201104781 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種測試搬運機’㈣將待職之封裝晶片連 接至一測試機，並且根據測試結果對測試之封裝晶片分類曰。曰 【先前技術】 封裝晶片〃）通 能夠在一測試 一記憶體或非記憶體半導體裝置（以下稱作,， 過不同之測試製程製造，其巾這些不同之測試製程 搬運機之中執行。 =運機與一另外之測試機相連接以測試封裝晶片。測試 "插槽。此hl-flx板與測試搬運機相連接。 測^搬運機通過使用測試盤可執行一裝載製程、一卸載製 二=試=測賴夠在其中容納有封裝晶片。在 、有複數個用於谷納封裝晶片之設備。 用托====㈣觸職術㈣一使 測謝麵物心彳娜_㈣容納於 製程執行峨細。觸戦細，透過裝載 此，待概之_ s相試封裝晶片與财lx板相連接。因 測試。 、曰曰片與hl-flx板相連接，並且通過使用測試機被 而且，挪試搬運機執行卸 製程測試之鉍 士裝日日片根據测試 载製程。通過卸戴製程，通過測試 結果按照等級分類；並且然後根據 201104781 測試=搬晶片分別自測試盤傳送至對應使用托盤。 載製程==;之_•裝載、測試及卸 片的訂，為了料肋容缺蚊寸之封裝晶 /、4盤’封裝晶片的現用容納裝置自戦盤之—主框架分 二適合於容納尺寸改變的封裝晶片之新裝置與測二 過二ΓΓ。此種情況之下’由於封裝晶片的各容域置透 :如螺栓與主框架相連接，因此用以替換封裝晶片的 納裝置之過程需要很多時間，這樣容易出現故障。也就是說， 如2封裝“之尺寸改變，f知技術之職晶片之容納裝置具有 不谷易處理改變尺寸之封裝晶片之問題。 【發明内容】 —因此，鑒於上述問題，本發明之目的在於提供—種封裝晶片 之合納裝置、具有該容納裝置之測試盤以及測試搬運機，藉以克 服由於習知技術之限制及缺點所產生之一個或多個問題。 本發明之優點之一在於提供一種封裝晶片之容納褒置、具有 該容納裝置之測試盤以及測試搬運機，其中此封裝晶片之容納裝 置能夠應付封裝晶片之尺寸的改變。 本發明其他的優點、目的、以及特徵將在如下的說明書中部 分地加以闡述，並且本發明其他的優點、目的和特徵對於本領域 的普通技術人員來說，可以透過本發明如下的說明得以部分地理 解或者可以從本發明的實踐中得出。本發明的目的和其他優點可 201104781 以透過本發明所記載的說明書和申請專利範圍中特別指明的 並結合圖式部份，得以實現和獲得。 、° 為了獲得本發明之目_這些目岐其他優點，現對本發明 作具體化和概括性的描述，本發明的一種封裝晶片之 含有-主體，此主體與-測試盤之主框架相連接；一容納件^ =有一容納封裝晶片之容納槽；以及-結合單元，其與主體相連 接，此結合單元可拆分地將容納件與主體相連接 符合封裝晶片之一尺寸的容納槽之此容納件。 〃、 ^本發明之另-方面中，一種測試盤包含有—雖晶片之容 Z置，以及-主框架，其與封裝晶片之容納裝置之㈣相連接· 封裝嫩，這些絲㈣安裝有複數個 片之==月之再一方面中’一種測試搬運機包含有··一封裝晶 接.-果載^ —顺盤’其與複數個域晶片之容納裝置相連 =，此裝載單元執行一装載製程，用以將待測試之 ===片之容納裝置之中;-測試腔室，透過將 相連接㈣制試之縣^與—财吨 相連接，執仃-測試製程，·以及—卸 用以自封裝晶片之容納裝置卸載已測試之封裝、曰片订卩％ ’ 本發=:;=本發明之概二和隨後所述的 進-步揭林===轉㈣朗，並且是為了 【實施方式】 6 201104781 以下將結合w式部份詳細滅本 之相同標縣示_麵似元件。“认佳實施例’圖式令 =Γ=雜蹲翻繩…容納裝置。 且中一主體Γ」^ 一封裝晶片之容納裳置之透視圖， j主體及-痛件與封裝晶片之容納裝置相分離。「第 第3圖」係為本發明之—封裝晶片」 封裝曰S片之額裝置之分解透視圖。「第 係為本翻之—爾單元之健之透細。 圖」 -：本發明之一封裝晶片之容納裝置1包含有 今納件3、以及一結合單元4。 =2與測靖之-主框架相連接。容納件3及結合單元4 連ϋ ΓΓ此種情況之下，容納件3與主體2可拆分地相 可容納尺十/封裝晶片之尺寸改變時，容納件3能夠容易透過 了谷納尺寸改變的封裝晶片之新容納件3替換。 雖然封裝晶狀尺找變，但是本㈣ ^透輸細編辦尺術轉3，== 相比較㈣知驗#封裝晶Μ變尺辑 ^二之容崎置之情況，本發明之難晶片之容置優 =’當封裝晶片改變尺寸時，能夠僅透過替換—^ ’由此可能減少本發明之封裝晶片之容納裝置丨之維護成本。 201104781 安繼個封裝⑽納裝置，例如 測試盤執行频、’―戰贿猶個岐㈣數個 少。 冑似、職卸餘程，由此產生㈣的成本減 主體2且右—墙 容納# 3—孔A。封裳晶片能夠通過第-孔A容納於201104781 VI. Description of the Invention: [Technical Field] The present invention relates to a test carrier (4) connecting a package wafer to be tested to a test machine, and classifying the packaged wafer to be tested according to the test results.曰 [Prior Art] Packaged wafers can be executed in a test-memory or non-memorable semiconductor device (hereafter, manufactured by a different test process, which is a different test process handler). The transporter is connected to an additional tester to test the packaged wafer. Test "slot. The hl-flx board is connected to the test handler. The test handler can perform a loading process, an unloading system by using the test disc. Two = test = measurement depends on the packaged wafer in it. There are a number of equipment for the guar package wafer. With support ==== (four) touch (4) one to make the face thank you _ (four) accommodate After the process is executed, the touch is fine. By loading this, the _s phase test package wafer is connected to the financial lx board. Because of the test, the cymbal is connected with the hl-flx board, and the test machine is used. In addition, the mobile phone performs the unloading test, and the gentleman installs the daily film according to the test carrier process. Through the unloading process, the test result is classified according to the grade; and then according to the test of 201104781, the wafer is transferred from the test disk. Sent to the corresponding use tray. Carrier process ==; _• loading, testing and unloading of the order, for the ribs of the mosquito-free package crystal /, 4 sets of packaged wafers of the current storage device from the disk - the main The frame is suitable for accommodating new devices and measuring the size of the packaged wafer. In this case, 'the package is filled with various areas: if the bolt is connected to the main frame, it is used to replace the package. The process of averaging the wafer requires a lot of time, which is prone to failure. That is to say, if the size of the package is changed, the accommodating device of the wafer has a problem that it is not easy to handle the size of the packaged wafer. SUMMARY OF THE INVENTION - Accordingly, in view of the above problems, it is an object of the present invention to provide a packaging apparatus for a packaged wafer, a test tray having the same, and a test handler to overcome the limitations and disadvantages of the prior art. One or more problems. One of the advantages of the present invention is to provide a packaging device for packaging a wafer, a test tray having the receiving device, and a test handler. The accommodating device of the packaged wafer is capable of coping with the change in the size of the packaged wafer. Other advantages, objects, and features of the present invention will be partially explained in the following description, and other advantages, objects and features of the present invention are The invention will be partially understood or can be derived from the practice of the present invention by the following description of the present invention. The objects and other advantages of the present invention can be used in the specification and claims of the present invention. In particular, and in conjunction with the drawings, the invention can be realized and obtained. In order to obtain the advantages of the present invention, the present invention is embodied and described in detail, and a packaged wafer of the present invention is described. a main body that is connected to a main frame of the test disc; a receiving member having a receiving groove for accommodating the packaged wafer; and a coupling unit connected to the main body, the coupling unit detachably receiving the receiving member The accommodating portion of the accommodating groove that is connected to the main body in accordance with one of the size of the package wafer. In another aspect of the invention, a test disc includes - although the wafer has a Z-position, and - a main frame, which is connected to the (four) of the packaging device of the packaged wafer, and the package is tender, and the wires (4) are mounted with plural In another aspect of the month == one of the test carriers includes a package crystal connection. The fruit carrier is connected to a plurality of domain wafer receiving devices. The loading