CN101894777A - The semiconductor device contact device of Test handler and use its Test handler - Google Patents
The semiconductor device contact device of Test handler and use its Test handler Download PDFInfo
- Publication number
- CN101894777A CN101894777A CN2010101766109A CN201010176610A CN101894777A CN 101894777 A CN101894777 A CN 101894777A CN 2010101766109 A CN2010101766109 A CN 2010101766109A CN 201010176610 A CN201010176610 A CN 201010176610A CN 101894777 A CN101894777 A CN 101894777A
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- semiconductor device
- test
- insertion section
- accommodation hole
- support portion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The Test handler that the invention discloses a kind of semiconductor device contact device and use it, when semiconductor device to be tested changes its type, when thickness or size, be convenient to change semiconductor device contact device, the described semiconductor device contact device that is used for Test handler comprises with fixed intervals and is arranged at a plurality of propulsion units on the operation panel, each propulsion unit in described a plurality of propulsion unit is along with the operation of described operation panel, by promoting semiconductor device described semiconductor device is contacted with test jack on the test board, wherein, each propulsion unit in described a plurality of propulsion unit comprises: forward block has an insertion section; Advance head unit, removably insert in described the insertion section; And a plurality of strutting pieces, being used for supporting described forward block, described a plurality of strutting pieces are installed in the described operation panel.
Description
The cross reference of related application
The application requires the rights and interests of the korean patent application No.P2009-0043604 of submission on May 19th, 2009, and this application is incorporated herein by reference, as having carried out complete elaboration here.
Technical field
The present invention relates to a kind of Test handler (test handler), more particularly, relate to a kind of Test handler that is used for the semiconductor device contact device of Test handler and uses it, they are convenient to the replacing of semiconductor device contact device when changing semiconductor device to be tested.
Background technology
Usually, memory that produces or non-memory semiconductor device are being undertaken distributing after the various test processs by Test handler, and wherein, described Test handler is used for testing the described semiconductor device that produces.
Test handler is a kind of device that semiconductor device to be tested is contacted with other testing apparatus and according to grade the semiconductor device of testing in described other testing apparatus is classified based on test result.Described Test handler is used for the performance of under high temperature and low temperature and normal temperature environment semiconductor test.
Described Test handler can comprise a plurality of carrier modules (carrier module) by use and carry out loading process, uninstall process and test process with the test panel (test tray) of stationary semiconductor devices.
In described loading process, semiconductor device to be tested is transmitted and is loaded on the test panel by user disk (user tray).At this moment, described semiconductor device is transmitted by a plurality of selection parts (picker).
In described uninstall process, the semiconductor device of testing is separated with described test panel, classify according to grade based on test result, and be unloaded on the described user disk.As described loading process, described uninstall process uses a plurality of selection parts so that unload described semiconductor device.
In described test process, the semiconductor device that is loaded on the described test panel is contacted with described testing apparatus, test therein then.Described test process carries out under high temperature and low temperature and normal temperature environment.For this reason, described Test handler is provided with chamber.
Described chamber is provided with and is used for the adjustment of described semiconductor device first chamber to high or low probe temperature; Be used for making and have described semiconductor device and the contacted test chamber of test machine of having regulated temperature; And be used for the temperature of described semiconductor device is after tested returned to second chamber of original temperature.In order to test described semiconductor device, described test panel is moved between described first chamber, described test chamber and described second chamber.
In addition, described test chamber is provided with semiconductor device contact device; Wherein, described semiconductor device contact device makes by described test panel loading and contacts with test machine plate (tester board) with the semiconductor device of testing.
Fig. 1 is a cutaway view, show the test chamber of the described Test handler of prior art, and Fig. 2 is a cutaway view, shows semiconductor device contact device shown in Figure 1.
Referring to Fig. 1 and Fig. 2, the described test chamber of prior art has test panel 10, test board 20 and semiconductor device contact device 30.
On test panel 10, be provided with porosely, carrier body 12a is set in each hole with fixed intervals; In addition, carrier body 12a is supported movably by elastic component 14 and supporting pin 16.At this moment, elastic component 14 is set between test panel 10 and the supporting pin 16.Supporting pin 16 passes elastic component 14, and two bights on the diagonal of test panel 10 and carrier body 12a link to each other, thereby carrier body 12a is supported.
The location hole (not shown) of the position that is used for determining semiconductor device contact device 30 is set in two other bight of carrier body 12a in addition.
