KR20110111957A - Buffer unit and test handler having the same - Google Patents

Abstract

The present invention includes a buffer including a first groove including an accommodating portion for accommodating a semiconductor element, and a buffer member in which a plurality of the first grooves are formed, wherein the accommodating portion is formed to have a size in which a plurality of semiconductor elements are stacked and stored. A device and a test handler comprising the same,
According to the present invention, it can be implemented to accommodate a larger number of semiconductor devices without increasing the size of the buffer device, so that the loading process, the test process, and the unloading process for more semiconductor devices in a short time Can be done.

Description

Buffer unit and test handler having the same {Buffer Unit and Test Handler having the same}

The present invention relates to a test handler for connecting semiconductor devices to be tested to a test device and classifying the semiconductor devices tested by the test device according to the test result.

Memory or non-memory semiconductor devices (hereinafter referred to as "semiconductor devices") are manufactured through various test procedures. The equipment used in this test process is the test handler.

The test handler is connected to a separate test equipment for testing a semiconductor device. The test equipment includes a high fix board having a plurality of test sockets to which semiconductor devices are connected. The high fix board is coupled to the test handler.

The test handler performs a loading process, a test process, and an unloading process by using a test tray having a plurality of sockets for storing semiconductor elements.

The test handler performs a loading process of accommodating a semiconductor device to be tested contained in a customer tray in a test tray.

The test handler performs a test process of connecting the semiconductor devices stored in the test tray to the high fix board through the loading process. The test equipment tests the semiconductor devices connected to the high fix board to determine whether the semiconductor devices operate normally. The test handler includes a plurality of chambers capable of heating or cooling the semiconductor devices so that the test equipment can determine whether the semiconductor devices operate normally in extreme environments of high or low temperature as well as at room temperature.

The test handler performs an unloading process of separating the semiconductor devices tested through the test process from the test tray and accommodating the semiconductor devices according to the test result into a customer tray corresponding to the class.

Here, as the time taken for the loading process, the test process, and the unloading process is reduced, more semiconductor devices can be manufactured in a shorter time, and product competitiveness, such as a reduction in manufacturing cost of semiconductor devices, can be strengthened. . Accordingly, there is a need for the development of a technology that enables a test handler to perform a loading process, a test process, and an unloading process for more semiconductor devices in a short time.

The present invention has been made to solve the above-described problems, an object of the present invention is to provide a buffer device and a test handler including the same to perform a loading process and an unloading process for more semiconductor devices in a short time To provide.

In order to achieve the above-mentioned object, the present invention can include the following configuration.

The buffer device according to the present invention may include a first groove including an accommodating part for accommodating a semiconductor device, and a buffer member in which a plurality of the first grooves are formed. The accommodating part may be formed to have a size that allows a plurality of semiconductor elements to be stacked and stacked up and down.

The test handler according to the present invention includes a loading unit for carrying out a loading process for accommodating a semiconductor device to be tested in a test tray, a chamber unit for connecting the semiconductor device stored in the test tray to the high fix board through the loading process, and the tested unit. The semiconductor device may include an unloading unit that separates the semiconductor device from the test tray and performs an unloading process for classifying the semiconductor devices by grade. The loading unit may include a loading buffer having the buffer device.

The test handler according to the present invention includes a loading unit for carrying out a loading process for accommodating a semiconductor device to be tested in a test tray, a chamber unit for connecting the semiconductor device stored in the test tray to the high fix board through the loading process, and the tested unit. The semiconductor device may include an unloading unit that separates the semiconductor device from the test tray and performs an unloading process for classifying the semiconductor devices by grade. The unloading unit may include an unloading buffer having the buffer device.

According to the present invention can achieve the following effects.

The present invention can be implemented to accommodate a larger number of semiconductor devices without increasing the size of the buffer device, thereby performing a loading process, a test process, and an unloading process for more semiconductor devices in a short time. We can aim at effect that we can do.

1 is a schematic block diagram of a test handler in which a buffer device according to the present invention may be used.
2 is a schematic perspective view of a buffer device according to the present invention;
3 is a partial cross-sectional view taken along line AA of FIG.
4 is a schematic plan view of a test handler according to an embodiment of the present invention.
5 is a schematic diagram illustrating a path in which a test tray is transported in the test handler of FIG. 4.
Figure 6 is a schematic diagram showing a path in which the test tray is transported in the test handler according to another embodiment of the present invention
7 is a schematic plan view of a test handler according to another embodiment of the present invention.

Hereinafter, a test handler in which a buffer device according to the present invention may be used will be described in detail with reference to the accompanying drawings.

1 is a schematic block diagram of a test handler in which a buffer device according to the present invention may be used.

Referring to FIG. 1, a test handler 1 in which a buffer device according to the present invention may be used may include a loading unit 2, an unloading unit 3, and a chamber unit 4.

The loading unit 2 performs a loading process of transferring the semiconductor device to be tested from the customer tray to the test tray. The loading unit 2 may include a loading stacker 21, a loading picker 22, and a loading buffer 23.

The loading stacker 21 stores a plurality of customer trays containing semiconductor devices to be tested.

The loading picker 22 may pick up the semiconductor device to be tested from the customer tray located in the loading stacker 21 and store it in the test tray. When the semiconductor element to be tested is received in the test tray, the test tray may be positioned at the loading position.

