KR20100128687A - Apparatus for containing semiconductor device, test tray including the same, and test handler using the same - Google Patents

Abstract

PURPOSE: An apparatus for containing semiconductor devices is provided to be cost-effectively performing a test regardless of the sizes of the semiconductor devices by including a combining unit for detachably connecting containing units to a main body. CONSTITUTION: A main body(2) is combined with the frame of a test tray. A containing unit(3) forms a containing recess in which semiconductor devices are contained. A combining unit(4) is combined with the main body and detachably combines the containing unit to the main body. The main body includes a protrusion which is inserted into the containing unit. The containing unit includes an insertion recess for the protrusion.

Description

Apparatus for containing semiconductor device, Test tray including the same, and Test Handler using the same}

The present invention relates to a test handler that connects semiconductor devices to be tested to test equipment and classifies the tested semiconductor devices according to test results.

Memory or non-memory semiconductor devices (hereinafter referred to as "semiconductor devices") are manufactured through various test procedures. The equipment used in this test process is the test handler.

The test handler is connected to a separate test equipment for testing a semiconductor device. The test equipment includes a high fix board having a plurality of test sockets to which semiconductor devices are connected. The high fix board is coupled to the test handler.

The test handler performs a loading process, a test process, and an unloading process by using a test tray that can accommodate a semiconductor device. The test tray is provided with a plurality of semiconductor element accommodating devices for accommodating semiconductor elements.

The test handler performs a loading process of transferring the semiconductor devices to be tested to the test tray in a customer tray containing the semiconductor devices to be tested. The semiconductor devices to be tested are stored in the semiconductor device accommodating device installed in the test tray through the loading process.

The test handler performs a test process of connecting the semiconductor devices to be tested stored in the test tray to the high fix board through the loading process. The test equipment tests the semiconductor devices to be tested connected to the high fix board.

The test handler performs an unloading process of classifying the semiconductor devices tested through the test process by grades according to test results. Each tested semiconductor device is transferred from the test tray to the corresponding customer tray according to the test result.

The test handler may perform a loading process, a test process, and an unloading process on various kinds of semiconductor devices. When the semiconductor device is changed to a different size according to the type, the test handler may perform a loading process, a test process, and an unloading process by using a test tray capable of accommodating the changed semiconductor device.

Conventionally, in order to provide a test tray for accommodating a changed semiconductor device, a semiconductor device accommodating device coupled to a frame of a test tray is separated, and semiconductor device accommodating devices for accommodating the changed semiconductor device may be provided. The method of binding to the frame was used. However, this method has a problem that the replacement of the semiconductor device housing is cumbersome and takes a long time because the semiconductor device receiving devices are fastened to the frame by fasteners such as bolts. That is, when the semiconductor device is changed into a semiconductor device having a different size from the conventional one, there is a problem in that the semiconductor device cannot easily be replaced.

The present invention has been made to solve the problems described above, the object of the present invention, when changing to a semiconductor device having a different size than the existing, semiconductor device storage device, test tray, which can easily correspond to the changed semiconductor device, And provide a test handler.

In order to achieve the above-mentioned object, the present invention can include the following configuration.

A semiconductor device accommodating device according to the present invention includes a main body coupled to a frame of a test tray; An accommodating member having an accommodating groove in which the semiconductor element is accommodated; And a coupling unit coupled to the main body, the coupling unit detachably coupling the housing member to the main body so that the housing groove can be replaced with a housing member formed in a size corresponding to the semiconductor element.

The test tray according to the present invention includes the semiconductor element accommodating device in which the semiconductor element is accommodated; And a plurality of installation holes for installing the semiconductor element accommodating device, and a frame to which the main body of the semiconductor element accommodating device is coupled.

The test handler according to the present invention includes a test tray in which a plurality of semiconductor device accommodating devices, in which semiconductor devices are accommodated, are installed; A loading unit which carries out a loading process for accommodating the semiconductor device to be tested into the semiconductor device housing; A chamber unit including a test chamber in which a semiconductor device to be tested stored in the semiconductor device accommodating device is connected to a high resolution board and tested through a loading process; And an unloading unit which separates the tested semiconductor device through the chamber part from the semiconductor device accommodating device and performs an unloading process for classifying the classes according to test results.

According to the present invention, the following effects can be obtained.

When the present invention is changed to a semiconductor element having a different size from the conventional one, it is possible to easily cope with the changed semiconductor element by replacing only the housing member accommodating the semiconductor element, and to achieve the effect of reducing the material cost.

