JP5604031B2 - 交差導電体アセンブリを備えた半導体パッケージ - Google Patents

交差導電体アセンブリを備えた半導体パッケージ Download PDF

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Publication number
JP5604031B2
JP5604031B2 JP2007500763A JP2007500763A JP5604031B2 JP 5604031 B2 JP5604031 B2 JP 5604031B2 JP 2007500763 A JP2007500763 A JP 2007500763A JP 2007500763 A JP2007500763 A JP 2007500763A JP 5604031 B2 JP5604031 B2 JP 5604031B2
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Japan
Prior art keywords
trace
wire
bond
substrate
conductive
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Expired - Fee Related
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JP2007500763A
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English (en)
Japanese (ja)
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JP2007525842A5 (https=
JP2007525842A (ja
Inventor
ジョウ、ヤピン
リー、チュ−チャン
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NXP USA Inc
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NXP USA Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2007500763A 2004-02-26 2005-01-21 交差導電体アセンブリを備えた半導体パッケージ Expired - Fee Related JP5604031B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/787,288 US6992377B2 (en) 2004-02-26 2004-02-26 Semiconductor package with crossing conductor assembly and method of manufacture
US10/787,288 2004-02-26
PCT/US2005/002132 WO2005091760A2 (en) 2004-02-26 2005-01-21 Semiconductor package with crossing conductor assembly and method of manufacture

Publications (3)

Publication Number Publication Date
JP2007525842A JP2007525842A (ja) 2007-09-06
JP2007525842A5 JP2007525842A5 (https=) 2007-12-13
JP5604031B2 true JP5604031B2 (ja) 2014-10-08

Family

ID=34886742

Family Applications (1)

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JP2007500763A Expired - Fee Related JP5604031B2 (ja) 2004-02-26 2005-01-21 交差導電体アセンブリを備えた半導体パッケージ

Country Status (6)

Country Link
US (3) US6992377B2 (https=)
EP (1) EP1719176A4 (https=)
JP (1) JP5604031B2 (https=)
KR (1) KR101114896B1 (https=)
CN (1) CN100461398C (https=)
WO (1) WO2005091760A2 (https=)

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US20070018292A1 (en) * 2005-07-22 2007-01-25 Sehat Sutardja Packaging for high speed integrated circuits
US7652364B2 (en) * 2005-12-21 2010-01-26 Teradata Us, Inc. Crossing conductive traces in a PCB
US20070215989A1 (en) * 2006-03-16 2007-09-20 Promos Technologies Inc. Semiconductor chip assembly
US7719112B2 (en) * 2006-08-07 2010-05-18 University Of Central Florida Research Foundation, Inc. On-chip magnetic components
CN101192588A (zh) * 2006-11-17 2008-06-04 飞思卡尔半导体公司 引线接合及其形成方法
JP2008218776A (ja) * 2007-03-06 2008-09-18 Renesas Technology Corp 半導体装置
JP2008270559A (ja) * 2007-04-20 2008-11-06 Sumitomo Electric Ind Ltd 光通信モジュール
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US20090189059A1 (en) * 2008-01-29 2009-07-30 Smith Darrell I Systems and methods for cross-over bond-wires for tia input
JP5255929B2 (ja) * 2008-07-04 2013-08-07 ルネサスエレクトロニクス株式会社 半導体装置
TWI382510B (zh) * 2008-09-15 2013-01-11 力成科技股份有限公司 使用獨立內引腳之半導體封裝構造
US8049339B2 (en) * 2008-11-24 2011-11-01 Powertech Technology Inc. Semiconductor package having isolated inner lead
WO2010073832A1 (ja) * 2008-12-26 2010-07-01 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体パッケージ
US8145061B2 (en) 2009-01-13 2012-03-27 Sumitomo Electric Industries, Ltd. Optical module implementing a light-receiving device and a light-transmitting device within a common housing
US9288893B2 (en) * 2009-02-11 2016-03-15 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US7872325B2 (en) * 2009-02-24 2011-01-18 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Reduced-crosstalk wirebonding in an optical communication system
CN102412167B (zh) * 2010-09-25 2016-02-03 飞思卡尔半导体公司 用于线接合的固定
US8867592B2 (en) 2012-05-09 2014-10-21 Nxp B.V. Capacitive isolated voltage domains
US9007141B2 (en) 2012-05-23 2015-04-14 Nxp B.V. Interface for communication between voltage domains
JP6133024B2 (ja) * 2012-08-08 2017-05-24 古河電気工業株式会社 光モジュール
US8680690B1 (en) 2012-12-07 2014-03-25 Nxp B.V. Bond wire arrangement for efficient signal transmission
FR3002814B1 (fr) * 2013-03-01 2016-06-24 Thales Sa Dispositif d'interconnexion pour circuits electroniques par fils paralleles couples, et procede et outillage y relatifs
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Also Published As

Publication number Publication date
CN100461398C (zh) 2009-02-11
CN1926683A (zh) 2007-03-07
KR101114896B1 (ko) 2012-03-06
KR20060126792A (ko) 2006-12-08
EP1719176A4 (en) 2008-07-23
US20050189643A1 (en) 2005-09-01
US20060163716A1 (en) 2006-07-27
US20060065966A1 (en) 2006-03-30
US7256488B2 (en) 2007-08-14
US7049694B2 (en) 2006-05-23
JP2007525842A (ja) 2007-09-06
WO2005091760A2 (en) 2005-10-06
EP1719176A2 (en) 2006-11-08
WO2005091760A3 (en) 2006-01-05
US6992377B2 (en) 2006-01-31

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