KR101285575B1 - 금속성 기판으로부터 고온 필름 및/또는 소자를 박리시키는 방법 - Google Patents
금속성 기판으로부터 고온 필름 및/또는 소자를 박리시키는 방법 Download PDFInfo
- Publication number
- KR101285575B1 KR101285575B1 KR1020087007670A KR20087007670A KR101285575B1 KR 101285575 B1 KR101285575 B1 KR 101285575B1 KR 1020087007670 A KR1020087007670 A KR 1020087007670A KR 20087007670 A KR20087007670 A KR 20087007670A KR 101285575 B1 KR101285575 B1 KR 101285575B1
- Authority
- KR
- South Korea
- Prior art keywords
- metallic substrate
- resin
- polymeric film
- stainless steel
- coating
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C3/00—Selection of compositions for coating the surfaces of moulds, cores, or patterns
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49227—Insulator making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Formation Of Insulating Films (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72170805P | 2005-09-29 | 2005-09-29 | |
US60/721,708 | 2005-09-29 | ||
PCT/US2006/033548 WO2007040870A1 (en) | 2005-09-29 | 2006-08-30 | Method of releasing high temperature films and/or devices from metallic substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080063761A KR20080063761A (ko) | 2008-07-07 |
KR101285575B1 true KR101285575B1 (ko) | 2013-07-15 |
Family
ID=37496438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020087007670A KR101285575B1 (ko) | 2005-09-29 | 2006-08-30 | 금속성 기판으로부터 고온 필름 및/또는 소자를 박리시키는 방법 |
Country Status (9)
Country | Link |
---|---|
US (2) | US8356407B2 (zh) |
EP (1) | EP1940989B1 (zh) |
JP (1) | JP2009510216A (zh) |
KR (1) | KR101285575B1 (zh) |
CN (1) | CN101278025A (zh) |
AT (1) | ATE491762T1 (zh) |
DE (1) | DE602006018976D1 (zh) |
TW (1) | TWI404221B (zh) |
WO (1) | WO2007040870A1 (zh) |
Families Citing this family (18)
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US7612143B2 (en) * | 1999-08-04 | 2009-11-03 | Hybrid Plastics, Inc. | Metallized nanostructured chemicals alloyed into polymers |
US7737228B2 (en) * | 2003-12-18 | 2010-06-15 | Hybrid Plastics, Inc. | Metallized polyhedral oligomeric silsesquioxanes as catalysts for polyurethanes |
JP5313478B2 (ja) * | 2007-10-05 | 2013-10-09 | 東レ・ダウコーニング株式会社 | セラミック状酸化ケイ素系被膜の形成方法、セラミック状酸化ケイ素系被膜を有する無機質基材の製造方法、セラミック状酸化ケイ素系被膜形成剤および半導体装置 |
US8318244B2 (en) | 2008-01-30 | 2012-11-27 | Dow Corning Corporation | Use of glassy silicone-based hard coating as release coatings for printable electronics |
US9336925B1 (en) * | 2008-11-26 | 2016-05-10 | Thin Film Electronics Asa | Siloxanes, doped siloxanes, methods for their synthesis, compositions containing the same, and films formed therefrom |
JP5337572B2 (ja) * | 2009-04-30 | 2013-11-06 | 日東電工株式会社 | 積層体およびそれを用いた配線回路基板 |
KR101079650B1 (ko) | 2009-05-21 | 2011-11-03 | 주식회사 엠에스하이텍 | 반도체 리젝트 다이로부터 합성수지 필름을 제거하는 방법 |
WO2011142804A1 (en) * | 2010-05-10 | 2011-11-17 | The University Of Toledo | Flexible photovoltaic cells and modules having an improved adhesion characteristic |
BR112012029813A2 (pt) | 2010-05-26 | 2017-03-07 | Univ Toledo | estrutura de célula fotovoltaica, método para fazer uma camada de interface de dispersão de luz para uma célula fotovoltaica e estrutura de célula fotovoltaica (pv) tendo uma camada de interface de dispersão |