Hereinafter, a preferred embodiment of a semiconductor device accommodating device according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a state in which a main body and a receiving member are separated in a semiconductor device accommodating device according to the present invention, and FIGS. 2 and 3 are perspective views illustrating a state in which a main body and a receiving member are coupled in a semiconductor device accommodating device according to the present invention. 4 is an exploded perspective view of a semiconductor device accommodating device according to the present invention, FIG. 5 is a partially cutaway view of a semiconductor device accommodating device according to the present invention, and FIGS. 6 and 7 illustrate a state in which a fixing unit according to the present invention is operated. Perspective view.

Referring to FIG. 1, the semiconductor device accommodating apparatus 1 according to the present invention includes a main body 2, an accommodating member 3, and a coupling unit 4.

The housing member 3 and the coupling unit 4 are coupled to the main body 2. When the semiconductor element is changed to a different size, the main body 2 is detachably coupled to the accommodating member 3 so that it can be replaced with an accommodating member 3 capable of accommodating the changed semiconductor element.

Therefore, the semiconductor element accommodating device 1 according to the present invention can easily correspond to the changed semiconductor element by replacing only the accommodating member 3 when the semiconductor element is changed to a different size.

In addition, since the semiconductor element accommodating device 1 according to the present invention only needs to replace the accommodating member 3 in order to correspond to the changed semiconductor element, the material cost of the semiconductor element accommodating device is compared with that of the conventional technology in which the entire semiconductor element accommodating device is replaced. Can be saved. The test tray is provided with a large number of semiconductor device storage devices such as 64, 128, 256, and the like, and the test handler performs the loading process, the test process, and the unloading process by using a plurality of test trays at one time. The semiconductor element accommodating device 1 can save a considerable material cost.

The main body 2 is formed with a through hole A through which the semiconductor element can pass while the semiconductor element is accommodated in the accommodating member 3. The main body 2 may be formed in a rectangular plate shape as a whole, and may include a through hole A having a rectangular shape.

The main body 2 may include a protruding member 21 to which the receiving member 3 is coupled. The protruding member 21 may be formed to protrude to one side from the main body 2, and a plurality of protruding members 21 may be formed on the main body 2.

The protruding member 21 may include a protrusion 211 formed to protrude in a direction in which the accommodating member 2 is positioned when the accommodating member 2 is coupled. The protrusion 211 may be formed to protrude in the direction in which the through hole A is positioned from the protruding member 21. The accommodation member 3 may be supported by the protrusion 211 and coupled to the main body 2.

Two protrusion members 21a and 21b may be formed to face each other at a predetermined distance so that the protrusion 211 may support both sides of the accommodation member 2. The receiving member 3 is located between the two protruding members 21a and 21b when coupled to the body 2. A plurality of protrusions 211 may be formed on the protruding members 21a and 21b, respectively, spaced apart by a predetermined distance. Accordingly, the accommodating member 3 may be coupled to the main body 2 without tilting.

The main body 2 may include a moving groove 22 for moving the accommodating member 2. The moving groove 22 may be a space located between the protruding members 21a and 21b as the protruding members 21a and 21b are spaced apart from each other. The receiving member 2 may be moved to a position that can be coupled to the main body 2 in the movable groove 22. When the accommodating member 2 is moved, the protruding members 21a and 21b may be in contact with both sides of the accommodating member 2 to guide the movement of the accommodating member 2.

The body 2 is coupled to the frame 101 of the test tray (shown in FIG. 8). To this end, the installation unit 23 may be coupled to the main body 2.

The installation unit 23 is coupled to the main body 2 and the frame 101 of the test tray 101 (shown in FIG. 8), so that the main body 2 is shown in the frame 101 of the test tray 101 (FIG. 8). ) The installation unit 23 may include a fixed body 231, a mobile body 232, and an elastic body 233.

The fixture 231 is coupled to the frame 101 (shown in FIG. 8) of the test tray, and one side of the elastic body 233 is coupled. The fixed body 231 may be inserted into the movable body 232, and when the movable body 232 is moved, the fixed body 231 may contact the movable body 232 to guide the movement of the movable body 232.

The movable body 232 is coupled to the body 2, the other side of the elastic body 233 is coupled. The movable body 232 is formed with a groove (not shown) into which the fixed body 231 can be inserted. The movable body 232 may be moved according to a force acting on the semiconductor device accommodating device 1. When the movable body 232 is moved, the main body 2 is also moved together.