process is used to connect the === piece of the device to be tested; the test chamber is connected to the county by the connection of the test (4), and the test process, and - Unloading the packaged device from the packaged wafer, unloading the tested package, 曰 卩 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' And it is for the [Embodiment] 6 201104781 The following will be combined with the w-type part to detail the same standard county _ face-like components. "Recommended embodiment" schema command = Γ = miscellaneous 蹲 rope ... accommodating device. And the middle body Γ ^ 一 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装Phase separation. Fig. 3 is an exploded perspective view of the apparatus for packaging a slab of the present invention. The first embodiment of the present invention comprises a package 3 for packaging a wafer, and a bonding unit 4. = 2 is connected to the Jingjing - main frame. The accommodating member 3 and the coupling unit 4 are connected to each other. In this case, when the accommodating member 3 and the main body 2 are detachably accommodated to change the size of the sizing/packaged wafer, the accommodating member 3 can easily pass through the guenna size change. Replace the new holder 3 of the packaged wafer. Although the encapsulation of the crystal ruler is changed, this (four) ^transmission fine-tuning scale is changed to 3, == compared with (4) the inspection # package crystal Μ 辑 辑 ^ ^ 二 容 容 容 容 容 容 容 , , , , , It is possible to reduce the maintenance cost of the packaging device of the packaged wafer of the present invention by simply replacing the package when the package wafer is resized. 201104781 An following a package (10) nano device, for example, the test disk execution frequency, '-------------------------------------------------------------- Similar to the job, the remainder of the job, resulting in (4) cost reduction body 2 and right-wall accommodation # 3 - hole A. The wafer can be accommodated through the first hole A
。域2可形狀—矩形©板之Θ，並且主體2可 包含有矩形的第一孔A。 魈2T 牟21m包含有一與容納件3相連接之突出框架21。突出框 _ 2之—侧面突出。主體2可包含有複數個突出框架 21 〇 、突出框架21可包含有一突出件扣。當容納件3與主糾 連接之時’突出件211朝向容納件3之-方向突出。突出件叫 可自突出框架21之一側面朝向第一孔A之一方向突出。當容納 3透過突出件211支樓時，容納件3可與主體2相連接。 體可is有兩個突出框架21&及211)。此種情況之下，兩 個犬出框架21a及21b可分別至少包含有一個突出件犯。兩個突 出框架21a及2ib以其間的一預定間隔對崎並且配設於主體2 之内以使得犬出件211能夠支撐容納件3之兩側面。當容納件3 與主體2相連接之時，容納件3位於兩個突出框架m與抓之 間。同時，複數個突出件211可在兩個突出框架叫及训之每 -中以固定間隔提供。因此，容納件3能夠與主體2相連接而不 傾斜。 主體2可^ 3有-第-槽22，第—槽22允許容納件 3之運 8 201104781 .^㈣仏㈣咖峨間隔設置，因此 ··納件3曰架21^21b之間的一間隔。因此，容 〇 —槽22之内移動至適合與主體2相連接之位置。 相接/動時，兩個突出框架仏及训與容納件3之兩個 側面相接觸，用以由此導向容納件3之移動。 主體2與測試盤之一主框架叫如「第8圖」所示）相連接， 為此，一女裝單元23可與主體2相連接。 安裝私23可分別與主體2及測試盤之主框_ (如「第 二主體/連透卿^ 框牟2Ή 」所不）相連接。安裝單元23可包含有一固定 231、一移動框架232、以及一彈簧233。 固^匡架231與測試盤之主框架⑼（如「第8圖」所示）相 之運動IS框架231可插入至移動框架232之内。在移動框架232 導==固定框架231可與移動框架232相接觸，用以由此 =移動框架232之運動。彈㈣之一端可與固定框架231相 移動框架攻與主體2相連接，框架攻可包含有一導 不）’固定框架231可插入至該導向槽之内。移動框架 H過-作用至封裝晶片之容納裝置ι的力移動。主體2與移 ^ 動同時移動。彈簧233之另—端與移動框架说 =彈菁233，固定框架231與移動框架232可彼此相連接。 彈箐说之-端可與固定框架231相連接，並且彈酱加之另一 201104781 端可移動框架232相連接。如果彈簧233透過作用至封裝晶片之 谷納裝置1之力按壓或延伸時，移動框架232與主體2能夠彈性 移動因此’當與測試盤之主框架(如「第8圖」所示）相連 接之時，封裝晶片之容納裝置丨能夠彈性移動。 請參閱「第1圖」至「第4圖」，容納件3包含有一用以容納 封裝晶片的容納槽3卜容納件3可包含有與封裝晶片之尺寸相對 應尺寸的容納槽3卜容納件3可包含有與封裝晶片之形狀相對應 之形，的容納槽3卜容納件3可包含有形狀為矩形的容納槽Μ。 谷納件3與主體2可拆分地相連接。因此，當封裝晶片改變 其財時，封裝晶片之容納裝置i可配财透過簡單替換的容納 件3 ’該容納件3具有與封裝晶片之改變尺寸相對應之尺寸，用以 由此容易應對尺寸改變之封裝晶片。 雖然圖未示 扣 谷鯽忏可包含有一插入槽，插入槽之中插入 有突出件2η。當容納件3與主體2相連接之時，容納件3能夠透 過插入至插入槽之内的突出件211支樓。容納件3可包含有複數 傭入槽·^體2可包含有複數個突出件。當容納件3與主體2 相連接時，容納件3能夠透過分別插入至插入槽之内的突出件211 支樓。這些插入槽可透過按壓與兩個突出框架叫及训相接觸 之容納件3之_面形成。容納件3之内的插人槽之數目可與突 出之數目相同。兩個突出框架叫及训之複數個突出件 可为別插人至這些插入槽之内1此，容納件3可與主體2相 連接而不發生傾斜。 一支撐件32。 谷納件3可包含有一透過突出件211支樓之第 201104781 •當容納件3與主體2相連接之時，第 ..扣支撐。第一支㈣之形成方式為，===突出件 :兩個突出框架叫及m相接觸之容納件I第一支樓㈣自與 以預定長度突出。容納件3可包含方楚兩個側面之每―個 容納件3观m购33。==件32。 相連接時，第二切件33可與突 备谷納件3與主體2 之形成方式為，每一第-支# 目接觸。第二支撐件33 相接觸之容納件個突出框架叫及加 第二支軸可與第mm 接觸，mut32簡物之—個側面相 此，_==:之= =及第二_3相接觸時，突 叩且 件人 可包含有一第一傾斜面321且第二支樓 可包含有一第二傾斜面331。第一e g 第及第二傾斜面321及331 導向為第-傾斜面321與第二傾斜面33 一及第二傾斜面321及 健疋-兄第 之導向’使仵突出件211插入至第一 # 32與第二支標件33之間具有一較大之入口。 t使付突出件211容易插入至第一支稽件32與第二支樓件 in内。而且’當容納件3移動用以與主體2相連接 ，’第-傾斜面321及第二傾斜面331導向容納件3之移動，由 11 201104781 此容納件3能夠容易與主體2相連接。 突出件211可按照如下方式形成，當突出件叫插入至第— 一樓件32與第二支樓件％之間的空間時，突出件2丨1之尺寸自 一插入結束點朝向—插入開始點逐漸減少。因此，突出件211容 ^插入至第一支撐件32與第二域件33之間的空間中，以使得 今納件3能夠容易與主體2相連接。 °月參閱第1圖」至「第4圖」，容納件 %，突出件211穿過通過槽34。 ^有通過槽 通過槽34可形成於容納件3之兩側面 ^有苐_支撐件32。容納件3可在容納件3之_==個 兩個第一支撐件32。此種情況 側面，、有 側面形成於兩個第，件32之間。二容 1 3之另—側面形成於兩個第—域件 件3可在容納件3之一個側面 二，、圖 容納们之-__34等 ::的第一可形成於容納-之—^ 如「第3圖」所示，當通過槽％ 納件3及主體2之時，容納件 X出件211用以連接容 移動，如「第2圖」所示，由此第_；=(箭頭C之方向） 弟支偉件32透過支揮件211 12 201104781 支刺楚第-支樓件Μ與主體2相連接。也就是說，如果容納件 3自势位置移動至—第二位置，容納件3能夠與主體2相連 接。位置表不突出件211位於通過槽34之中的位置，並且第 二位=表示第-支禮件32透過突出件2ιι支擇之位置。容納件3 可在第一槽22之中移動。 =此，可能減少容納件3自主體2之側表面的突出距離，以 便將合納件3連接至主體2。因此，雖然封裝晶片之容納裝置】 在測試盤之主框架101 (如「第8圖」所示）之内彼此靠近安裝， 但疋=件3能夠容易與主體2相連接。而且，可能減少在水平 β引頭c之方向）與主體2相連接的容納件3之移動距離。 此種情況可囉翻於與將容鱗3自主體2分離的情況。 35。 ❼閱帛1圖」至「第5圖」，容納件3可包含有一結合槽 …，過在谷納件3之接觸表面之上預定深度 盥拿柄^、田合納件3與主體2相接觸時，容納件3之接觸表面 1、一相接觸。結合單元4可插入至結合槽35之中。如果結合 Γ 結合槽％之中，容納件3能夠與主體2相連接。當 谷納件3位於第—位置，即第一支樓件幻透過突出件211支樓的 之^合單％ 4可插人至結合槽35之中。結合槽35可透 -^合納件3喊。容納件3可包含有複數個結合槽^。 主^參閱「第1圖」至「第5圖」’結合單元4允許容納件3與 體可拆分地相結合。因此，當封裝晶片之尺寸改變時，本發 之封裝晶片之容納襄置1可包含有透過簡單替換的容納件3，其 13 201104781 =谷:Γ具有之容納槽31的尺寸可與改變尺寸的封裝晶片之 寸對應。目此，本義之封裝“之容納裝置1能夠容易處 理改變尺相封裝以。 ）谷易處 結合單元4可包含有一結合件41及-彈性件42。 ^合件41可軸軸域2減接，並雖_人至結合槽 二相:41插入至結合槽35之中’容納件3能夠與 體相連接1容納件3位於第二位置時，結合件㈣入至結 合槽35之中，以使得可能決定將容納件3與主體2相連接之位置。 結合件41之戦枝餅當齡件W I至結合槽％之中時， 結合件41之尺寸自—插人結束點朝向—插人開始點逐漸減少。結 。槽35之械方毅縣讀％之職與齡件^之形狀相對 應。 彈性件幻在結合件μ插入至結合槽％中的方向上向结合件 4!提供彈性。由於彈性件42，當結合件41與主體2相連接時， 結合件41能夠彈性移動。 當容納件3自第-位置朝向第二位置移動時，彈性件幻透過 =谷納件3作用至結合件41之力被她當容納件3位於第二位 置之時，雜件42釋放以使得結合件41插入至結合槽^ 3自第二位置移動至其他位置時，彈性件42透過由容納 =至結合件41之力_。耻，本發明之_片之容 納裝置i可包含有透過簡單替換的容納件3,其中該容納件3 之谷納槽31的尺寸可與改變尺寸的_晶片之尺寸相對庫。因 此，本發明之封裝“之容峨置i能夠容祕理改變尺寸的封 201104781 裝晶片。 結合單元4可與主體2相連接。如「第5圖」所示，主體2 可包含有一第二槽24及一第二孔25。結合件41與第二槽24可移 動地連接，並且第二孔25允許結合件41插入至結合槽35之中。 、’。σ件41可在第二槽24之中垂直移動。當容納件3位於第二位 置之時，結合件41透過穿過主體2的第二孔25能夠插入至結合 槽35之中。 、、，σ cr仵41可包含有一導向件411及一結合塊412。導 向件411在第二槽24之中移動。結合塊412通過穿過主體2的第 一孔25插入至結合槽35之中。彈性件42可與導向件4ιι相連接。 彈性件42可在結合塊化插入至結合槽％之中的方向上向導向 件411提供彈性。結合塊412之尺寸與第二孔25之尺寸基本相同； 並且導向件411之尺寸可相比較於第二孔25之尺寸更大。因此， 雖然彈性件42向結合件41提供彈性，但是導向件411透過主體2 支樓。因此’可能防止結合件41自主體2分離。 結合單元4可更包含有一支撐架43。 ^架43與主體2相連接。支_3能夠支轉性件们。 ==能職結合件41及支辟43树接。此種情況下， 、之&與結合件41相連接且彈性件42之另-端與支# ^ 3相連接。#彈性件42透過支縣43支料，彈性件42处牙 夠向結合件41提供彈性。 此 置1可包含有-保持單S 5。 A〈摘裝 15 201104781 保持單元5與球2相雜。_單元5關偏 納槽31之内的封穿s κ。仅狄c “ 肩於合 鎖5…移動：。可包3有-結合體51、-問 結合體51與主體2相連接。