CN100461398C - 具有交叉导体装配件的半导体封装件及制造方法 - Google Patents

具有交叉导体装配件的半导体封装件及制造方法 Download PDF

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Publication number
CN100461398C
CN100461398C CNB200580006124XA CN200580006124A CN100461398C CN 100461398 C CN100461398 C CN 100461398C CN B200580006124X A CNB200580006124X A CN B200580006124XA CN 200580006124 A CN200580006124 A CN 200580006124A CN 100461398 C CN100461398 C CN 100461398C
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CN
China
Prior art keywords
substrate trace
wire
trace
substrate
bond
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Expired - Fee Related
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CNB200580006124XA
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English (en)
Chinese (zh)
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CN1926683A (zh
Inventor
周亚平
李曙钟
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NXP USA Inc
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Freescale Semiconductor Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
CNB200580006124XA 2004-02-26 2005-01-21 具有交叉导体装配件的半导体封装件及制造方法 Expired - Fee Related CN100461398C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/787,288 US6992377B2 (en) 2004-02-26 2004-02-26 Semiconductor package with crossing conductor assembly and method of manufacture
US10/787,288 2004-02-26

Publications (2)

Publication Number Publication Date
CN1926683A CN1926683A (zh) 2007-03-07
CN100461398C true CN100461398C (zh) 2009-02-11

Family

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Family Applications (1)

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CNB200580006124XA Expired - Fee Related CN100461398C (zh) 2004-02-26 2005-01-21 具有交叉导体装配件的半导体封装件及制造方法

Country Status (6)

Country Link
US (3) US6992377B2 (https=)
EP (1) EP1719176A4 (https=)
JP (1) JP5604031B2 (https=)
KR (1) KR101114896B1 (https=)
CN (1) CN100461398C (https=)
WO (1) WO2005091760A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104218900A (zh) * 2013-05-30 2014-12-17 联发科技股份有限公司 射频发送器以及无线通信单元
US12199467B2 (en) 2021-03-11 2025-01-14 Delta Electronics (Shanghai) Co., Ltd. Switching module

