KR20130115575A - Handling system for semiconductor device - Google Patents

Abstract

PURPOSE: A semiconductor device handling system is provided to prevent a work time delay even when there is a difference in time required to perform each of a loading process, a test process and an unloading process, thereby improving the manufacturing yield of a semiconductor device. CONSTITUTION: A semiconductor device handling system (1) includes a test unit (2), a sorting unit (3), and a transport unit (4). The sorting unit performs a loading process, for disposing a target semiconductor device in a test tray, and an unloading process for separating the tested semiconductor device from the test tray. The test unit is spaced from the sorting unit. The test unit performs a test process for connecting the semiconductor device, disposed in the test tray, to test equipment. The transport unit transports the test tray between the sorting unit and the test unit. [Reference numerals] (2,AA,BB) Test unit; (31) Loading unit; (32) Unloading unit; (4) Transport unit

Description

Semiconductor Device Handling System

The present invention relates to a semiconductor device handling system for connecting a semiconductor device to be tested to test equipment and classifying the tested semiconductor device by class.

Memory or non-memory semiconductor devices, module ICs, etc. (hereinafter referred to as "semiconductor devices") are manufactured through devices that perform various processes. One of these devices, a test handler, is a device for connecting a semiconductor device to a test apparatus so that the semiconductor device is tested, and performing a process of classifying the tested semiconductor device into grades according to test results. The semiconductor device is classified as a good product by the test result, and manufacture is completed.

1 is a schematic plan view of a test handler according to the prior art.

Referring to FIG. 1, the test handler 100 according to the related art may include a loading unit 110 for accommodating a semiconductor device contained in a customer tray in a test tray T, and a semiconductor device stored in a test tray T. The test unit 120 to be connected to the, and the unloading unit 130 to classify the tested semiconductor device according to the test result according to the class and stored in the customer tray.

The loading unit 110 performs a loading process of accommodating the tested semiconductor device in the test tray T. The loading unit 110 includes a loading stacker 111 for storing a customer tray containing a semiconductor device to be tested, and a loading picker 112 for transferring the semiconductor device to be tested from the customer tray to the test tray T. . The test tray T is transferred to the test unit 120 when the semiconductor device to be tested is accommodated.

The test unit 120 performs a test process of connecting the semiconductor device accommodated in the test tray T to the test equipment 200. Accordingly, the test equipment 200 is electrically connected to the semiconductor device housed in the test tray T, thereby testing the semiconductor device housed in the test tray T. When the test for the semiconductor device is completed, the test tray T is transferred to the unloading unit 130.

The unloading unit 130 performs an unloading process of separating the tested semiconductor device into the test tray T. The unloading unit 130 includes an unloading stacker 131 for storing a customer tray for holding the tested semiconductor device, and an unloading picker 132 for transferring the tested semiconductor device from the test tray T to the customer tray. ). When the test tray T becomes empty as the tested semiconductor device is transferred to the customer tray, the empty test tray T is transferred to the loading unit 110 again.

As described above, the test handler 100 according to the related art sequentially performs the loading process, the test process, and the unloading process while circularly moving the test tray T in one apparatus. The test handler 100 according to the related art has the following problems.

First, according to the recent technology development, the time taken for the loading unit 110 to perform the loading process on the basis of one test tray T is shortened. On the other hand, the test equipment 200 is increasing the time it takes to perform the test process based on one test tray (T) as the type of semiconductor device is diversified, the structure of the semiconductor device is complicated. Accordingly, the test process based on one test tray (T) takes longer than the loading process. Therefore, the test handler 100 according to the prior art does not immediately transfer the test tray T in which the loading process is completed to the test unit 120, and the test tray until the test process is completed in the test unit 120. (T) has to wait in the loading unit 110, there is a problem that the work time is delayed. As the test tray T waits for the loading unit 110 to occur, the test handler 100 according to the related art performs the loading process for the loading unit 110 to the next test tray T. There is also a problem that the time it takes to delay.

Secondly, like the loading process, the time taken by the unloading unit 130 to perform the unloading process is also shortened. However, as described above, since the test tray T should wait in the loading unit 110 until the test process is completed, the test handler 100 according to the related art has a test tray T in which the unloading process is completed. Does not immediately transfer to the loading unit 110, the test tray (T) has to wait in the unloading unit (130). Accordingly, the test handler 100 according to the related art has a problem in that the time taken until the unloading unit 110 performs the unloading process on the next test tray T is delayed.

Third, the test handler 100 according to the prior art, even if a failure occurs in any one of the loading unit 110, the test unit 120 and the unloading unit 130, the rest of the components that work normally also work There is a problem that cannot be done.

The present invention has been made to solve the problems described above, even if there is a difference in the time taken to perform each of the loading process, the test process and the unloading process semiconductor device handling system that can prevent the operation time is delayed It is to provide.

The present invention is to provide a semiconductor device handling system that can be prevented from affecting the overall working time even if a failure occurs in at least one of the devices performing each of the loading process, the test process and the unloading process.

In order to solve the above-described problems, the present invention can include the following configuration.

The semiconductor device handling system according to the present invention includes N (N is an integer greater than 0) for carrying out a loading process for accommodating a semiconductor device to be tested in a test tray and an unloading process for separating a tested semiconductor device from a test tray. And a sorting apparatus, and M test apparatuses (M is an integer greater than N) for performing a test process of installing a semiconductor device spaced apart from the sorting apparatus and connected to the test equipment, the semiconductor element stored in the test tray. .

A semiconductor device handling system according to the present invention includes a sorting apparatus for performing a loading process for accommodating a semiconductor device to be tested in a test tray and an unloading process for separating the tested semiconductor device from the test tray; A test apparatus installed to be spaced apart from the sorting apparatus, and configured to perform a test process of connecting a semiconductor device stored in a test tray to a test equipment; And an automatic guided vehicle for transporting a test tray between the sorting device and the test device. The sorting apparatus may be provided in a smaller number than the test apparatus.

According to the present invention, the following effects can be achieved.

The present invention is implemented to include a greater number of test devices than the sorting device, so that even if a difference occurs in the time required to perform each of the loading process, the test process and the unloading process, work time can be prevented from being delayed. Thereby, the manufacturing yield with respect to a semiconductor element can be improved.

The present invention can prevent the entire system from stopping even if a failure occurs in any one of the test apparatus and the sorting apparatus, thereby preventing the loss of working time.

1 is a schematic plan view of a test handler according to the prior art
2 is a schematic plan view of a semiconductor device handling system in accordance with the present invention;
3 is a schematic block diagram of a semiconductor device handling system according to the present invention;
4 is a schematic plan view of a test apparatus according to the present invention;
5 is a conceptual diagram illustrating a path in which a test tray moves in a test apparatus according to the present invention.
6 is a conceptual diagram illustrating a path in which a test tray moves in a test apparatus according to a modified embodiment of the present invention.
7 is a schematic plan view of the sorting apparatus according to the present invention.
8 is a schematic side view of the loading and closing mechanism according to the present invention;
9 is a schematic side view of the unloading opening and closing mechanism according to the present invention;
10 is a schematic plan view of a loading apparatus according to the present invention;
11 is a schematic plan view of the unloading apparatus according to the present invention.

Hereinafter, a preferred embodiment of a semiconductor device handling system according to the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIGS. 2 and 3, a semiconductor device handling system 1 according to the present invention includes a test device 2 performing a test process of connecting a semiconductor device stored in a test tray T to a test equipment 200. And a sorting apparatus 3 installed spaced apart from the test apparatus 2. The sorting apparatus 3 performs a loading process for accommodating the semiconductor element to be tested in the test tray T and an unloading process for separating the tested semiconductor element from the test tray T.