The elastic body 233 connects the fixed body 231 and the mobile body 232. One side of the elastic body 233 may be coupled to the fixed body 231, and the other side thereof may be coupled to the moving body 232. The elastic body 233 may be elastically moved while the mobile body 232 and the main body 2 are compressed or tensioned in accordance with the direction of the force acting on the semiconductor element accommodating device (1). Accordingly, the semiconductor device accommodating apparatus 1 may be elastically moved in a state in which it is coupled to the frame 101 of the test tray (shown in FIG. 8).

1 to 4, the accommodating member 3 has an accommodating groove 31 in which the semiconductor element is accommodated. The accommodating member 3 may include an accommodating groove 31 formed in a size corresponding to the semiconductor element. The accommodating member 3 may include an accommodating groove 31 formed in a shape corresponding to the semiconductor element, and may include an accommodating groove 31 formed in a quadrangular shape as a whole.

The receiving member 3 may be detachably coupled to the main body 2. Accordingly, when the semiconductor element is changed to a different size, the semiconductor element accommodating device 1 according to the present invention is replaced with the accommodating member 3 in which the accommodating groove 31 is formed in a size corresponding to the changed semiconductor element. By doing so, it is possible to easily cope with the changed semiconductor element.

Although not shown, the accommodating member 3 may include an insertion groove into which the protrusion 211 may be inserted. When the accommodating member 3 is coupled to the main body 2, the accommodating member 3 may be supported by the protrusions 211 respectively inserted into the insertion grooves. The insertion groove may be formed by recessing a predetermined depth at both side surfaces of the accommodation member 3 in contact with the protruding members 21a and 21b, respectively. The accommodation member 3 may include the same number of insertion grooves as the protruding member 21, and a plurality of protrusions 211 may be inserted into the insertion grooves, respectively. Therefore, the receiving member 3 may be coupled to the main body 2 without tilting.

The accommodation member 3 may include a first support member 32 supported by the protrusion 211. The first support member 32 may be supported by the protrusion 211 when the accommodating member 3 is coupled to the main body 2. The first support member 32 may be formed to protrude a predetermined length from both sides of the receiving member 3 in contact with the protrusion member (21a, 21b), respectively. The accommodation member 3 may include a plurality of first support members 32.

The accommodation member 3 may further include a second support member 33. The second support member 33 may contact the protrusion 211 when the accommodating member 3 is coupled to the main body 2. The second supporting member 33 may be formed to protrude a predetermined length from both sides of the receiving member 3 in contact with the protruding members 21a and 21b, respectively.

The second support member 33 may be formed at a position spaced apart from the first support member 32 by a predetermined distance. Accordingly, the protrusion 211 may be inserted between the second support member 33 and the first support member 32. In this case, the first support member 32 may be in contact with one surface of the protrusion 211, and the second support member 33 may be in contact with the other surface of the protrusion 211. Therefore, when the accommodating member 3 is moved to be coupled to the main body 2, the protrusion 211 is in contact with the first support member 32 and the second support member 33 to receive the accommodating member. The movement of the member 3 can be guided.

The first support member 32 and the second support member 33 may further include a first slope 321 and a second slope 331, respectively. The first inclined surface 321 and the second inclined surface 331 may be inclined in directions opposite to each other, and the protrusion 211 may be formed between the first support member 32 and the second support member 33. ) May be inclined in a direction to enlarge the inlet space for insertion.

Accordingly, the protrusion 211 may be easily inserted between the first support member 32 and the second support member 33. In addition, the first inclined surface 321 and the second inclined surface 331 guide the movement of the accommodating member 3 when the accommodating member 3 is moved to be coupled to the main body 2. The accommodation member 3 may be easily coupled to the main body 2.

The protrusion 211 may be formed to decrease in size in a direction inserted between the first support member 32 and the second support member 33. Accordingly, the protrusion 211 is easily inserted between the first support member 32 and the second support member 33, so that the accommodation member 3 is easily coupled to the main body 2. You can do that.

1 to 4, the accommodating member 3 may further include a passage groove 34 through which the protrusion 211 may pass.

The through grooves 34 may be formed at both side surfaces of the accommodating member 3 in which the first supporting member 32 is formed. Two first support members 32 may be formed on one side of the accommodating member 3, and the passage groove 34 may be formed between the first support members 32. Two first support members 32 may be formed on the other side surface of the accommodating member 3, and the through hole 34 may be formed between the first support members 32. Although not shown, the first support member 32 may be formed at the central portion of the side surface of the accommodation member 3, and the through grooves 34 may be formed at both sides of the first support member 32. .

