KR101176273B1 - 부품 공급 장치 - Google Patents

부품 공급 장치 Download PDF

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Publication number
KR101176273B1
KR101176273B1 KR1020100007178A KR20100007178A KR101176273B1 KR 101176273 B1 KR101176273 B1 KR 101176273B1 KR 1020100007178 A KR1020100007178 A KR 1020100007178A KR 20100007178 A KR20100007178 A KR 20100007178A KR 101176273 B1 KR101176273 B1 KR 101176273B1
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KR
South Korea
Prior art keywords
tape
component
cover tape
electronic component
cover
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KR1020100007178A
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English (en)
Korean (ko)
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KR20100087663A (ko
Inventor
히로시 이께다
요시나오 우스이
가즈요시 오야마
쯔또무 야나기다
이사오 다까히라
Original Assignee
가부시끼가이샤 히다찌 하이테크 인스트루먼츠
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Publication of KR20100087663A publication Critical patent/KR20100087663A/ko
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0417Feeding with belts or tapes
    • H05K13/0419Feeding with belts or tapes tape feeders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00Severing by tearing or breaking
    • Y10T225/20Severing by manually forcing against fixed edge
    • Y10T225/22With means to move work toward or into severing position

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020100007178A 2009-01-27 2010-01-27 부품 공급 장치 Active KR101176273B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-014877 2009-01-27
JP2009014877 2009-01-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020120050883A Division KR101269706B1 (ko) 2009-01-27 2012-05-14 부품 공급 장치

Publications (2)

Publication Number Publication Date
KR20100087663A KR20100087663A (ko) 2010-08-05
KR101176273B1 true KR101176273B1 (ko) 2012-08-22

Family

ID=42167639

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020100007178A Active KR101176273B1 (ko) 2009-01-27 2010-01-27 부품 공급 장치
KR1020120050883A Active KR101269706B1 (ko) 2009-01-27 2012-05-14 부품 공급 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020120050883A Active KR101269706B1 (ko) 2009-01-27 2012-05-14 부품 공급 장치

Country Status (5)

Country Link
US (1) US8353424B2 (enExample)
EP (1) EP2211600B1 (enExample)
JP (3) JP5301475B2 (enExample)
KR (2) KR101176273B1 (enExample)
CN (2) CN101790302B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101450191B1 (ko) 2014-04-04 2014-10-14 주식회사 일진 핀 헤더 피더

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US8678065B2 (en) * 2010-03-30 2014-03-25 Sts Co., Ltd. Carrier tape feeder
JP5826919B2 (ja) 2012-03-23 2015-12-02 ヤマハ発動機株式会社 部品供給装置及び部品実装装置
JP6114509B2 (ja) 2012-06-28 2017-04-12 ヤマハ発動機株式会社 部品供給装置及び部品実装装置
JP6007253B2 (ja) * 2012-08-27 2016-10-12 ヤマハ発動機株式会社 部品供給装置及び電子部品装着装置
JP5913037B2 (ja) * 2012-09-28 2016-04-27 ヤマハ発動機株式会社 部品供給ユニット
CN104685987B (zh) * 2012-09-28 2018-01-02 雅马哈发动机株式会社 元件供给单元
CN102942076A (zh) * 2012-11-16 2013-02-27 昆山市力格自动化设备有限公司 料带输送机构
KR101690581B1 (ko) * 2012-12-19 2016-12-28 야마하하쓰도키 가부시키가이샤 부품 공급 유닛
DE102013104344B4 (de) * 2013-04-29 2015-07-09 Kilian Tableting Gmbh Vorrichtung zum Einlegen von Einlegern in Matrizen einer Tablettenpresse
JP5995784B2 (ja) 2013-05-31 2016-09-21 ヤマハ発動機株式会社 部品供給装置、及び部品実装装置
EP3041334B1 (en) * 2013-08-26 2020-04-08 FUJI Corporation Feeder
WO2015029124A1 (ja) * 2013-08-26 2015-03-05 富士機械製造株式会社 フィーダ
JP6320730B2 (ja) 2013-11-25 2018-05-09 ハンファテクウィン株式会社Hanwha Techwin Co.,Ltd. テープフィーダ
JP6293469B2 (ja) * 2013-12-05 2018-03-14 ヤマハ発動機株式会社 電子部品供給装置および電子部品実装装置
US10101176B2 (en) 2014-03-13 2018-10-16 Texas Instruments Incorporated Carrier tape packaging method and apparatus
JP6427003B2 (ja) * 2014-12-25 2018-11-21 ヤマハ発動機株式会社 電子部品供給装置、リール装置、及び部品収納テープの補給方法
US10285313B2 (en) 2015-01-22 2019-05-07 Fuji Corporation Feeder device
JP6571184B2 (ja) * 2015-06-18 2019-09-04 株式会社Fuji テープ切断処理装置および処理方法
JP6492289B2 (ja) * 2015-10-14 2019-04-03 パナソニックIpマネジメント株式会社 部品供給装置および部品装着装置
CN108781527B (zh) * 2016-03-30 2020-06-23 雅马哈发动机株式会社 元件供给装置
WO2018029753A1 (ja) * 2016-08-08 2018-02-15 ヤマハ発動機株式会社 部品供給装置
DE112016007129T5 (de) 2016-08-08 2019-04-25 Yamaha Hatsudoki Kabushiki Kaisha Bauteilzuführungsvorrichtung
WO2018042509A1 (ja) * 2016-08-30 2018-03-08 富士機械製造株式会社 スプライシング装置
CN106102437B (zh) * 2016-08-31 2019-08-09 周继禹 贴片机送料器
JP6861339B2 (ja) * 2017-03-31 2021-04-21 パナソニックIpマネジメント株式会社 テープフィーダ及びテープフィーダにおけるカバーテープ剥離方法
JP6861338B2 (ja) * 2017-03-31 2021-04-21 パナソニックIpマネジメント株式会社 テープフィーダ及びテープフィーダにおけるカバーテープ剥離方法
CN110476494B (zh) * 2017-04-10 2021-04-06 雅马哈发动机株式会社 料带排出引导结构体、元件供应装置及元件安装机
JP7126056B2 (ja) * 2017-08-21 2022-08-26 パナソニックIpマネジメント株式会社 部品供給装置および部品供給装置におけるテープ剥離方法
JP6753910B2 (ja) * 2018-10-25 2020-09-09 ヤマハ発動機株式会社 電子部品供給装置、リール装置、テープ処理装置、及び部品収納テープの補給方法
CN114175870B (zh) 2019-07-19 2024-02-02 株式会社富士 带引导件、元件供给装置及带引导件的使用方法
US11032956B1 (en) 2020-01-30 2021-06-08 Automation Technical Service Inc Component feeder mechanism with floating frame
EP4102947B1 (en) * 2020-02-06 2024-03-27 Fuji Corporation Tape guide and component supplying equipment