Plenum chamber 12b is formed by the central opening portion of carrier body 12a.
Semiconductor device accommodation section 12c is set on the lower surface of plenum chamber 12b, and the semiconductor device S that is moved by selection part (not shown) is supported.
Each test jack 22 is connected with external testing is dynamo-electric, thus, and by receiving and launching the signal of telecommunication and come semiconductor test S, so that test described semiconductor device.
Semiconductor device contact device 30 is provided with operation panel 32 and a plurality of propulsion unit 34.
Each propulsion unit 34 is provided with forward block 50, piece strutting piece 60 and alignment pin 70.
Piece strutting piece 60 is provided with coupling pin 62, connects screw 64 and helical spring 66.
The connection screw 64 that passes the lateral parts of forward block 50 connects mutually with coupling pin 62, and thus, forward block 50 is supported by coupling pin 62.
Between a coupling pin 62 and forward block 50, forward block 50 can carry out resilient movement thus around the helical spring 66 of coupling pin 62.
The operation of each forward block 34 by described operating means promotes to be placed in the semiconductor device S on the semiconductor device accommodation section 12c of test panel 10 according to the pressure of operation panel 32, semiconductor device S is contacted with test jack 22 on the test body 20.
The described process that semiconductor device S in the described test chamber is tested of prior art will be described below.
The test panel 10 that is equipped with semiconductor device S at first, above is placed between test board 20 and the semiconductor device contact device 30.
Then, operation panel 32 is operated, so that the forward block 50 to each propulsion unit in a plurality of propulsion units 34 is exerted pressure, thereby make alignment pin 70 on the forward block 50 insert location hole on the carrier body 12a of test panels 10, determine the position of forward block 50 thus.
Then, make by the operation of operation panel 32 and determined that the forward block 50 of position reduces, thereby forward block 50 promotes to be placed in the semiconductor device S on the carrier module 12 of test panel 10.Therefore, semiconductor device S just is electrically connected with test jack 22.
When semiconductor device S contacted with test jack 22, test jack 22 utilized test board 20 to receive and launches the signal of telecommunication that is used for semiconductor test S, comes semiconductor test S thus.
When the test that is placed in the semiconductor device S on the test panel 10 was finished, operation panel 32 arrived its home position by the operation recovery of described operating means, has finished described test process thus.
Yet the semiconductor device contact device of the described test chamber of prior art has following shortcoming.
At first, when semiconductor device to be tested changed its type, thickness or size, the propulsion unit 34 of semiconductor device contact device 30 had to change based on the variation of semiconductor device to be tested.In other words, because all a plurality of propulsion units 34 in the operation panel 32 all will change, so the increase of changing time of a plurality of propulsion units 34 and workload is just inevitable.Because change a plurality of propulsion unit 34 events, described test process has to stop, thereby testing efficiency reduces.
Because a plurality of propulsion units 34 in the operation panel 32 all will be changed, so, need to make extraly the propulsion unit 34 that is suitable for semiconductor device to be tested, this problem with regard to causing maintenance cost to increase.
Summary of the invention
Therefore, the present invention relates to a kind of semiconductor device contact device and the Test handler that uses it, they have solved basically because one or more problems that limitation and shortcoming produced of prior art.
An advantage of the invention is, a kind of semiconductor device contact device and the Test handler that uses it are provided, when semiconductor device to be tested changes its type, thickness or size, be convenient to change semiconductor device contact device.
Other advantage of the present invention, target and characteristic ground will be illustrated in the following description, become apparent maybe and can learn by practice of the present invention when partly can those of ordinary skill in the art investigating following content.The objectives and other advantages of the present invention can be realized and obtained by the structure of being specifically noted in written explanation and claims and accompanying drawing.
In order to realize these purposes and other advantage and consistent with target of the present invention, describe particularly and briefly as this paper, a kind of semiconductor device contact device that is used for Test handler is provided, this device comprises with fixed intervals and is arranged at a plurality of propulsion units on the operation panel, each propulsion unit in described a plurality of propulsion unit is along with the operation of described operation panel, by promoting semiconductor device described semiconductor device is contacted with test jack on the test board, wherein, each propulsion unit in described a plurality of propulsion unit comprises: forward block has an insertion section; Advance head unit, removably insert in described the insertion section; And a plurality of strutting pieces, being used for supporting described forward block, described a plurality of strutting pieces are installed in the described operation panel.
