KR101034979B1 - 전자 디바이스의 전기적 시험용 접촉자, 프로브 조립체 및 그 제조방법 - Google Patents

전자 디바이스의 전기적 시험용 접촉자, 프로브 조립체 및 그 제조방법 Download PDF

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KR101034979B1
KR101034979B1 KR1020090034848A KR20090034848A KR101034979B1 KR 101034979 B1 KR101034979 B1 KR 101034979B1 KR 1020090034848 A KR1020090034848 A KR 1020090034848A KR 20090034848 A KR20090034848 A KR 20090034848A KR 101034979 B1 KR101034979 B1 KR 101034979B1
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South Korea
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region
contact
substrate
reflecting film
light reflecting
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KR20090115666A (ko
Inventor
쇼지 카마타
토모야 사토
토시나가 타케야
타카유키 하야시자키
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가부시키가이샤 니혼 마이크로닉스
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020090034848A 2008-05-02 2009-04-22 전자 디바이스의 전기적 시험용 접촉자, 프로브 조립체 및 그 제조방법 Active KR101034979B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-120306 2008-05-02
JP2008120306A JP2009270880A (ja) 2008-05-02 2008-05-02 電子デバイスの電気的試験用接触子、その製造方法及びプローブ組立体

Publications (2)

Publication Number Publication Date
KR20090115666A KR20090115666A (ko) 2009-11-05
KR101034979B1 true KR101034979B1 (ko) 2011-05-17

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KR1020090034848A Active KR101034979B1 (ko) 2008-05-02 2009-04-22 전자 디바이스의 전기적 시험용 접촉자, 프로브 조립체 및 그 제조방법

Country Status (3)

Country Link
US (1) US8063651B2 (https=)
JP (1) JP2009270880A (https=)
KR (1) KR101034979B1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150008950A1 (en) * 2011-12-31 2015-01-08 Roy E. Swart Manufacturing advanced test probes
JP5977583B2 (ja) * 2012-05-29 2016-08-24 株式会社日本マイクロニクス 接合パッド、プローブ組立体及び接合パッドの製造方法
EP2877831A4 (en) * 2012-06-29 2016-03-16 Hydrovision Asia Pte Ltd IMPROVED FABRIC MEASURING DEVICE
USD702646S1 (en) * 2012-08-29 2014-04-15 Kabushiki Kaisha Nihon Micronics Electric contact
KR20140080750A (ko) * 2012-12-14 2014-07-01 한국전자통신연구원 반도체 소자 테스트 장치
JP6042761B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置
KR101724954B1 (ko) * 2015-12-02 2017-04-07 한국기초과학지원연구원 마이크로 진공 프로브 시스템
WO2018003507A1 (ja) * 2016-06-28 2018-01-04 株式会社日本マイクロニクス 電気的接続装置及び接触子
DE102017209510A1 (de) * 2017-06-06 2018-12-06 Feinmetall Gmbh Kontaktelementsystem
JP1646397S (https=) * 2019-05-21 2019-11-25
JP2021028603A (ja) * 2019-08-09 2021-02-25 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置
CN115436675B (zh) * 2021-06-04 2026-03-17 芯卓科技(浙江)有限公司 测试装置及其探针组件
KR20260010596A (ko) * 2024-07-12 2026-01-21 주식회사 에이엠에스티 프로브 카드 조립체 및 그 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002009117A (ja) 2000-06-19 2002-01-11 Micronics Japan Co Ltd プローブカード
JP2002031652A (ja) 2000-07-17 2002-01-31 Ando Electric Co Ltd プローブカード、その修復方法及びその製造方法
JP2007184417A (ja) 2006-01-06 2007-07-19 Kawasaki Microelectronics Kk プローブカードの取り付け位置ずれの検出方法及びプローバ装置

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US5272434A (en) * 1987-06-20 1993-12-21 Schlumberger Technologies, Inc. Method and apparatus for electro-optically testing circuits
JPH05109824A (ja) * 1991-10-15 1993-04-30 Omron Corp 電子部品のフリツプチツプ実装方法
JPH0685448A (ja) * 1992-08-24 1994-03-25 Hitachi Ltd レーザはんだ付け方法及びその装置
US5725989A (en) * 1996-04-15 1998-03-10 Chang; Jeffrey C. Laser addressable thermal transfer imaging element with an interlayer
US6127832A (en) * 1998-01-06 2000-10-03 International Business Machines Corporation Electrical test tool having easily replaceable electrical probe
JP3761023B2 (ja) * 2001-11-20 2006-03-29 セイコーエプソン株式会社 圧電デバイス及びその製造方法
US7679389B2 (en) * 2005-03-07 2010-03-16 Kabushiki Kaisha Nihon Micronics Probe for electrical test and electrical connecting apparatus using it
JP4570997B2 (ja) * 2005-03-24 2010-10-27 株式会社日本マイクロニクス プローブ、基板へのプローブの取り付け方法及び装置、電気的接続装置、並びに電気的接続装置の製造方法
US7629807B2 (en) * 2005-08-09 2009-12-08 Kabushiki Kaisha Nihon Micronics Electrical test probe
JP5060965B2 (ja) * 2006-01-25 2012-10-31 株式会社日本マイクロニクス 通電試験用プローブ、プローブ組立体およびその製造方法
JP2007240235A (ja) * 2006-03-07 2007-09-20 Micronics Japan Co Ltd 通電試験用プローブおよびプローブ組立体
JP2008034569A (ja) * 2006-07-28 2008-02-14 Matsushita Electric Ind Co Ltd 半導体集積回路検査用プローブカードとその製造方法
TW200815763A (en) * 2006-09-26 2008-04-01 Nihon Micronics Kabushiki Kaisha Electrical test probe and electrical test probe assembly
JP4916893B2 (ja) * 2007-01-05 2012-04-18 株式会社日本マイクロニクス プローブの製造方法
JP5123533B2 (ja) * 2007-02-01 2013-01-23 株式会社日本マイクロニクス 通電試験用プローブおよびその製造方法
JP4916903B2 (ja) * 2007-02-06 2012-04-18 株式会社日本マイクロニクス プローブの製造方法
JP5438908B2 (ja) * 2008-03-11 2014-03-12 株式会社日本マイクロニクス 電気的試験用接触子、これを用いた電気的接続装置及び接触子の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002009117A (ja) 2000-06-19 2002-01-11 Micronics Japan Co Ltd プローブカード
JP2002031652A (ja) 2000-07-17 2002-01-31 Ando Electric Co Ltd プローブカード、その修復方法及びその製造方法
JP2007184417A (ja) 2006-01-06 2007-07-19 Kawasaki Microelectronics Kk プローブカードの取り付け位置ずれの検出方法及びプローバ装置

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US8063651B2 (en) 2011-11-22
US20090273357A1 (en) 2009-11-05
JP2009270880A (ja) 2009-11-19
KR20090115666A (ko) 2009-11-05

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