The loading buffer 23 may temporarily receive the semiconductor device to be tested. The loading buffer 23 may include a buffer device according to the present invention. The loading picker 22 transfers the semiconductor device to be tested from the customer tray located in the loading stacker 21 to the loading buffer 23, and the semiconductor device to be tested is loaded into the loading buffer 23. ) May include a second loading picker transferring the test tray to the test tray. Due to the loading buffer 23, the test handler 1 can achieve the following effects.

First, since the loading buffer 23 reduces the distance that the first loading picker and the second loading picker are moved to transport the semiconductor device, the test handler 1 reduces the time taken for the loading process. Can be reduced.

Second, when the first loading picker transfers all the semiconductor devices contained in the customer tray and the customer tray becomes empty, the test handler 1 performs a process of replacing the empty customer tray with a customer tray containing the semiconductor device to be tested. do. When the test handler 1 does not include the loading buffer 23, the first loading picker may transfer the semiconductor device from the customer tray to the loading buffer 23 while the customer tray is replaced as described above. As a result, the entire loading process may be interrupted, thereby increasing the time taken for the loading process. To solve this problem, the test handler 1 may use the loading buffer 23, and the semiconductor device to be tested by the second loading picker from the loading buffer 23 to the test tray while the customer tray is replaced. By transferring, the loading process can be performed even while the customer tray is replaced. Therefore, the test handler 1 can reduce the time taken for the loading process by using the loading buffer 23.

Third, when semiconductor devices are filled in the test tray located at the loading position, the test handler 1 performs a process of replacing a test tray filled with semiconductor devices with an empty test tray. When the test handler 1 does not include the loading buffer 23, the second loading picker may transfer the semiconductor device from the loading buffer 23 to the test tray while replacing the test tray as described above. As a result, the entire loading process may be interrupted, thereby increasing the time taken for the loading process. To solve this problem, the test handler 1 may use the loading buffer 23, and the semiconductor device to be tested by the first loading picker from the customer tray to the loading buffer 23 while the test tray is replaced. By transferring, the loading process can be performed even while the test tray is being replaced. Therefore, the test handler 1 can reduce the time taken for the loading process by using the loading buffer 23.

Fourth, by reducing the time taken for the loading process, the test handler 1 can reduce the time taken until the test tray containing the semiconductor element to be tested is supplied to the chamber unit 4. Therefore, the test handler 1 can reduce the time required for the test process and can also reduce the time taken for the unloading process by reducing the time required for the test process.

Referring to FIG. 1, the unloading unit 3 performs an unloading process of transferring a tested semiconductor device from a test tray to a customer tray. The unloading unit 3 may include an unloading stacker 31, an unloading picker 32, and an unloading buffer 33.

The unloading stacker 31 stores a plurality of customer trays containing the tested semiconductor devices. The tested semiconductor devices may be stored in a customer tray located at different positions for each grade in the unloading stacker 31 according to a test result.

The unloading picker 32 may pick up the semiconductor device tested in a test tray and store it in a customer tray located in the unloading stacker 31. When the semiconductor element tested in the test tray is picked up, the test tray may be located in an unloading position.

The unloading buffer 33 may temporarily receive the tested semiconductor device. The unloading buffer 33 may include a buffer device according to the present invention. The unloading picker 32 is a first unloading picker for transferring a tested semiconductor device from a test tray to the unloading buffer 33, and the unloading stack from the unloading buffer 33. It may include a second unloading picker to transfer to the customer tray located in the beaker 31. The second unloading picker may store the semiconductor device picked up by the unloading buffer 33 in a customer tray corresponding to a class according to a test result. Due to the unloading buffer 33, the test handler 1 can achieve the following effects.

First, since the unloading buffer 33 reduces the distance that the first unloading picker and the second unloading picker are moved to transport the semiconductor device, the test handler 1 performs the unloading process. It can reduce the time it takes.

Second, when the first unloading picker transfers all the semiconductor devices stored in the test tray to empty the test tray positioned at the unloading position, the test handler 1 stores the empty test tray in the tested semiconductor device. The process of replacing it with an old test tray. When the test handler 1 does not include the unloading buffer 33, the first unloading picker moves the semiconductor device from the test tray to the unloading buffer 33 while the test tray is replaced as described above. Since the unloading process can be stopped, the entire time taken for the unloading process can be increased. In order to solve this problem, the test handler 1 may use the unloading buffer 33, and the second unloading picker moves the semiconductor device from the unloading buffer 33 to the customer tray while the test tray is replaced. The unloading process can be performed even while the test tray is replaced. Therefore, the test handler 1 can reduce the time taken for the unloading process by using the unloading buffer 33.

Third, when the semiconductor devices are filled in the customer tray located in the unloading stacker 31, the test handler 1 performs a process of replacing the customer tray filled with the semiconductor devices with an empty customer tray. When the test handler 1 does not include the unloading buffer 33, the second unloading picker moves the semiconductor element from the unloading buffer 33 to the customer tray while the customer tray is replaced as described above. Since the unloading process can be stopped, the entire time taken for the unloading process can be increased. In order to solve this problem, the test handler 1 may use the unloading buffer 33, and during the replacement of the customer tray, the unloading buffer ( 33), the unloading process can be performed while the test tray is replaced. Therefore, the test handler 1 can reduce the time taken for the unloading process by using the unloading buffer 33.