The test apparatus 2 may be spaced apart from the sorting apparatus 3 so that the sorting apparatus 3 may independently perform the test process with respect to the loading process and the unloading process. In addition, the semiconductor device handling system 1 according to the present invention includes N sorting apparatuses 3 (N is an integer greater than 0) and M test apparatuses 2 (M is an integer greater than N). . In other words, the semiconductor device handling system 1 according to the invention comprises a larger number of test devices 2 than the sorting device 3. Therefore, the semiconductor element handling system 1 according to the present invention can achieve the following effects.

First, since the semiconductor device handling system 1 according to the present invention can independently perform the test process with respect to the loading process and the unloading process, any one of the test apparatus 2 and the sorting apparatus 3 may be used. If one fails, the rest of the working devices can continue to work. Therefore, the semiconductor device handling system 1 according to the present invention prevents the entire system from stopping when a failure occurs in any one of the test apparatus 2 and the sorting apparatus 3, thereby preventing the working time from being lost. It can prevent.

Secondly, the semiconductor device handling system 1 according to the present invention is implemented to include a larger number of test devices 2 than the sorting device 3, so that the loading process based on one test tray T. Compared with the unloading process, the test process may take longer to prevent a delay in working time. Since each of the test apparatuses 2 individually performs a test process for the test tray T, the semiconductor device handling system 1 according to the present invention performs a test process for a plurality of test trays T. Because it can. In addition, the semiconductor device handling system 1 according to the present invention can efficiently distribute a test tray in consideration of the time taken to perform each of the loading process, the unloading process, and the test process, thereby improving equipment operation rate. Can be.

Third, the semiconductor device handling system 1 according to the present invention is implemented to include a smaller number of the sorting device 3 than the test device 2, thereby reducing the number of the sorting device (3). . Therefore, the semiconductor device handling system 1 according to the present invention can reduce the equipment investment cost for constructing a process line for performing the loading process, the unloading process and the test process. In addition, the semiconductor device handling system 1 according to the present invention can improve the utilization of the installation space by reducing the area occupied by the sorting device 3 in the installation space.

Fourth, since the semiconductor device handling system 1 according to the present invention comprises the sorting device 3 and the test device 2 as separate devices, the number of devices or devices installed in the sorting device 3 may be reduced. Can be reduced. Accordingly, the semiconductor device handling system 1 according to the present invention can reduce the jam rate for the sorting device 3. Therefore, the semiconductor device handling system 1 according to the present invention reduces the time for the sorting device 3 to stop as the jam occurs in the sorting device 3, thereby reducing the operating time for the sorting device 3. You can increase it.

Hereinafter, the test apparatus 2 and the sorting apparatus 3 will be described in detail with reference to the accompanying drawings.

2 to 4, the test apparatus 2 performs a test process of connecting the semiconductor device accommodated in the test tray T to the test equipment 200. The test equipment 200 tests the semiconductor device when the semiconductor device is electrically connected to the semiconductor device as the semiconductor device is connected. The test tray T may accommodate a plurality of semiconductor elements. In this case, the test apparatus 2 may connect a plurality of semiconductor devices to the test equipment 200, and the test equipment 200 may test a plurality of semiconductor devices. The test equipment 200 may include a hi-fix board.

The test apparatus 2 includes a chamber unit 21. The chamber unit 21 includes a first chamber 211 in which the test process is performed. The test equipment 200 is installed in the first chamber 211. The test equipment 200 is installed so that some or all of the test equipment 200 is inserted into the first chamber 211. The test equipment 200 includes test sockets (not shown) to which semiconductor devices stored in the test tray T are connected. The test equipment 200 may include a number of test sockets approximately equal to the number of semiconductor devices accommodated in the test tray T. For example, the test tray T may accommodate 64, 128, 256, and 512 semiconductor devices. When the semiconductor devices stored in the test tray T are connected to the test sockets, the test equipment 200 may test the semiconductor devices connected to the test sockets. The first chamber 211 may be formed in a rectangular parallelepiped shape in which a portion into which the test equipment 200 is inserted is opened.

The chamber unit 21 includes a contact unit 212 for connecting the test tray T to the test equipment 200. The contact unit 212 is installed in the first chamber 211. The contact unit 212 connects the semiconductor devices accommodated in the test tray T to the test equipment 200. The contact unit 212 may move the semiconductor devices accommodated in the test tray T in a direction approaching or away from the test equipment 200. When the contact unit 212 moves the semiconductor devices stored in the test tray T in a direction approaching the test equipment 200, the semiconductor devices stored in the test tray T may be transferred to the test equipment 200. Connected. Accordingly, the test equipment 200 may test the semiconductor devices. When the test of the semiconductor devices is completed, the contact unit 3 may move the semiconductor devices stored in the test tray T in a direction away from the test equipment 200.

Carrier modules for accommodating semiconductor devices are installed in the test tray T. Each of the carrier modules may accommodate at least one semiconductor device. The carrier modules are elastically movable to the test tray T by springs (not shown), respectively. When the contact unit 212 pushes the semiconductor devices accommodated in the test tray T in a direction approaching the test equipment 200, the carrier modules may move in a direction approaching the test equipment 200. When the contact unit 212 removes the force pushing the semiconductor elements stored in the test tray T, the carrier modules may move away from the test equipment 200 by the restoring force of the spring. While the contact unit 212 moves the carrier modules and the semiconductor devices, the test tray T may move together.

Although not shown, the contact unit 212 may include a plurality of contact sockets for contacting the semiconductor devices accommodated in the test tray T. The contact sockets may contact the semiconductor devices stored in the test tray T to move the semiconductor devices, thereby connecting the semiconductor devices to the test equipment 200. The contact unit 212 may include a number of contact sockets approximately equal to the number of semiconductor devices accommodated in the test tray T. The contact unit 212 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, etc., a motor, a rack gear and a pinion gear, etc. It can be moved by a gear method, a belt method using a motor, a pulley and a belt, a linear motor, or the like.

2 to 6, the chamber unit 21 allows the test equipment 200 to test the semiconductor device in a high temperature or low temperature environment as well as a room temperature environment, and a second chamber 213. And a third chamber 214.

The second chamber 213 adjusts the semiconductor device accommodated in the test tray T to a first temperature. The semiconductor device to be tested is accommodated in the test tray T positioned in the second chamber 213. The test tray T located in the second chamber 213 is transferred from the sorting apparatus 3. The first temperature is a temperature range of the semiconductor devices to be tested when the semiconductor device to be tested is tested by the test equipment 20. The second chamber 213 includes at least one of an electrothermal heater and a liquefied nitrogen injection system to adjust the semiconductor device to be tested to the first temperature. When the semiconductor device to be tested is adjusted to the first temperature, the test tray T is transferred from the second chamber 213 to the first chamber 211.

The third chamber 214 adjusts the semiconductor device accommodated in the test tray T to a second temperature. The tested semiconductor device is accommodated in the test tray T positioned in the third chamber 214. The test tray T located in the third chamber 214 is transferred from the first chamber 211. The second temperature is a temperature range including or close to room temperature. The third chamber 214 includes at least one of an electrothermal heater and a liquefied nitrogen injection system to adjust the tested semiconductor device to the second temperature. When the tested semiconductor device is adjusted to the second temperature, the test tray T is transferred to the sorting apparatus 3.

Although not shown, the chamber unit 21 may include a transfer means (not shown) for transferring the test tray T. The conveying means may transfer by pushing the test tray (T) or pull the test tray (T). The transfer means may transfer the test tray T in which the semiconductor element to be tested is accommodated from the second chamber 213 to the first chamber 211. The transfer means may transfer the test tray T in which the tested semiconductor device is accommodated from the first chamber 211 to the third chamber 214. The conveying means may be a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear, and a pinion gear, a belt method using a motor, a pulley, a belt, and the like. The test tray T may be transferred using a motor or the like.