Accordingly, as shown in FIG. 2, the receiving member 3 is positioned to overlap the main body 2 such that the protrusion 211 is positioned in the passage groove 34. As the receiving member 3 is moved in the horizontal direction (in the direction of the arrow C), the first supporting member 32 may be coupled to the main body 2 so as to be supported by the protrusion 211. That is, the accommodating member 3 moves from the first position in which the protrusion 211 is positioned in the passage groove 34 to the second position in which the first supporting member 32 is supported by the protrusion 211. By doing so it can be coupled to the body (2). The accommodating member 3 may be moved in the movable groove 22.

Therefore, since the accommodation member 3 can reduce the distance protruding to the side of the main body 2 to be coupled to the main body 2, the semiconductor device receiving apparatus 1 is the frame 101 of the test tray 8 may be easily coupled to the main body 2 even if the storage member 3 is installed adjacent to the main body 2. In addition, the distance in which the receiving member 3 is moved in the horizontal direction (C arrow direction) to be coupled to the main body 2 can be reduced. The same applies to the case where the housing member 3 is separated from the main body 2.

1 to 5, the accommodating member 3 may include a coupling groove 35.

When the accommodating member 3 is coupled to the main body 2, the coupling groove 35 may be formed by recessing a predetermined depth in a surface where the accommodating member 3 contacts the main body 2. . The coupling unit 4 may be inserted into the coupling groove 35, and the accommodation unit 3 may be coupled to the main body 2 by inserting the coupling unit 4 into the coupling groove 35. Can be. When the accommodating member 3 is positioned at a second position in which the first support member 32 is supported by the protrusion 211, the coupling unit 4 may be inserted into the coupling groove 35. . A plurality of coupling grooves 35 may be formed, and may be formed through the receiving member 3.

1 to 5, the coupling unit 4 detachably couples the accommodation member 3 to the main body 2. Accordingly, when the semiconductor element is changed to a different size, the semiconductor element accommodating device 1 according to the present invention is replaced with the accommodating member 3 in which the accommodating groove 31 is formed in a size corresponding to the changed semiconductor element. By doing so, it is possible to easily cope with the changed semiconductor element.

The coupling unit 4 may include a coupling member 41 and an elastic member 42.

The coupling member 41 is movably coupled to the main body 2 and may be inserted into the coupling groove 35. As the coupling member 41 is inserted into the coupling groove 35, the accommodation member 3 may be coupled to the main body 2. The coupling member 41 is inserted into the coupling groove 35 when the accommodating member 3 is positioned at the second position, thereby determining a position at which the accommodating member 3 is coupled to the main body 2. Can be. The coupling member 41 may be formed to decrease in size in the direction in which the coupling member 41 is inserted into the coupling groove 35. The coupling groove 35 may be formed in a shape corresponding to the coupling member 41.

The elastic member 42 provides an elastic force to the coupling member 41 in the direction in which the coupling member 41 is inserted into the coupling groove 35. Due to the elastic member 42, the coupling member 41 can be elastically moved in a state coupled to the main body (2).

The elastic member 42 may be compressed by a force applied by the housing member 3 to the coupling member 41 when the housing member 3 is moved from the first position to the second position. have. The elastic member 42 may be tensioned so that the coupling member 41 is inserted into the coupling groove 35 when the accommodating member 3 is positioned at the second position. The elastic member 42 may be compressed by a force applied by the housing member 3 to the coupling member 41 when the housing member 3 is moved from the second position to another position. Accordingly, the semiconductor device accommodating device 1 may be easily replaced with the accommodating member 3 having the accommodating groove 31 corresponding to the size of the semiconductor device.

The coupling unit 4 may be coupled to the body 2. As shown in FIG. 5, the main body 2 may include a groove 24 to which the coupling member 41 is movably coupled, and the coupling member 41 may be inserted into the coupling groove 35. It may include a through hole 25 to be. The coupling member 41 may be moved in the vertical direction while being inserted into the groove 24, and the main body through the through hole 25 when the receiving member 3 is positioned in the second position. It can be inserted into the coupling groove 35 through (2).

Here, the coupling member 41 passes through the main body 2 through the moving body 411 and the through-hole 25 is inserted into the groove 24, the coupling groove 35 It may include a coupling protrusion 412 is inserted into. The elastic member 42 may be coupled to the movable body 411, and may provide an elastic force to the movable body 411 in the direction in which the coupling protrusion 412 is inserted into the coupling groove 35. . The coupling protrusion 412 may have a size substantially coincident with the through hole 25, and the moving body 411 may have a size larger than that of the through hole 25. Accordingly, even when the elastic member 42 exerts an elastic force on the coupling member 41, the movable body 411 is supported by the main body 2 so that the coupling member 41 is supported by the main body 2. It is possible to prevent the departure.

