KR101075733B1 - 도포·현상 장치 - Google Patents

도포·현상 장치 Download PDF

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Publication number
KR101075733B1
KR101075733B1 KR1020060009384A KR20060009384A KR101075733B1 KR 101075733 B1 KR101075733 B1 KR 101075733B1 KR 1020060009384 A KR1020060009384 A KR 1020060009384A KR 20060009384 A KR20060009384 A KR 20060009384A KR 101075733 B1 KR101075733 B1 KR 101075733B1
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KR
South Korea
Prior art keywords
unit
unit block
block
substrate
stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020060009384A
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English (en)
Korean (ko)
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KR20060088495A (ko
Inventor
마사미 아키모토
신이치 하야시
야스시 하야시다
노부아키 마츠오카
요시오 키무라
이세이 우에다
히카루 이토
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20060088495A publication Critical patent/KR20060088495A/ko
Application granted granted Critical
Publication of KR101075733B1 publication Critical patent/KR101075733B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
KR1020060009384A 2005-02-01 2006-01-31 도포·현상 장치 Expired - Fee Related KR101075733B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005025509A JP4459831B2 (ja) 2005-02-01 2005-02-01 塗布、現像装置
JPJP-P-2005-00025509 2005-02-01

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020110014015A Division KR101188081B1 (ko) 2005-02-01 2011-02-17 도포·현상 장치
KR1020110014021A Division KR101125340B1 (ko) 2005-02-01 2011-02-17 도포?현상 장치

Publications (2)

Publication Number Publication Date
KR20060088495A KR20060088495A (ko) 2006-08-04
KR101075733B1 true KR101075733B1 (ko) 2011-10-21

Family

ID=36907616

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020060009384A Expired - Fee Related KR101075733B1 (ko) 2005-02-01 2006-01-31 도포·현상 장치
KR1020110014015A Expired - Lifetime KR101188081B1 (ko) 2005-02-01 2011-02-17 도포·현상 장치
KR1020110014021A Expired - Lifetime KR101125340B1 (ko) 2005-02-01 2011-02-17 도포?현상 장치

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020110014015A Expired - Lifetime KR101188081B1 (ko) 2005-02-01 2011-02-17 도포·현상 장치
KR1020110014021A Expired - Lifetime KR101125340B1 (ko) 2005-02-01 2011-02-17 도포?현상 장치

Country Status (5)