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JPH10139272A (ja) * 1996-11-12 1998-05-26 Copal Co Ltd 部品供給装置
JP2008205406A (ja) 2007-02-22 2008-09-04 Juki Corp テープフィーダ

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JP2662948B2 (ja) * 1986-10-30 1997-10-15 ニツト− システム テクノロジ− インコ−ポレ−テツド チップテープのトップテープ除去装置
JP2669864B2 (ja) * 1988-09-13 1997-10-29 株式会社日立製作所 チップ電子部品供給装置
JPH02205398A (ja) * 1989-02-03 1990-08-15 Matsushita Electric Ind Co Ltd テープフィーダ
US4944979A (en) * 1989-10-19 1990-07-31 At&T Bell Laboratories Tape conveyers for components
JPH0422196A (ja) 1990-05-17 1992-01-27 Matsushita Electric Ind Co Ltd 電子部品供給装置
JP2808844B2 (ja) * 1990-07-19 1998-10-08 松下電器産業株式会社 テープフィーダ
JP2794945B2 (ja) * 1990-11-29 1998-09-10 松下電器産業株式会社 電子部品の実装装置及び実装方法
JPH0546098A (ja) 1991-08-09 1993-02-26 Matsushita Electric Ind Co Ltd 大型映像表示装置
JPH05116836A (ja) * 1991-10-24 1993-05-14 Mitsubishi Electric Corp エンボステーピング部品のテープ除去装置及び除去方法
JPH05310264A (ja) * 1992-04-28 1993-11-22 Matsushita Electric Ind Co Ltd 電子部品包装テープ
WO1998037746A1 (fr) * 1997-02-20 1998-08-27 Matsushita Electric Industrial Co., Ltd. Dispositif d'alimentation en composants electroniques
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US6659705B1 (en) * 2001-01-10 2003-12-09 Delaware Capital Formation, Inc. Cover tape cutting system using a thermal energy source
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JP4522839B2 (ja) * 2004-12-20 2010-08-11 ヤマハ発動機株式会社 部品供給装置および表面実装機
JP4783255B2 (ja) * 2006-10-03 2011-09-28 ヤマハ発動機株式会社 部品供給装置、並びに表面実装機
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Publication number Priority date Publication date Assignee Title
JPH10139272A (ja) * 1996-11-12 1998-05-26 Copal Co Ltd 部品供給装置
JP2008205406A (ja) 2007-02-22 2008-09-04 Juki Corp テープフィーダ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101450191B1 (ko) 2014-04-04 2014-10-14 주식회사 일진 핀 헤더 피더

Also Published As

Publication number Publication date
CN103533820A (zh) 2014-01-22
EP2211600A3 (en) 2015-11-25
KR20120056245A (ko) 2012-06-01
US8353424B2 (en) 2013-01-15
JP2013150020A (ja) 2013-08-01
CN103533820B (zh) 2017-08-08
JP2016026415A (ja) 2016-02-12
JP5301475B2 (ja) 2013-09-25
JP5877815B2 (ja) 2016-03-08
KR101269706B1 (ko) 2013-05-30
EP2211600A2 (en) 2010-07-28
US20100186901A1 (en) 2010-07-29
EP2211600B1 (en) 2017-05-10
JP2010199567A (ja) 2010-09-09
CN101790302A (zh) 2010-07-28
KR20100087663A (ko) 2010-08-05
CN101790302B (zh) 2013-12-18
JP6498103B2 (ja) 2019-04-10

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