CN101968127B (zh) * | 2010-09-17 | 2012-05-30 | 北京海林节能设备股份有限公司 | 集水器 |
US8871425B2 (en) * | 2012-02-09 | 2014-10-28 | Az Electronic Materials (Luxembourg) S.A.R.L. | Low dielectric photoimageable compositions and electronic devices made therefrom |
JP2015104843A (ja) * | 2013-11-29 | 2015-06-08 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 積層体とその製造方法、及び該積層体を用いた電子デバイスの製造方法 |
JP6180661B2 (ja) * | 2014-12-03 | 2017-08-16 | 東京応化工業株式会社 | 積層体の製造方法、基板の処理方法及び積層体 |
CN105118893A (zh) * | 2015-08-31 | 2015-12-02 | 苏州瑞晟纳米科技有限公司 | 一种微晶玻璃覆盖柔性薄膜太阳能电池样片的热处理方法 |
DE102015015452A1 (de) * | 2015-12-02 | 2017-06-08 | Forschungszentrum Jülich GmbH | Verfahren zum Planarisieren von Nanostrukturen |
TW201806779A (zh) | 2016-05-16 | 2018-03-01 | 道康寧公司 | 用於顯示裝置基板處理之包括矽倍半氧烷聚合物及矽烷中至少一者的黏合劑剝離層 |
CN106009016A (zh) * | 2016-08-11 | 2016-10-12 | 潘忠宁 | 一种单分散聚倍半硅氧烷球形薄膜制备方法 |
CN111629899A (zh) * | 2018-01-17 | 2020-09-04 | Agc株式会社 | 层叠体、层叠体的制造方法和电子设备的制造方法 |
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US20040163246A1 (en) * | 2003-02-21 | 2004-08-26 | Renesas Technology Corp. | Electronic device manufacturing method |
US20050064726A1 (en) * | 2003-09-23 | 2005-03-24 | Jason Reid | Method of forming low-k dielectrics |
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-
2006
- 2006-08-30 AT AT06802491T patent/ATE491762T1/de not_active IP Right Cessation
- 2006-08-30 US US11/991,831 patent/US8356407B2/en not_active Expired - Fee Related
- 2006-08-30 CN CNA2006800360886A patent/CN101278025A/zh active Pending
- 2006-08-30 JP JP2008533362A patent/JP2009510216A/ja active Pending
- 2006-08-30 WO PCT/US2006/033548 patent/WO2007040870A1/en active Application Filing
- 2006-08-30 DE DE200660018976 patent/DE602006018976D1/de active Active
- 2006-08-30 EP EP20060802491 patent/EP1940989B1/en not_active Not-in-force
- 2006-08-30 KR KR1020087007670A patent/KR101285575B1/ko not_active IP Right Cessation
- 2006-09-15 TW TW95134153A patent/TWI404221B/zh not_active IP Right Cessation
-
2012
- 2012-12-12 US US13/711,780 patent/US20130108501A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040012076A1 (en) * | 1999-11-16 | 2004-01-22 | Hawker Craig Jon | Porous low-dielectric constant materials for use in electronic devices |
KR20020007135A (ko) * | 2000-07-14 | 2002-01-26 | 마티네즈 길러모 | 다공성 물질 |
US20040163246A1 (en) * | 2003-02-21 | 2004-08-26 | Renesas Technology Corp. | Electronic device manufacturing method |
US20050064726A1 (en) * | 2003-09-23 | 2005-03-24 | Jason Reid | Method of forming low-k dielectrics |
Also Published As
Publication number | Publication date |
---|---|
DE602006018976D1 (de) | 2011-01-27 |
US20090098393A1 (en) | 2009-04-16 |
KR20080063761A (ko) | 2008-07-07 |
JP2009510216A (ja) | 2009-03-12 |
EP1940989A1 (en) | 2008-07-09 |
ATE491762T1 (de) | 2011-01-15 |
TW200721524A (en) | 2007-06-01 |
US20130108501A1 (en) | 2013-05-02 |
EP1940989B1 (en) | 2010-12-15 |
US8356407B2 (en) | 2013-01-22 |
TWI404221B (zh) | 2013-08-01 |
WO2007040870A1 (en) | 2007-04-12 |
CN101278025A (zh) | 2008-10-01 |
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