KR101114896B1 - 교차하는 도체 어셈블리를 갖는 반도체 패키지 및 제조방법 - Google Patents

교차하는 도체 어셈블리를 갖는 반도체 패키지 및 제조방법 Download PDF

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Publication number
KR101114896B1
KR101114896B1 KR1020067017117A KR20067017117A KR101114896B1 KR 101114896 B1 KR101114896 B1 KR 101114896B1 KR 1020067017117 A KR1020067017117 A KR 1020067017117A KR 20067017117 A KR20067017117 A KR 20067017117A KR 101114896 B1 KR101114896 B1 KR 101114896B1
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South Korea
Prior art keywords
trace
coupling
wiring
substrate
wires
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Expired - Fee Related
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KR1020067017117A
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English (en)
Korean (ko)
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KR20060126792A (ko
Inventor
야핑 쥬
추-종 리
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프리스케일 세미컨덕터, 인크.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020067017117A 2004-02-26 2006-08-25 교차하는 도체 어셈블리를 갖는 반도체 패키지 및 제조방법 Expired - Fee Related KR101114896B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/787,288 US6992377B2 (en) 2004-02-26 2004-02-26 Semiconductor package with crossing conductor assembly and method of manufacture
US10/787,288 2004-02-26
PCT/US2005/002132 WO2005091760A2 (en) 2004-02-26 2005-01-21 Semiconductor package with crossing conductor assembly and method of manufacture

Publications (2)

Publication Number Publication Date
KR20060126792A KR20060126792A (ko) 2006-12-08
KR101114896B1 true KR101114896B1 (ko) 2012-03-06

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Application Number Title Priority Date Filing Date
KR1020067017117A Expired - Fee Related KR101114896B1 (ko) 2004-02-26 2006-08-25 교차하는 도체 어셈블리를 갖는 반도체 패키지 및 제조방법

Country Status (6)

Country Link
US (3) US6992377B2 (https=)
EP (1) EP1719176A4 (https=)
JP (1) JP5604031B2 (https=)
KR (1) KR101114896B1 (https=)
CN (1) CN100461398C (https=)
WO (1) WO2005091760A2 (https=)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060026850A1 (en) * 2004-08-05 2006-02-09 Yazaki North America, Inc. Compass system for a motor vehicle
EP1746648A3 (en) * 2005-07-22 2008-09-03 Marvell World Trade Ltd. Packaging for high speed integrated circuits
US20070018292A1 (en) * 2005-07-22 2007-01-25 Sehat Sutardja Packaging for high speed integrated circuits
US7652364B2 (en) * 2005-12-21 2010-01-26 Teradata Us, Inc. Crossing conductive traces in a PCB
US20070215989A1 (en) * 2006-03-16 2007-09-20 Promos Technologies Inc. Semiconductor chip assembly
US7719112B2 (en) * 2006-08-07 2010-05-18 University Of Central Florida Research Foundation, Inc. On-chip magnetic components
CN101192588A (zh) * 2006-11-17 2008-06-04 飞思卡尔半导体公司 引线接合及其形成方法
JP2008218776A (ja) * 2007-03-06 2008-09-18 Renesas Technology Corp 半導体装置
JP2008270559A (ja) * 2007-04-20 2008-11-06 Sumitomo Electric Ind Ltd 光通信モジュール
EP2630966B1 (en) * 2007-10-12 2017-04-19 Massachusetts Institute of Technology Vaccine nanotechnology
US20090189059A1 (en) * 2008-01-29 2009-07-30 Smith Darrell I Systems and methods for cross-over bond-wires for tia input
JP5255929B2 (ja) * 2008-07-04 2013-08-07 ルネサスエレクトロニクス株式会社 半導体装置
TWI382510B (zh) * 2008-09-15 2013-01-11 力成科技股份有限公司 使用獨立內引腳之半導體封裝構造
US8049339B2 (en) * 2008-11-24 2011-11-01 Powertech Technology Inc. Semiconductor package having isolated inner lead
WO2010073832A1 (ja) * 2008-12-26 2010-07-01 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体パッケージ
US8145061B2 (en) 2009-01-13 2012-03-27 Sumitomo Electric Industries, Ltd. Optical module implementing a light-receiving device and a light-transmitting device within a common housing
US9288893B2 (en) * 2009-02-11 2016-03-15 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US7872325B2 (en) * 2009-02-24 2011-01-18 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Reduced-crosstalk wirebonding in an optical communication system
CN102412167B (zh) * 2010-09-25 2016-02-03 飞思卡尔半导体公司 用于线接合的固定
US8867592B2 (en) 2012-05-09 2014-10-21 Nxp B.V. Capacitive isolated voltage domains
US9007141B2 (en) 2012-05-23 2015-04-14 Nxp B.V. Interface for communication between voltage domains
JP6133024B2 (ja) * 2012-08-08 2017-05-24 古河電気工業株式会社 光モジュール
US8680690B1 (en) 2012-12-07 2014-03-25 Nxp B.V. Bond wire arrangement for efficient signal transmission
FR3002814B1 (fr) * 2013-03-01 2016-06-24 Thales Sa Dispositif d'interconnexion pour circuits electroniques par fils paralleles couples, et procede et outillage y relatifs
US9467060B2 (en) 2013-04-03 2016-10-11 Nxp B.V. Capacitive level shifter devices, methods and systems
US8896377B1 (en) 2013-05-29 2014-11-25 Nxp B.V. Apparatus for common mode suppression
US9722571B2 (en) 2013-05-30 2017-08-01 Mediatek, Inc. Radio frequency transmitter, power combiners and terminations therefor
JP6277550B2 (ja) * 2014-04-07 2018-02-14 パナソニックＩｐマネジメント株式会社 電流計測器、分電盤用電流計測器、分電盤、電流計測器の製造方法
US9729242B2 (en) 2015-01-23 2017-08-08 Furukawa Electric Co., Ltd. Optical module for reducing crosstalk
US10103627B2 (en) * 2015-02-26 2018-10-16 Altera Corporation Packaged integrated circuit including a switch-mode regulator and method of forming the same
ITTO20150231A1 (it) 2015-04-24 2016-10-24 St Microelectronics Srl Procedimento per produrre lead frame per componenti elettronici, componente e prodotto informatico corrispondenti
JP7038489B2 (ja) * 2016-06-20 2022-03-18 日本ルメンタム株式会社 光受信モジュール及び光モジュール
US10135545B2 (en) * 2016-06-20 2018-11-20 Oclaro Japan, Inc. Optical receiver module and optical module
JP7051409B2 (ja) * 2017-12-07 2022-04-11 日本ルメンタム株式会社 光送信モジュール及び光モジュール
WO2019167104A1 (ja) * 2018-02-27 2019-09-06 三菱電機株式会社 半導体装置
JP2019169504A (ja) * 2018-03-22 2019-10-03 日本電信電話株式会社 ワイヤボンディング構造
CN113224025B (zh) * 2020-01-21 2025-03-11 瑞昱半导体股份有限公司 半导体组件
CN115085706B (zh) 2021-03-11 2025-04-11 台达电子企业管理（上海）有限公司 开关模块