Referring to FIG. 1, in the chamber unit 4, a test process for testing a semiconductor device stored in a test tray is performed. A test equipment (not shown) may be connected to the chamber unit 4 and test a semiconductor device stored in a test tray. The chamber unit 4 may include the first chamber 41, the test chamber 42, and the second chamber so that the test equipment can test the semiconductor device not only at room temperature but also at high or low temperature. 43).

The first chamber 41 adjusts the semiconductor devices to be tested contained in the test tray to a first temperature. The first temperature is a temperature range of the semiconductor devices to be tested when the semiconductor devices to be tested are tested by the test equipment. The test tray containing the semiconductor devices to be tested is transferred from the loading position. At least one of an electrothermal heater or a liquefied nitrogen injection system may be installed in the first chamber 41 to adjust the semiconductor devices to be tested to the first temperature. When the semiconductor devices to be tested are adjusted to the first temperature, the test tray is transferred from the first chamber 41 to the test chamber 42.

The test chamber 42 connects the semiconductor devices to be tested contained in the test tray to the test equipment. The semiconductor devices to be tested stored in the test tray are adjusted to the first temperature, and the test apparatus includes a high fix board to which the semiconductor devices to be tested are connected. The test chamber 42 includes a part or all of the high fix board inserted therein and a contact unit for connecting the semiconductor devices controlled to the first temperature to the high fix board. The test equipment tests the semiconductor devices connected to the high fix board to determine whether the semiconductor devices operate normally. The test chamber 42 may be provided with at least one of an electrothermal heater or a liquid nitrogen injection system to maintain the semiconductor devices to be tested at the first temperature. The test handler 1 may include a plurality of test chambers 42, and the high fix board may be installed in each of the plurality of test chambers 42. When the test for the semiconductor devices is completed, the test tray is transferred from the test chamber 42 to the second chamber 43.

The second chamber 43 adjusts the tested semiconductor devices stored in the test tray to a second temperature. The second temperature is a temperature range including or close to room temperature. At least one of an electrothermal heater or a liquid nitrogen injection system may be installed in the second chamber 43 to adjust the tested semiconductor devices to the second temperature. When the tested semiconductor devices are adjusted to the second temperature, the test tray may be transferred from the second chamber 43 to the unloading position.

Referring to FIG. 1, the test handler 1 may include a rotator 5 for rotating the test tray. The rotator 5 may rotate the test tray containing the semiconductor device to be tested. Accordingly, the test tray may be vertical to horizontal. The rotator 5 may rotate the test tray containing the tested semiconductor device. Accordingly, the test tray may be in a horizontal state from a vertical state. Therefore, the test handler 1 may perform the loading process and the unloading process on a test tray in a horizontal state, and perform the test process on a test tray in a vertical state.

As described above, the test handler 1 may perform the loading process on the test tray located at the loading position, and perform the unloading process on the test tray located at the unloading position. have.

Here, the test handler 1 may include the loading position and the unloading position formed at the same position. That is, the test handler 1 may perform the loading process and the unloading process on one test tray. When the unloading picker 32 separates the tested semiconductor device from the test tray, the loading picker 22 may accommodate the semiconductor device to be tested in a place where the semiconductor device is separated and emptied. In this case, the test handler 1 may include one rotator 5.

The test handler 1 may include the loading position and the unloading position formed at different positions. That is, the test handler 1 may perform the loading process and the unloading process on different test trays, respectively. In this case, the rotator 5 may include a first rotator and a second rotator. The test tray containing the semiconductor device to be tested may be transferred to the first chamber 41 at the loading position, and may be rotated by the first rotator to be vertical in a horizontal state in the process. The test tray in which the tested semiconductor device is accommodated may be transferred from the second chamber 43 to the unloading position. In this process, the test tray may be rotated by the second rotator to be horizontal in a vertical state.

Although not shown, the test handler 1 may further include a connection portion. The test tray containing the semiconductor device to be tested may be transferred to the first chamber 41 via the connection part at the loading position. The test tray containing the tested semiconductor device may be transferred from the second chamber 43 to the unloading position via the connection part. In this case, the loading position and the unloading position may be formed at different positions, and the rotator 5 may be installed at the connection portion. The test tray containing the semiconductor element to be tested may be rotated by the rotator 5 to be in a horizontal state to a vertical state, and the test tray containing the tested semiconductor element may be rotated by the rotator 5 to be in a vertical state. Can be leveled at.

Referring to FIG. 1, the test handler 1 may include a transfer unit 6 for transferring a test tray between the components as described above. The transfer unit 6 may include a plurality of pulleys, a motor for rotating at least one of the pulleys, a belt connecting the pulleys, and a transfer means coupled to the belt. The conveying means may convey the test tray by pushing or pulling the test tray while being moved as the belt is moved.

Hereinafter, a preferred embodiment of a buffer device according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a schematic perspective view of a buffer device according to the present invention, and FIG. 3 is a partial cross-sectional view taken along line A-A of FIG.

1 to 3, the buffer device 10 according to the present invention includes a buffer member 11. A plurality of semiconductor elements S may be accommodated in the buffer member 11, and a plurality of first grooves 111 may be formed. The first groove 111 may form a (m X n) matrix (m, n is an integer greater than 1) and a plurality of first grooves 111 may be formed in the buffer member 11. Each of the first grooves 111 may include an accommodating part 112 (shown in FIG. 3) for accommodating the semiconductor device S. Referring to FIG.