As shown in FIG. 5, the chamber unit 21 may have the second chamber 213, the first chamber 211, and the third chamber 214 side by side in a horizontal direction. In this case, the chamber unit 21 may include a plurality of first chambers 211, and a plurality of first chambers 211 may be stacked up and down. As shown in FIG. 6, the chamber unit 21 may include the second chamber 213, the first chamber 211, and the third chamber 214 stacked in a vertical direction. That is, the second chamber 213, the first chamber 211, and the third chamber 214 may be stacked up and down. The second chamber 213 may be installed to be positioned above the first chamber 211, and the third chamber 214 may be installed to be positioned below the first chamber 211.

2 to 6, the test apparatus 2 may include a rotator 22 for rotating the test tray T between a horizontal state and a vertical state.

The rotator 22 is installed in the chamber unit 21. The rotator 22 may rotate the test tray T in which the semiconductor device to be tested is accommodated from a horizontal state to a vertical state. Accordingly, the first chamber 211 may perform the test process on the test tray T standing in a vertical state. The rotator 22 may rotate the test tray T containing the tested semiconductor device from a vertical state to a horizontal state. Accordingly, the sorting apparatus 3 may perform the loading process and the unloading process on the test tray T laid down in a horizontal state.

The test apparatus 2 may include one rotator 22, as shown in FIGS. 5 and 6. In this case, the rotator 22 may be installed between the second chamber 213 and the third chamber 214. After the test tray T in which the semiconductor device to be tested is accommodated is rotated to be vertical by the rotator 22, the test tray T may be transferred from the rotator 22 to the second chamber 213 by the transfer means. have. The test tray T in which the tested semiconductor device is accommodated may be rotated to be horizontal by the rotator 22 after being transferred from the third chamber 214 to the rotator 22 by the transfer means. have. Although not shown, the test apparatus 2 includes a first rotator for rotating the test tray T in which the semiconductor element to be tested is accommodated and a second rotator for rotating the test tray T in which the test semiconductor element is accommodated. It may also include. The first rotator may be installed to be located inside the second chamber 213 or outside the second chamber 213. The second rotator may be installed to be located inside the third chamber 214 or outside the third chamber 214. Although not shown, the test apparatus 2 may perform a test process on the test tray T in a horizontal state without the rotator 22. In this case, the test tray T may be transferred between the second chamber 213, the first chamber 211, and the third chamber 214 in a horizontal state to perform the test process.

2 to 4, the test apparatus 2 may include a first test rack 23 for storing a test tray T in which a semiconductor device to be tested is accommodated.

The first test rack 23 is coupled to the chamber unit 21. When the test tray T stored in the first test rack 23 is transferred to the chamber unit 21, the chamber unit 21 performs the test process on the test tray T. The test tray T stored in the first test rack 23 may be transferred from the first test rack 23 to the chamber unit 21 by the transfer means. The transfer means may transfer the test tray T stored in the first test rack 23 to the first chamber 211. When the chamber unit 21 includes the second chamber 213, the transfer means uses the test tray T stored in the first test rack 23 via the second chamber 213. It may be transferred to the first chamber 211. Although not shown, the first test rack 23 may include a transfer unit (not shown) for transferring the test tray T stored therein to the chamber unit 21. The conveying unit is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, etc., a gear method using a motor, a rack gear and a pinion gear, a belt method using a motor, a pulley and a belt, and a linear. The test tray T may be pushed or the test tray T may be pulled and transferred using a motor or the like.

The first test rack 23 may store a plurality of test trays T. In this case, the chamber unit 21 is sequentially transferred from the first test rack 23 until the test trays T stored in the first test rack 23 are exhausted. The test process can be performed for. Accordingly, the semiconductor device handling system 1 according to the present invention may independently perform the test process with respect to the sorting device 3 performing the loading process and the unloading process. When the first test rack 23 stores a plurality of test trays T, the test trays T may be stacked in a horizontal state and stored in the first test rack 23. Although not shown, the test trays T may be stored inside the first test rack 23 in a vertical state. The first test rack 23 may be formed in a rectangular parallelepiped shape having a size capable of storing a plurality of test trays T.

The first test rack 23 is detachably coupled to the chamber unit 21. Accordingly, when the test tray T stored in the first test rack 23 is exhausted as the test tray T is exhausted, the empty first test rack 23 may be separated from the chamber unit 21. The empty first test rack 23 is transported to the sorting apparatus 3, and after the semiconductor element to be tested by the sorting apparatus 3 is filled with the received test tray T, the chamber unit 21 is again. Can be coupled to. Until the empty first test rack 23 is separated from the chamber unit 21 and then coupled to the chamber unit 21 again, another chamber in which the test tray T is stored is stored in the chamber unit 21. One test rack 23 may be combined. Therefore, the semiconductor device handling system 1 according to the present invention can prevent the waiting time from occurring as the test tray T stored in the first test rack 23 is exhausted. The first test rack 23 may be detachably coupled to the first chamber 211 or the second chamber 213.

2 to 4, the test apparatus 2 may include a second test rack 24 for storing a test tray T in which the tested semiconductor device is accommodated.

The second test rack 24 is coupled to the chamber unit 21. The second test rack 24 stores a test tray T transferred from the chamber unit 21. The test tray T in which the test process is completed in the chamber unit 21 may be transferred from the chamber unit 21 to the second test rack 24 by the transfer means. The transfer means may transfer the test tray T, in which the test process is completed, from the first chamber 211 to the second test rack 24. When the chamber unit 21 includes the third chamber 214, the transfer means passes through the third chamber 214 from the first chamber 211 to the test tray T where the test process is completed. To be transferred to the second test rack 24. Although not shown, the second test rack 24 may include a conveying unit (not shown). The transfer unit may transfer the test tray T, in which the test process is completed, from the chamber unit 21 to the second test rack 24. The conveying unit is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, etc., a gear method using a motor, a rack gear and a pinion gear, a belt method using a motor, a pulley and a belt, and a linear. The test tray T may be pushed or the test tray T may be pulled and transferred using a motor or the like.

The second test rack 24 may store a plurality of test trays T. In this case, the chamber unit 21 sequentially tests the test trays T, in which the test process is completed, until the second test rack 24 is filled with the test trays T. Can be transported with. Accordingly, the semiconductor device handling system 1 according to the present invention may independently perform the test process with respect to the sorting device 3 performing the loading process and the unloading process. When the second test rack 24 stores a plurality of test trays T, the test trays T may be stacked vertically and horizontally and stored in the second test rack 24. Although not shown, the test trays T may be stored inside the second test rack 24 in a vertical state. The second test rack 24 may be formed in a rectangular parallelepiped shape having a size capable of storing a plurality of test trays T.

The second test rack 24 is detachably coupled to the chamber unit 21. Accordingly, when the second test rack 24 is filled with the test tray T, the second test rack 24 filled with the test tray T may be separated from the chamber unit 21. After the second test rack 24 filled with the test tray T is transported to the sorting apparatus 3, the second test rack 24 is empty as the unloading process for the test tray T is performed by the sorting apparatus 3. Again, it may be coupled to the chamber unit 21. The second test rack 24 filled with the test tray T is separated from the chamber unit 21 and then coupled to the chamber unit 21 until the second test rack 24 is empty. The test rack 24 may be coupled. Therefore, the semiconductor device handling system 1 according to the present invention can prevent the waiting time from occurring as the second test rack 24 is filled with the test tray T. The second test rack 24 may be detachably coupled to the first chamber 211 or the third chamber 214.

2 to 4 and 7, the sorting apparatus 3 performs the loading process and the unloading process. The sorting apparatus 3 is installed spaced apart from the test apparatus 2. Accordingly, the semiconductor device handling system 1 according to the present invention may independently perform the test process with respect to the sorting device 3 performing the loading process and the unloading process. The semiconductor device handling system 1 according to the invention also comprises a smaller number of sorting devices 3 than the test device 2. Accordingly, the semiconductor device handling system 1 according to the present invention has a delay in working time due to the longer time required for the test process than the loading process and the unloading process based on one test tray T. Can be prevented. In addition, since the semiconductor device handling system 1 according to the present invention includes a smaller number of sorting apparatuses 3 than the test apparatus 2, the semiconductor device handling system 1 reduces the number of the sorting apparatuses 3 to provide a complete system. Reduce costs The sorting apparatus 3 may receive a test result for the semiconductor device from the test apparatus 2 using at least one of wired communication and wireless communication. The sorting apparatus 3 may classify the semiconductor devices according to grades according to the received test results. Although one sorting device 3 is shown in FIG. 2, the present invention is not limited thereto, and the semiconductor device handling system 1 according to the present invention may include two or more sorting devices 3.

