JP2009270880A - 電子デバイスの電気的試験用接触子、その製造方法及びプローブ組立体 - Google Patents

電子デバイスの電気的試験用接触子、その製造方法及びプローブ組立体 Download PDF

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Publication number
JP2009270880A
JP2009270880A JP2008120306A JP2008120306A JP2009270880A JP 2009270880 A JP2009270880 A JP 2009270880A JP 2008120306 A JP2008120306 A JP 2008120306A JP 2008120306 A JP2008120306 A JP 2008120306A JP 2009270880 A JP2009270880 A JP 2009270880A
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JP
Japan
Prior art keywords
region
contact
substrate
reflection film
light reflection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008120306A
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English (en)
Japanese (ja)
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JP2009270880A5 (https=
Inventor
Shoji Kamata
省司 鎌田
Tomoya Sato
友哉 佐藤
Toshinaga Takeya
敏永 竹谷
Takayuki Hayashizaki
孝幸 林崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Priority to JP2008120306A priority Critical patent/JP2009270880A/ja
Priority to US12/417,861 priority patent/US8063651B2/en
Priority to KR1020090034848A priority patent/KR101034979B1/ko
Publication of JP2009270880A publication Critical patent/JP2009270880A/ja
Publication of JP2009270880A5 publication Critical patent/JP2009270880A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2008120306A 2008-05-02 2008-05-02 電子デバイスの電気的試験用接触子、その製造方法及びプローブ組立体 Pending JP2009270880A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008120306A JP2009270880A (ja) 2008-05-02 2008-05-02 電子デバイスの電気的試験用接触子、その製造方法及びプローブ組立体
US12/417,861 US8063651B2 (en) 2008-05-02 2009-04-03 Contact for electrical test of electronic devices, probe assembly and method for manufacturing the same
KR1020090034848A KR101034979B1 (ko) 2008-05-02 2009-04-22 전자 디바이스의 전기적 시험용 접촉자, 프로브 조립체 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008120306A JP2009270880A (ja) 2008-05-02 2008-05-02 電子デバイスの電気的試験用接触子、その製造方法及びプローブ組立体

Publications (2)

Publication Number Publication Date
JP2009270880A true JP2009270880A (ja) 2009-11-19
JP2009270880A5 JP2009270880A5 (https=) 2011-05-19

Family

ID=41256686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008120306A Pending JP2009270880A (ja) 2008-05-02 2008-05-02 電子デバイスの電気的試験用接触子、その製造方法及びプローブ組立体

Country Status (3)

Country Link
US (1) US8063651B2 (https=)
JP (1) JP2009270880A (https=)
KR (1) KR101034979B1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013246133A (ja) * 2012-05-29 2013-12-09 Micronics Japan Co Ltd 接合パッド、プローブ組立体及び接合パッドの製造方法
WO2026014939A1 (ko) * 2024-07-12 2026-01-15 주식회사 에이엠에스티 프로브 카드 조립체 및 그 제조 방법

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150008950A1 (en) * 2011-12-31 2015-01-08 Roy E. Swart Manufacturing advanced test probes
EP2877831A4 (en) * 2012-06-29 2016-03-16 Hydrovision Asia Pte Ltd IMPROVED FABRIC MEASURING DEVICE
USD702646S1 (en) * 2012-08-29 2014-04-15 Kabushiki Kaisha Nihon Micronics Electric contact
KR20140080750A (ko) * 2012-12-14 2014-07-01 한국전자통신연구원 반도체 소자 테스트 장치
JP6042761B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置
KR101724954B1 (ko) * 2015-12-02 2017-04-07 한국기초과학지원연구원 마이크로 진공 프로브 시스템
WO2018003507A1 (ja) * 2016-06-28 2018-01-04 株式会社日本マイクロニクス 電気的接続装置及び接触子
DE102017209510A1 (de) * 2017-06-06 2018-12-06 Feinmetall Gmbh Kontaktelementsystem
JP1646397S (https=) * 2019-05-21 2019-11-25
JP2021028603A (ja) * 2019-08-09 2021-02-25 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置
CN115436675B (zh) * 2021-06-04 2026-03-17 芯卓科技(浙江)有限公司 测试装置及其探针组件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05109824A (ja) * 1991-10-15 1993-04-30 Omron Corp 電子部品のフリツプチツプ実装方法
JPH0685448A (ja) * 1992-08-24 1994-03-25 Hitachi Ltd レーザはんだ付け方法及びその装置
JP2003158208A (ja) * 2001-11-20 2003-05-30 Seiko Epson Corp 圧電デバイス及びその製造方法
JP2006266914A (ja) * 2005-03-24 2006-10-05 Micronics Japan Co Ltd プローブ、基板へのプローブの取り付け方法及び装置、電気的接続装置、並びに電気的接続装置の製造方法
JP2008034569A (ja) * 2006-07-28 2008-02-14 Matsushita Electric Ind Co Ltd 半導体集積回路検査用プローブカードとその製造方法