The accommodating part 112 may be formed in a size such that a plurality of semiconductor elements S may be stacked and stacked. That is, a plurality of semiconductor elements S may be stacked and stacked in the accommodation part 112. Therefore, the buffer device 10 according to the present invention can obtain the following effects.

First, when the accommodating part 112 is formed to have a size capable of accommodating one semiconductor element S, the buffer member 11 has a horizontal length 11a to accommodate a larger number of semiconductor elements S. ) Or at least one of the longitudinal lengths 11b must be increased. Accordingly, the test handler 1 (shown in FIG. 1) has an increase in the length of at least one of the horizontal length 1L and the vertical length 1H, thereby requiring a larger installation area. .

In order to solve this problem, the buffer device 10 according to the present invention may be formed to have a size in which the accommodating part 112 may stack a plurality of semiconductor elements S up and down. Therefore, the buffer device 10 according to the present invention can be implemented to accommodate a larger number of semiconductor elements (S) without increasing the size of the buffer member 11, accordingly the test handler (1, 1) may be maintained at the same size.

Second, when the accommodating part 112 is formed to have a size capable of accommodating one semiconductor element S, the test handler 1 (shown in FIG. 1) takes time for the loading process and the unloading process. In order to reduce the number of the loading buffer (23, shown in Figure 1) and the unloading buffer (33, shown in Figure 1) had to be provided in a larger number. The greater the number of the loading buffer 23 (shown in FIG. 1) and the unloading buffer 33 (shown in FIG. 1), the greater the width of the test handler 1 (shown in FIG. 1). 1L) is increased, thus requiring a larger installation area.

In order to solve this problem, the buffer device 10 according to the present invention is formed so that the accommodating part 112 stacks the plurality of semiconductor elements S up and down, and thus the loading buffer 23, as shown in FIG. 1. And the number of the unloading buffers 33 (shown in FIG. 1) can be implemented to accommodate more semiconductor devices. Therefore, the buffer device 10 according to the present invention can reduce the time taken for the loading process and the unloading process without increasing the size of the test handler 1 (shown in FIG. 1).

Third, when the test handler 1 (shown in FIG. 1) performs the unloading process, semiconductor devices having different grades are stored in the unloading buffer 33 (shown in FIG. 1). For example, the first unloading picker accommodates semiconductor devices found to be a first grade in a test result in a first zone in the unloading buffer 33 (shown in FIG. The elements are housed in a second zone which is different from the first zone in the unloading buffer 33 (shown in FIG. 1). Accordingly, the second unloading picker picks up the semiconductor devices stored in the first zone from the unloading buffer 33 (shown in FIG. 1) and stores the semiconductor devices in a customer tray corresponding to the first class. In the loading buffer 33 (shown in FIG. 1), the semiconductor devices stored in the second zone are picked up and stored in the customer tray corresponding to the second grade. Here, when the accommodating part 112 is formed to have a size capable of accommodating one semiconductor device S, when the unloading buffer 33 (shown in FIG. 1) is filled with semiconductor devices in a first zone, Since the first unloading picker cannot transfer the semiconductor devices corresponding to the first grade from the test tray to the unloading buffer 33 (shown in FIG. 1), the time taken for the unloading process is increased. There is.

In order to solve this problem, the buffer device 10 according to the present invention is formed so that the accommodating part 112 stacks the plurality of semiconductor elements S up and down, thereby increasing the number of semiconductor elements corresponding to a predetermined grade. It can be implemented to be stored. Therefore, the buffer device 10 according to the present invention can reduce the time taken for the unloading process and can improve the efficiency for the unloading process. In addition, since it is not necessary to increase the size of the buffer member 11 or increase the number of the unloading buffers 33 (shown in FIG. 1) for this purpose, the buffer device 10 according to the present invention is the test handler. The time taken for the unloading process can be reduced without increasing the size of (1, shown in FIG. 1).

3 illustrates that two semiconductor elements S are accommodated in the accommodating part 112, but the present invention is not limited thereto. The accommodating part 112 may be formed to accommodate two or more semiconductor elements S. Can be.

Referring to FIG. 3, the accommodating part 112 may have a thickness D in which a plurality of semiconductor elements S may be stacked and stacked. The accommodating part 112 may be formed to have a thickness D as follows.

[Equation 1] D ≥ (N × T)

Here, D is the thickness of the accommodating part 112, N is the number of semiconductor elements (S) that can be stacked and stored in the accommodating part 112 up and down, T is the thickness of the semiconductor element (S).

Therefore, in the buffer device 10 according to the present invention, when the first groove 111 is formed in the buffer member 11 in an (m X n) matrix (m, n is an integer greater than 1), m X It can accommodate n XN semiconductor elements. For example, as illustrated in FIG. 2, the first groove 111 is formed in a matrix (7 × 11) in the buffer member 11, and two semiconductor devices S are formed in the accommodating part 112. In the case of stacking up and down, the buffer device 10 according to the present invention may accommodate 154 semiconductor elements.

Referring to FIG. 3, the accommodating part 112 may be formed in a shape corresponding to the semiconductor device S. Referring to FIG. The accommodating part 112 may be formed in a form such that side surfaces of the semiconductor element S accommodated therein may contact the inner wall 11c of the buffer member 11. For example, the accommodating part 112 may be formed in a rectangular parallelepiped shape as a whole.

2 and 3, the buffer member 11 may further include an inclined surface 113.