Country Link
US (3) US7793609B2 (https=)
JP (1) JP4459831B2 (https=)
KR (3) KR101075733B1 (https=)
CN (1) CN100538519C (https=)
TW (1) TW200710940A (https=)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4459831B2 (ja) * 2005-02-01 2010-04-28 東京エレクトロン株式会社 塗布、現像装置
JP4830523B2 (ja) * 2006-02-08 2011-12-07 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及びその方法を実施するためのコンピュータプログラム。
US20070258712A1 (en) * 2006-05-03 2007-11-08 Moffat William A Method and apparatus for the vaporous development of photoresist
JP2008072016A (ja) * 2006-09-15 2008-03-27 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体
JP4999415B2 (ja) * 2006-09-29 2012-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理装置の用力供給装置及び基板処理装置の用力供給方法
CN101206992B (zh) * 2006-12-20 2010-05-12 沈阳芯源微电子设备有限公司 一种可以节约时间的匀胶显影加工工艺及设备的改进结构
JP4687682B2 (ja) * 2007-03-30 2011-05-25 東京エレクトロン株式会社 塗布、現像装置及びその方法並びに記憶媒体
JP2008258208A (ja) * 2007-03-30 2008-10-23 Tokyo Electron Ltd 塗布、現像装置及びその方法並びに記憶媒体
KR100897850B1 (ko) 2007-06-18 2009-05-15 세메스 주식회사 기판 처리 장치
JP5006122B2 (ja) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4957426B2 (ja) * 2007-07-19 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体
TW200919117A (en) * 2007-08-28 2009-05-01 Tokyo Electron Ltd Coating-developing apparatus, coating-developing method and storage medium
JP2009135169A (ja) * 2007-11-29 2009-06-18 Tokyo Electron Ltd 基板処理システムおよび基板処理方法
JP5318403B2 (ja) * 2007-11-30 2013-10-16 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5160204B2 (ja) * 2007-11-30 2013-03-13 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP2010182906A (ja) * 2009-02-06 2010-08-19 Tokyo Electron Ltd 基板処理装置
JP5462506B2 (ja) * 2009-03-18 2014-04-02 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5397399B2 (ja) * 2010-07-09 2014-01-22 東京エレクトロン株式会社 塗布、現像装置
JP5408059B2 (ja) * 2010-07-09 2014-02-05 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5223897B2 (ja) 2010-09-02 2013-06-26 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5212443B2 (ja) * 2010-09-13 2013-06-19 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5608148B2 (ja) * 2011-11-25 2014-10-15 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
JP2013247197A (ja) * 2012-05-24 2013-12-09 Sokudo Co Ltd 基板処理装置
JP5442889B2 (ja) * 2013-05-17 2014-03-12 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5442890B2 (ja) * 2013-05-17 2014-03-12 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP6243784B2 (ja) 2014-03-31 2017-12-06 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
JP5852219B2 (ja) * 2014-12-24 2016-02-03 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法および基板処理装置
CN106610568A (zh) * 2015-10-27 2017-05-03 沈阳芯源微电子设备有限公司 一种涂胶显影工艺模块及该模块内环境参数的控制方法
JP6195601B2 (ja) * 2015-12-03 2017-09-13 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法および基板処理装置
JP6439766B2 (ja) * 2016-09-23 2018-12-19 東京エレクトロン株式会社 塗布、現像方法及び塗布、現像装置
JP7195841B2 (ja) * 2018-09-21 2022-12-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7186605B2 (ja) * 2018-12-27 2022-12-09 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7221048B2 (ja) 2018-12-28 2023-02-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7181081B2 (ja) 2018-12-28 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7297650B2 (ja) * 2019-11-27 2023-06-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7525394B2 (ja) 2020-12-28 2024-07-30 東京エレクトロン株式会社 搬送装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2931820B2 (ja) 1991-11-05 1999-08-09 東京エレクトロン株式会社 板状体の処理装置及び搬送装置
JP3734095B2 (ja) 1994-09-12 2006-01-11 株式会社ニコン 基板処理装置
JP3779393B2 (ja) * 1996-09-06 2006-05-24 東京エレクトロン株式会社 処理システム
JP3851751B2 (ja) * 1999-03-24 2006-11-29 東京エレクトロン株式会社 処理システム
JP3445757B2 (ja) * 1999-05-06 2003-09-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP3914690B2 (ja) * 1999-06-30 2007-05-16 東京エレクトロン株式会社 基板受け渡し装置及び塗布現像処理システム
US6402400B1 (en) * 1999-10-06 2002-06-11 Tokyo Electron Limited Substrate processing apparatus
US6402401B1 (en) * 1999-10-19 2002-06-11 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
KR100348938B1 (ko) 1999-12-06 2002-08-14 한국디엔에스 주식회사 포토리소그라피 공정을 위한 반도체 제조장치
TW594835B (en) 2000-05-09 2004-06-21 Tokyo Electron Ltd System for coating and developing
JP4104828B2 (ja) 2001-02-22 2008-06-18 東京エレクトロン株式会社 処理装置
US6402200B1 (en) * 2001-04-11 2002-06-11 Raymond T. Myers Apparatus and method for moving mud flaps to a protected position
JP4342147B2 (ja) 2002-05-01 2009-10-14 大日本スクリーン製造株式会社 基板処理装置
JP2004015023A (ja) 2002-06-11 2004-01-15 Dainippon Screen Mfg Co Ltd 基板処理装置およびその方法
KR100935291B1 (ko) * 2002-11-28 2010-01-06 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 도포 현상 장치
JP4087328B2 (ja) 2002-11-28 2008-05-21 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法
JP2004266283A (ja) 2004-03-15 2004-09-24 Tokyo Electron Ltd 基板処理装置
JP4955976B2 (ja) * 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4955977B2 (ja) * 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4459831B2 (ja) * 2005-02-01 2010-04-28 東京エレクトロン株式会社 塗布、現像装置

Also Published As

Publication number Publication date
CN100538519C (zh) 2009-09-09
US7793609B2 (en) 2010-09-14
JP2006216614A (ja) 2006-08-17
US20100300353A1 (en) 2010-12-02
CN1815368A (zh) 2006-08-09
KR20110033160A (ko) 2011-03-30
KR20110036019A (ko) 2011-04-06
US20070056514A1 (en) 2007-03-15
TW200710940A (en) 2007-03-16
KR20060088495A (ko) 2006-08-04
US8302556B2 (en) 2012-11-06
KR101188081B1 (ko) 2012-10-05
KR101125340B1 (ko) 2012-03-28
US20100326353A1 (en) 2010-12-30
TWI299181B (https=) 2008-07-21
JP4459831B2 (ja) 2010-04-28

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