主體2可包含有-第三样％，妹 °,θ^ 之複數個第-二接。主體2可包含有與複數個結合體51相連接 复數個第二槽26。主體2可包含有兩個位於第一孔 的第，也就是說，關於第一孔Α配設的兩個第三修 閂鎖52與結合體51可旋轉地相連接 轉位置D與一第二旋轉位置E之間旋轉。 了在第一方疋 31二ΓΓ位於第一旋轉位置D之時，問鎖52可位於容納槽 之内士並且可與容納槽31之中容納的封裝晶片 觸。因此’當封裝晶>;容納於容簡31之中時 持。封裝晶片之交細捉里， 哀曰日片了被保 以便糊軸持-， 之外二=置e時，_52可位於容納槽31 之納的胸能夠一 移動件53與結合體5!可移動地 _2。移動件53與第—旋 ^ =件〜_ 問鎖52之旋轉軸仏相距 第一_位置E之間的 ^ 53 〇 雖鈔a 一 f _ 52可圍繞旋轉轴52a旋轉。 圖未不，移動件53可透過測試搬運機之中安裝的-打開 201104781 •單元赫。在铜試之城“容胁容鱗3之巾 封裝；之前，飾件53透過打開單= := 禮件⑽旋轉為位於第二旋轉位置E。在： 蝴件3之令，獻自容晴3巾取_試 於第之二旋^3透過打開單元移動’以使得問鎖52旋轉: 如線 =移 =：Τ77及結合㈣相連接。 件一，::一為力二^^^^^ 除透過打開單元_至移_3之 |去 透過推或拉軸件53㈣鶴軸件53。 置二=^=^#^531，當_52位於第二旋轉位 移動件n 納槽31之外部而不需要中斷 之==片容~^^ IT取出而不需要中斷閂鎖52。 #d52r納槽3丨之中保留的封裝㈣接觸，因此 ==::::Γ變的更長，52更靠近於封 較長，^由州/ 定保持封裝晶片。雖朗鎖52比 =二=:斷^ 使用問鎖52穩定地保持 +53 °因此’封裝晶片能夠通過 ",、、。且，封裝晶片能夠容納於容納槽31 17 201104781 之中且自容納槽31取出不需要透過_ 52產生中斷。 町，將結合圖式部份_本㈣之實關之測試盤。 第8圖」係為本發明之測靖之透視圖。 ¥ 1 ^'「第8i」’本發明W馳1G0可包含 匡’ 101 ’主框架1Q1連接有複數個封裝晶片之容納裝置1。 二 =納裝置1之情況下’當主體2位於安裝孔顧之中時:二 與主框架101相連接，由脐*锕王頫z _㈣曰u 裝於主框架101之令。因此， 雖然封裝晶片之尺寸改變，在主體2與主框架 下，僅需要簡單替換能夠容納尺寸改變 兄 此，本恢獅轉咖===_。因 ，框架101可具有排列為mxn"(其中每一、 =1 ?數)矩陣結構的安裝孔1011，主框架⑼之中安 者更”第之Γ可與測試盤100中容納的封裝晶片之數目相同或 之^夕:第圖」表示三個封裝晶片之容納裝置安裝於主_ 101 ，第9圖」係為本發二::=Γ試:::。 之移動路徑之示意圖。 &例之腔室系統中_試盤 201104781 °月參閱「第1圖」至「第11圖」’本發明之測試搬運機10包 含有一裝載單元11、一卸載單元12、以及一腔室系統13。通過使 用測試盤1GG ’測試搬運機1G可執行—裝載製程、—測試製程、 以及一卸載製程’其中測試盤100連接有複數個封裝晶片之容納 裝置1。 ' 裝载單元11執行裝載製程。裝載單元能夠將待測試之封裝晶 片裝載至各封裝晶片之容納裝置1之中。裝載單元11可包含有一 裝載堆疊H 111及—裝載拾取器 112。 裝載堆疊器111可儲存複數個使用托盤，其中每一使用托盤 谷納待測試之封裝晶片。 侧錢拾取器112對位於一裝載位置1 la的測試盤100執行裝 由 '"田待測試之封裝晶片容納於用以封裝日日日片之容納裝置1 ^時’測試盤⑽位於裝載位们^裝載單元^可包含有複 數個裝載拾取器η〗。 裝載拾取器112自位於裝載堆疊器⑴ ===:==: 臨=載單元11可包対—輯_ϋ 113。制叙封裝曰片 L時谷納於裝載緩衝器113之内 裝Β曰片 載緩衝器113。裝載拾取琴奶可包3有複數個裂 取_ __及錄緩衝器m能夠 201104781 將封裝晶片容納於裝載位置lla的測試盤 如果提供裝載緩衝器113,裝载拾取“ 内 載拾取器助、以及-第二裝載拾取器ιΐ22。第匕第一裝 自位於裝_|| 1U __錄待=取= 將拾取之封裝晶片容納於裝載緩衝器m之t。第::並: 肋自裝載緩衝器113拾取待 、。取益 裝晶片容納於位於裝載位置lla的測試==且將拾取之封 裝載緩衝H 113可在γ財向上移^雖 衝器m可與-連接複數個帶輪的皮帶相結合:由此當不一，,= 轉至少—個帶輪時，裝載緩衝H 113可㈣。 卸載單元！2執行卸載製程。卸载單元12自 裝置1卸載已戦之封裝晶片。已戦之封裝晶片藉由腔室3 =測試。卸載單元12自封裝晶片之容納裝置1分離測試之封裝晶 片’並且根據測試結果按照等級分類已測試之封装晶片。卸載單 元12可緊鄰於褒载單元I〗安裳。 卸載單元12可包含有一卸戴堆疊器⑵、一卸載拾取器. 以及一卸載緩衝器123。 合納已測試之封裝晶片的使用托盤儲存於卸載堆疊器⑵之 内三同時’已測試之封裝晶片根_試結果，按照料在卸載堆 疊益121之不同位置的使賴之中，容納於對應的使祕盤之内。 卸載拾取器122對位於卸載位置12a的測試盤1〇〇執行钟載 製程。當已測試之封裝晶片自封裝晶片之容納裝置丨分離時，測 試盤應位於卸載位置12a。如「第9圖」所示，賴位置山可 20 201104781 •位於與卸載位置12a相同之區域。雖然圖未示，卸載位置123可 鄰近裝載位置11a定位。 卸載拾取器122可包含有一第一卸載拾取器1221及一第二卸 載拾取器1222。 第-卸載拾取H 1221自城緩衝器123拾取已峨之封裝晶 片’並且將拾取之封裝“容驗錄卸載堆疊H 121的使用托 盤之内。第-卸載拾取器1221可在χ軸方向及丫軸方向上移動， 並且還可向上或向下移動。卸載單元12可包含有複數個第一卸 拾取器1221。 第二卸載拾取器1222自位於卸載位置以的測試盤卿拾取 封農晶片，並絲拾取之封裝晶片容納於卸载緩衝器123之中。 第二卸載拾取器i222可在X軸方向及γ軸方向移動，並且還可 向上或向下移動。卸載單元12可包含有複數個第二卸载拾取器 已測試之封農晶片臨時容納於卸载緩衝器123之内。卸載單 几12可包含有複數個卸載緩衝器123 ^ 时卸載緩衝器123可在γ轴方向移動。雖然圖未示，卸载緩衝 盗123可錢接複數個的皮帶減合，由財—馬達旋轉至 少一個帶輪時，卸載緩衝器123可移動。 一腔室，13包含有一第一腔室131、一測物132、以及 ΐΪ一^至133 °腔室系統13能夠在高或低溫以及一例如室溫的 正常溫度下測試封裝晶片。 第-腔室1Μ將測試盤·之_彳試的·晶片調節至一 21 201104781 第Z瓜度帛/皿度表示，當待測試之封裝晶片與Μ-fix板η相 連接且之時’細試之封裝晶4之溫度細。容納在第一腔 至131之中測试的封裂晶片之測試盤觸自裝載位置山傳送出。 第腔至131可包含有至少一個電加熱器及液化氮注入設 備’以便將待測試之封裝晶片調整至第一溫度。第一腔室⑶可 移動垂直姿態的測試盤1〇〇。 富测試盤100 、/J試之封裝晶片調整至第一溫度時，i 試盤100自第-腔1131傳送至測試腔室132。 測試腔室m將測試盤100之中的封裝晶片與财ιχ板H ^ 接觸，其中hi-fix板Η部份或全部插入至測試腔室出之中。^ ，腔室m包含有-接觸單元1321，接觸如則以將封裝 "Mx板Η相接觸。測試機測試測試盤⑽中之封裝 〇 132將封裝晶片與hi-flx板相接觞眭_ & + 判式腔』. The field 2 can be shaped—a rectangle 板 板, and the body 2 can include a rectangular first hole A. The 魈2T 牟21m includes a protruding frame 21 connected to the accommodating member 3. Protruding frame _ 2 - side protruding. The main body 2 may include a plurality of protruding frames 21 〇 , and the protruding frame 21 may include a protruding piece buckle. When the accommodating member 3 is spliced with the main body, the projecting member 211 protrudes in the direction of the accommodating member 3. The protruding member is protruded from one side of the protruding frame 21 toward one of the first holes A. The accommodating member 3 is connectable to the main body 2 when the accommodating 3 is transmitted through the protruding member 211. The body is provided with two protruding frames 21 & and 211). In this case, the two dog exit frames 21a and 21b may each contain at least one protruding member. The two projecting frames 21a and 2ib are disposed at a predetermined interval therebetween and disposed within the main body 2 to enable the dog-outlet 211 to support both sides of the accommodating member 3. When the accommodating member 3 is coupled to the main body 2, the accommodating member 3 is located between the two projecting frames m and the grip. At the same time, a plurality of protruding members 211 can be provided at regular intervals in each of the two protruding frames. Therefore, the accommodating member 3 can be connected to the main body 2 without being inclined. The main body 2 can have a -th-groove 22, and the first trough 22 allows the accommodating member 3 to be transported. 8 201104781 . . . (4) 仏 (4) 峨 峨 设置 , , 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 纳 纳 纳. Therefore, the inside of the groove 22 is moved to a position suitable for connection with the main body 2. In the case of the contact/movement, the two projecting frames are in contact with the two sides of the accommodating member 3 for guiding the movement of the accommodating member 3. The main body 2 is connected to one of the main frames of the test disc as shown in "Fig. 8". To this end, a women's unit 23 can be connected to the main body 2. The installation of the private 23 can be connected to the main frame of the main body 2 and the test disc _ (such as "the second main body / continuous transparency ^ box 牟 2 Ή"). The mounting unit 23 can include a fixed 231, a moving frame 232, and a spring 233. The movable IS frame 231 of the solid frame 231 and the main frame (9) of the test disk (as shown in Fig. 8) can be inserted into the moving frame 232. At the moving frame 232, the fixed frame 231 can be brought into contact with the moving frame 232 to thereby move the movement of the frame 232. One end of the projectile (4) can be coupled to the fixed frame 231. The frame can be connected to the main body 2, and the frame tap can include a guide. The fixed frame 231 can be inserted into the guide groove. The moving frame H is over-acting to the force of the holding device ι of the package wafer. The main body 2 moves simultaneously with the movement. The other end of the spring 233 and the moving frame say that the elastic 233, the fixed frame 231 and the moving frame 232 can be connected to each other. The magazine can be connected to the fixed frame 231, and the magazine is connected to another 201104781 movable frame 232. If the spring 233 is pressed or extended by the force applied to the nano-device 1 of the package wafer, the moving frame 232 and the main body 2 can be elastically moved, so that when connected to the main frame of the test disc (as shown in "Fig. 8") At this time, the accommodating device 封装 of the packaged wafer can be elastically moved. Referring to FIG. 1 to FIG. 4, the accommodating member 3 includes a receiving groove 3 for accommodating the packaged wafer. The accommodating member 3 may include a receiving groove 3 corresponding to the size of the packaged wafer. 