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EP1746648A3 (en) * 2005-07-22 2008-09-03 Marvell World Trade Ltd. Packaging for high speed integrated circuits
US20070018292A1 (en) * 2005-07-22 2007-01-25 Sehat Sutardja Packaging for high speed integrated circuits
US7652364B2 (en) * 2005-12-21 2010-01-26 Teradata Us, Inc. Crossing conductive traces in a PCB
US20070215989A1 (en) * 2006-03-16 2007-09-20 Promos Technologies Inc. Semiconductor chip assembly
US7719112B2 (en) * 2006-08-07 2010-05-18 University Of Central Florida Research Foundation, Inc. On-chip magnetic components
CN101192588A (zh) * 2006-11-17 2008-06-04 飞思卡尔半导体公司 引线接合及其形成方法
JP2008218776A (ja) * 2007-03-06 2008-09-18 Renesas Technology Corp 半導体装置
JP2008270559A (ja) * 2007-04-20 2008-11-06 Sumitomo Electric Ind Ltd 光通信モジュール
EP2630966B1 (en) * 2007-10-12 2017-04-19 Massachusetts Institute of Technology Vaccine nanotechnology
US20090189059A1 (en) * 2008-01-29 2009-07-30 Smith Darrell I Systems and methods for cross-over bond-wires for tia input
JP5255929B2 (ja) * 2008-07-04 2013-08-07 ルネサスエレクトロニクス株式会社 半導体装置
TWI382510B (zh) * 2008-09-15 2013-01-11 力成科技股份有限公司 使用獨立內引腳之半導體封裝構造
US8049339B2 (en) * 2008-11-24 2011-11-01 Powertech Technology Inc. Semiconductor package having isolated inner lead
WO2010073832A1 (ja) * 2008-12-26 2010-07-01 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体パッケージ
US8145061B2 (en) 2009-01-13 2012-03-27 Sumitomo Electric Industries, Ltd. Optical module implementing a light-receiving device and a light-transmitting device within a common housing
US9288893B2 (en) * 2009-02-11 2016-03-15 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US7872325B2 (en) * 2009-02-24 2011-01-18 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Reduced-crosstalk wirebonding in an optical communication system
CN102412167B (zh) * 2010-09-25 2016-02-03 飞思卡尔半导体公司 用于线接合的固定
US8867592B2 (en) 2012-05-09 2014-10-21 Nxp B.V. Capacitive isolated voltage domains
US9007141B2 (en) 2012-05-23 2015-04-14 Nxp B.V. Interface for communication between voltage domains
JP6133024B2 (ja) * 2012-08-08 2017-05-24 古河電気工業株式会社 光モジュール
US8680690B1 (en) 2012-12-07 2014-03-25 Nxp B.V. Bond wire arrangement for efficient signal transmission
FR3002814B1 (fr) * 2013-03-01 2016-06-24 Thales Sa Dispositif d'interconnexion pour circuits electroniques par fils paralleles couples, et procede et outillage y relatifs
US9467060B2 (en) 2013-04-03 2016-10-11 Nxp B.V. Capacitive level shifter devices, methods and systems
US8896377B1 (en) 2013-05-29 2014-11-25 Nxp B.V. Apparatus for common mode suppression
JP6277550B2 (ja) * 2014-04-07 2018-02-14 パナソニックＩｐマネジメント株式会社 電流計測器、分電盤用電流計測器、分電盤、電流計測器の製造方法
US9729242B2 (en) 2015-01-23 2017-08-08 Furukawa Electric Co., Ltd. Optical module for reducing crosstalk
US10103627B2 (en) * 2015-02-26 2018-10-16 Altera Corporation Packaged integrated circuit including a switch-mode regulator and method of forming the same
ITTO20150231A1 (it) 2015-04-24 2016-10-24 St Microelectronics Srl Procedimento per produrre lead frame per componenti elettronici, componente e prodotto informatico corrispondenti
JP7038489B2 (ja) * 2016-06-20 2022-03-18 日本ルメンタム株式会社 光受信モジュール及び光モジュール
US10135545B2 (en) * 2016-06-20 2018-11-20 Oclaro Japan, Inc. Optical receiver module and optical module
JP7051409B2 (ja) * 2017-12-07 2022-04-11 日本ルメンタム株式会社 光送信モジュール及び光モジュール
WO2019167104A1 (ja) * 2018-02-27 2019-09-06 三菱電機株式会社 半導体装置
JP2019169504A (ja) * 2018-03-22 2019-10-03 日本電信電話株式会社 ワイヤボンディング構造
CN113224025B (zh) * 2020-01-21 2025-03-11 瑞昱半导体股份有限公司 半导体组件

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EP0276940A2 (en) * 1987-01-30 1988-08-03 Hitachi, Ltd. Semiconductor chip having external terminals connected to corresponding leads by wires
JPH05226398A (ja) * 1992-02-17 1993-09-03 Nippon Steel Corp 集積回路モジュール
WO1998026452A1 (en) * 1996-12-09 1998-06-18 Microbonds, Inc. High density integrated circuits and the method of packaging the same
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US6169331B1 (en) * 1998-08-28 2001-01-02 Micron Technology, Inc. Apparatus for electrically coupling bond pads of a microelectronic device
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104218900A (zh) * 2013-05-30 2014-12-17 联发科技股份有限公司 射频发送器以及无线通信单元
US12199467B2 (en) 2021-03-11 2025-01-14 Delta Electronics (Shanghai) Co., Ltd. Switching module

Also Published As

Publication number Publication date
JP5604031B2 (ja) 2014-10-08
CN1926683A (zh) 2007-03-07
KR101114896B1 (ko) 2012-03-06
KR20060126792A (ko) 2006-12-08
EP1719176A4 (en) 2008-07-23
US20050189643A1 (en) 2005-09-01
US20060163716A1 (en) 2006-07-27
US20060065966A1 (en) 2006-03-30
US7256488B2 (en) 2007-08-14
US7049694B2 (en) 2006-05-23
JP2007525842A (ja) 2007-09-06
WO2005091760A2 (en) 2005-10-06
EP1719176A2 (en) 2006-11-08
WO2005091760A3 (en) 2006-01-05
US6992377B2 (en) 2006-01-31

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