The coupling unit 4 may further include a support 43.

The support 43 may be coupled to the main body 2 and support the elastic member 42. The elastic member 42 may be coupled between the coupling member 41 and the support 43, and may be supported by the support 43 to provide an elastic force to the coupling member 41.

1 to 7, the semiconductor device accommodating device 1 may further include a fixing unit 5.

The fixing unit 5 may be coupled to the main body 2 and fix the semiconductor element accommodated in the accommodation groove 31. The fixing unit 5 may include a coupling body 51, a fixing member 52, and a moving member 53.

The coupling body 51 is coupled to the body (2). The main body 2 may include an installation groove 26 to which the coupling body 51 is coupled. The coupling body 51 may be coupled to the body 2 in a state of being inserted into the installation groove 26. The main body 2 may include a plurality of installation grooves 26 so that the plurality of coupling bodies 51 may be coupled thereto. The main body 2 may include two installation grooves 26 on both sides of the through hole A based on the through hole A. Referring to FIG.

The fixing member 52 is rotatably coupled to the coupling body 51. The fixing member 52 may be rotated between the first rotation position (D) and the second rotation position (E).

When the fixing member 52 is positioned at the first rotational position D, the fixing member 52 may be located inside the accommodation groove 31 and may be accommodated in the accommodation groove 31. It may be in contact with the top surface of the device. Accordingly, the semiconductor device may be fixed in a state of being accommodated in the accommodation groove 31. The semiconductor device accommodating device 1 may include two fixing units 5 installed to face each other so that the semiconductor device may be stably fixed by the fixing member 52.

When the fixing member 52 is located at the second rotational position E, the fixing member 52 may be located outside the receiving groove 31. Accordingly, the semiconductor device may be accommodated in the accommodating groove 31 and taken out of the accommodating groove 31 without being disturbed by the fixing member 52.

The movable member 53 is movably coupled to the coupling body 51 and may rotate the fixing member 52. Although not shown, the movable member 53 is positioned at a predetermined distance from the rotation shaft 52a for rotating the fixing member 52 between the first rotation position D and the second rotation position E. FIG. It may be combined with the fixing member 52. Accordingly, when the moving member 53 is moved in the vertical direction, the fixing member 52 may be rotated about the rotation shaft 52a.

Although not shown, the movable member 53 may be moved by an open unit installed in the test handler. The movable member 53 is moved by the opening unit before the semiconductor element to be tested is accommodated in the accommodating member 3 and before the tested semiconductor element is taken out of the accommodating member 3. 52 may be positioned at the second rotational position (E). The movable member 53 is moved by the opening unit after the semiconductor element to be tested is accommodated in the accommodating member 3 and after the tested semiconductor element is removed from the accommodating member 3. The member 52 may be positioned at the first rotational position D. FIG.

An elastic member (not shown) may be coupled between the movable member 53 and the coupling body 51. Accordingly, when the opening unit exerts a force on the movable member 53, the movable member 53 compresses the elastic member (not shown) while the fixing member 52 is in the second rotational position E. It can be rotated to be located at. When the opening unit removes the force applied to the movable member 53, the movable member 53 is the fixed member 52 by the restoring force of the elastic member (not shown) is the first rotation position (D) Can be rotated to The opening unit may move the movable member 53 by pushing or pulling the movable member 53.

The moving member 53 may include a groove 531 into which the fixing member 52 is inserted when the fixing member 52 is positioned at the second rotation position E. FIG. As the fixing member 52 is inserted into the groove 531, the fixing member 52 may be located outside the receiving groove 31 without being disturbed by the moving member 53.

Accordingly, the semiconductor device may be accommodated in the accommodating groove 31 and taken out of the accommodating groove 31 without being disturbed by the fixing member 52. In addition, even if the fixing member 52 is formed to have a long length, the fixing member 52 may be positioned outside the receiving groove 31 by being inserted into the groove 531, so that the semiconductor device is provided in the receiving groove. The semiconductor device can be stably contacted with and fixed to a portion close to the center of the semiconductor device accommodated in the storage groove 31 without being disturbed when it is received in the storage groove 31. Can be fixed

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of a test tray according to the present invention will be described in detail.

8 is a perspective view of a test tray according to the present invention.

1 to 8, the test tray 100 according to the present invention may include a frame 101 in which a plurality of semiconductor device accommodating devices 1 are installed.

