JP4459831B2 - 塗布、現像装置 - Google Patents

塗布、現像装置 Download PDF

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Publication number
JP4459831B2
JP4459831B2 JP2005025509A JP2005025509A JP4459831B2 JP 4459831 B2 JP4459831 B2 JP 4459831B2 JP 2005025509 A JP2005025509 A JP 2005025509A JP 2005025509 A JP2005025509 A JP 2005025509A JP 4459831 B2 JP4459831 B2 JP 4459831B2
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JP
Japan
Prior art keywords
unit
block
substrate
laminated
antireflection film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005025509A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006216614A (ja
Inventor
正巳 飽本
伸一 林
林田　　安
伸明 松岡
義雄 木村
一成 上田
晃 伊東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2005025509A priority Critical patent/JP4459831B2/ja
Priority to TW095103331A priority patent/TW200710940A/zh
Priority to CNB2006100047910A priority patent/CN100538519C/zh
Priority to KR1020060009384A priority patent/KR101075733B1/ko
Priority to US11/342,616 priority patent/US7793609B2/en
Publication of JP2006216614A publication Critical patent/JP2006216614A/ja
Application granted granted Critical
Publication of JP4459831B2 publication Critical patent/JP4459831B2/ja
Priority to US12/855,534 priority patent/US8302556B2/en
Priority to US12/855,524 priority patent/US20100326353A1/en
Priority to KR1020110014015A priority patent/KR101188081B1/ko
Priority to KR1020110014021A priority patent/KR101125340B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
JP2005025509A 2005-02-01 2005-02-01 塗布、現像装置 Expired - Lifetime JP4459831B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2005025509A JP4459831B2 (ja) 2005-02-01 2005-02-01 塗布、現像装置
TW095103331A TW200710940A (en) 2005-02-01 2006-01-27 Coating and developing apparatus
CNB2006100047910A CN100538519C (zh) 2005-02-01 2006-01-28 涂敷·显影装置
US11/342,616 US7793609B2 (en) 2005-02-01 2006-01-31 Coating and developing apparatus
KR1020060009384A KR101075733B1 (ko) 2005-02-01 2006-01-31 도포·현상 장치
US12/855,534 US8302556B2 (en) 2005-02-01 2010-08-12 Coating and developing apparatus
US12/855,524 US20100326353A1 (en) 2005-02-01 2010-08-12 Coating and developing apparatus
KR1020110014015A KR101188081B1 (ko) 2005-02-01 2011-02-17 도포·현상 장치
KR1020110014021A KR101125340B1 (ko) 2005-02-01 2011-02-17 도포?현상 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005025509A JP4459831B2 (ja) 2005-02-01 2005-02-01 塗布、現像装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2009211737A Division JP2010034566A (ja) 2009-09-14 2009-09-14 塗布、現像装置
JP2009211791A Division JP2010041059A (ja) 2009-09-14 2009-09-14 塗布、現像装置

Publications (2)

Publication Number Publication Date
JP2006216614A JP2006216614A (ja) 2006-08-17
JP4459831B2 true JP4459831B2 (ja) 2010-04-28

Family

ID=36907616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005025509A Expired - Lifetime JP4459831B2 (ja) 2005-02-01 2005-02-01 塗布、現像装置

Country Status (5)