3 may include a shape corresponding to the shape of the packaged wafer, and the receiving groove 3 may include a receiving groove having a rectangular shape. The guillotine piece 3 is detachably connected to the main body 2. Therefore, when the package wafer is changed, the package device i of the packaged wafer can be dispensed through a simple replacement of the holder 3' which has a size corresponding to the resizing of the package wafer, thereby being easily responsive to the size Change the packaged wafer. Although not shown, the buckle may include an insertion groove into which the projection 2n is inserted. When the accommodating member 3 is coupled to the main body 2, the accommodating member 3 can pass through the projecting member 211 which is inserted into the insertion groove. The accommodating member 3 may include a plurality of commissioning slots. The body 2 may include a plurality of protruding members. When the accommodating member 3 is coupled to the main body 2, the accommodating member 3 can pass through the projecting member 211 which is inserted into the insertion groove, respectively. These insertion grooves can be formed by pressing the surface of the accommodating member 3 which is in contact with the two projecting frames. The number of insertion slots in the holder 3 can be the same as the number of protrusions. The two protruding frames are called a plurality of protruding members which can be inserted into the insertion grooves. The receiving member 3 can be connected to the main body 2 without tilting. A support member 32. The guillotine piece 3 may include a portion of the louver that passes through the protruding member 211. 201104781. When the accommodating member 3 is coupled to the main body 2, the buckle is supported. The first branch (four) is formed in the form of === protruding members: the two protruding frames are called the first branch of the accommodating member I in contact with the m-phase (four) and protrude from the predetermined length. The accommodating member 3 can include each of the two side faces of the accommodating member. == piece 32. When connected, the second cutting member 33 can be formed in such a manner that the projection member 3 and the main body 2 are formed in such a manner that each of the first branches is in contact with each other. The second supporting member 33 is in contact with the receiving member, the protruding frame is called and the second supporting shaft is in contact with the first mm, and the side of the mut32 is in contact with each other, _==:== and the second_3 contact In time, the protrusion and the person may include a first inclined surface 321 and the second branch may include a second inclined surface 331. The first eg and second inclined faces 321 and 331 are guided to the first inclined surface 321 and the second inclined surface 33, and the second inclined surface 321 and the guide of the health-and-brothers to insert the protruding protrusion 211 into the first There is a larger entrance between #32 and the second standard member 33. The insertion protrusion 211 is easily inserted into the first branch member 32 and the second branch member in. Further, when the accommodating member 3 is moved to be coupled to the main body 2, the 'first inclined surface 321 and the second inclined surface 331 are guided to the movement of the accommodating member 3, and the accommodating member 3 can be easily connected to the main body 2 by 11 201104781. The protruding member 211 can be formed in such a manner that when the protruding member is inserted into the space between the first floor member 32 and the second branch member%, the size of the protruding member 2丨1 is oriented from an insertion end point--insertion start The point is gradually reduced. Therefore, the protruding member 211 is inserted into the space between the first support member 32 and the second domain member 33, so that the present member 3 can be easily connected to the main body 2. Referring to Fig. 1 to Fig. 4, the accommodating member 211 passes through the groove 34. ^ There is a through groove. The groove 34 can be formed on both sides of the accommodating member 3. There is a 苐_support member 32. The accommodating member 3 can be _== two first support members 32 of the accommodating member 3. In this case, the side faces are formed between the two first members 32. The other side of the second volume 1 3 is formed on the two first-domain members 3 on one side of the accommodating member 3, and the first one of the accommodating members can be formed in the accommodating-- As shown in Fig. 3, when the slot member 3 and the main body 2 are passed, the accommodating member X output member 211 is used for connection movement, as shown in "Fig. 2", whereby the _;= (arrow) Direction of C) The supporter 32 is connected to the main body 2 through the support member 211 12 201104781. That is, if the accommodating member 3 is moved from the position to the second position, the accommodating member 3 can be connected to the main body 2. The position table non-protruding member 211 is located at a position passing through the groove 34, and the second position = indicates the position at which the first-piece gift member 32 is supported by the protruding member 2ι. The accommodating member 3 is movable in the first groove 22. = This may reduce the protruding distance of the accommodating member 3 from the side surface of the main body 2 to connect the absorbing member 3 to the main body 2. Therefore, although the accommodating means for packaging the wafers are mounted close to each other within the main frame 101 of the test disc (as shown in "Fig. 8"), the 疋 = member 3 can be easily connected to the main body 2. Moreover, it is possible to reduce the moving distance of the accommodating member 3 connected to the main body 2 in the direction of the horizontal ?