The inclined surface 113 may be formed to be inclined to the outside of the accommodating part 112. The inclined surface 113 may be formed at a position capable of functioning as a passage for passing the semiconductor element when the semiconductor element is accommodated in the accommodating part 112 or the semiconductor element is taken out from the accommodating part 112. 3, the inclined surface 113 may be formed to be positioned above the accommodating part 112. As the inclined surface 113 is formed to be inclined to the outside of the accommodating part 112, the buffer device 10 according to the present invention increases the passage area for the semiconductor element to pass therethrough, thereby increasing the area of the accommodating part 112. The semiconductor device may be easily accommodated, and the semiconductor device may be easily taken out from the accommodating part 112.

As the inclined surface 113 is formed to be inclined to the outside of the accommodating part 112, the semiconductor device may be corrected to a state corresponding to the accommodating part 112 while passing through the inclined surface 113. In the process of picking up and transferring the semiconductor device S by the loading picker 22 or the unloading picker 32, the semiconductor device is picked up by the loading picker 22 or the unloading picker 32. It may be rotated or moved, and thus may be in a state not corresponding to the accommodating part 112. In this case, the semiconductor device may be corrected to a state corresponding to the accommodating part 112 by being rotated or moved along the inclined surface 113 while passing through the inclined surface 113. Accordingly, the buffer device 10 according to the present invention may allow the semiconductor device to be easily received in the normal state in the accommodating part 112.

Referring to FIG. 3, the first groove 111 may be formed such that its size decreases as the portion where the inclined surface 113 is formed toward the accommodating part 112 from the top thereof, for example, the inclined surface 113. The vertical section of the formed portion may be formed in a polyhedron shape having an inverted trapezoidal shape. A portion in which the inclined surface 113 is formed in the first groove 111 may be connected to communicate with the accommodating part 112.

Referring to FIG. 3, the buffer device 10 according to the present invention may further include a buffer mechanism 12. The buffer device 10 according to the present invention may include a plurality of the shock absorbing mechanisms 12, and the shock absorbing mechanisms 12 may be installed to be positioned in each of the first grooves 111. The shock absorbing mechanism 12 prevents the semiconductor element from being damaged by reducing the force applied to the semiconductor element when the semiconductor element is accommodated in the accommodating part 112 or when the semiconductor element is taken out from the accommodating part 112. Can be. The shock absorbing mechanism 12 may include a support member 121 and an elastic member 122.

The support member 121 may be installed to be positioned in the first groove 111 and support the semiconductor device accommodated in the accommodating part 112. The bottom surface of the semiconductor device may be accommodated in the accommodating part 112 by being supported by the support member 121. Referring to FIG. 3, the support member 121 may be installed in the first groove 111 to be positioned below the accommodating part 112. The support member 121 may be formed in a shape corresponding to the accommodating part 112 and may be formed in a rectangular plate shape as a whole.

One side of the elastic member 122 is coupled to the support member 121, the other side is coupled to the buffer member (11). Referring to FIG. 3, the elastic member 122 may be installed to be positioned in the first groove 111, and one end thereof may be coupled to a bottom surface of the support member 121.

By the elastic member 122, the support member 121 can be moved elastically. When a force is applied to the semiconductor element S supported by the support member 121, the elastic member 122 is compressed and the support member 121 is moved in a direction in which a force is applied to the semiconductor element S. Can be. Accordingly, the buffer device 10 according to the present invention can prevent the semiconductor device S from being damaged by the force applied to the semiconductor device S. FIG. For example, while the loading picker 22 or the unloading picker 32 picks up the semiconductor device S from the accommodating part 112, the loading picker 22 or the unloading picker 32 Force may be applied to the semiconductor device S. The elastic member 122 is compressed by the force applied to the loading picker 22 or the unloading picker 32 to the semiconductor device (S), it is possible to reduce the force applied to the semiconductor device (S), Accordingly, the semiconductor device S may be prevented from being damaged. Accordingly, the buffer device 10 according to the present invention may be implemented such that the test handler 1 (shown in FIG. 1) can stably perform the loading process and the unloading process.

A plurality of elastic members 122 may be installed in each of the first grooves 111. Accordingly, by maintaining the support member 121 in a horizontal state, the semiconductor device S may be accommodated in the storage unit 112 in a horizontal state. A spring may be used as the elastic member 122.

Hereinafter, a preferred embodiment of a test handler according to the present invention will be described in detail with reference to the accompanying drawings.

4 is a schematic plan view of a test handler according to an embodiment of the present invention, FIG. 5 is a schematic view showing a path in which a test tray is transported in the test handler of FIG. 4, and FIG. 6 is a test handler according to another embodiment of the present invention. 7 is a schematic plan view showing a path in which a test tray is transported, FIG. 7 is a schematic plan view of a test handler according to another embodiment of the present invention.

4 and 5, the test handler 1 according to an embodiment of the present invention may include a loading unit 2, an unloading unit 3, and a chamber unit 4.

The loading unit 2 performs a loading process of transferring the semiconductor device to be tested from the customer tray to the test tray T. The loading unit 2 may include a loading stacker 21, a loading picker 22, and a loading buffer 23.

The loading stacker 21 stores a plurality of customer trays containing semiconductor devices to be tested.

The loading picker 22 may pick up a semiconductor device to be tested in a customer tray located in the loading stacker 21 and store it in the test tray T. When the semiconductor element to be tested is accommodated in the test tray T, the test tray T may be located at the loading position 2a. The loading picker 22 may include a first loading picker 221 and a second loading picker 222.