Referring to FIG. 7, the sorting apparatus 3 may include a loading apparatus 31 for performing the loading process. The loading device 31 transfers the semiconductor device to be tested from the customer tray to the test tray T. The loading device 31 may include a loading stacker 311 and a loading picker 312.

The loading stacker 311 supports the customer tray. The customer tray supported by the loading stacker 311 contains the semiconductor devices to be tested. The loading stacker 311 may store a plurality of customer trays containing semiconductor devices to be tested. The customer trays may be stacked up and down and stored in the loading stacker 311.

The loading picker 312 may pick up a semiconductor device to be tested from a customer tray located in the loading stacker 311 and store the semiconductor device in a test tray T. When the semiconductor device to be tested is accommodated in the test tray T, the test tray T may be located at the loading position 31a. The loading picker 312 may transfer the semiconductor device to be tested while moving in the first axis direction (X-axis direction) and the second axis direction (Y-axis direction). The first axis direction (X axis direction) and the second axis direction (Y axis direction) are perpendicular to each other. The loading picker 312 may move up and down.

The loading device 31 may further include a loading buffer 313 for temporarily receiving the semiconductor device to be tested. In this case, the loading picker 312 picks up the semiconductor device to be tested from the customer tray, and then, the test tray T located at the loading position 31a via the loading buffer 313. Can be stored in. The loading picker 312 may include a first loading picker 3121 for transferring the semiconductor device to be tested from the customer tray to the loading buffer 313, and a test tray T from the loading buffer 313 to the semiconductor device to be tested. It may also include a second loading picker 3122 to transfer to.

7 and 8, the loading device 31 may include a loading opening / closing mechanism 314 (shown in FIG. 8) for opening and closing the test tray T. Referring to FIGS.

The loading opening / closing mechanism 314 may open the test tray T to accommodate the semiconductor device in the test tray T. The loading and closing mechanism 314 may close the test tray T so that the semiconductor device is fixed to the test tray T. As described above, the test tray T includes a carrier module for accommodating a semiconductor device. The carrier module includes a latch (not shown) for fixing a semiconductor device. The latch is installed to move elastically by a spring (not shown). When the loading opening and closing mechanism 314 pushes and moves the latch, the carrier module is opened to accommodate the semiconductor device. When the semiconductor device is accommodated in the carrier module, the loading opening and closing mechanism 314 is moved away from the latch. Accordingly, the latch can be fixed by pressing the semiconductor element by moving by the restoring force of the spring. The loading opening and closing mechanism 314 may move the latch to open and close the test tray T while being lifted by a loading lift means (not shown). The loading lifting means is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt method using a motor, a pulley and a belt, The loading opening / closing mechanism 314 may be elevated by using a linear motor.

Here, the semiconductor device is formed in various sizes according to the type, the loading device 31 is to perform the loading process for the semiconductor device formed of various sizes by using a test tray (T) corresponding to the size of the semiconductor device. Can be. For example, the loading device 31 uses a first test tray for accommodating a first semiconductor element and a second test tray for accommodating a second semiconductor element, thereby loading a semiconductor device having different sizes. Can be performed. In this case, the loading device 31 may include a first loading opening and closing mechanism 314a for opening and closing the first test tray and a second loading opening and closing mechanism 314b for opening and closing the second test tray.

The first loading opening and closing mechanism 314a may open and close the first carrier modules installed in the first test tray. To this end, the first loading opening and closing mechanism 314a includes a plurality of first loading opening and closing pins 3141a for opening and closing the first carrier modules. As the first loading opening / closing mechanism 314a moves up and down, the first loading opening / closing pins 3141a may move up and down to move the first latches of the first carrier module. Accordingly, the first loading opening and closing mechanism 314a may open and close the first test tray so that the loading process is performed on the first test tray.

The first loading opening and closing mechanism 314a may be formed to have a smaller size than the first test tray. Accordingly, the first loading opening / closing mechanism 314a sequentially opens and closes the first carrier modules of the first test tray for each zone, so that the first semiconductor element is provided in all of the first carrier modules of the first test tray. Can be stored. In this case, the loading device 31 moves at least one of the first test tray and the first loading opening and closing mechanism 314a, so that the first loading opening and closing mechanism 314a opens an area in which the first carrier modules are opened. You can change it.

The second loading opening and closing mechanism 314b may open and close the second carrier modules installed in the second test tray. To this end, the second loading opening and closing mechanism 314b includes a plurality of second loading opening and closing pins 3141b for opening and closing the second carrier modules. As the second loading opening and closing mechanism 314b moves up and down, the second loading opening and closing pins 3141b may move up and down to move the second latches of the second carrier modules. Accordingly, the second loading opening and closing mechanism 314b may open and close the second test tray so that the loading process is performed on the second test tray.

The second loading opening and closing mechanism 314b may be formed to have a smaller size than the second test tray. Accordingly, the second loading opening / closing mechanism 314b sequentially opens and closes the second carrier modules of the second test tray for each zone, whereby the second semiconductor element is placed on all of the second carrier modules of the second test tray. Can be stored. In this case, the loading device 31 moves at least one of the second test tray and the second loading opening and closing mechanism 314b, whereby the second loading opening and closing mechanism 314b opens an area for opening the second carrier modules. You can change it. Accordingly, the semiconductor device handling system 1 according to the present invention may include the plurality of the loading and closing mechanisms 314 such that the sorting device 3 may perform the loading process on the semiconductor devices having various sizes. It is possible to prevent the size of the device 3 from increasing.

The second loading opening and closing pins 3141b may be formed by being spaced apart from the distance formed by the first loading and closing pins 3141a being spaced apart from each other. The second loading opening and closing pins 3141b may be formed to be spaced apart from each other by a distance substantially equal to a distance from each other. The first loading opening and closing pins 3141a may be formed to be spaced apart from each other by a distance substantially equal to a distance from each other. Accordingly, the second loading and closing mechanism 314b and the first loading and closing mechanism 314a may open and close the first test tray and the second test tray for accommodating semiconductor elements having different sizes. Therefore, the loading device 31 may perform the loading process on semiconductor devices formed of different sizes. When the plurality of second loading and closing pins 3141b are used as a set to open and close one second carrier module, the distances between the sets of the second loading and closing pins 3141b are spaced apart from each other. Approximately matched distance. When the plurality of first loading opening and closing pins 3141a are used as a set to open and close one first carrier module, the distances spaced apart from each other between the sets of the first loading and closing pins 3141a are spaced apart from each other. Approximately matched distance.

In FIG. 8, the loading device 31 is illustrated as including two loading opening and closing mechanisms 314. However, the loading device 31 is not limited thereto, and the loading device 31 may include three or more loading opening and closing mechanisms 314. have. The loading device 31 may include a plurality of loading lifting means to lift and lower the loading opening and closing mechanisms 314 individually. The loading device 31 may include a loading lifting means of a number approximately equal to the number of the loading and closing mechanisms 314.

Referring to FIG. 7, the sorting apparatus 3 may include an unloading apparatus 32 for performing the unloading process. The unloading device 32 separates the tested semiconductor device from the test tray T and transfers it to the customer tray. The unloading device 32 may include an unloading stacker 321 and an unloading picker 322.

The unloading stacker 321 supports the customer tray. The customer tray supported by the unloading stacker 321 contains the tested semiconductor devices. The unloading stacker 321 may store a plurality of customer trays containing the tested semiconductor devices. The customer trays may be stacked up and down and stored in the unloading stacker 321.