-head c. This situation can be reversed to the case where the volume scale 3 is separated from the main body 2. 35. Referring to Figures 1 through 5, the accommodating member 3 may include a coupling groove ... passing over a contact surface of the gull member 3 at a predetermined depth, a handle shank, a tianhe member 3, and a body 2 Upon contact, the contact surfaces 1 of the receiving member 3 are in contact. The coupling unit 4 can be inserted into the coupling groove 35. If the Γ is combined with the groove %, the accommodating member 3 can be connected to the main body 2. When the guillotine piece 3 is located at the first position, that is, the splicing unit of the first slab through the protruding piece 211 can be inserted into the coupling groove 35. The coupling groove 35 can be shouted through the receiving member 3. The accommodating member 3 may include a plurality of coupling grooves. The main unit 2 refers to "Fig. 1" to "Fig. 5". The joining unit 4 allows the accommodating member 3 to be detachably coupled to the body. Therefore, when the size of the package wafer is changed, the housing unit 1 of the packaged wafer of the present invention may include the accommodating member 3 through a simple replacement, and the size of the accommodating groove 31 is sized and resized. The size of the packaged wafer corresponds. Therefore, the package of the original meaning "the accommodating device 1 can be easily processed to change the sizing package." The splicing unit 4 can include a coupling member 41 and an elastic member 42. The splicing member 41 can be axis 2 And the splicing member (4) is inserted into the coupling groove 35, It is made possible to determine the position at which the accommodating member 3 is connected to the main body 2. When the lychee cake of the joint member 41 is in the joint groove WI, the size of the joint member 41 is changed from the end point of the insertion end to the insertion point. The point is gradually reduced. The knot is the same as the shape of the age piece. The elastic member phantom provides elasticity to the joint member 4 in the direction in which the joint member μ is inserted into the joint groove %. Due to the elastic member 42, when the coupling member 41 is coupled to the main body 2, the coupling member 41 is elastically movable. When the accommodating member 3 is moved from the first position toward the second position, the elastic member phantom transmission = the gusset member 3 acts to bond The force of the piece 41 is released by her when the accommodating member 3 is in the second position. When the coupling member 41 is inserted into the coupling groove 3 and moved from the second position to the other position, the elastic member 42 transmits the force from the accommodation = to the coupling member 41. The shaving device i of the present invention may include the transmission device The accommodating member 3 is simply replaced, wherein the size of the gull groove 31 of the accommodating member 3 can be compared with the size of the sized wafer. Therefore, the package of the present invention can accommodate the size change. Seal 201104781 loaded with wafers. The coupling unit 4 can be coupled to the main body 2. As shown in FIG. 5, the main body 2 may include a second groove 24 and a second hole 25. The coupling member 41 is movably coupled to the second groove 24, and the second hole 25 allows the coupling member 41 to be inserted into the coupling groove 35. , '. The σ member 41 is vertically movable in the second groove 24. When the accommodating member 3 is at the second position, the coupling member 41 can be inserted into the coupling groove 35 through the second hole 25 passing through the main body 2. The σ cr仵41 may include a guiding member 411 and a bonding block 412. The guide member 411 moves in the second groove 24. The coupling block 412 is inserted into the coupling groove 35 through the first hole 25 passing through the body 2. The elastic member 42 can be coupled to the guide member 4ι. The elastic member 42 can provide elasticity to the guide member 411 in a direction in which the block insertion is inserted into the coupling groove %. The size of the bonding block 412 is substantially the same as the size of the second hole 25; and the size of the guiding member 411 can be larger than the size of the second hole 25. Therefore, although the elastic member 42 provides elasticity to the coupling member 41, the guide member 411 passes through the main body 2 branch. Therefore, it is possible to prevent the joint member 41 from being separated from the main body 2. The bonding unit 4 may further include a support frame 43. The frame 43 is connected to the main body 2. Branch _3 can support the pieces. == The ability combination unit 41 and the support 43 tree connection. In this case, the & is coupled to the coupling member 41 and the other end of the elastic member 42 is coupled to the branch #^3. #弹性件42 passes through the branch of the county, and the teeth of the elastic member 42 provide elasticity to the joint member 41. This setting 1 can include a hold-single S 5 . A <Extraction 15 201104781 The holding unit 5 is mixed with the ball 2. The unit 5 closes the sealing s κ within the neutral slot 31. Only Di c "shoulders in the lock 5... move: can be packaged with 3 - combined body 51, - the combination body 51 is connected to the main body 2. The main body 2 can contain - the third sample %, sister °, θ ^ The plurality of second and second joints. The main body 2 may include a plurality of second grooves 26 connected to the plurality of combined bodies 51. The main body 2 may include two first ones located at the first holes, that is, with respect to the first holes The two second trim latches 52 are rotatably connected between the rotating position D and a second rotating position E. The first square 31 is located at the first rotational position D. At this time, the question lock 52 can be located in the sump of the