The frame 101 is provided with a plurality of mounting holes 1011 for installing the semiconductor device accommodating device 1. The semiconductor device accommodating apparatus 1 may be installed in the frame 101 by coupling the main body 2 to the frame 101 while the main body 2 is positioned in the installation hole 1011. have. Accordingly, when the semiconductor element is changed to a different size, only the housing member 3 capable of accommodating the changed semiconductor element while the main body 2 is coupled to the frame 101 is replaced. It can respond easily to an element.

The installation hole 1011 may be formed in the frame 101 in a (m X n) matrix (m, n is an integer greater than 1). The installation holes 1011 may be formed in the frame 101 in a number equal to or greater than the number of semiconductor devices accommodated in the test tray 100. Although FIG. 8 illustrates a state in which three semiconductor device accommodating devices 1 are installed in the frame 101, the number of semiconductor device accommodating devices 1 corresponds to the number of semiconductor devices accommodated in the test tray 100. It may be installed in the frame 101.

Hereinafter, a preferred embodiment of a test handler according to the present invention will be described in detail with reference to the accompanying drawings.

9 is a schematic plan view of a test handler according to the present invention, FIG. 10 is a schematic view showing a path in which a test tray is moved in a chamber unit according to an embodiment of the present invention, and FIG. 11 is a chamber according to another embodiment of the present invention. This is a schematic diagram showing a path in which a test tray is moved in a part.

1 to 11, the test handler 10 according to the present invention includes a loading unit 11, an unloading unit 12, and a chamber unit 13. The test handler 10 may perform a loading process, a test process, and an unloading process by using the test tray 100 in which the plurality of semiconductor device accommodating devices 1 are installed.

The loading unit 11 performs a loading process of accommodating the semiconductor devices to be tested in the semiconductor device accommodating apparatus 1.

The loading unit 11 may include a loading stacker 111 and a loading picker 112.

The loading stacker 111 stores a plurality of customer trays containing semiconductor devices to be tested.

The loading picker 112 performs a loading process on the test tray 100 located at the loading position 11a. The test tray 100 is located at the loading position 11a when the semiconductor devices to be tested are accommodated in the semiconductor device accommodating device 1. The loading unit 11 may include a plurality of loading pickers 112.

The loading picker 112 may pick up the semiconductor devices to be tested in the customer tray located in the loading stacker 111 and store the picked-up semiconductor devices in the test tray 100 located at the loading position 11a. have. The semiconductor devices are accommodated in the semiconductor device accommodating device 1 installed in the test tray 100. The loading picker 112 may move in the X-axis direction and the Y-axis direction, and may be moved up and down.

The loading unit 11 may further include a loading buffer 113.

The loading buffer 113 temporarily stores the semiconductor devices to be tested. The loading unit 11 may include a plurality of loading buffers 113.

As the loading buffer 113 is provided, the loading picker 112 tests the semiconductor elements to be tested in the customer tray via the loading buffer 113 in the test tray 100 located at the loading position 11a. Can be stored in.

When the loading buffer 113 is provided, the loading picker 112 may include a first loading picker 1121 and a second loading picker 1122. The first loading picker 1121 may pick up the semiconductor devices to be tested from the customer tray located in the loading stacker 111 and store the picked-up semiconductor devices in the loading buffer 113. The second loading picker 1122 may pick up the semiconductor devices to be tested in the loading buffer 113 and store the picked-up semiconductor devices in the test tray 100 located at the loading position 11a.

The loading buffer 113 may be moved in the Y-axis direction. Although not shown, the loading buffer 113 may be coupled to a belt connecting the plurality of pulleys so that the motor may move as the at least one of the pulleys rotates.

The unloading unit 12 performs an unloading process of separating the tested semiconductor device through the chamber part 13 from the semiconductor device accommodating device 1 and classifying the resultant according to a test result. The unloading part 12 may be installed next to the loading part 11.

The unloading unit 12 may include an unloading stacker 121, an unloading picker 122, and an unloading buffer 123.

The unloading stacker 121 stores a plurality of customer trays containing the tested semiconductor devices. The tested semiconductor devices are stored in a customer tray corresponding to a test result among customer trays located at different positions for each grade in the unloading stacker 121.

The unloading picker 122 performs an unloading process on the test tray 100 located at the unloading position 12a. The test tray 100 is located at the unloading position 12a when the semiconductor devices tested from the semiconductor device accommodating device 1 are separated. As shown in FIG. 9, the loading position 11a and the unloading position 12a may be the same position. Although not shown, the unloading position 12a may be located next to the loading position 11a.

The unloading picker 122 may include a first unloading picker 1221 and a second unloading picker 1222.