The unloading picker 322 may pick up the tested semiconductor device from the test tray T and store it in a customer tray located in the unloading stacker 321. When the tested semiconductor element is picked up from the test tray T, the test tray T may be located at the unloading position 32a. The unloading picker 322 may store the tested semiconductor device in a customer tray corresponding to the grade for each grade according to the test result. The unloading picker 322 may transfer the tested semiconductor device while moving in the first axis direction (X axis direction) and the second axis direction (Y axis direction). The unloading picker 322 may be elevated. When the test tray T becomes empty as the unloading device 32 separates all the tested semiconductor devices from the test tray T, the sorting device 3 unloads the empty test tray T. It is possible to transfer from the device 32 to the loading device 31.

The unloading device 32 may further include an unloading buffer 323 for temporarily receiving the tested semiconductor device. In this case, the unloading picker 322 picks up the tested semiconductor device from the test tray T located at the unloading position 32a and passes the picked-up semiconductor device through the unloading buffer 323. It can be stored in the customer tray. The unloading picker 322 transfers the tested semiconductor device from the test tray T to the unloading buffer 323, and the unloading buffer 323. It may also include a second unloading picker 3222 to transfer to the customer tray.

7 and 9, the unloading device 32 may include an unloading opening and closing mechanism 324 (shown in FIG. 9) for opening and closing the test tray T.

The unloading opening and closing mechanism 324 may open the test tray T to separate the semiconductor device from the test tray T. When the unloading opening and closing mechanism 324 pushes and moves the latch, the carrier module is opened so that the semiconductor device can be separated. When the semiconductor device is separated from the carrier module, the unloading opening and closing mechanism 324 moves away from the latch. Accordingly, the carrier module is closed as the latch moves by the restoring force of the spring. The unloading opening and closing mechanism 324 may move the latch to open and close the test tray T while lifting and lowering by the unloading lifting and lowering means (not shown). The unloading lifting means is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, and a belt method using a motor, a pulley and a belt. By using a linear motor, the unloading opening and closing mechanism 324 can be raised and lowered.

The unloading device 32 may perform the unloading process on semiconductor devices having various sizes by using a test tray T corresponding to the size of the semiconductor device. For example, the unloading device 32 uses the first test tray for accommodating the first semiconductor element and the second test tray for accommodating the second semiconductor element, thereby unloading the semiconductor device formed in different sizes. The loading process can be performed. In this case, the unloading device 32 may include a first unloading opening and closing mechanism 324a for opening and closing the first test tray and a second unloading opening and closing mechanism 324b for opening and closing the second test tray. have.

The first unloading opening and closing mechanism 324a may open and close the first carrier modules installed in the first test tray. To this end, the first unloading opening and closing mechanism 324a includes a plurality of first unloading opening and closing pins 3241a for opening and closing the first carrier modules. As the first unloading opening and closing mechanism 324a moves up and down, the first unloading opening and closing pins 3241a may move up and down to move the first latches of the first carrier modules. Accordingly, the first unloading opening and closing mechanism 324a may open and close the first test tray so that the unloading process is performed on the first test tray.

The first unloading opening and closing mechanism 324a may be formed to have a smaller size than the first test tray. Accordingly, the first unloading opening / closing mechanism 324a sequentially opens and closes the first carrier modules of the first test tray for each zone, thereby allocating the first semiconductor element from all of the first carrier modules of the first test tray. Can be separated. In this case, the unloading device 32 moves at least one of the first test tray and the first unloading opening and closing mechanism 324a so that the first unloading opening and closing mechanism 324a opens the first carrier modules. You can change the area to be.

The second unloading opening and closing mechanism 324b may open and close the second carrier modules installed in the second test tray. To this end, the second unloading opening and closing mechanism 324b includes a plurality of second unloading opening and closing pins 3241b for opening and closing the second carrier modules. As the second unloading opening and closing mechanism 324b moves up and down, the second unloading opening and closing pins 3241b may move and move the second latches of the second carrier modules. Accordingly, the second unloading opening and closing mechanism 324b may open and close the second test tray to perform the unloading process on the second test tray.

The second unloading opening and closing mechanism 324b may be formed to have a smaller size than the second test tray. Accordingly, the second unloading opening / closing mechanism 324b sequentially opens and closes the second carrier modules of the second test tray for each zone, so that all of the second semiconductor modules from the second carrier modules of the second test tray are opened. Can be separated. In this case, the unloading device 32 moves at least one of the second test tray and the second unloading opening and closing mechanism 324b so that the second unloading opening and closing mechanism 324b opens the second carrier modules. You can change the area to be. Therefore, even if the semiconductor device handling system 1 according to the present invention includes a plurality of the unloading opening and closing mechanism 324 so that the sorting device 3 can perform the unloading process for the semiconductor device formed in various sizes, It is possible to prevent the size of the sorting device 3 from increasing.

The second unloading opening and closing pins 3241b may be formed to be spaced apart from the distance formed by the first unloading opening and closing pins 3241a spaced apart from each other. The second unloading opening and closing pins 3241b may be formed to be spaced apart from each other by a distance substantially equal to a distance from each other. The first unloading opening and closing pins 3241a may be formed to be spaced apart from each other by a distance substantially equal to a distance from each other. Accordingly, the second unloading switch 324b and the first unloading switch 324a may open and close the first test tray and the second test tray for accommodating semiconductor elements having different sizes. Accordingly, the unloading device 32 may perform the unloading process on semiconductor devices having different sizes. When a plurality of second unloading opening and closing pins 3241b are used as a set to open and close one second carrier module, the distances between the sets of the second unloading opening and closing pins 3241b are separated from each other. Approximately equal to the distance from each other. When a plurality of first unloading opening and closing pins 3321a are used as a set to open and close one first carrier module, the first carrier modules may be spaced apart from each other between the sets of the first unloading opening and closing pins 3241a. Approximately equal to the distance from each other.

9, the unloading device 32 is illustrated as including two unloading opening and closing mechanisms 324, but is not limited thereto. The unloading device 32 may include three or more unloading opening and closing mechanisms 324. It may also include. The unloading device 32 may include a plurality of unloading lifting and lowering means so as to individually lift and unload the unloading opening and closing mechanisms 324. The unloading device 32 may include a number of unloading lifting and lowering means approximately equal to the number of the unloading opening and closing mechanisms 324.

4 and 7, the sorting apparatus 3 may include a first loading rack 33 for storing a test tray T in which the semiconductor device to be tested is accommodated.

The first loading rack 33 stores a test tray T transferred from the loading device 31. The test tray T in which the loading process is completed may be transferred from the loading device 31 to the first loading rack 33. Although not shown, the sorting apparatus 3 may include a loading transfer means for transferring the test tray T on which the loading process is completed, to the first loading rack 33. The loading transfer means may be a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt method using a motor, a pulley and a belt, A linear motor or the like may be used to push the test tray T or pull the test tray T to transfer. Although not shown, the first loading rack 33 may include a loading transport unit (not shown). The loading transport unit may transfer the test tray T, in which the loading process is completed, from the loading device 31 to the first loading rack 33. The loading conveying unit is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt method using a motor, a pulley and a belt, A linear motor or the like may be used to push the test tray T or pull the test tray T to transfer.

The first loading rack 33 may store a plurality of test trays T. In this case, the sorting apparatus 3 sequentially loads the test trays T which have been loaded in the first loading rack 33 until the first loading rack 33 is filled with the test trays T. Can be transported with. Accordingly, the semiconductor device handling system 1 according to the present invention may independently perform the loading process with respect to the test apparatus 2 performing the test process. When the first loading rack 33 stores a plurality of test trays T, the test trays T may be stacked in a horizontal state and stored in the first loading rack 33. Although not shown, the test trays T may be stored inside the first loading rack 33 in a vertical state. The first loading rack 33 may be formed in a rectangular parallelepiped shape having a size capable of storing a plurality of test trays T.