accommodating groove and can be in contact with the package wafer accommodated in the accommodating groove 31. Therefore, when the package crystal is contained in the accommodating case 31, the package wafer is captured. In the mourning day, the mourning day is insured so that the slap is held - when the outer two = set e, the _52 can be located in the receiving slot 31 and the chest can be a moving member 53 and the combined body 5! movably _2. The piece 53 is rotated from the rotation axis 问 of the question lock 52 to the first _ position E. Although the banknote a-f _ 52 is rotatable about the rotation axis 52a. No, the moving part 53 can be installed through the test handler - open 201104781 • unit ah. In the copper test city "Horning the scales of the scale 3 towel package; before, the decoration 53 through the open single = := gift (10) The rotation is at the second rotational position E. In: The order of the butterfly 3, from the Rongqing 3 towel take _ try the second rotation ^ 3 through the open unit to move 'to make the lock 52 rotation: as line = shift =: Τ 77 and combined (four) connected. Piece one,:: one for force two ^^^^^ except through the opening unit _ to shift _3 | go through the push or pull shaft member 53 (four) crane shaft member 53. Set two = ^ = ^ #^531, when _52 is located outside the second rotation position of the moving member n of the slot 31 without interrupting == chip capacity ~ ^ ^ IT is taken out without interrupting the latch 52. The #d52r nano-slot 3 保留 retains the package (4) contact, so ==:::: Γ is longer, 52 is closer to the seal longer, ^ is kept by the state / fixed package wafer. Although the lock 52 ratio = two =: break ^ use the lock 52 to stably maintain +53 ° so the package wafer can pass ",,. Moreover, the package wafer can be accommodated in the accommodating groove 31 17 201104781 and can be taken out from the accommodating groove 31 without interrupting the transmission. Machi, will be combined with the test part of the pattern part _ this (four). Figure 8 is a perspective view of the survey of the present invention. ¥ 1 ^ '"8i"" The W1G0 of the present invention may comprise a accommodating device 1 in which a plurality of packaged wafers are connected to a 匡'101' main frame 1Q1. 2 = In the case of the nano device 1 'When the main body 2 is located in the mounting hole: 2 is connected to the main frame 101, and is attached to the main frame 101 by the umbilical 锕 俯 俯 z _ (4) 曰 u. Therefore, although the size of the packaged wafer is changed, under the main body 2 and the main frame, only a simple replacement is required to accommodate the size change, and the lion turns to ===_. Therefore, the frame 101 may have mounting holes 1011 arranged in a matrix structure of mxn " (each of which is =1?), and the number of packaged wafers accommodated in the test tray 100 may be the same as that of the main frame (9) The same or the same: the "picture" indicates that the three packaged wafer accommodating devices are installed in the main _101, and the ninth picture is the second one: := Γ test:::. A schematic diagram of the movement path. In the chamber system of the example, the test tray 10 of the present invention includes a loading unit 11, an unloading unit 12, and a chamber system. 13. By using the test disc 1GG' test carrier 1G, a load-carrying process, a test process, and an unloading process are performed, in which the test tray 100 is connected to a plurality of packaged wafer containing devices 1. The loading unit 11 performs a loading process. The loading unit is capable of loading the package wafer to be tested into the housing device 1 of each package wafer. The loading unit 11 can include a loading stack H 111 and a loading picker 112. The load stacker 111 can store a plurality of use trays, each of which uses a package wafer to be tested. The side money picker 112 performs a test wafer mounted on the test tray 100 at a loading position 1 la to be contained in the packaging device for packaging the day and the day. The test disk (10) is located at the loading position. The load unit ^ can include a plurality of load pickers η. The load picker 112 is located at the load stacker (1) ===:==: Pro = load unit 11 can be packaged - _ 113. The package package L is loaded with a buffer 114 in the load buffer 113. Loading and picking up the piano milk can have a plurality of cracks _ __ and the recording buffer m can 201104781 to accommodate the package wafer in the loading position 11a of the test tray. If the loading buffer 113 is provided, the loading picks the internal pickup device, and - the second loading picker ιΐ22. The first loading from the loading _|| 1U __recording = taking = accommodating the picked package wafer in the loading buffer m t.: and: rib self-loading buffer The device 113 picks up the sample. The take-up wafer is accommodated in the test at the loading position 11a == and the packaged load buffer H 113 to be picked up can be moved up in the gamma. Although the punch m can be connected to the belt of the plurality of pulleys Combination: Thus, when there is a difference, == at least one pulley, the load buffer H 113 can be (4). The unloading unit! 2 performs the unloading process. The unloading unit 12 unloads the packaged wafer from the device 1. The packaged wafer is tested by chamber 3 = the unloading unit 12 separates the tested packaged wafer from the packaged device 1 of the packaged wafer and classifies the tested packaged wafer according to the test results. The unloading unit 12 can be adjacent to the load-bearing unit I Unloading unit 12 can include A unloading stacker (2), an unloading picker, and an unloading buffer 123. The use tray of the tested packaged wafer is stored in the unloading stacker (2) while the 'tested packaged wafer root_test result, According to the different positions of the unloading stacking profit 121, it is accommodated in the corresponding secret disk. The unloading picker 122 performs a clock load process on the test disk 1 located at the unloading position 12a. When the package wafer is separated from the package device of the package wafer, the test disk should be located at the unloading position 12a. As shown in Fig. 9, the position is 20 201104781. • It is located in the same area as the unloading position 12a. Although