The first loading picker 221 may transfer the semiconductor device to be tested from the customer tray positioned in the loading stacker 21 to the loading buffer 23. The first loading picker 221 may move in the X-axis direction and the Y-axis direction, and may be moved up and down. The loading picker 22 may include a plurality of first loading pickers 221.

The second loading picker 222 may transfer the semiconductor device to be tested from the loading buffer 23 to the test tray T. The second loading picker 222 may move in the X-axis direction and the Y-axis direction, and may be moved up and down. The loading picker 22 may include a plurality of second loading pickers 222.

The loading buffer 23 may temporarily receive the semiconductor device to be tested. As described above, the loading buffer 23 may include a buffer device 10 capable of stacking up and down a plurality of semiconductor devices. Therefore, the test handler 1 according to the present invention can reduce the time taken for the loading process without increasing the horizontal length 1L or the vertical length 1H, and thus, the test process and the unloading process. It can reduce the time it takes. In addition, as described above, during the process of replacing the empty customer tray with the customer tray containing the semiconductor element to be tested or replacing the test tray T filled with the semiconductor elements with the empty test tray T, Since the loading buffer 23 can accommodate more semiconductor elements, the loading process can be continued while the customer tray or the test tray T is replaced. Since the buffer device 10 is as described above, a detailed description thereof will be omitted. The test handler 1 according to the present invention may include a plurality of the loading buffers 23.

The loading buffer 23 may further include a loading driving device 231. The loading driving device 231 may move the buffer device 10 between the first storage position 23a and the first pickup position 23b. The loading driving device 231 may move the buffer device 10 in the Y-axis direction. The first loading picker 221 may transfer the semiconductor device to be tested from the customer tray located in the loading stacker 21 to the buffer device 10 located at the first storage position 23a. The second loading picker 222 may transfer the semiconductor device to be tested from the buffer device 10 located at the first pick-up position 23b to the test tray T located at the loading position 2a. . The test handler 1 according to the present invention may include a plurality of the loading buffers 23, and the loading buffers 23 may be moved individually.

Although not shown, the loading driving device 231 may include a plurality of pulleys, a motor for rotating at least one of the pulleys, and a belt connecting the pulleys. The buffer device 10 may be coupled to the belt, and the buffer device 10 may be moved between the first storage position 23a and the first pickup position 23b as the belt is moved. The loading driving device 231 may be configured to move the buffer device 10 to the first storage position 23a and the first pickup position by a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack pinion gear, or the like. 23b). The loading driving device 231 may include a loading guide mechanism (not shown) for guiding the movement of the buffer device 10.

4 and 5, the unloading unit 3 performs an unloading process of transferring the tested semiconductor device from the test tray T to the customer tray. The unloading unit 3 may include an unloading stacker 31, an unloading picker 32, and an unloading buffer 33.

The unloading stacker 31 stores a plurality of customer trays containing the tested semiconductor devices. The tested semiconductor devices may be stored in a customer tray located at different positions for each grade in the unloading stacker 31 according to a test result.

The unloading picker 32 may pick up the semiconductor device tested in the test tray T and store it in a customer tray located in the unloading stacker 31. When the tested semiconductor element is picked up from the test tray T, the test tray T may be located at the unloading position 3a. The unloading picker 32 may include a first unloading picker 321 and a second unloading picker 322.

The first unloading picker 321 may transfer the tested semiconductor device from the test tray T located at the unloading position 3a to the unloading buffer 33. The first unloading picker 321 may be moved in the X-axis direction and the Y-axis direction, and may be moved up and down. The unloading picker 32 may include a plurality of first unloading pickers 321.

The second unloading picker 322 may transfer the tested semiconductor device from the unloading buffer 33 to a customer tray located in the unloading stacker 31. The second unloading picker 322 may accommodate the semiconductor device picked up by the unloading buffer 33 in a customer tray corresponding to a grade according to a test result. The second unloading picker 322 may move in the X-axis direction and the Y-axis direction, and may move up and down. The unloading picker 32 may include a plurality of second unloading pickers 322.

The unloading buffer 33 may temporarily receive the tested semiconductor device. As described above, the unloading buffer 33 may include a buffer device 10 capable of stacking a plurality of semiconductor devices up and down. Therefore, the test handler 1 according to the present invention can reduce the time taken for the unloading process without increasing the horizontal length 1L or the vertical length 1H, and thus the test process and the loading process. It can reduce the time it takes. In addition, as described above, during the process of replacing the empty test tray T with the test tray T in which the tested semiconductor element is stored or the customer tray filled with the semiconductor elements with the empty customer tray, Since the unloading buffer 33 can accommodate more semiconductor elements, the unloading process can be continued while the test tray T or the customer tray is replaced. Since the buffer device 10 is as described above, a detailed description thereof will be omitted. The test handler 1 according to the present invention may include a plurality of the unloading buffers 33.

The unloading buffer 33 may further include an unloading driving device 331. The unloading driving device 331 may move the buffer device 10 between the second storage position 33a and the second pickup position 33b. The unloading driving device 331 may move the buffer device 10 in the Y-axis direction. The first unloading picker 321 may transfer the tested semiconductor device from the test tray T located at the unloading position 3a to the buffer device 10 located at the second storage position 33a. Can be. The second unloading picker 322 may transfer the tested semiconductor device from the buffer device 10 located at the second pick-up position 33b to a customer tray located at the unloading stacker 31. . The test handler 1 according to the present invention may include a plurality of the unloading buffers 33, and the unloading buffers 33 may be moved individually.