The first loading rack 33 is detachably coupled to the loading device 31. Accordingly, when the first loading rack 33 is filled with the test tray T, the first loading rack 33 filled with the test tray T may be separated from the loading device 31. After the first loading rack 33 filled with the test tray T is transported to the test apparatus 2, when the first loading rack 33 is emptied as the test process for the test tray T is performed by the test apparatus 2, It may be coupled to the loading device 31 again. The first loading rack 33 filled with the test tray T is separated from the loading device 31 and then coupled to the loading device 31 until the first loading rack 33 is coupled to the loading device 31. The loading rack 33 may be combined. Therefore, the semiconductor device handling system 1 according to the present invention can prevent the waiting time from occurring as the first loading rack 33 is filled with the test tray T. In the above description, the first loading rack 33 and the first test rack 23 are described as separate components, but the present invention is not limited thereto, and the semiconductor device handling system 1 according to the present invention may include a test tray T. A rack for storage may be coupled to the sorting device 3 to function as the first loading rack 33 and coupled to the test device 2 to function as the first test rack 23. .

4 and 7, the sorting apparatus 3 may include a first unloading rack 34 for storing a test tray T in which a tested semiconductor device is accommodated.

The first unloading rack 34 is coupled to the unloading device 32. When the test tray T stored in the first unloading rack 34 is transferred to the unloading device 32, the unloading device 32 performs the unloading process with respect to the test tray T. To perform. Although not shown, the sorting apparatus 3 may provide an unloading transfer means for transferring the test tray T in which the tested semiconductor device is accommodated, from the first unloading rack 34 to the unloading device 32. It may include. The unloading transfer means is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, and a belt method using a motor, a pulley and a belt. By using a linear motor, the test tray T can be pushed or the test tray T can be pulled and transferred. Although not shown, the first unloading rack 34 may include an unloading conveying unit (not shown). The unloading transfer unit may transfer the test tray T in which the tested semiconductor device is stored, to the unloading device 32. The unloading conveying unit is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, and a belt method using a motor, a pulley and a belt. By using a linear motor, the test tray T can be pushed or the test tray T can be pulled and transferred.

The first unloading rack 34 may store a plurality of test trays T. In this case, until the test trays T stored in the first unloading rack 34 are exhausted, the unloading device 32 is sequentially transferred from the first unloading rack 34. The unloading process may be performed on (T). Accordingly, the semiconductor device handling system 1 according to the present invention may independently perform the unloading process with respect to the test apparatus 2 performing the test process. When the first unloading rack 34 stores a plurality of test trays T, the test trays T may be stacked vertically in a horizontal state and stored in the first unloading rack 34. . Although not shown, the test trays T may be stored inside the first unloading rack 34 in a vertical state. The first unloading rack 34 may be formed in a rectangular parallelepiped shape having a size capable of storing a plurality of test trays T.

The first unloading rack 34 is detachably coupled to the unloading device 32. Accordingly, when the test tray T stored in the first unloading rack 34 becomes empty as the test tray T is exhausted, the empty first unloading rack 34 may be separated from the unloading device 32. . The empty first unloading rack 34 is transported to the test apparatus 2, and after the semiconductor element tested by the test apparatus 2 is filled with the received test tray T, the unloading apparatus ( 32). The test tray T is attached to the unloading device 32 until the empty first unloading rack 34 is separated from the unloading device 32 and then coupled to the unloading device 32. Another archived first unloading rack 34 may be combined. Therefore, the semiconductor device handling system 1 according to the present invention can prevent the waiting time from occurring as the test tray T stored in the first unloading rack 34 is exhausted. In the above description, the first unloading rack 34 and the second test rack 24 are described as separate components. However, the present invention is not limited thereto, and the semiconductor device handling system 1 according to the present invention may include a test tray T. The rack for storing the coupled to the sorting device (3) to function as the first unloading rack 34, coupled to the test device (2) to be implemented to function as the second test rack (24) It may be.

10 and 11, the sorting apparatus 3 according to the modified embodiment of the present invention may be installed with the loading device 31 and the unloading device 32 spaced apart from each other. Accordingly, the semiconductor device handling system 1 according to the present invention may be implemented such that the loading process and the unloading process are performed independently of each other. Therefore, the semiconductor device handling system 1 according to the present invention can minimize the work time required for each process as the loading process, the unloading process and the test process are performed independently of each other. have.

Referring to FIG. 10, the loading device 31 includes the loading stacker 311, the loading picker 312 (shown in FIG. 7), the loading buffer 313, and the loading opening / closing mechanism 314. do.

The loading stacker 311 supports a plurality of customer trays containing semiconductor devices to be tested. The customer trays may be spaced apart from each other in the first axial direction (X-axis direction) to be supported by the loading stacker 311.

The loading picker 312 (shown in FIG. 7) is located at the loading position 31a via the loading buffer 313 from customer trays supported by the loading stacker 311 for the semiconductor device to be tested. It is stored in the test tray T. The loading picker 312 (shown in FIG. 7) includes a first loading picker 3121 (shown in FIG. 7) that transfers the semiconductor device to be tested from the customer tray to the loading buffer 313, and the semiconductor device to be tested. The loading buffer 313 may include a second loading picker 3122 (shown in FIG. 7) transferred to the test tray T.

The loading buffer 313 is installed to be located between the loading position 31a and the loading stacker 311. The loading buffer 313 may be installed to be movable in the second axis direction (Y-axis direction). The loading device 31 may include a plurality of loading buffers 313. In this case, the loading buffers 313 may be spaced apart from each other in the first axis direction (X-axis direction). The loading buffers 313 may individually move in the second axis direction (Y-axis direction).

The loading opening and closing mechanism 314 is installed to be located in the loading position (31a). When the loading and closing mechanism 314 opens the test tray T positioned at the loading position 31a, the loading picker 312 (shown in FIG. 7) is opened by the loading and closing mechanism 314. The semiconductor element to be tested is stored in the test tray T.

The loading device 31 may include a plurality of the loading and closing mechanism 314. In this case, the loading opening and closing mechanisms 314 may be installed to be spaced apart from each other in the first axial direction (X-axis direction). The opening and closing mechanism 314 may include a plurality of loading opening and closing pins (not shown), which are formed to be spaced apart from each other at different distances. Accordingly, the loading device 31 may open and close the test trays T for accommodating semiconductor devices having different sizes. Accordingly, the semiconductor device handling system 1 according to the present invention may perform the loading process by using the loading switch mechanism 314 corresponding to the size of the changed semiconductor device, even if the semiconductor device is changed to a different size. Accordingly, the semiconductor device handling system 1 according to the present invention can improve the responsiveness to semiconductor devices formed in various sizes. 10, the loading device 31 is illustrated as including four loading opening and closing mechanisms 314. However, the loading device 31 is not limited thereto, and the loading device 31 includes two, three, five or more loading opening and closing mechanisms ( 314).

The loading device 31 may include a plurality of loading buffers 313 for accommodating semiconductor devices having different sizes so as to perform a loading process on semiconductor devices having various sizes. In addition, the loading picker 312 (shown in FIG. 7) adjusts the spacing of nozzles (not shown) for adsorbing the semiconductor device, thereby removing the semiconductor device having different sizes from the loading buffer 313 in the customer tray. It can be accommodated in the test tray T via. The loading picker 312 (shown in FIG. 7) may adjust the distance between the nozzles in at least one of the first axis direction (X-axis direction) and the second axis direction (Y-axis direction). Although not shown, the loading device 31 may include a plurality of loading pickers 312 (shown in FIG. 7) capable of transferring semiconductor devices having different sizes so as to perform a loading process on semiconductor devices having various sizes. It may also include.