The first unloading picker 1221 may pick up the semiconductor devices tested in the unloading buffer 123 and store the picked-up semiconductor devices in a customer tray located in the unloading stacker 121. The first unloading picker 1221 may be moved in the X-axis direction and the Y-axis direction, and may be moved up and down. The unloading unit 12 may include a plurality of first unloading pickers 1221.

The second unloading picker 1222 may pick up semiconductor devices from the test tray 100 located at the unloading position 12a and store the picked-up semiconductor devices in the unloading buffer 123. The second unloading picker 1222 may move in the X-axis direction and the Y-axis direction, and may move up and down. The unloading unit 12 may include a plurality of second unloading pickers 1222.

The unloading buffer 123 temporarily stores the tested semiconductor devices. The unloading unit 12 may include a plurality of unloading buffers 123.

The unloading buffer 123 may be moved in the Y-axis direction. Although not shown, the unloading buffer 123 may be coupled to a belt connecting the plurality of pulleys so that the motor may move as the motor rotates at least one of the pulleys.

The chamber 13 may include a first chamber 131, a test chamber 132, and a second chamber 133 so that the test equipment may test the semiconductor devices not only at room temperature but also at high or low temperature. ).

The first chamber 131 adjusts the semiconductor devices to be tested contained in the test tray 100 to a first temperature. The first temperature is a temperature range of the semiconductor devices to be tested when the semiconductor devices to be tested are connected to the high fix board H provided in the test equipment and tested. The test tray 100 containing the semiconductor devices to be tested is a test tray 100 transferred from the loading position 11a.

At least one of an electrothermal heater or a liquid nitrogen injection system may be installed in the first chamber 131 to adjust the semiconductor devices to be tested to a first temperature. The first chamber 131 may move the test tray 100 in a vertical state therein.

When the semiconductor devices to be tested are adjusted to the test temperature, the test tray 100 is transferred from the first chamber 131 to the test chamber 132.

The test chamber 132 connects the semiconductor devices accommodated in the test tray 100 to the high fix board H. A part or all of the high fix board H is inserted into the test chamber 132, and a contact unit 1321 for connecting the semiconductor devices to the high fix board H is installed. The test equipment tests the semiconductor devices to determine electrical characteristics of the semiconductor devices to be tested connected to the high fix board H. The test chamber 132 may connect the semiconductor devices accommodated in the test tray 100 in a vertical state to the high fix board H.

The test chamber 132 may be provided with at least one of an electrothermal heater or a liquid nitrogen injection system so that the semiconductor devices to be tested may be maintained at a first temperature during the test. The test handler 10 may include a plurality of test chambers 132, and a high fix board H may be installed in each of the plurality of test chambers 132.

When the test for the semiconductor devices is completed, the test tray 100 is transferred from the test chamber 132 to the second chamber 133.

The second chamber 133 adjusts the tested semiconductor devices accommodated in the test tray 100 to a second temperature. The second temperature is a temperature range including at or near room temperature. At least one of an electrothermal heater or a liquid nitrogen injection system may be installed in the second chamber 133 to adjust the tested semiconductor elements to a second temperature. The second chamber 133 may move the test tray 100 in a vertical state therein.

When the tested semiconductor devices are adjusted to the second temperature, the test tray 100 is transferred from the second chamber 133 to the unloading position 12a. The test tray 100 transferred to the unloading position 12a may be transferred to the loading position 11a when the unloading process is completed.

As shown in FIG. 10, the first chamber 131, the test chamber 132, and the second chamber 133 may be installed in a horizontal direction. The test chamber 132 may be installed in a plurality of stacked up and down.

As shown in FIG. 11, the first chamber 131, the test chamber 132, and the second chamber 133 may be stacked up and down. In this case, the first chamber 131 may be installed above the test chamber 132, and the second chamber 133 may be installed below the test chamber 132.

The loading position 11a and the unloading position 12a may be the same position. In this case, a rotator R for rotating the test tray 100 may be installed at the loading position 11a and the unloading position 12a.

The rotator R rotates the test tray 100 in which the semiconductor devices to be tested are accommodated, thereby switching from the horizontal state to the vertical state. The rotator R rotates the test tray 100 in which the tested semiconductor devices are accommodated, thereby switching from the vertical state to the horizontal state.

Accordingly, the test handler 1 may perform a loading process and an unloading process on the test tray 100 in a horizontal state, and perform a test process on the test tray 100 in a vertical state.

The loading position 11a and the unloading position 12a may be different positions. In this case, a rotator R for rotating the test tray 100 may be installed at the loading position 11a and the unloading position 12a, respectively.