Described propelling head unit is rotated a week or is less than a week, so as to insert in described the insertion section or with described insertion portion from.
Described forward block comprises: horizontal block, by described a plurality of supports support; And protuberance, extending from described horizontal block, described protuberance has described insertion section.
Described propelling head unit comprises: advance head, promote described semiconductor device; And a support portion, vertically link to each other with the described rear surface of head that advances, and removably insert in described the insertion section.
In addition, described device also comprises fixture, is used for fixing separably the support portion in described insertion section of insertion.
Described fixture comprises: steady pin, insert in the described horizontal block, and pass by described insertion section; Fixing hole, be included in the upright opening of the lower vertical ground formation of described support portion, and the lateral aperture that communicates with described upright opening of level formation, wherein, the described upright opening that is inserted with described steady pin is fixed described support portion under the guiding of described steady pin; Holddown groove is positioned at described support portion, and is simultaneously adjacent with described fixing hole; And rotation preventing device, being arranged in described protuberance, can insert in the described holddown groove simultaneously, to prevent the rotation of described support portion.
Described rotation preventing device comprises: accommodation hole, be positioned at a side of described protuberance, and described accommodation hole communicates with described insertion section; Ball partly inserts in the described holddown groove, is accommodated in simultaneously in the described accommodation hole; Elastomer is accommodated in the described accommodation hole, and described elastomer inserts described ball in the described holddown groove by elasticity; And lid, be positioned at a side of described protuberance, the described accommodation hole of described cap covers.
Described fixture comprises: a plurality of holddown grooves are arranged in described support portion; And a plurality of rotation preventing devices, being positioned on each side of described protuberance, described a plurality of rotation preventing devices insert respectively in described a plurality of holddown groove, to prevent the rotation of described support portion.
Each rotation preventing device in described a plurality of rotation preventing device comprises: accommodation hole, be positioned at a side of described protuberance, and described accommodation hole communicates with described insertion section; Ball partly inserts in the described holddown groove, is accommodated in simultaneously in the described accommodation hole; Elastomer is accommodated in the described accommodation hole, and described elastomer inserts described ball in the described holddown groove by elasticity; And lid, be positioned at a side of described protuberance, the described accommodation hole of described cap covers.
On the other hand, a kind of Test handler comprises the test chamber that is used for semiconducter device testing, and wherein, described test chamber comprises: test panel, place a plurality of semiconductor device on it; Semiconductor device contact device; And test board, have a plurality of test jacks, with test by promoting described semiconductor device contact device with contacted each semiconductor device of described test jack, wherein, the described semiconductor device contact device that is used for Test handler comprises with fixed intervals and is arranged at a plurality of propulsion units on the operation panel, each propulsion unit in described a plurality of propulsion unit is along with the operation of described operation panel, by promoting semiconductor device described semiconductor device is contacted with test jack on the test board, wherein, each propulsion unit in described a plurality of propulsion unit comprises: forward block has an insertion section; Advance head unit, removably insert in described the insertion section; And a plurality of strutting pieces, being used for supporting described forward block, described a plurality of strutting pieces are installed in the described operation panel.
Should be understood that above-mentioned general describe and following detailed is exemplary with illustrative of the present invention, aim to provide of the present invention the further specifying of stating as claim.
Description of drawings
Be used to provide further understanding of the present invention and be combined in here and the accompanying drawing that constitutes the part of the application's book shows embodiments of the invention,, be used for illustrating principle of the present invention together with describing.In the accompanying drawings,
Fig. 1 is a cutaway view, shows the test chamber of the described Test handler of prior art;
Fig. 2 is a cutaway view, shows the semiconductor device contact device among Fig. 1;
Fig. 3 is a perspective view, shows the described semiconductor device contact device that is used for Test handler of embodiments of the invention;
Fig. 4 is a cutaway view, shows according to the propulsion unit among the described Fig. 3 of the first embodiment of the present invention;
Fig. 5 is a decomposition diagram, shows the propulsion unit among Fig. 4;
Fig. 6 is a perspective view, shows the propelling head in the insertion section of insert head regularly among Fig. 3;
Fig. 7 A is a series of perspective views to Fig. 7 C, shows the method that installation of the present invention advances head;
Fig. 8 is a perspective view, shows the propulsion unit among described according to a second embodiment of the present invention Fig. 3; And
Fig. 9 is a cutaway view, shows the test chamber of the described Test handler of embodiments of the invention.
Specific embodiment
To describe the preferred embodiments of the present invention in detail below, its example is shown in the drawings.As possible, in all figure, use identical Reference numeral to indicate same or analogous part.
Hereinafter, will the Test handler that be used for the semiconductor device contact device of Test handler and use described semiconductor device contact device of the present invention be described with reference to the accompanying drawings.
Fig. 3 is a perspective view, shows the described semiconductor device contact device that is used for Test handler of embodiments of the invention.
Referring to Fig. 3, be provided with operation panel 132 and a plurality of propulsion unit 134 according to the semiconductor device contact device 130 of the described Test handler of embodiments of the invention.
Each propulsion unit in described a plurality of propulsion unit 134 under the operation of described operating means along with the pressure of operation panel 132 promotes to be placed in semiconductor device (not shown) on the test panel (not shown), thus, described semiconductor device is contacted with test jack (not shown) on the test body (not shown).
Fig. 4 is a cutaway view, shows shown in Figure 3 according to the described propulsion unit of the first embodiment of the present invention; And Fig. 5 is a perspective view, shows propulsion unit shown in Figure 4.
Referring to Fig. 4 and Fig. 5, according to the described propulsion unit 134 of the first embodiment of the present invention be provided with forward block 200, advance head unit 210, a fixture 220, a plurality of strutting pieces 230 and alignment pin 240.
Forward block 200 flexibly is provided with and is supported on movably on the operation panel 132 by piece strutting piece 230.Forward block 200 is provided with horizontal block 202 and protuberance 204.
By utilizing a fixture 220, can make to advance in the head unit 210 insert head insertion sections 206, it is separated with an insertion section 206.For this reason, advance head unit 210 to be provided with to advance 212 and a support portion 214.
As shown in Figure 6, the steady pin 300 that inserts in the horizontal block 202 passes an insertion section 206.For this reason, horizontal block 202 comprises pin insertion hole 302, and pin insertion hole 302 communicates with an insertion section 206.
As shown in Figure 6, the fixing hole 310 that is inserted into steady pin 300 is fixing with a support portion 214 under the guiding of steady pin 300, makes to advance head unit 210 to be securely fixed in the insertion section 206, and does not from the beginning deviate from the insertion section 206.For this reason, fixing hole 310 forms " L " shape, comprises upright opening 312 and lateral aperture 314, and wherein, upright opening 312 is vertically formed in the bottom of a support portion 214, and lateral aperture 314 then flatly forms, and communicates with upright opening 312.
The predetermined part of ball 333 is inserted in the holddown groove 320.
The lid 337 of a side that is arranged at the protuberance 204 of forward block 200 covers the accommodation hole 331 that is used to hold ball 333 and elastomer 335.Lid 337 by with protuberance 204 in the screw (not shown) that connects mutually of screw hole 339 be arranged on the protuberance 204.
As shown in Figure 6, rotation preventing device 330 inserts ball 333 in the holddown groove 320 that advances head unit 210 by the elasticity of utilizing elastomer 335 and prevents to advance head unit 210 to rotate.
In Fig. 4 and Fig. 5, each piece strutting piece 230 is provided with coupling pin 232, connects screw 234 and helical spring 236.
Fig. 7 A shows the method for the described propelling head unit of installation of the present invention to 7C.
To 7C the method that installation of the present invention advances head unit is described below with reference to Fig. 7 A.
At first, shown in Fig. 7 A, the upright opening 312 of the fixing hole 310 on advancing head unit 210 be set at steady pin 300 corresponding positions on the time, will advance in the head unit 210 insert head insertion sections 206, thus, inserted steady pin 300 in the upright opening 312.
Then, shown in Fig. 7 B, rotate to advance head unit 210 (circle or be less than a circle) along predetermined direction (for example, clockwise direction).At this moment, advance head unit 210 to be rotated the corresponding degree of length with the lateral aperture 314 of the fixing hole 310 that has inserted steady pin 300.Thus, steady pin 300 be located in lateral aperture 314 with upright opening 312 opposing ends, advance head unit 210 to be fixed in the insertion section 206 thus, does not from the beginning deviate from the top of insertion section 206.
Shown in Fig. 7 C, when advancing head unit 210 to rotate, the ball 333 of rotation preventing device 330 is inserted in the holddown groove 320 that advances head unit 210 by the elasticity of elastomer 335, prevents to advance head unit 210 to rotate in an insertion section 206 thus.If operating personnel firmly rotate and advance head unit 210, so, the ball 333 in the rotation preventing device 330 just separates with holddown groove 320 by the elasticity of elastomer 335, thus make propelling head unit 210 can with an insertion section 206 in separate.
To illustrate when semiconductor device to be tested changes its type, thickness or size below, make the method that advances head unit 210 to separate with forward block 200.
At first, operating personnel firmly rotate along predetermined direction (for example, counterclockwise) and are installed into the propelling head unit 210 that is securely fixed in the insertion section 206.At this moment, the ball 333 that has inserted in the holddown groove 320 that advances head unit 210 utilizes the elasticity of elastomer 335 to separate with holddown groove 320; Lateral aperture 314 along fixing hole 310 rotates propelling head unit 210.
When being arranged in the upright opening 312 of fixing hole 310 along with the rotational fixation pin 300 that advances head unit 210, operating personnel upwards mention propelling head unit 210, thereby will advance head unit 210 to separate with an insertion section 206.
Then, as mentioned above, operating personnel advance head unit 210 with in the altered propelling head unit 210 insert head insertion sections 206 so that change.
The operation of each propulsion unit 134 by described operating means promotes to be placed in semiconductor device on the described test panel according to the pressure of operation panel 132, and described semiconductor device is contacted with described test body.At this moment, if changed type, thickness or the size of described semiconductor device to be measured, need to change the propulsion unit 134 of semiconductor device contact device 130 so.Therefore, after separating from forward block 200 and removing the propelling head unit 210 of each propulsion unit 134, be installed on the forward block 200 based on the propelling head unit of altered semiconductor device to be tested.Therefore, when changing semiconductor device to be tested, because it is very convenient to change propulsion unit 134, so can save time and workload.
Fig. 8 is a perspective view, shows described according to a second embodiment of the present invention propulsion unit as shown in Figure 3.
Referring to Fig. 8, described according to a second embodiment of the present invention propulsion unit 134 is provided with forward block 200, advances head unit 210, a fixture, a plurality of strutting pieces 230 and alignment pin 240.
Except a fixture, described according to a second embodiment of the present invention propulsion unit 134 is with structurally identical according to the described propulsion unit of the first embodiment of the present invention, and therefore, except described fixture, the detailed description of other parts will be omitted.
Described fixture can be provided with a plurality of holddown grooves 620 and a plurality of rotation preventing device 630.
A plurality of holddown grooves 620 are set on the support portion 214 by fixing interval.
A plurality of rotation preventing devices 630 are set on the side of protuberance 204, and wherein, a plurality of rotation preventing devices 630 can insert respectively in a plurality of holddown grooves 620, thus, prevent a support portion 214 rotations.Except being provided with on the side of protuberance 204 a plurality of rotation preventing devices 630, the structure of described according to a second embodiment of the present invention rotation preventing device 630 is with identical according to the structure of the described rotation preventing device 330 of the first embodiment of the present invention, and therefore, it describes omission in detail.
Described fixture utilizes the elasticity of the elastomer 335 in each rotation preventing device 630 respectively ball 333 to be inserted in a plurality of holddown grooves 620, thus, will advance head unit 210 to firmly fix.This just can prevent to advance the rotation of head unit 210, and prevents to advance head unit 210 to separate with an insertion section 206 by the top of an insertion section 206.If operating personnel firmly rotate when needs are changed or pulling advances head unit 210, advance head unit 210 to separate with an insertion section 206.
Fig. 9 is a cutaway view, shows the test chamber according to the described Test handler of embodiments of the invention.
Referring to Fig. 9, be provided with test panel 110, test board 120 and semiconductor device contact device 130 according to the described test chamber of embodiments of the invention.
The semiconductor device that test panel 110 will have been fixed transmits in described Test handler.Test panel 110 is provided with a plurality of carrier modules 112, and these carrier modules are installed in the rectangular metal frame with fixed intervals, so that Semiconductor substrate is fixed to the upper, perhaps described Semiconductor substrate is taken off from it.
On test panel 110, be provided with porosely, carrier body 112a is set in each hole with fixed intervals; In addition, carrier body 112a is supported movably by elastic component 114 and supporting pin 116.At this moment, elastic component 114 is set between test panel 110 and the supporting pin 116.The supporting pin 116 that passes elastic component 114 and test panel 110 links to each other with two bights on the diagonal of carrier body 112a, thereby carrier body 112a is supported.
The location hole (not shown) of the position that is used for determining semiconductor device contact device 130 can be set in two other bight of carrier body 112a in addition.
Plenum chamber 112b is formed by the central opening portion of carrier body 112a.
Semiconductor device accommodation section 112c is set on the lower surface of plenum chamber 112b.Therefore, semiconductor device S is moved by selection part (not shown), is received then and is placed on the lower surface of plenum chamber 112b.
Each test jack 122 is connected with external testing is dynamo-electric, thus, comes semiconductor test S by the reception and the emission signal of telecommunication, thereby tests described semiconductor device.
As illustrated referring to figs. 3 to Fig. 8, semiconductor device contact device 130 is provided with operation panel 132 and a plurality of propulsion unit 134.The detailed description of semiconductor device contact device 130 description with the front is substituted.
To illustrate below according to of the present invention in described test chamber the process of semiconductor test S.
At first, the test panel 110 with carrier module 112 (being placed with semiconductor device S on it) is placed between test board 120 and the semiconductor device contact device 130.
Then, make by the operation of operation panel 132 and determined that the forward block 200 of position reduces, thereby forward block 200 promotes to be placed in the semiconductor device S on the carrier module 112 of test panel 110.Therefore, semiconductor device S just is electrically connected with test jack 122.
When semiconductor device S contacted with test jack 122, test jack 122 utilized test board 120 to receive and launches the signal of telecommunication that is used for semiconductor test S, comes semiconductor test S thus.
When the test that is placed in the semiconductor device S on the test panel 110 was finished, operation panel 132 arrived its home position by the operation recovery of described operating means.
If semiconductor device S to be tested has changed its type, thickness or size, so, the forward block 200 and the propelling head unit 210 of each propulsion unit 134 are separated; To be installed on the forward block 200 based on the suitable propelling head unit of altered semiconductor device S to be tested; Carry out aforementioned test process then.
Of the present inventionly be used for the semiconductor device contact device of Test handler and use its Test handler to have following advantage.
At first, when semiconductor device to be tested changes its type, thickness or size, can use described semiconductor device contact device at any time by the propelling head unit of changing in the described forward block.
In addition, only, change required time and workload thereby can reduce widely, thereby improved testing efficiency by easily changing described propelling head unit once enclosing or being less than a rotation of enclosing.
To corresponding semiconductor device to be tested, only change it and advance head unit, rather than change whole propulsion unit, thus, manufacturing is used for the described propelling head unit of corresponding semiconductor device to be tested in addition, thereby maintenance cost is reduced.
For those technical staff in this area, clearly, under the situation that does not depart from the spirit or scope of the present invention, can carry out various modifications and variations in the present invention.Therefore, the present invention is intended to cover described modification of the present invention and modification, as long as they fall in the scope of appended claims and equivalent thereof.
Claims (10)
1. semiconductor device contact device that is used for Test handler, comprise with fixed intervals and be arranged at a plurality of propulsion units on the operation panel, each propulsion unit in described a plurality of propulsion unit is along with the operation of described operation panel, by promoting semiconductor device described semiconductor device is contacted with test jack on the test board
Wherein, each propulsion unit in described a plurality of propulsion unit comprises:
Forward block has an insertion section;
Advance head unit, removably insert in described the insertion section; And
A plurality of strutting pieces are used for supporting described forward block, and described a plurality of strutting pieces are installed in the described operation panel.
2. device according to claim 1, wherein, described propelling head unit is rotated a week or is less than a week so that insert in described the insertion section or with described insertion portion from.
3. device according to claim 1, wherein, described forward block comprises:
Horizontal block is by described a plurality of supports support; And
Protuberance extends from described horizontal block, and described protuberance has described insertion section.
4. device according to claim 3, wherein, described propelling head unit comprises:
Advance head, promote described semiconductor device; And
Support portion vertically links to each other with the described rear surface of head that advances, and removably inserts in described the insertion section.
5. device according to claim 4 also comprises a fixture, is used for fixing separably the support portion in described insertion section of insertion.
6. device according to claim 5, wherein, described fixture comprises:
Steady pin inserts in the described horizontal block, passes by described insertion section;
Fixing hole, be included in the upright opening of the lower vertical ground formation of described support portion, and the lateral aperture that communicates with described upright opening of level formation, wherein, the described upright opening that is inserted with described steady pin is fixed described support portion under the guiding of described steady pin;
Holddown groove is positioned at described support portion, and is simultaneously adjacent with described fixing hole; And
Rotation preventing device is arranged in described protuberance, can insert in the described holddown groove simultaneously, to prevent the rotation of described support portion.
7. device according to claim 5, wherein, described rotation preventing device comprises:
Accommodation hole is positioned at a side of described protuberance, and described accommodation hole communicates with described insertion section;
Ball partly inserts in the described holddown groove, is accommodated in simultaneously in the described accommodation hole;
Elastomer is accommodated in the described accommodation hole, and described elastomer inserts described ball in the described holddown groove by elasticity; And
Lid is positioned at a side of described protuberance, the described accommodation hole of described cap covers.
8. device according to claim 5, wherein, described fixture comprises:
A plurality of holddown grooves are arranged in described support portion; And
A plurality of rotation preventing devices are positioned on each side of described protuberance, and described a plurality of rotation preventing devices insert respectively in described a plurality of holddown groove, to prevent the rotation of described support portion.
9. device according to claim 8, wherein, each rotation preventing device in described a plurality of rotation preventing devices comprises:
Accommodation hole is positioned at a side of described protuberance, and described accommodation hole communicates with described insertion section;
Ball partly inserts in the described holddown groove, is accommodated in simultaneously in the described accommodation hole;
Elastomer is accommodated in the described accommodation hole, and described elastomer inserts described ball in the described holddown groove by elasticity; And
Lid is positioned at a side of described protuberance, the described accommodation hole of described cap covers.
10. a Test handler comprises the test chamber that is used for semiconducter device testing, and wherein, described test chamber comprises:
Test panel is placed a plurality of semiconductor device on it;
With the corresponding semiconductor device contact device of any one claim in the claim 1 to 9; And
Test board has a plurality of test jacks, with test by promoting described semiconductor device contact device with contacted each semiconductor device of described test jack.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2009-0043604 | 2009-05-19 | ||
| KR1020090043604A KR101039857B1 (en) | 2009-05-19 | 2009-05-19 | Semiconduct device contacting apparatus for test handler and test handler using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101894777A true CN101894777A (en) | 2010-11-24 |
Family
ID=43103927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101766109A Pending CN101894777A (en) | 2009-05-19 | 2010-05-19 | The semiconductor device contact device of Test handler and use its Test handler |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101039857B1 (en) |
| CN (1) | CN101894777A (en) |
| TW (1) | TW201042725A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104338682B (en) * | 2013-07-26 | 2017-04-12 | 泰克元有限公司 | A push component assembly for a matching plate of a testing and sorting machine |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102836829A (en) * | 2012-09-19 | 2012-12-26 | 无锡红光微电子有限公司 | TO251/252 sorter feed zone holding block structure |
| KR101348422B1 (en) * | 2013-10-08 | 2014-01-10 | 주식회사 아이티엔티 | Pogo block device of automatic test equipment |
| KR101650520B1 (en) * | 2015-01-13 | 2016-08-23 | 주식회사 아이에스시 | Pusher apparatus for electrical test |
| KR101863559B1 (en) * | 2016-10-24 | 2018-06-01 | (주) 나노에이스 | Pusher assembly for match plate of test handler |
| KR102012745B1 (en) * | 2018-08-17 | 2019-08-21 | (주) 나노에이스 | Head replacement and displacement type pushing unit |
| KR102103339B1 (en) * | 2018-12-28 | 2020-04-22 | (주) 나노에이스 | Pushing unit of one-step detachable type |
| KR102239739B1 (en) * | 2019-04-15 | 2021-04-13 | 주식회사 아테코 | Electronic device test handler |
| KR102227346B1 (en) * | 2019-11-07 | 2021-03-12 | 주식회사 아테코 | Electronic device test handler |
| TWI744205B (en) * | 2021-03-16 | 2021-10-21 | 力成科技股份有限公司 | Universal match plate for test handler |
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- 2010-05-19 CN CN2010101766109A patent/CN101894777A/en active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20100124544A (en) | 2010-11-29 |
| TW201042725A (en) | 2010-12-01 |
| KR101039857B1 (en) | 2011-06-09 |
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