Meanwhile, the semiconductor device handling system 1 (shown in FIG. 2) according to the present invention may perform a test process on semiconductor devices having different sizes so that the test process may be performed on semiconductor devices formed of various sizes. It may also include a plurality of test devices (shown in FIG. 2). Contact units 212 (shown in FIG. 4) installed in the test apparatus 2 (shown in FIG. 2) may include contact sockets formed spaced apart from each other at different intervals. In addition, the test equipment 200 installed in the test apparatus 2 (shown in FIG. 2) may include test sockets spaced apart from each other at different intervals.

Referring to FIG. 10, the first loading rack 33 is detachably coupled to the loading device 31. The first loading rack 33 may be coupled to the loading device 31 to be positioned opposite to the loading stacker 311 based on the loading position 31a. The test tray T located at the loading position 31a may be transferred to the first loading rack 33 and stored in the first loading rack 33.

Referring to FIG. 10, the sorting apparatus 3 may further include a second loading rack 35 for storing a test tray T on which the loading process is to be performed.

The second loading rack 35 is coupled to the loading device 31. The second loading rack 35 may be coupled to the loading device 31 to be spaced apart from the first loading rack 33 by a predetermined distance. When the test tray T stored in the second loading rack 35 is transferred to the loading device 31, the loading device 31 performs the loading process on the test tray T. The loading transfer means may transfer the test tray T stored in the second loading rack 35 to the loading position 31a. Although not shown, the second loading rack 35 may include a loading transport unit (not shown). When the loading transfer unit installed in the second loading rack 35 transfers the test tray T to the loading device 31, the loading transfer means transfers the test tray T to the loading position 31a. You may. The loading conveying unit installed in the second loading rack 35 may include a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear, and a pinion gear, and a motor. By using a belt method using a pulley and a belt, a linear motor, etc., the test tray T may be pushed or the test tray T may be pulled and transferred.

The second loading rack 35 may store a plurality of empty test trays T. In this case, the loading device 31 is sequentially transferred from the second loading rack 35 until the test trays T stored in the second loading rack 35 are exhausted. The loading process may be performed. When the second loading rack 35 stores the plurality of test trays T, the test trays T may be stacked vertically and horizontally and stored in the second loading rack 35. Although not shown, the test trays T may be stored inside the second loading rack 35 in a vertical state. The second loading rack 35 may be formed in a rectangular parallelepiped shape having a size capable of storing a plurality of test trays T.

The second loading rack 35 is detachably coupled to the loading device 31. Accordingly, when the test tray T stored in the second loading rack 35 is exhausted as the test tray T is exhausted, the empty second loading rack 35 may be separated from the loading device 31. The empty second loading rack 35 is transported to the test apparatus 2 (shown in FIG. 4) and includes a test tray in which the semiconductor devices tested by the test apparatus 2 (FIG. 4) are stored. It may function as the second test rack 24 (shown in FIG. 4) to be filled with T). When the second loading rack 35 is filled with the test tray T in which the tested semiconductor device is accommodated, the second loading rack 35 is coupled to the unloading device 32 (shown in FIG. 11). It may function as the first unloading rack 34 (shown in FIG. 11). The empty second loading rack 35 may be coupled to the loading device 31 to function as the first loading rack 33.

Referring to FIG. 11, the unloading device 32 includes the unloading stacker 321, the unloading picker 322 (shown in FIG. 7), the unloading buffer 323, and the unloading opening and closing mechanism. 324.

The unloading stacker 321 supports a plurality of customer trays in which the tested semiconductor device is to be contained. The customer trays may be spaced apart from each other in the first axial direction (X-axis direction) to be supported by the unloading stacker 321.

The unloading picker 322 (shown in FIG. 7) receives the tested semiconductor device from the test tray T located at the unloading position 32a via the unloading buffer 323. 321 is stored in the customer tray supported. The unloading picker 322 (shown in FIG. 7) may include a first unloading picker 3221 (shown in FIG. 7) for transferring the tested semiconductor device from the test tray T to the unloading buffer 323. And a second unloading picker 3222 (shown in FIG. 7) for transferring the tested semiconductor device from the unloading buffer 323 to the customer tray.

The unloading buffer 323 is installed to be located between the unloading position 32a and the unloading stacker 321. The unloading buffer 323 may be installed to be movable in the second axis direction (Y-axis direction). The unloading device 32 may include a plurality of unloading buffers 323. In this case, the unloading buffers 323 may be spaced apart from each other in the first axial direction (X-axis direction). The unloading buffers 323 may individually move in the second axis direction (Y-axis direction).

The unloading opening and closing mechanism 324 is installed to be located at the unloading position 32a. When the unloading opening and closing mechanism 324 opens the test tray T positioned at the unloading position 32a, the unloading picker 322 (shown in FIG. 7) is opened. The tested semiconductor device is separated from the test tray T opened by the.

The unloading device 32 may include a plurality of unloading opening and closing mechanisms 324. In this case, the unloading opening and closing mechanisms 324 may be spaced apart from each other in the first axial direction (X-axis direction). The unloading opening and closing mechanisms 324 may each include a plurality of unloading opening and closing pins (not shown) formed to be spaced apart from each other by a different distance. Accordingly, the unloading device 32 may open and close the test trays T for accommodating semiconductor devices having different sizes. Therefore, the semiconductor device handling system 1 according to the present invention can perform the unloading process by using the unloading opening and closing mechanism 324 corresponding to the size of the changed semiconductor device even if the semiconductor device is changed to a different size. have. Accordingly, the semiconductor device handling system 1 according to the present invention can improve the responsiveness to semiconductor devices formed in various sizes. In FIG. 11, the unloading device 32 includes four unloading opening and closing mechanisms 324, but the present disclosure is not limited thereto, and the unloading device 32 may include two, three, five or more unloading devices. It may also include a loading and closing mechanism (324).

The unloading device 32 may include a plurality of unloading buffers 323 that can accommodate semiconductor devices of different sizes so as to perform an unloading process on semiconductor devices formed of various sizes. In addition, the unloading picker 322 (shown in FIG. 7) adjusts the distance between nozzles (not shown) for adsorbing the semiconductor device, thereby allowing semiconductor devices of different sizes to be loaded from the test tray T. Via the 323 can be stored in the customer tray. The unloading picker 322 (shown in FIG. 7) may adjust the distance between the nozzles in at least one of the first axis direction (X-axis direction) and the second axis direction (Y-axis direction). Although not shown, the unloading device 32 may include a plurality of unloading pickers 322 (FIG. 7) capable of transferring semiconductor devices having different sizes to perform an unloading process on semiconductor devices having various sizes. Shown).

Referring to FIG. 11, the first unloading rack 34 is detachably coupled to the unloading device 32. The first unloading rack 34 may be coupled to the unloading device 32 to be positioned opposite to the unloading stacker 321 based on the unloading buffer 323. After the test tray T stored in the first unloading rack 34 is transferred to the unloading position 32a, the unloading process may be performed.

Referring to FIG. 11, the sorting apparatus 3 may further include a second unloading rack 36 for storing a test tray T in which the unloading process is performed.

The second unloading rack 36 is coupled to the unloading device 32. The second unloading rack 36 may be coupled to the unloading device 32 to be spaced apart from the first unloading rack 34 by a predetermined distance. When the test tray T located at the unloading position 32a becomes empty as the unloading process is performed, the unloading transport means moves the empty test tray T to the second unloading rack 36. Can be transported with. Although not shown, the second unloading rack 36 may include an unloading conveying unit (not shown). The unloading transport unit installed in the second unloading rack 36 may transfer the test tray T located at the unloading position 3a into the second unloading rack 36. The unloading conveying unit installed in the second unloading rack 36 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, and the like. By using a belt method using a motor, a pulley and a belt, or a linear motor, the test tray T may be pushed or the test tray T may be pulled and transferred.