not shown, the unloading position 123 can be positioned adjacent to the loading position 11a. The unloading picker 122 can include a first unloading picker 1221 and a second unloading picker 1222. The first-unload pickup H 1221 picks up the packaged package wafer ' from the city buffer 123 and loads the packaged package into the use tray of the stack unloading stack H 121. The first-unloading picker 1221 can be in the x-axis direction and Moving in the axial direction, and also moving up or down. The unloading unit 12 may include a plurality of first unloading pickers 1221. The second unloading picker 1222 picks up the agricultural wafer from the test disc located at the unloading position, and The wire-wound package wafer is housed in the unloading buffer 123. The second unloading picker i222 is movable in the X-axis direction and the γ-axis direction, and is also movable up or down. The unloading unit 12 may include a plurality of second The unloading picker has been tested to be temporarily housed in the unloading buffer 123. The unloading unit 12 may include a plurality of unloading buffers 123^ when the unloading buffer 123 is movable in the γ-axis direction. Although not shown, The unloading hacker 123 can withdraw a plurality of belts, and the unloading buffer 123 can be moved when the at least one pulley is rotated by the money-motor. A chamber 13 includes a first chamber 131 and a measuring object 132. And the chamber system 13 can test the package wafer at a high or low temperature and a normal temperature such as room temperature. The first chamber 1 adjusts the test wafer to a 21 201104781 The Z-thickness/dish indicates that when the package wafer to be tested is connected to the Μ-fix plate η and the temperature of the packaged crystal 4 is fine, it is accommodated in the first cavity to 131. The test disc of the chip is transferred from the loading position. The first chamber to 131 may include at least one electric heater and a liquefied nitrogen injection device 'to adjust the package wafer to be tested to the first temperature. The first chamber (3) The test disc of the movable vertical posture is 1〇〇. When the package wafer of the test tray 100, /J test is adjusted to the first temperature, the i test disc 100 is transferred from the first chamber 1131 to the test chamber 132. The test chamber m The package wafer in the test disc 100 is brought into contact with the financial panel H^, wherein the hi-fix panel is partially or completely inserted into the test chamber. ^, the chamber m includes the contact-contact unit 1321, such as Then the package "Mx board is in contact. The test machine test test board (10) Mounting 〇 132 connects the package wafer to the hi-flx board 觞眭 _ & + judgment cavity
可為垂直姿態。板相接觸時，谷納雜晶片的測試盤U 測試腔室Π2可具有至少一個電加熱器 f便將測試盤1⑻之中的待測試之封裝晶片維持於第一溫度備, 试搬運機1G可包含有魏_試腔室⑶，其^ 裝於每-個測試腔室132之内。 、-a板Η可; 當完成測試盤100之内封裝晶片 試腔室m傳送至第二腔室133 似時，測試盤1⑻自須 第二腔室！33將測試盤i⑽之中的已 第二溫度。第二溫度可為-常溫， /裝阳片調印至一 /者罪近吊溫的一溫度範圍， 22 201104781 第二齡133可具有至少-個電加熱器及液錄注人賴，以便 將測試盤謂之中已測試之封裝晶片調節至第二溫度。第二腔室 '133可移動在此係為垂直姿態之測試盤1〇〇。 當測試盤1GG之中已測試之封裝晶片調節至第二溫度時測 試盤100自第二腔室133傳送至㈣位置仏。當完成卸載製程 時’位於卸載位置12a的測試盤可傳送至裝載位置⑴。 如第ίο圖」所示’第一腔室131、測試腔m、以及第 -腔至133可相對地彼此在同一行水平排列。複數個測試腔室132 可堆疊。 如「第11圖」所示，第一腔室⑶、測試腔室132、以及第 =腔室133可彼此相對在同一列垂直排列。此種情況下，第一腔 至⑶可位於測試腔室132之上，並且同時第二腔室⑶可位於 測试腔室132之下。也就是說，測試腔室132位於第-腔室131 與第一腔室133之間。 裝载位置lla與卸載位置以可位於同一區域。此種情況之 疋轉測忒盤1⑻的旋轉單元R可位於每一裝載位置lla及 卸载位置12a。 一旋轉早凡11將其中容納有制試之封裝晶片的測試盤1〇〇自 試平姿!^疋轉至一垂直姿態。而且，旋轉單元r將容納有已測 、裝aa片的測试盤自垂直姿態旋轉至水平姿態。 行 Y '則試搬運機1能夠在具有水平姿態的測試盤1〇〇上執Can be a vertical pose. When the plates are in contact, the test disk U of the glutinous wafer test chamber Π2 may have at least one electric heater f to maintain the packaged wafer to be tested among the test disks 1 (8) at the first temperature, and the test carrier 1G may be A test chamber (3) is included, which is housed in each test chamber 132. -a board can be used; when the package wafer is completed within the test disc 100, the test chamber m is transferred to the second chamber 133, and the test disc 1 (8) is required to have the second chamber! 33 will test the second temperature in the disk i (10). The second temperature can be - normal temperature, / the temperature of the positive film is printed to one / the temperature of the hanging temperature, 22 201104781 the second age 133 can have at least one electric heater and liquid recording, so that the test will be tested The packaged wafer tested has been adjusted to a second temperature. The second chamber '133 is movable in the test tray 1 which is in a vertical posture. The test disc 100 is transferred from the second chamber 133 to the (four) position 当 when the tested package wafer in the test disc 1GG is adjusted to the second temperature. When the unloading process is completed, the test disc located at the unloading position 12a can be transferred to the loading position (1). The first chamber 131, the test chamber m, and the first chamber to 133 may be arranged horizontally in the same row with each other as shown in Fig. 00. A plurality of test chambers 132 can be stacked. As shown in Fig. 11, the first chamber (3), the test chamber 132, and the = chamber 133 may be vertically aligned with each other in the same column. In this case, the first chamber to (3) may be located above the test chamber 132, and at the same time the second chamber (3) may be located below the test chamber 132. That is, the test chamber 132 is located between the first chamber 131 and the first chamber 133. The loading position 11a and the unloading position may be located in the same area. In this case, the rotary unit R of the turn detecting disk 1 (8) can be located at each of the loading position 11a and the unloading position 12a. A rotating test panel 1 is used to test the test disc in which the test package is housed, and the test panel is rotated to a vertical posture. Moreover, the rotating unit r rotates the test disc containing the measured and mounted aa sheets from the vertical posture to the horizontal posture. Line Y 'the test carrier 1 can be executed on the test disc 1 with a horizontal attitude
