10-28 2005-07-08 다우 코닝 도레이 실리콘 캄파니 리미티드 경화성 오가노폴리실록산 조성물 및 당해 조성물을사용하여 제조한 반도체 장치

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US5674966A (en) * 1995-06-05 1997-10-07 General Electric Company Low molecular weight liquid injection molding resins having a high vinyl content
JP3635181B2 (ja) * 1997-02-24 2005-04-06 ダウ コーニング アジア株式会社 剥離性硬化皮膜形成用組成物
JP2000169714A (ja) * 1998-12-07 2000-06-20 Dow Corning Toray Silicone Co Ltd 硬化性シリコーン組成物
JP3523098B2 (ja) 1998-12-28 2004-04-26 信越化学工業株式会社 付加硬化型シリコーン組成物
JP2000327921A (ja) * 1999-03-12 2000-11-28 Dow Corning Toray Silicone Co Ltd 硬化性シリコーン組成物
JP3595731B2 (ja) 1999-06-21 2004-12-02 信越化学工業株式会社 半導体装置封止用付加硬化型シリコーン組成物及び半導体装置
JP4646363B2 (ja) * 2000-06-29 2011-03-09 東レ・ダウコーニング株式会社 シリコーンゴム組成物
US6512037B1 (en) * 2001-06-06 2003-01-28 Dow Corning Corporation Silicone composition and cured silicone product
US6623864B1 (en) * 2003-01-13 2003-09-23 Dow Corning Corporation Silicone composition useful in flame retardant applications
JP4647941B2 (ja) 2004-06-23 2011-03-09 東レ・ダウコーニング株式会社 シリコーンレジンとシリコーンゴムの一体化成形体、その製造方法および硬化性シリコーンレジン組成物
JP4664032B2 (ja) 2004-10-13 2011-04-06 東レ・ダウコーニング株式会社 シリルアルコキシメチルハライドの製造方法
JP4528613B2 (ja) 2004-12-27 2010-08-18 東レ・ダウコーニング株式会社 シリコーン樹脂とエポキシ樹脂の接着複合体およびその製造方法
JP5025917B2 (ja) 2005-06-15 2012-09-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
JP4839041B2 (ja) 2005-08-29 2011-12-14 東レ・ダウコーニング株式会社 絶縁性液状ダイボンディング剤および半導体装置
JP4955984B2 (ja) 2005-11-04 2012-06-20 東レ・ダウコーニング株式会社 有機ケイ素重合体およびその製造方法

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US5235004A (en) * 1991-05-29 1993-08-10 Dow Corning Toray Silicone Co., Ltd. Hexenyl-containing silicone resin and method for its preparation
EP0997498A1 (en) * 1998-10-28 2000-05-03 Dow Corning Corporation Silicone composition, method for the preparation thereof and silicone elastomer
KR20050072123A (ko) * 2002-10-28 2005-07-08 다우 코닝 도레이 실리콘 캄파니 리미티드 경화성 오가노폴리실록산 조성물 및 당해 조성물을사용하여 제조한 반도체 장치
KR100976075B1 (ko) 2002-10-28 2010-08-17 다우 코닝 도레이 캄파니 리미티드 경화성 오가노폴리실록산 조성물 및 당해 조성물을사용하여 제조한 반도체 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10336913B2 (en) 2013-08-28 2019-07-02 Dow Corning Toray Co., Ltd. Curable silicone composition, cured product thereof, and optical semiconductor device
KR102022949B1 (ko) * 2019-05-31 2019-09-19 한국산전(주) 배전반의 활선접속부에 사용되는 접착제 및 이의 제조방법

Also Published As

Publication number Publication date
JP2007131694A (ja) 2007-05-31
CN101300305A (zh) 2008-11-05
EP1945716B1 (en) 2011-02-16
US8044153B2 (en) 2011-10-25
EP1945716A1 (en) 2008-07-23
TWI402315B (zh) 2013-07-21
WO2007055395A1 (en) 2007-05-18
KR20080070816A (ko) 2008-07-31
DE602006020159D1 (de) 2011-03-31
CN101300305B (zh) 2012-08-29
TW200720361A (en) 2007-06-01
MY142540A (en) 2010-12-15
JP4965111B2 (ja) 2012-07-04
US20090118441A1 (en) 2009-05-07

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