Although not shown, the unloading driving device 331 may include a plurality of pulleys, a motor for rotating at least one of the pulleys, and a belt connecting the pulleys. The buffer device 10 may be coupled to the belt, and the buffer device 10 may be moved between the second storage position 33a and the second pickup position 33b as the belt is moved. The unloading driving device 331 may be configured to move the buffer device 10 to the second storage position 33a and the second pickup position by a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack pinion gear, or the like. It may move between 33b. The unloading driving device 331 may include an unloading guide mechanism (not shown) for guiding the movement of the buffer device 10.

4 and 5, in the chamber unit 4, a test process for testing a semiconductor device stored in a test tray T is performed. A test equipment (not shown) may be connected to the chamber unit 4 and test a semiconductor device stored in the test tray T. The chamber unit 4 may include the first chamber 41, the test chamber 42, and the second chamber so that the test equipment can test the semiconductor device not only at room temperature but also at high or low temperature. 43).

The first chamber 41 adjusts the semiconductor devices to be tested stored in the test tray T to a first temperature. The first temperature is a temperature range of the semiconductor devices to be tested when the semiconductor devices to be tested are tested by the test equipment. The test tray containing the semiconductor elements to be tested is transferred from the loading position 2a. At least one of an electrothermal heater or a liquefied nitrogen injection system may be installed in the first chamber 41 to adjust the semiconductor devices to be tested to the first temperature. When the semiconductor devices to be tested are adjusted to the first temperature, the test tray T is transferred from the first chamber 41 to the test chamber 42.

The test chamber 42 connects the semiconductor devices to be tested contained in the test tray T to test equipment. The semiconductor devices to be tested stored in the test tray T are adjusted to the first temperature, and the test apparatus includes a high fix board H to which the semiconductor devices to be tested are connected. The test chamber 42 includes a part or all of the high fix board H inserted therein, and a contact unit 421 for connecting the semiconductor devices adjusted to the first temperature to the high fix board H is installed. . The test equipment tests the semiconductor devices connected to the high fix board H to determine whether the semiconductor devices operate normally. The test chamber 42 may be provided with at least one of an electrothermal heater or a liquid nitrogen injection system to maintain the semiconductor devices to be tested at the first temperature. The test handler 1 may include a plurality of test chambers 42, and the high fix board H may be installed in each of the plurality of test chambers 42. When the test for the semiconductor devices is completed, the test tray T is transferred from the test chamber 42 to the second chamber 43.

The second chamber 43 adjusts the tested semiconductor devices accommodated in the test tray T to a second temperature. The second temperature is a temperature range including or close to room temperature. At least one of an electrothermal heater or a liquid nitrogen injection system may be installed in the second chamber 43 to adjust the tested semiconductor devices to the second temperature. When the tested semiconductor devices are adjusted to the second temperature, the test tray T may be transferred from the second chamber 43 to the unloading position 3a.

As shown in FIG. 5, the chamber unit 4 may include the first chamber 41, the test chamber 42, and the second chamber 43 in a horizontal direction. In this case, the chamber unit 4 may include a plurality of test chambers 42, and a plurality of the test chambers 42 may be stacked up and down. As shown in FIG. 6, in the test handler according to another embodiment of the present invention, the chamber unit 4 includes the first chamber 41, the test chamber 42, and the second chamber 43. ) May be laminated in a vertical direction. That is, the first chamber 41, the test chamber 42, and the second chamber 43 may be stacked up and down. The first chamber 41 may be installed to be positioned above the test chamber 42, and the second chamber 43 may be installed to be positioned below the test chamber 42.

4 and 5, the test handler 1 according to the present invention may include a rotator 5 for rotating the test tray (T). The rotator 5 may rotate the test tray T in which the semiconductor device to be tested is accommodated. Accordingly, the test tray T may be in a vertical state from a horizontal state. The rotator 5 may rotate the test tray T in which the tested semiconductor device is accommodated. Accordingly, the test tray T may be in a horizontal state from a vertical state. Therefore, the test handler 1 according to the present invention may perform the loading process and the unloading process on a test tray in a horizontal state, and perform the test process on a test tray in a vertical state.

Here, the test handler 1 according to an embodiment of the present invention may be formed at the same position as the loading position 2a and the unloading position 3a. That is, the test handler 1 according to the exemplary embodiment of the present invention may perform the loading process and the unloading process on one test tray T. When the unloading picker 32 separates the tested semiconductor device from the test tray T, the loading picker 22 may store the semiconductor device to be tested in a place where the semiconductor device is separated and emptied. The loading position 2a and the unloading position 3a may be located between the loading buffer 23 and the unloading buffer 33. The test handler 1 according to an embodiment of the present invention may include one rotator 5, and the rotator 5 may be located between the loading buffer 23 and the unloading buffer 33. Can be installed.

Referring to FIG. 7, in the test handler 1 according to another embodiment of the present invention, the loading position 2a and the unloading position 3a may be formed at different positions. The loading unit 2 and the unloading unit 3 may perform the loading process and the unloading process on test trays T positioned at different positions. The test tray T, which is empty through the unloading process, may be transferred from the unloading position 3a to the loading position 2a.