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141463A (ja) 2000-10-31 2002-05-17 Mitsubishi Electric Corp 半導体モジュール
JP2003023135A (ja) 2001-07-06 2003-01-24 Sharp Corp 半導体集積回路装置
WO2004012266A1 (en) 2002-07-31 2004-02-05 Intel Corporation Electronic package substrate with back side, cavity mounted capacitors and method of fabrication therefor

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63187639A (ja) 1987-01-30 1988-08-03 Hitachi Ltd 半導体装置
US5004317A (en) * 1990-01-03 1991-04-02 International Business Machines Corp. Wire bond connection system with cancellation of mutual coupling
JPH05226398A (ja) * 1992-02-17 1993-09-03 Nippon Steel Corp 集積回路モジュール
JPH065647A (ja) * 1992-06-24 1994-01-14 Nec Kyushu Ltd 半導体装置
US5352326A (en) * 1993-05-28 1994-10-04 International Business Machines Corporation Process for manufacturing metalized ceramic substrates
JPH06342858A (ja) 1993-06-02 1994-12-13 Sumitomo Electric Ind Ltd ハイブリッド集積回路
JP3462921B2 (ja) * 1995-02-14 2003-11-05 三菱電機株式会社 半導体装置
WO1998026452A1 (en) 1996-12-09 1998-06-18 Microbonds, Inc. High density integrated circuits and the method of packaging the same
JP3638750B2 (ja) * 1997-03-25 2005-04-13 株式会社ルネサステクノロジ 半導体装置
KR100265461B1 (ko) * 1997-11-21 2000-09-15 윤종용 더미본딩와이어를포함하는반도체집적회로소자
US6169331B1 (en) * 1998-08-28 2001-01-02 Micron Technology, Inc. Apparatus for electrically coupling bond pads of a microelectronic device
US6177726B1 (en) * 1999-02-11 2001-01-23 Philips Electronics North America Corporation SiO2 wire bond insulation in semiconductor assemblies
JP2001148458A (ja) * 1999-11-22 2001-05-29 Mitsubishi Electric Corp パワー半導体モジュール
JP2001319992A (ja) * 2000-02-28 2001-11-16 Shinko Electric Ind Co Ltd 配線基板、半導体装置及びそれらの製造方法
JP3831593B2 (ja) * 2000-09-21 2006-10-11 三洋電機株式会社 マルチチップモジュール
US6894398B2 (en) * 2001-03-30 2005-05-17 Intel Corporation Insulated bond wire assembly for integrated circuits
JP2003068780A (ja) * 2001-08-30 2003-03-07 Matsushita Electric Ind Co Ltd 半導体装置
US7157790B2 (en) * 2002-07-31 2007-01-02 Microchip Technology Inc. Single die stitch bonding

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141463A (ja) 2000-10-31 2002-05-17 Mitsubishi Electric Corp 半導体モジュール
JP2003023135A (ja) 2001-07-06 2003-01-24 Sharp Corp 半導体集積回路装置
WO2004012266A1 (en) 2002-07-31 2004-02-05 Intel Corporation Electronic package substrate with back side, cavity mounted capacitors and method of fabrication therefor

Also Published As

Publication number Publication date
CN100461398C (zh) 2009-02-11
JP5604031B2 (ja) 2014-10-08
CN1926683A (zh) 2007-03-07
KR20060126792A (ko) 2006-12-08
EP1719176A4 (en) 2008-07-23
US20050189643A1 (en) 2005-09-01
US20060163716A1 (en) 2006-07-27
US20060065966A1 (en) 2006-03-30
US7256488B2 (en) 2007-08-14
US7049694B2 (en) 2006-05-23
JP2007525842A (ja) 2007-09-06
WO2005091760A2 (en) 2005-10-06
EP1719176A2 (en) 2006-11-08
WO2005091760A3 (en) 2006-01-05
US6992377B2 (en) 2006-01-31

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