Country Link
US (3) US7793609B2 (https=)
JP (1) JP4459831B2 (https=)
KR (3) KR101075733B1 (https=)
CN (1) CN100538519C (https=)
TW (1) TW200710940A (https=)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4459831B2 (ja) * 2005-02-01 2010-04-28 東京エレクトロン株式会社 塗布、現像装置
JP4830523B2 (ja) * 2006-02-08 2011-12-07 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及びその方法を実施するためのコンピュータプログラム。
US20070258712A1 (en) * 2006-05-03 2007-11-08 Moffat William A Method and apparatus for the vaporous development of photoresist
JP2008072016A (ja) * 2006-09-15 2008-03-27 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体
JP4999415B2 (ja) * 2006-09-29 2012-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理装置の用力供給装置及び基板処理装置の用力供給方法
CN101206992B (zh) * 2006-12-20 2010-05-12 沈阳芯源微电子设备有限公司 一种可以节约时间的匀胶显影加工工艺及设备的改进结构
JP4687682B2 (ja) * 2007-03-30 2011-05-25 東京エレクトロン株式会社 塗布、現像装置及びその方法並びに記憶媒体
JP2008258208A (ja) * 2007-03-30 2008-10-23 Tokyo Electron Ltd 塗布、現像装置及びその方法並びに記憶媒体
KR100897850B1 (ko) 2007-06-18 2009-05-15 세메스 주식회사 기판 처리 장치
JP5006122B2 (ja) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4957426B2 (ja) * 2007-07-19 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体
TW200919117A (en) * 2007-08-28 2009-05-01 Tokyo Electron Ltd Coating-developing apparatus, coating-developing method and storage medium
JP2009135169A (ja) * 2007-11-29 2009-06-18 Tokyo Electron Ltd 基板処理システムおよび基板処理方法
JP5318403B2 (ja) * 2007-11-30 2013-10-16 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5160204B2 (ja) * 2007-11-30 2013-03-13 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP2010182906A (ja) * 2009-02-06 2010-08-19 Tokyo Electron Ltd 基板処理装置
JP5462506B2 (ja) * 2009-03-18 2014-04-02 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5397399B2 (ja) * 2010-07-09 2014-01-22 東京エレクトロン株式会社 塗布、現像装置
JP5408059B2 (ja) * 2010-07-09 2014-02-05 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5223897B2 (ja) 2010-09-02 2013-06-26 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5212443B2 (ja) * 2010-09-13 2013-06-19 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5608148B2 (ja) * 2011-11-25 2014-10-15 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
JP2013247197A (ja) * 2012-05-24 2013-12-09 Sokudo Co Ltd 基板処理装置
JP5442889B2 (ja) * 2013-05-17 2014-03-12 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5442890B2 (ja) * 2013-05-17 2014-03-12 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP6243784B2 (ja) 2014-03-31 2017-12-06 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
JP5852219B2 (ja) * 2014-12-24 2016-02-03 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法および基板処理装置
CN106610568A (zh) * 2015-10-27 2017-05-03 沈阳芯源微电子设备有限公司 一种涂胶显影工艺模块及该模块内环境参数的控制方法
JP6195601B2 (ja) * 2015-12-03 2017-09-13 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法および基板処理装置
JP6439766B2 (ja) * 2016-09-23 2018-12-19 東京エレクトロン株式会社 塗布、現像方法及び塗布、現像装置
JP7195841B2 (ja) * 2018-09-21 2022-12-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7186605B2 (ja) * 2018-12-27 2022-12-09 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7221048B2 (ja) 2018-12-28 2023-02-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7181081B2 (ja) 2018-12-28 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7297650B2 (ja) * 2019-11-27 2023-06-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7525394B2 (ja) 2020-12-28 2024-07-30 東京エレクトロン株式会社 搬送装置

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JP4087328B2 (ja) 2002-11-28 2008-05-21 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法
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JP4955977B2 (ja) * 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4459831B2 (ja) * 2005-02-01 2010-04-28 東京エレクトロン株式会社 塗布、現像装置

Also Published As

Publication number Publication date
CN100538519C (zh) 2009-09-09
US7793609B2 (en) 2010-09-14
JP2006216614A (ja) 2006-08-17
US20100300353A1 (en) 2010-12-02
CN1815368A (zh) 2006-08-09
KR20110033160A (ko) 2011-03-30
KR20110036019A (ko) 2011-04-06
US20070056514A1 (en) 2007-03-15
TW200710940A (en) 2007-03-16
KR20060088495A (ko) 2006-08-04
KR101075733B1 (ko) 2011-10-21
US8302556B2 (en) 2012-11-06
KR101188081B1 (ko) 2012-10-05
KR101125340B1 (ko) 2012-03-28
US20100326353A1 (en) 2010-12-30
TWI299181B (https=) 2008-07-21

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