TWI356909B - - Google Patents

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Publication number
TWI356909B
TWI356909B TW096141992A TW96141992A TWI356909B TW I356909 B TWI356909 B TW I356909B TW 096141992 A TW096141992 A TW 096141992A TW 96141992 A TW96141992 A TW 96141992A TW I356909 B TWI356909 B TW I356909B
Authority
TW
Taiwan
Prior art keywords
electronic component
test
processing device
disk
component processing
Prior art date
Application number
TW096141992A
Other languages
English (en)
Chinese (zh)
Other versions
TW200839264A (en
Inventor
Ito Akihiko
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200839264A publication Critical patent/TW200839264A/zh
Application granted granted Critical
Publication of TWI356909B publication Critical patent/TWI356909B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW096141992A 2006-11-30 2007-11-07 Electronic component handling device, electronic component handling system and electronic component testing method TW200839264A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/323924 WO2008068798A1 (ja) 2006-11-30 2006-11-30 電子部品ハンドリング装置、電子部品ハンドリングシステムおよび電子部品試験方法

Publications (2)

Publication Number Publication Date
TW200839264A TW200839264A (en) 2008-10-01
TWI356909B true TWI356909B (https=) 2012-01-21

Family

ID=39491720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096141992A TW200839264A (en) 2006-11-30 2007-11-07 Electronic component handling device, electronic component handling system and electronic component testing method

Country Status (3)

Country Link
KR (1) KR101157414B1 (https=)
TW (1) TW200839264A (https=)
WO (1) WO2008068798A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010021038A1 (ja) * 2008-08-20 2010-02-25 株式会社アドバンテスト 電子部品ハンドリング装置および電子部品試験システム
WO2010052771A1 (ja) * 2008-11-05 2010-05-14 株式会社アドバンテスト 電子部品ハンドリング装置および電子部品移送方法
KR102722381B1 (ko) * 2016-12-29 2024-10-28 (주)테크윙 전자부품 테스트용 핸들링 시스템
KR102853954B1 (ko) * 2017-01-05 2025-09-03 (주)테크윙 전자부품 핸들링 시스템

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08105938A (ja) * 1994-10-06 1996-04-23 Advantest Corp Ｉｃテストハンドラ
JP2000074987A (ja) * 1998-09-02 2000-03-14 Advantest Corp 電子部品試験装置
JP2000214217A (ja) * 1999-01-21 2000-08-04 Toshiba Microelectronics Corp 半導体試験方法および半導体テストシステム
US7919974B2 (en) * 2004-07-23 2011-04-05 Advantest Corporation Electronic device test apparatus and method of configuring electronic device test apparatus

Also Published As

Publication number Publication date
KR101157414B1 (ko) 2012-06-21
TW200839264A (en) 2008-10-01
WO2008068798A1 (ja) 2008-06-12
KR20090086992A (ko) 2009-08-14

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees