Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/2851—Testing of integrated circuits [IC]
  • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/26—Testing of individual semiconductor devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Definitions

• the present invention relates to an electronic component handling apparatus, an electronic component handling system, and an electronic component test method.
• test apparatus In the manufacturing process of electronic components such as IC devices, it is necessary to test the electronic components finally manufactured. Such testing of electronic parts may be divided into a plurality of processes, and in such a case, a test apparatus may be prepared for each test process.
• Each test equipment has a test tray for storing the IC device and using the IC device for the test.
• the IC device under test is stored in the test equipment while being stored in the customer tray. And transferred to the customer tray tester and tested.
• the Ic device for which the test has been completed is transferred to the customer tray by the test equipment, and is transferred to the test equipment for the next test process, and the same operation is performed.
• the IC device is transferred from the customer tray to the test tray to perform the test, and the IC device that has been tested is tested by the test tray customer tray. Therefore, it was difficult to improve the throughput because the test efficiency was very bad.
• the present invention has an object to provide an electronic component handling apparatus, an electronic component handling system, and an electronic component testing method capable of improving throughput in two or more test steps.
• the present invention includes a loader unit that mounts an electronic component on a test tray, and can transport the test tray to the loader unit force test unit.
• the electronic component handling apparatus is characterized in that the test tray storing the tested electronic components that have been tested in the test section can be taken out of the electronic component handling apparatus.
• An electronic component handling device is provided (Invention 1).
• the test tray storing the tested electronic components is taken out of the electronic component handling device as it is and passed to the next test electronic component handling device. Therefore, it is not necessary to transfer the tested electronic component to the customer tray in the electronic component handling apparatus, so that the throughput can be improved.
• the electronic component is also transferred to the customer tray tester tray in the subsequent electronic component handling device. Since it is not necessary, the throughput can be further improved.
• the electronic component handling apparatus includes a heat removal tank for removing the thermal stress of the tested electronic components stored in the test tray.
• the test tray in which the tested electronic component from which the thermal stress has been removed is stored can be taken out of the electronic component handling apparatus (Invention 2).
• test tray in which no electronic component is stored can be incorporated into the electronic component handling device by using the external force of the electronic component handling device.
• test tray can be automatically replenished.
• the electronic component can be mounted on a test tray taken from outside the electronic component handling device into the electronic component handling device (Invention 4).
• the external force of the electronic component handling device can be mounted on the empty test tray incorporated in the electronic component handling device. Since product testing can be performed continuously, throughput can be further improved.
• the electronic component handling apparatus includes a second loader unit capable of mounting the electronic component on a test tray (Invention 5).
• the electronic component handling device since the electronic component handling device includes the second loader unit, the speed at which the electronic component is mounted on the test tray can be increased, and the throughput can be further increased. Can be improved.
• the second loader part is also an unloader part that can be transferred to another tray while classifying the tested electronic components stored in the test tray.
• the above inventions (Inventions 1 to 6) further include an unloader unit that can transfer the tested electronic components stored in the test tray to other trays while sorting them. It is preferable that this is possible (Invention 7).
• the present invention includes an unloader unit that sorts the tested electronic components stored in the test tray, and the electronic component capable of transporting the test tray from the test unit to the unloader unit
• an electronic component handling device which is a handling device, wherein a test tray storing electronic components can be taken from outside the electronic component handling device and transported to the test unit (Invention) 8).
• the test tray in which the electronic components to be tested are preferentially stored can be taken from outside the electronic component handling apparatus.
• throughput can be improved.
• there is an electronic component handling device in front of the electronic component handling device there is no need to transfer the tested electronic components to the test tray customer tray in the previous electronic component handling device.
• throughput can be improved.
• the electronic component handling device is mounted on a test tray.
• a thermostatic chamber for applying thermal stress to the stored electronic components is provided, and a test tray in which the electronic components are stored can be taken from outside the electronic component handling apparatus and transported to the thermostatic chamber. If possible, (Invention 9).
• test tray in which the tested electronic components are sorted and emptied can be taken out from the electronic component handling device to the outside of the electronic component handling device. (Invention 10).
• test tray that has been emptied after sorting the tested electronic components can be taken out of the electronic component handling apparatus, the empty test tray can be stored. Therefore, it is possible to prevent the electronic component handling apparatus from becoming large in size without the need to provide a stocker or the like in the electronic component handling apparatus.
• the test tray taken out of the electronic component handling device can be returned to the previous electronic component handling device. In this case, the test tray in the previous electronic component handling device can be replenished. Is possible.
• the electronic component handling apparatus includes a second unloader unit that can sort the tested electronic components stored in the test tray! Preferred (Invention 11).
• the electronic component handling device since the electronic component handling device includes the second unloader unit, the speed at which the tested electronic components stored in the test tray are classified and sorted is increased. And the throughput can be further improved.
• the second unloader section is preferably also a loader section capable of mounting an electronic component on a test tray (Invention 12). Further, in the above inventions (Inventions 8 to 12), it is preferable that a loader unit capable of mounting electronic components on a test tray is further provided and can be used stand-alone (Invention 13).
• the conventional electronic component handling device used in a stand-alone manner can be used to provide the electronic component handling device.
• the present invention comprises the first electronic component handling device of the above invention (Invention 1) and the second electronic component handling device of the above invention (Invention 8), wherein the first electronic component Parts handling
• the test tray containing the tested electronic components that have been tested in the test unit of the handling device is also taken into the second electronic component handling device by taking out the force of the first electronic component handling device,
• An electronic component handling system is provided that can be transported to a test section of the second electronic component handling apparatus (Invention 14).
• the tested electronic component that has been tested by the test unit of the first electronic component handling device is stored.
• the first electronic component can be removed from the first electronic component handling device, taken into the second electronic component handling device, and transported to the test section of the second electronic component handling device. It is not necessary to transfer the tested electronic components stored in the test tray in the handling device to the test tray customer tray. Also, in the second test electronic component handling device, the electronic components are placed in the customer tray test tray. Since there is no need to transfer, throughput can be improved.
• test tray transport device is provided that can take out the test tray from the first electronic component handling device and incorporate it into the second electronic component handling device. (Invention 15).
• the test tray can be automatically transported from the first electronic component handling device to the second electronic component handling device, so that the throughput can be further improved. it can.
• the present invention comprises the first electronic component handling device of the above invention (Invention 4) and the second electronic component handling device of the above invention (Invention 10), wherein the first electronic component A test tray containing the tested electronic components that have been tested in the test section of the component handling device is also taken out from the first electronic component handling device to the second electronic component handling device.
• the test tray in which the tested electronic components are sorted and emptied in the second electronic component handling device is taken out and transported to the test section of the second electronic component handling device.
• an electronic component handling system characterized in that the handling device power can also be taken out and incorporated into the first electronic component handling device (Invention 16).
• the test of the electronic component is continuously performed while the test tray is efficiently routed between the first electronic component handling device and the second electronic component handling device. Since it can be performed, the throughput can be further improved.
• test tray is taken out from the first electronic component handling device and taken into the second electronic component handling device, and Z or the second electronic component handling device. It is preferable to provide a test tray transport device that can be taken out of the first electronic component handling device and incorporated into the first electronic component handling device (Invention 17).
• test tray can be automatically conveyed between the first electronic component handling device and the second electronic component handling device, the throughput is further improved. Can be improved.
• the present invention relates to a first electronic component handling device of the above invention (Invention 4), a second electronic component handling device of the above invention (Invention 10), and the first electronic component handling. And one or more other electronic component handling devices provided between the device and the second electronic component handling device, and a test conducted at a test unit of the first electronic component handling device
• the test tray that houses the used electronic components is taken out and taken out from the first electronic component handling device, and is then transferred to the other electronic component handling device and transported to the test section of the other electronic component handling device.
• the test tray containing the tested electronic components that have been tested in the test section of the other electronic component handling device is taken out of the other electronic component handling device.
• test tray can be taken out from the second electronic component handling device and taken into the first electronic component handling device (Invention 18).
• test tray containing the electronic components is transported between the electronic component handling devices. be able to.
• Each electronic component handling device uses a test that is stored in a test tray. It is possible to improve the throughput because there is no need to transfer the tested electronic components to the test tray or customer tray or from the customer tray to the test tray.
• the present invention comprises the first electronic component handling device of the above invention (Invention 7) and the second electronic component handling device of the above invention (Invention 13), wherein the first electronic component In the component handling apparatus, the unloader unit is used as the second loader unit, and a test tray that stores the tested electronic components that have been tested in the test unit of the first electronic component handling apparatus.
• the first electronic component handling device force is also taken out and taken into the second electronic component handling device, and is transported to the test unit of the second electronic component handling device.
• an electronic component handling system characterized by using a loader portion as a second unloader portion (Invention 19).
• the conventional electronic component handling device used in a stand-alone manner can be diverted to the first electronic component handling device and the second electronic component handling device.
• the first electronic component handling device and the second electronic component handling device include at least the second electronic component handling device. It is preferable that information on test results in the apparatus can be acquired (Invention 20).
• the tested electronic in the second electronic component handling device Since parts can be sorted, throughput can be improved without having to sort each test.
• the present invention uses the first electronic component handling apparatus to mount an electronic component on a test tray, and to perform a first test on the electronic component mounted on the test tray.
• the test tray that houses the electronic component that has undergone the first test is taken out of the first electronic component handling device force and incorporated into the second electronic component handling device.
• the electronic part where the first test was conducted using an electronic component handling device A second test is performed on the product, and an electronic component test method is provided, wherein the electronic component subjected to the second test is sorted from a test tray (Invention 21).
• the test tray in which the tested electronic components are sorted and emptied in the second electronic component handling device is used as the second electronic component handling device force. It is preferable to take it out and put it into the first electronic component handling apparatus (Invention 22).
• the test tray is efficiently routed between the first electronic component handling device and the second electronic component handling device. Since the testing of electronic components can be performed continuously, the throughput can be further improved.
• the present invention uses the first electronic component handling apparatus to mount an electronic component on a test tray, and to perform a first test on the electronic component mounted on the test tray.
• the test tray that houses the electronic component that has undergone the first test is taken out of the first electronic component handling device force and incorporated into the second electronic component handling device.
• the second test is performed on the electronic component on which the first test is performed, and the process is repeated once or more, and the n ⁇ l (n is an integer of 3 or more)
• the test tray storing the electronic components that have been tested is taken out of the n-1st electronic component handling device and is loaded into the nth electronic component handling device, and the nth electronic component handling device is removed.
• the n-1 th Electronic components Nitsu the test is performed, Te using the electronic device handling apparatus of the n-th row ,, the first n the test
• the electronic component test method is characterized in that the electronic component subjected to the nth test is also sorted by a test tray (Invention 24).
• test tray containing the electronic components is transported between the electronic component handling devices. be able to.
• Each electronic component handling device improves throughput by eliminating the need to transfer the tested electronic components stored in the test tray to the test tray or customer tray or from the customer tray to the test tray Can be
• the test tray in which electronic components that have been tested in the nth electronic component handling device are sorted and emptied is used as the power of the nth electronic component handling device. It is preferable to take it out and incorporate it into the first electronic component handling apparatus (Invention 25).
• the electronic component before the test is mounted on the empty test tray incorporated in the first electronic component handling apparatus (Invention 26).
• the test tray has a first electronic component handling device force between the nth electronic component handling device and the nth Since the electronic component handling device power can be efficiently operated between the first electronic component handling devices and the electronic component test can be continuously performed, the throughput can be further improved.
• a loader unit that mounts electronic components on a test tray and an unloadable unit that can be transferred to another tray while classifying the tested electronic components stored in the test tray.
• the unloader unit is used as a second loader unit, electronic components are mounted on a test tray, a first test is performed on the electronic components mounted on the test tray !, and the first test is performed.
• the test tray storing the electronic components that have been taken out is taken out of the first electronic component handling device, and the second power supply is removed.
• a second test is performed on the electronic component subjected to the first test in the second electronic component handling apparatus, the unloader unit is used, and the loader unit is used as the second electronic component.
• the electronic component test method is characterized in that the electronic component subjected to the second test is used as an unloader section of the printer to sort the test tray (Invention 27).
• the conventional electronic component handling device used in a stand-alone manner can be used for the first electronic component handling device and the second electronic component handling device.
• throughput can be improved in two or more test steps.
• FIG. 1 is a schematic configuration diagram of an electronic component handling system according to an embodiment of the present invention.
• FIG. 2 is a schematic configuration diagram of an electronic component handling system according to another embodiment of the present invention.
• Second handler (second electronic component handling device)
• FIG. 1 is a schematic configuration diagram of an electronic component handling system (hereinafter referred to as a “nodal system”) according to an embodiment of the present invention.
• the handler system includes a first IC device test apparatus 1 and a second IC device test apparatus 2.
• the first IC device test apparatus 1 includes a first handler 10, a first test main apparatus 11, and a test head (not shown).
• the second IC device test apparatus 2 includes a second handler 20, a second test main apparatus 21, and a test head (not shown).
• the test head is provided below the handlers 10 and 20, and the test head is provided with a plurality of sockets that are electrically connected to the test main devices 11 and 21 through the cable 7. .
• the IC device 5 (an example of an electronic component) is mounted on the socket and is tested by a test electrical signal from the test main apparatuses 11 and 21.
• the handlers 10 and 20 execute the operation of sequentially transporting the IC devices 5 to the socket.
• the handlers 10 and 20 in the present embodiment are a soak chamber 101 as a thermostatic chamber that applies a target high-temperature or low-temperature thermal stress to the IC device 5, and a test for testing the IC device 5 at a predetermined temperature.
• a chamber 102, an idid chamber 103 as a heat removal tank for removing thermal stress from the IC device 5, and a chamber 100 configured by force are provided.
• the upper part of the test head is inserted into the test chamber 102, where the IC device 5 is tested!
• the first test (high temperature) is performed in the test chamber 102 of the first handler 10.
• Test (or low temperature test)
• a second test (high temperature test (or low temperature test)) is performed in the test chamber 102 of the second handler 20.
• the first handler 10 transfers the device storage unit 200 for storing the customer tray KST storing the IC device 5 before the test, the IC device 5 from the customer tray KST to the test tray TST, and the IC
• the first loader unit 301 (corresponding to the first loader unit of the present invention) that sends the test tray TST containing the device 5 to the soak chamber 101 and the IC device 5 are transferred from the customer tray KST to the test tray TST.
• a test tray TST containing the IC device 5 is transferred to the first loader unit 301, a second loader unit 302 (corresponding to the second order unit of the present invention), and the IC device 5 is connected to the customer tray KST.
• a third loader section 302 (corresponding to the second loader section of the present invention) for transferring the test tray TST containing the IC device 5 to the second loader section 302. ing.
• the first handler 10 is a diversion of a conventional handler that has been used in a stand-alone manner, and the second loader unit 302 and the third loader unit 303 are stand-alone.
• the IC device 5 functions as an unloader part that sorts the tested IC devices 5 and replaces them on the test tray TST force customer mat KST.
• the second handler 20 categorizes and sorts according to the test results.
• the device storage unit 200 stores the customer tray KST storing the sorted IC devices 5, and the test tray TST storing the IC devices 5 is loaded.
• the first unloader unit 401 (corresponding to the first unloader unit of the present invention) for taking in the IC chamber 5 and transferring the IC device 5 from the test tray TST to the customer tray KST, and the test tray TST containing the IC device 5 Is loaded from the first unloader unit 401, the IC device 5 is transferred from the test tray TST to the customer tray KST, the second unloader unit 402 (corresponding to the first unloader unit of the present invention), and the IC device 5
• the stored test tray TST is taken from the second unloader unit 402, and the IC device 5 is transferred from the test tray TST to the customer tray KST.
• a (corresponding to the second unloader part of the present invention) a third unloader section 403 that.
• the second handler 20 is a diversion of a conventional handler that was used in a stand-alone manner
• the third unloader unit 403 is a pre-test IC device when the handler is in a stand-alone state.
• Loader section for transferring 5 from customer tray KST to test tray TST It functions as.
• the device storage unit 200 includes an apparatus that moves the customer tray KST between the device storage unit 200 and the loader units 301, 302, 303 or the unloader units 401, 402, 403, for example, a vertical A conveying device or the like is provided.
• a tray horizontal transport device capable of transporting the test tray TST in the horizontal direction, and There is a device transporter that can pick up and transport the IC device 5.
• the tray horizontal conveyance device can be configured by, for example, a rotating roller.
• the device transport device is configured by, for example, a movable arm that can reciprocate between the test tray TST and the customer tray KST, and a suction head that is supported by the movable arm and can move along the movable arm. be able to.
• a precursor may be provided between the test tray TST and the customer tray KST to make the mutual position of the IC device 5 accurate.
• the IC device 5 sucked from the customer tray KST is placed on the preciseer, again picked up from the preciseer, and placed on the test tray TST and stored.
• test tray TST discharged from the exit chamber 103 of the first handler 10 is input to the entrance of the soak chamber 101 of the second handler 20.
• a second inter-handler transfer device 602 is provided.
• the first inter-handler transport device 601 and the second inter-handler transport device 602 can be configured by, for example, a rotating roller, a belt conveyor, an automatic guided vehicle (AGV), or the like.
• the first inter-handler transport device 601 and the second inter-handler transport device 602 are forces capable of automatically transporting the test tray TST.
• the present invention is not limited to this, and the manual Let's transport the test tray TST by.
• the first handler 10 and the second handler 20 are able to communicate test results with each other.
• the force S is applied to the unloaders 401, 402, 403 of the second nodler 20! / Based on the test result in the first handler 10 and the test result in the second handler 20, the tested IC devices 5 can be classified and sorted.
• the customer tray KST storing the IC device 5 before the test is transferred from the device storage unit 200 to the first loader unit 301, the second loader unit 302, and the third loader unit 303.
• the IC device 5 before the test stored in the customer tray KST installed in the first loader section 301 is transferred to the customer tray KST force test tray TST by the device transport device, and the IC device 5 before the test is loaded.
• the test tray TST equipped with is fed into the soak chamber 101 by the tray horizontal transfer device.
• the IC device 5 before the test that is stored in the customer tray KST installed in the second loader section 302 is transferred from the customer tray KST to the test tray TST by the device transport device, and the test is performed.
• the test tray TST loaded with the previous IC device 5 is sent to the soak chamber 101 via the first loader unit 301 by the tray horizontal transfer device.
• the IC device 5 before the test stored in the customer tray KST installed in the third loader section 303 is transferred from the customer tray KST to the test tray TST by the device transport device, and the pre-test IC device 5 is loaded.
• the test tray TST loaded with the IC device 5 is sent to the soak chamber 101 via the second loader unit 302 and the first loader unit 301 by the tray horizontal transfer device.
• the IC device 5 housed in the test tray TST sent to the soak chamber 101 is subjected to high or low temperature heat stress in the soak chamber 101, and then transferred to the test chamber 102, where the test head It is attached to the socket and used for the first test by the electrical test signal from the test main unit 11.
• Information on the test result of the first test is transmitted from the first handler 10 to the second handler 20.
• the IC device 5 for which the first test has been completed is transferred to the jig chamber 103 while being stored in the test tray TST, where thermal stress is removed. After that, the test tray TST containing the IC device 5 for which the first test has been completed is discharged from the Ididit chamber 103. Then, it is transferred to the inlet of the soak chamber 101 of the second handler 20 by the first inter-handler transfer device 601 and sent into the soak chamber 101.
• the IC device 5 accommodated in the test tray TST sent to the soak chamber 101 of the second handler 20 is transferred to the test chamber 102 after being subjected to low or high temperature thermal stress in the soak chamber 101. Then, it is mounted on the socket of the test head and is subjected to the second test by the electrical test signal from the test main unit 21.
• the IC device 5 for which the second test has been completed is transferred to the jig chamber 103 while being stored in the test tray TST, where thermal stress is removed. Thereafter, the test tray TST in which the IC device 5 for which the second test has been completed is stored is ejected from the idle chamber 103, and the first unloader unit 401 and the first unloader unit 401 are connected by the tray horizontal transfer device. Via the second unloader unit 402 via the first unloader unit 401 and the second unloader unit 402 via the second unloader unit 402.
• the tested IC device 5 housed in the test tray TST taken in the first unloader unit 401, the second unloader unit 402, and the third unloader unit 403 is a test of the first test. Based on the result and the test result of the second test, it is transferred to multiple customer trays KST by the device transport device while being classified.
• the customer tray KST containing the tested IC device 5 is stored in the device storage unit 200.
• test tray TST emptied in the first unloader unit 401 is transported to the third unloader unit 403 via the second unloader unit 402, and emptied in the second unloader unit 402.
• the test tray TST that has been transferred is conveyed to the third unloader unit 403.
• the empty test tray TST transported to the third unloader unit 403 and the test tray TST emptied in the third unloader unit 403 are transferred to the first handler 10 by the second inter-handler transport device 602. To the third loader section 303.
• the empty test tray TST conveyed to the third loader unit 303 of the first handler 10 includes the one in which the IC device before the test is mounted in the third loader unit 303, and the second loader unit
• the first loader unit 302 is mounted with the IC device before the test in the second loader unit 302, and the first loader unit 301 is transported to the first loader unit 301 via the second loader unit 302. Part 301 is divided into those where IC devices before testing are mounted.
• the test tray TST storing the IC device 5 in which the first test has been completed is used as it is.
• the first handler 10 in the present embodiment includes the first loader unit 301, the second loader unit 302, and the third loader unit 303, the force of the first loader unit 301 is reduced. Compared with a conventional handler that is not equipped, the speed of mounting the IC device 5 on the test tray TST can be increased, and the test throughput of the IC device 5 can be improved.
• the second handler 20 in the present embodiment includes the first unloader unit 401, the second unloader unit 402, and the third unloader unit 403, the first unloader unit 401 Compared to conventional handlers, the speed at which IC device 5 is sorted into the customer tray KST can be increased, and the throughput of IC device 5 testing is improved. Can be made.
• the test tray TST that has become empty in the second handler 20 is returned to the loader units 301, 302, and 303 of the first handler 10. Therefore, it is possible to prevent the second handler 20 from becoming large because it is not necessary to provide a stocker or the like for storing the empty test tray TST in the second handler 20.
• the empty test tray TST in the first handler 10 can be automatically replenished. That is, since the test of the IC device 5 can be performed continuously while the test tray TST is efficiently routed between the first handler 10 and the second handler 20, throughput is reduced. Further improvement can be achieved.
• the handler system according to the above-described embodiment may perform a test process with a force of 3 or more, which is a process for performing two test processes of the first test and the second test.
• Figure 2 shows an example of performing three test steps.
• a third IC device test apparatus 3 is provided between the first IC device test apparatus 1 and the second IC device test apparatus 2 in the above embodiment.
• the first test is performed with the first IC device test apparatus 1
• the second test is performed with the third IC device test apparatus 3
• the third test is performed with the second IC device test apparatus 2. .
• the third IC device test apparatus 3 has a third handler 30, a third test main apparatus 31, and a test head (not shown).
• the third handler 30 may be the same as the first handler 10 or the second handler 20, that is, a diversion of a conventional handler that has been used stand-alone.
• the portion corresponding to the first loader unit 301 or the third unloader unit 403 (third region 503) only needs to have a tray horizontal transport device that transports the test tray TST in the horizontal direction.
• a first inter-handler transport device 601 and a second inter-handler transport device 602 are provided.
• the test tray TST storing the IC device 5 for which the first test has been completed is ejected from the idid chamber 103, and the third inter-handler transfer device 601 performs the third test. It is transferred to the inlet of the soak chamber 101 of the handler 30 and fed into the soak chamber 101.
• the IC device 5 housed in the test tray TST sent to the soak chamber 101 of the third handler 30 is transferred to the test chamber 102 after being subjected to a low or high temperature thermal stress in the soak chamber 101. Then, it is mounted on the socket of the test head and is subjected to the second test by the electrical test signal from the test main unit 31.
• the IC device 5 for which the second test has been completed is transported to the jig chamber 103 while being stored in the test tray TST, where thermal stress is removed. Then the second test
• the test tray TST containing the finished IC device 5 is ejected from the ididit chamber 103 and is transported to the inlet of the soak chamber 101 of the second handler 20 by the first inter-handler transport device 601 and then the test chamber. 102 for the third test.
• the test result information of the first test is transmitted from the first handler 10 to the second handler 20, and the test result information of the second test is transmitted from the third handler 30 to the second handler 20. Sent to handler 20. Then, the IC device 5 on which the first to third tests have been performed has the test results of the first test and the test results of the second test in the unloader sections 401, 402, and 403 of the second handler 20. And classification and sorting based on the test results of the third test.
• the test tray TST emptied in the second handler 20 is transported from the third unloader section 403 to the first area 501 of the third handler 30 by the second inter-handler transport device 602.
• the empty test tray TST conveyed to the first area 501 of the third handler 30 is sequentially conveyed to the second area 502 and the third area 503 by the tray horizontal conveying device.
• the empty test tray TST conveyed to the third area 503 is conveyed to the third loader unit 303 of the first handler 10 by the second inter-handler conveying device 602.
• the first to nth tests (n is an integer of 3 or more) can be efficiently performed with high throughput.
• the electronic component handling apparatus, electronic component handling system, and electronic component testing method of the present invention are extremely useful when two or more test steps are continuously performed.

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Citations (4)

• 2006
  • 2006-11-30 WO PCT/JP2006/323924 patent/WO2008068798A1/ja not_active Ceased
  • 2006-11-30 KR KR1020097009784A patent/KR101157414B1/ko active Active
• 2007
  • 2007-11-07 TW TW096141992A patent/TW200839264A/zh not_active IP Right Cessation

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