Although not shown in the loading position 11a and the unloading position 12a, the test tray 100 is transferred from the loading position 11a to the chamber portion 13 or the test tray 100 is transferred to the chamber. A transfer means for transferring the portion 13 to the unloading position 12a may be installed. The conveying means may be coupled to the plurality of pulleys, the belts connecting the pulleys, and the belt to push or pull the test tray 100. The transfer means may be installed in the chamber portion 13.

The test handler 1 may further include a transfer unit (not shown).

The transfer unit may transfer the test tray 100, which is emptied through an unloading process, from the unloading position 12a to the loading position 11a. Although not shown, the transfer part may include a plurality of pulleys, a belt connecting the pulleys, and a moving member coupled to the belt to push or pull the test tray 100.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and alterations are possible within the scope without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

1 is a perspective view showing a state in which a main body and a receiving member are separated in a semiconductor device accommodating device according to the present invention;

2 and 3 are perspective views showing a state in which the main body and the receiving member is coupled in the semiconductor device receiving apparatus according to the present invention;

4 is an exploded perspective view of a semiconductor device accommodating device according to the present invention.

5 is a partial cutaway view of a semiconductor device accommodating device according to the present invention.

6 and 7 are perspective views showing a state in which the fixing unit according to the invention is operated

8 is a perspective view of a test tray according to the present invention;

9 is a schematic plan view of a test handler according to the present invention.

10 is a schematic diagram showing a path in which a test tray is moved in a chamber part according to an embodiment of the present invention.

11 is a schematic view showing a path in which the test tray is moved in the chamber according to another embodiment of the present invention.

Claims (10)

A body coupled to the frame of the test tray; An accommodating member having an accommodating groove in which the semiconductor element is accommodated; And And a coupling unit coupled to the main body, the coupling unit detachably coupling the receiving member to the main body so that the receiving groove can be replaced with a receiving member having a size corresponding to the semiconductor element. The method of claim 1, The main body includes a protrusion inserted into the receiving member; The housing member is a semiconductor device receiving apparatus, characterized in that the insertion groove is formed is inserted into the projection. The method of claim 1, The main body includes a protrusion formed to protrude in a direction in which the housing member is located when the housing member is coupled; And the housing member includes a first support member supported by the protrusion. The method of claim 3, The first support member is in contact with one surface of the protrusion, The accommodation member includes a second support member in contact with the other surface of the protrusion, And the protrusion is inserted between the first support member and the second support member. The method of claim 3, The accommodation member further includes a passage groove through which the protrusion can pass, The main body includes a moving groove for moving the accommodating member between a first position in which the protrusion is positioned in the passage groove and a second position in which the first support member is supported by the protrusion; And the coupling unit couples the accommodation member to the main body when the accommodation member is positioned in the second position. The method of claim 1, A fixing unit fixed to the semiconductor device coupled to the main body and received in the receiving groove; The fixing unit is a coupling body coupled to the main body, a fixing member rotatably coupled to the coupling body and in contact with a semiconductor element accommodated in the receiving groove, and coupled to the coupling body so as to be movable. Including a moving member to rotate; The fixing member is rotated between a first rotational position inside the receiving groove and a second rotational position outside the receiving groove; And a groove into which the fixing member is inserted when the fixing member is positioned in the second rotational position. The method of claim 1, A coupling groove is formed in the accommodation member; The coupling unit includes a coupling member movably coupled to the main body and inserted into the coupling groove, and an elastic member providing elastic force to the coupling member in a direction in which the coupling member is inserted into the coupling groove. A semiconductor element storage device characterized in that. The method of claim 7, wherein The coupling member is inserted into the coupling groove through the main body, The coupling unit further includes a support coupled to the main body to support the elastic member, And the elastic member is coupled between the coupling member and the support. A semiconductor element accommodating device according to any one of claims 1 to 8 in which semiconductor elements are accommodated; And A test tray including a frame in which a plurality of installation holes for installing the semiconductor device housing device is formed, and the main body of the semiconductor device housing device is coupled. A test tray provided with a plurality of semiconductor device accommodating devices according to any one of claims 1 to 8; A loading unit which carries out a loading process for accommodating the semiconductor device to be tested into the semiconductor device housing; A chamber unit including a test chamber in which a semiconductor device to be tested stored in the semiconductor device accommodating device is connected to a high resolution board and tested through a loading process; And And an unloading unit which separates the tested semiconductor element through the chamber unit from the semiconductor element storage device and performs an unloading process for classifying the grades according to test results.

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