KR101157414B1 - 전자부품 핸들링 장치, 전자부품 핸들링 시스템 및 전자부품 시험방법 - Google Patents

전자부품 핸들링 장치, 전자부품 핸들링 시스템 및 전자부품 시험방법 Download PDF

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Publication number
KR101157414B1
KR101157414B1 KR1020097009784A KR20097009784A KR101157414B1 KR 101157414 B1 KR101157414 B1 KR 101157414B1 KR 1020097009784 A KR1020097009784 A KR 1020097009784A KR 20097009784 A KR20097009784 A KR 20097009784A KR 101157414 B1 KR101157414 B1 KR 101157414B1
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South Korea
Prior art keywords
electronic component
test
component handling
handling apparatus
tray
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KR1020097009784A
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English (en)
Korean (ko)
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KR20090086992A (ko
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아키히코 이토
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가부시키가이샤 아드반테스트
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Publication of KR20090086992A publication Critical patent/KR20090086992A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020097009784A 2006-11-30 2006-11-30 전자부품 핸들링 장치, 전자부품 핸들링 시스템 및 전자부품 시험방법 Active KR101157414B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/323924 WO2008068798A1 (ja) 2006-11-30 2006-11-30 電子部品ハンドリング装置、電子部品ハンドリングシステムおよび電子部品試験方法

Publications (2)

Publication Number Publication Date
KR20090086992A KR20090086992A (ko) 2009-08-14
KR101157414B1 true KR101157414B1 (ko) 2012-06-21

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KR1020097009784A Active KR101157414B1 (ko) 2006-11-30 2006-11-30 전자부품 핸들링 장치, 전자부품 핸들링 시스템 및 전자부품 시험방법

Country Status (3)

Country Link
KR (1) KR101157414B1 (https=)
TW (1) TW200839264A (https=)
WO (1) WO2008068798A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180080794A (ko) * 2017-01-05 2018-07-13 (주)테크윙 전자부품 핸들링 시스템

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010021038A1 (ja) * 2008-08-20 2010-02-25 株式会社アドバンテスト 電子部品ハンドリング装置および電子部品試験システム
WO2010052771A1 (ja) * 2008-11-05 2010-05-14 株式会社アドバンテスト 電子部品ハンドリング装置および電子部品移送方法
KR102722381B1 (ko) * 2016-12-29 2024-10-28 (주)테크윙 전자부품 테스트용 핸들링 시스템

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006009282A1 (ja) * 2004-07-23 2006-01-26 Advantest Corporation 電子部品試験装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08105938A (ja) * 1994-10-06 1996-04-23 Advantest Corp Ｉｃテストハンドラ
JP2000074987A (ja) * 1998-09-02 2000-03-14 Advantest Corp 電子部品試験装置
JP2000214217A (ja) * 1999-01-21 2000-08-04 Toshiba Microelectronics Corp 半導体試験方法および半導体テストシステム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006009282A1 (ja) * 2004-07-23 2006-01-26 Advantest Corporation 電子部品試験装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180080794A (ko) * 2017-01-05 2018-07-13 (주)테크윙 전자부품 핸들링 시스템
KR102853954B1 (ko) * 2017-01-05 2025-09-03 (주)테크윙 전자부품 핸들링 시스템

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Publication number Publication date
WO2008068798A1 (ja) 2008-06-12
TW200839264A (en) 2008-10-01
KR20090086992A (ko) 2009-08-14
TWI356909B (https=) 2012-01-21

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