二裝載製程及卸载製程，並且還執行對具有垂直姿 :執行戦製程。 U 23 201104781 裝載位置lla及卸載位置12a可為不同之區域。此種情況下， 用以旋轉測試盤100的旋轉單元R可位於每一裝載位置lla及卸 載位置12a。 雖然圖未示，測試搬運機10可包含有一第一傳送單元、一第 二傳送單元、以及一第三傳送單元。 第一傳送單元能夠將測試盤100自裝載位置Ua傳送至腔室 系統13 ’並且還能夠將測試盤100自腔室系統13傳送至卸載位置 12a。第一傳送單元可包含有複數個帶輪、一旋轉至少一個帶輪的 馬達、一連接複數個帶輪之皮帶、以及一與皮帶相連接之第一傳 送件，第一傳送件透過推或拉測試盤100傳送測試盤1〇〇<3第一傳 送單元可安裝於腔室系統13之内或可配設於每一裝載位置Ua及 卸載位置12a。 第二傳送單元能夠將藉由卸載製程變空的測試盤1〇〇,自卸載 位置12a傳送至裝載位置lla。第二傳送單元可包含有複數個帶 輪、-旋轉至少-個帶輪的馬達、—連接複數個帶輪之皮帶、以 及-與皮帶相連接之第二傳送件，第二傳送件過推或拉測試盤 100傳送用以測試盤100。 乐二得送早元能夠將測試盤100自第一腔室131傳送至測 腔室132 ’並且還能夠將測試盤100自測試腔室132傳送至第二 室133。第三傳送單元可包含有複數個帶輪、—旋轉至少一個帶 的馬達、-連接複數個帶輪之皮帶、以及—與皮帶相連接之第 =送件傳送件透過推_麵⑽㈣傳送測試盤10 第二傳送單元可位於腔室系統13之内。 24 201104781 +雖然本發a⑽前述之難實施觸露如上，然其並非用以限 定本發明。本領域之技術人貞應當意、識到在猶縣發明所附之 申請專利麵所揭示之本發明之精神和簡的情況下，所作之更 動與潤飾’均屬本發明之專他護範L關於本發明所界定 之保護範圍請參照所附之申請專利範圍。 【圖式簡單說明】 .主， 第1圖係為本發明之一封裝晶片之容納裝置之透視圖，其中 」及一容納件與該封裝晶片之容納裝置相分離； 第2圖及第3圖係為本發明之一封裝晶片之容納裝置之透視 圖其中封裝晶片之容納裝置連接有主體及容納件； 第4圖係為本發明之一封裝晶片之容納裝置之分解透視圖 第圖係為本發明之一封震晶片之容納裝置之局部剖視圖 第6圖及第7圖係為本發明之一保持單元之作業之透視圖 第8圖係為本發明之一測試盤之透視圖； 第9圖係為本發明之一測試搬運機之平面圖； 第1〇 _為本㈣之—實關之—腔室純巾的測試盤之 移動路徑之示意圖；以及 之兹t 1圖係為本發明之另—實施歉m财的測試盤 之移動路徑之示意圖。 25 201104781 【主要元件符號說明】 1 封裝晶片之容納裝置 2 主體 3 容納件 4 結合單元 5 保持單元 10 測試搬運機 11 裝載單元 11a 裝載位置 12 卸載單元 12a 卸載位置 13 腔室系統 21 ' 21a ' 21b 突出框架 22 第一槽 23 安裝單元 24 第二槽 25 第二孔 26 第三槽 31 容納槽 32 第一支撐件 33 第二支撐件 26 201104781 34 通過槽 35 結合槽 41 結合件 42 彈性件 43 支撐架 51 結合體 52 閂鎖 52a 旋轉軸 53 移動件 100 測試盤 101 主框架 111 裝載堆疊器 112 裝載拾取器 113 裝載緩衝器 121 卸載堆疊器 122 卸載拾取器 123 卸載緩衝器 131 第一腔室 132 測試腔室 133 第二腔室 211 突出件 27 201104781 231 固定框架 232 移動框架 233 彈簧 321 第一傾斜面 331 第二傾斜面 411 導向件 412 結合塊 531 釋放槽 1011 安裝孔 1121 第一裝載拾取器 1122 第二裝載拾取器 1221 第一卸載拾取器 1222 第二卸載拾取器 1321 接觸單元 A 第一孔 C 方向 D 第一旋轉位置 E 第二旋轉位置 Η hi-fix才反 R 旋轉單元 28The second loading process and the unloading process, and also the execution of the pair has a vertical posture: the execution process. U 23 201104781 The loading position 11a and the unloading position 12a may be different areas. In this case, the rotary unit R for rotating the test disc 100 may be located at each of the loading position 11a and the unloading position 12a. Although not shown, the test handler 10 can include a first transfer unit, a second transfer unit, and a third transfer unit. The first transfer unit is capable of transferring the test disc 100 from the loading position Ua to the chamber system 13' and is also capable of transferring the test disc 100 from the chamber system 13 to the unloading position 12a. The first conveying unit may include a plurality of pulleys, a motor rotating at least one pulley, a belt connecting the plurality of pulleys, and a first conveying member connected to the belt, the first conveying member being pushed or pulled The test disc 100 transmits the test disc 1 〇〇 < 3 The first transport unit can be installed in the chamber system 13 or can be disposed in each of the loading position Ua and the unloading position 12a. The second transport unit is capable of transferring the test disc 1 变 which is emptied by the unloading process from the unloading position 12a to the loading position 11a. The second transport unit may include a plurality of pulleys, a motor that rotates at least one pulley, a belt that connects the plurality of pulleys, and a second transport member that is coupled to the belt, the second transport member is over-pushed or The pull test disc 100 is transferred for testing the disc 100. The second transfer of the test disc 100 from the first chamber 131 to the test chamber 132' and also the transfer of the test disc 100 from the test chamber 132 to the second chamber 133. The third transfer unit may include a plurality of pulleys, a motor that rotates at least one belt, a belt that connects the plurality of pulleys, and a third delivery member that is connected to the belt through the push-to-surface (10) (four) transmission test tray 10 The second transfer unit can be located within the chamber system 13. 24 201104781 + Although the foregoing difficult implementation of the present invention (10) is as described above, it is not intended to limit the present invention. Those skilled in the art should understand that the changes and refinements made by the invention in the context of the invention disclosed in the application of the invention are all exclusive to the invention. Please refer to the attached patent application for the scope of protection defined by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Mainly, FIG. 1 is a perspective view of a packaging device for a packaged wafer of the present invention, in which a receiving member is separated from a receiving device of the packaged wafer; FIGS. 2 and 3 A perspective view of a receiving device for a packaged wafer of the present invention, wherein a receiving device for packaging a wafer is connected with a main body and a receiving member; and FIG. 4 is an exploded perspective view of a receiving device for a packaged wafer of the present invention. 6 is a perspective view of a holding unit of the present invention. FIG. 8 is a perspective view of one of the test discs of the present invention; FIG. Is a plan view of one of the test handlers of the present invention; a first schematic diagram of the moving path of the test disc of the chamber pure towel; and the map of the t 1 is the other - A schematic diagram of the movement path of the test disc for apologizing. 25 201104781 [Description of main components] 1 Packing device for packaged wafer 2 Main body 3 Holder 4 Binding unit 5 Holding unit 10 Test carrier 11 Loading unit 11a Loading position 12 Unloading unit 12a Unloading position 13 Chamber system 21 ' 21a ' 21b Projection frame 22 First groove 23 Mounting unit 24 Second groove 25 Second hole 26 Third groove 31 Receiving groove 32 First support member 33 Second support member 26 201104781 34 Through groove 35 Bonding groove 41 Joint member 42 Elastic member 43 Support Rack 51 Combination 52 Latch 52a Rotary shaft 53 Moving member 100 Test disc 101 Main frame 111 Loading stacker 112 Loading picker 113 Loading buffer 121 Unloading stacker 122 Unloading picker 123 Unloading buffer 131 First chamber 132 Testing Chamber 133 Second chamber 211 Projection member 27 201104781 231 Fixing frame 232 Moving frame 233 Spring 321 First inclined surface 331 Second inclined surface 411 Guide member 412 Bonding block 531 Release groove 1011 Mounting hole 1121 First loading picker 1122 Two loading picker 1221 first unloading picker 1222 Second unloading picker 1321 Contact unit A First hole C Direction D First rotation position E Second rotation position Η hi-fix reverse R Rotary unit 28