The unloading buffer 33 may be installed to be located between the loading position 2a and the unloading position 3a. Referring to FIG. 7, the loading position 2a may be located at the left side of the unloading buffer 33, and the unloading position 3a may be located at the right side of the unloading buffer 33. . The unloading buffer 33 may be installed to be movable between the second storage position 33a and the second pickup position 33b by the unloading driving device 331.

The loading buffer 23 may be installed to be located between the loading position 2a and the loading stacker 21. The loading buffer 23 may be fixedly installed between the loading position 2a and the loading stacker 21, and as shown in FIG. 4, the first storage position 23a and the first pickup. It may be installed to be movable between the positions 23b. Although not shown, the loading unit 2 loads the semiconductor device to be tested by the loading picker 22 without the loading buffer 23 in the loading tray 2a in the customer tray located in the loading stacker 21. It may be implemented to transfer directly to the test tray (T) located in.

Although not shown, the test handler 1 according to another embodiment of the present invention may include a first rotator and a second rotator. The first rotator may rotate the test tray T in which the semiconductor device to be tested is accommodated, from a horizontal state to a vertical state. The test tray T in which the semiconductor device to be tested is accommodated may be transferred to the first chamber 41 at the loading position 2a and rotated by the first rotator in this process. The first rotator may be installed to be located between the loading position 2a, the first chamber 41, or the loading position 2a and the first chamber 41. The second rotator may rotate the test tray T containing the tested semiconductor device from a vertical state to a horizontal state. The test tray T in which the tested semiconductor device is accommodated may be transferred from the second chamber 43 to the unloading position 3a, and may be rotated by the second rotator in this process. The second rotator may be installed to be located between the unloading position 3a, the second chamber 43, or the unloading position 3a and the second chamber 43.

Although not shown, the test handler 1 according to another embodiment of the present invention may include a connection portion. The test tray T containing the semiconductor device to be tested may be transferred from the loading position 2a to the connection part and then transferred from the connection part to the first chamber 41. The test tray T in which the tested semiconductor device is accommodated may be transferred from the second chamber 43 to the connection part and then transferred from the connection part to the unloading position 3a. The connecting portion may be installed to be located between the loading position 2a and the unloading position 3a, and the rotator 5 may be installed to be positioned on the connecting portion. The test tray T in which the semiconductor element to be tested is accommodated may be rotated by the rotator 5 to be in a horizontal state to a vertical state, and the test tray T in which the tested semiconductor element is accommodated is the rotator 5. It can be rotated to make it horizontal from vertical to horizontal.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and alterations are possible within the scope without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

1: test handler 2: loading unit 3: unloading unit 4: chamber unit
5: Rotator 21: Loading Stacker 22: Loading Picker 23: Loading Buffer
31: unloading stacker 32: unloading picker 33: unloading buffer 41: the first chamber
42: test chamber 43: second chamber 10: buffer device 11: buffer member
DESCRIPTION OF SYMBOLS 12 Shock absorbing mechanism 111 First groove 112 Storage part 113 Inclined surface
114: inner wall 121: support member 122: elastic member

Claims (8)

A first groove including an accommodating part for accommodating the semiconductor device; And
A buffer member having a plurality of first grooves formed therein;
The accommodating part is a buffer device, characterized in that formed in a size that can be accommodated in a plurality of semiconductor elements stacked up and down. The method of claim 1,
A plurality of shock absorbing mechanisms disposed in each of the first grooves;
The buffer device includes a support member for supporting a semiconductor device accommodated in the accommodating portion, and an elastic member having one side coupled to the support member and the other side coupled to the buffer member. The method of claim 1,
The buffer member includes an inclined surface for correcting a state of a semiconductor device to be received in the accommodating part,
The inclined surface is a buffer device, characterized in that formed inclined in the outward direction of the housing. The method of claim 1,
The first groove includes the receiving portion formed to a thickness of (N × T) ≤ D,
D is a thickness of the housing portion, N is the number of semiconductor elements that can be stacked stacked up and down in the housing, T is the thickness of the semiconductor device. A loading unit which performs a loading process of accommodating a semiconductor device to be tested in a test tray;
A chamber unit for connecting the semiconductor device stored in the test tray to the high fix board through the loading process; And
And an unloading unit which performs an unloading process of separating the tested semiconductor devices from the test tray and classifying them by grade.
The loading unit test handler, characterized in that it comprises a loading buffer having a buffer device of any one of claims 1 to 4. The method of claim 5,
The loading buffer includes a loading driving device for moving the buffer device between a first storage position and a first pickup position,
The loading unit includes a first loading picker for transferring a semiconductor device to be tested from a customer tray to a buffer device located at the first storage position, and a semiconductor device to be tested from a buffer device located at the first pickup position to a test tray. And a second loading picker for transferring. A loading unit which performs a loading process of accommodating a semiconductor device to be tested in a test tray;
A chamber unit for connecting the semiconductor device stored in the test tray to the high fix board through the loading process; And
And an unloading unit which performs an unloading process of separating the tested semiconductor devices from the test tray and classifying them by grade.
The unloading unit is a test handler, characterized in that it comprises an unloading buffer having a buffer device of any one of claims 1 to 4. The method of claim 7, wherein
The unloading buffer includes an unloading driving device for moving the buffer device between a second storage position and a second pickup position.
The unloading unit may include a first unloading picker for transferring a tested semiconductor device from a test tray to a buffer device located at the second storage position, and the tested semiconductor device at a buffer device located at the second pickup position. And a second unloading picker for transferring to the tray.

Images