The second unloading rack 36 may store a plurality of empty test trays T. In this case, until the second unloading rack 36 is filled with empty test trays T, the unloading device 32 may empty the test tray T which is empty as the unloading process is performed. The second unloading rack 36 may be sequentially transferred. When the second unloading rack 36 stores a plurality of test trays T, the test trays T may be stacked in a horizontal state and stored in the second unloading rack 36. . Although not shown, the test trays T may be stored inside the second unloading rack 36 in a vertical state. The second unloading rack 36 may be formed in a rectangular parallelepiped shape having a size capable of storing a plurality of test trays T.

The second unloading rack 36 is detachably coupled to the unloading device 32. Accordingly, when the second unloading rack 36 is filled with empty test trays T, the second unloading rack 36 may be separated from the unloading device 32. The second unloading rack 36 separated from the unloading device 32 may be coupled to the loading device 31 to function as the second loading rack 35 (shown in FIG. 10).

2 and 3, a semiconductor device handling system 1 according to the present invention is a conveying device 4 for conveying a test tray T between the sorting device 3 and the test device 2. Shown in 3).

The conveying device 4 is installed to be movable between the sorting device 3 and the test device 2. The conveying apparatus 4 conveys the test tray T from which the loading process is completed, from the sorting apparatus 3 to the test apparatus 2. The conveying apparatus 4 conveys the test tray T on which the test process is completed, from the test apparatus 2 to the sorting apparatus 3. When the loading device 31 and the unloading device 32 are spaced apart from each other, the conveying device 4 may load the test tray T on which the unloading process is completed from the unloading device 32. I can carry it in (31). The conveying apparatus 4 includes the first test rack 23, the second test rack 24, the first loading rack 33, the first unloading rack 34, and the second loading rack ( By carrying at least one of 35) and the second unloading rack 36, the test tray T may be transported between the sorting device 3 and the test device 2. Therefore, the semiconductor device handling system 1 according to the present invention can achieve the following effects.

First, since the semiconductor device handling system 1 according to the present invention can transport the test tray T between the sorting device 3 and the test device 2 installed to be spaced apart from each other through the transport device 4, It is possible to improve the ease and freedom of work to arrange the sorting device (3) and the test device (2). Accordingly, in the semiconductor device handling system 1 according to the present invention, the sorting apparatus 3 and the sorting apparatus 3 are minimized so that a copper wire for transporting the test tray T between the sorting apparatus 3 and the test apparatus 2 is minimized. It is possible to arrange the test apparatus 2.

Secondly, in the semiconductor device handling system 1 according to the present invention, even if at least one of the sorting device 3 and the test device 2 is added, a path through which the transport device 4 carries the test tray T is provided. It can be responded easily by changing Accordingly, the semiconductor device handling system 1 according to the present invention may improve the ease of operation of expanding or contracting the process line by adding or removing at least one of the sorting device 3 and the test device 2. In addition, the additional cost of doing this can be reduced.

Third, the semiconductor device handling system 1 according to the present invention is designed to connect with devices that perform other processes on the semiconductor device by changing the path that the carrier device 4 carries the test tray T. Can improve the ease of use. For example, the semiconductor device handling system 1 according to the present invention includes an external inspection device for performing an external inspection on a semiconductor device, a marking device for displaying product information on the tested semiconductor device, and a packaged semiconductor device. By connecting with other devices such as a packaging device for carrying out the process through the conveying device (4), it is possible to implement a variety of process lines for semiconductor devices.

The conveying device 4 may include an Automatic Guided Vehicle (AGV). The unmanned transport vehicle may carry a test tray T between the sorting device 3 and the test device 2 while moving between the sorting device 3 and the test device 2. The unmanned vehicle may carry the test tray T between the sorting device 3 and the test device 2 by directly loading and moving the test tray T. The unmanned transport vehicle is the first test rack 23, the second test rack 24, the first loading rack 33, the first unloading rack 34, the second loading rack 35 and By carrying at least one of the second unloading racks 36, the test tray T may be transported between the sorting device 3 and the test device 2.

The unmanned vehicle may move to transport the test tray T between the sorting apparatus 3 and the test apparatus 2 under the control of the controller 500 (shown in FIG. 2). The controller 500 may control the unmanned vehicle using at least one of wireless communication and wired communication. The control unit 500 performs the loading process, the unloading process and the test process from the sorting device 3 and the test device 2 using at least one of wireless communication and wired communication, and the progress of the test process. Information about the system can be received. The controller 500 may control the unmanned vehicle using the information received from the sorting apparatus 3 and the test apparatus 2. Although not shown, the unmanned vehicle may carry the test tray T by directly transmitting and receiving information with the sorting device 3 and the test device 2 using at least one of wireless communication and wired communication. Although not shown, the test tray T may be transported between the sorting device 3 and the test device 2 manually by an operator.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the art that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

DESCRIPTION OF SYMBOLS 1 Semiconductor element handling system 2 Test apparatus 3 Sorting apparatus
4 Transporting Device 21 Test Unit 22 Rotator 23 First Test Rack
24: second test rack 31: loading device 32: unloading device 33: first loading rack
34: first unloading rack 35: second loading rack 36: second unloading rack

Claims (13)

N sorting apparatuses (N is an integer greater than 0) for performing a loading process for accommodating the semiconductor element to be tested in a test tray and an unloading process for separating the tested semiconductor element from the test tray; And
And a M device (M is an integer greater than N) for performing a test process, wherein the test device is installed spaced apart from the sorting device and connects the semiconductor device stored in the test tray to the test equipment. The method of claim 1,
And a conveying device for conveying a test tray between the sorting device and the test device. The method of claim 1,
The sorting apparatus includes a plurality of first loading opening and closing pins for opening and closing the first test tray, and a plurality of second loading opening and closing pins for opening and closing the second test tray;
The first loading opening and closing pins of the semiconductor device handling system, characterized in that the second loading opening and closing pins are formed to be spaced apart from each other at a distance different from the formed distance. The method of claim 1,
The sorting apparatus includes a plurality of first unloading opening and closing pins for opening and closing a first test tray, and a plurality of second unloading opening and closing pins for opening and closing a second test tray;
And the first unloading opening and closing pins are formed to be spaced apart from each other by a distance different from the distance formed by the second unloading opening and closing pins. The method of claim 1, wherein the test device
A first test rack for storing a test tray containing a semiconductor device to be tested;
A chamber unit performing the test process on a test tray conveyed from the first test rack; And
And a second test rack for storing a test tray transferred from the chamber unit. The method of claim 5,
The first test rack is detachably coupled to the chamber unit,
And the second test rack is detachably coupled to the chamber unit. The method of claim 1, wherein the sorting apparatus
A loading device for performing the loading process;
A first loading rack for storing a test tray transferred from the loading device;
A first unloading rack for storing a test tray containing the tested semiconductor device; And
And an unloading device for performing the unloading process on a test tray conveyed from the first unloading rack. The method of claim 7, wherein
The first loading rack is detachably coupled to the loading device,
And the first unloading rack is detachably coupled to the unloading device. The method of claim 7, wherein the sorting device
A second loading rack detachably coupled to the loading device, for storing a test tray on which the loading process is to be performed; And
And a second unloading rack detachably coupled to the unloading device and for storing a test tray in which the unloading process has been performed. The method of claim 1,
The test apparatus includes a rotator for rotating the test tray between a horizontal state and a vertical state. A sorting apparatus for performing a loading process for accommodating the semiconductor element to be tested in a test tray and an unloading process for separating the tested semiconductor element from the test tray;
A test apparatus installed to be spaced apart from the sorting apparatus, and configured to perform a test process of connecting a semiconductor device stored in a test tray to a test equipment; And
And an automatic guided vehicle for transporting a test tray between the sorting device and the test device,
The sorting device is a semiconductor device handling system, characterized in that provided with a smaller number than the test device. The method of claim 1 or 11, wherein the sorting apparatus
A loading device for performing the loading process; And
And an unloading device spaced apart from the loading device and performing the unloading process. 12. The method of claim 11,
And a control unit for controlling the unmanned vehicle so that the unmanned vehicle carries a test tray between the sorting device and the test device.

Images