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
US5272434A (en) * 1987-06-20 1993-12-21 Schlumberger Technologies, Inc. Method and apparatus for electro-optically testing circuits
US5725989A (en) * 1996-04-15 1998-03-10 Chang; Jeffrey C. Laser addressable thermal transfer imaging element with an interlayer
US6127832A (en) * 1998-01-06 2000-10-03 International Business Machines Corporation Electrical test tool having easily replaceable electrical probe
JP2002009117A (ja) 2000-06-19 2002-01-11 Micronics Japan Co Ltd プローブカード
JP2002031652A (ja) 2000-07-17 2002-01-31 Ando Electric Co Ltd プローブカード、その修復方法及びその製造方法
US7679389B2 (en) * 2005-03-07 2010-03-16 Kabushiki Kaisha Nihon Micronics Probe for electrical test and electrical connecting apparatus using it
US7629807B2 (en) * 2005-08-09 2009-12-08 Kabushiki Kaisha Nihon Micronics Electrical test probe
JP4971636B2 (ja) 2006-01-06 2012-07-11 川崎マイクロエレクトロニクス株式会社 プローブカードの取り付け位置ずれの検出方法及びプローバ装置
JP5060965B2 (ja) * 2006-01-25 2012-10-31 株式会社日本マイクロニクス 通電試験用プローブ、プローブ組立体およびその製造方法
JP2007240235A (ja) * 2006-03-07 2007-09-20 Micronics Japan Co Ltd 通電試験用プローブおよびプローブ組立体
TW200815763A (en) * 2006-09-26 2008-04-01 Nihon Micronics Kabushiki Kaisha Electrical test probe and electrical test probe assembly
JP4916893B2 (ja) * 2007-01-05 2012-04-18 株式会社日本マイクロニクス プローブの製造方法
JP5123533B2 (ja) * 2007-02-01 2013-01-23 株式会社日本マイクロニクス 通電試験用プローブおよびその製造方法
JP4916903B2 (ja) * 2007-02-06 2012-04-18 株式会社日本マイクロニクス プローブの製造方法
JP5438908B2 (ja) * 2008-03-11 2014-03-12 株式会社日本マイクロニクス 電気的試験用接触子、これを用いた電気的接続装置及び接触子の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05109824A (ja) * 1991-10-15 1993-04-30 Omron Corp 電子部品のフリツプチツプ実装方法
JPH0685448A (ja) * 1992-08-24 1994-03-25 Hitachi Ltd レーザはんだ付け方法及びその装置
JP2003158208A (ja) * 2001-11-20 2003-05-30 Seiko Epson Corp 圧電デバイス及びその製造方法
JP2006266914A (ja) * 2005-03-24 2006-10-05 Micronics Japan Co Ltd プローブ、基板へのプローブの取り付け方法及び装置、電気的接続装置、並びに電気的接続装置の製造方法
JP2008034569A (ja) * 2006-07-28 2008-02-14 Matsushita Electric Ind Co Ltd 半導体集積回路検査用プローブカードとその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013246133A (ja) * 2012-05-29 2013-12-09 Micronics Japan Co Ltd 接合パッド、プローブ組立体及び接合パッドの製造方法
WO2026014939A1 (ko) * 2024-07-12 2026-01-15 주식회사 에이엠에스티 프로브 카드 조립체 및 그 제조 방법

Also Published As

Publication number Publication date
US8063651B2 (en) 2011-11-22
US20090273357A1 (en) 2009-11-05
KR101034979B1 (ko) 2011-05-17
KR20090115666A (ko) 2009-11-05

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