KR101018509B1 - 보수 시스템 기판 처리 장치 원격 조작 장치 및 통신 방법 - Google Patents

보수 시스템 기판 처리 장치 원격 조작 장치 및 통신 방법 Download PDF

Info

Publication number
KR101018509B1
KR101018509B1 KR1020057003123A KR20057003123A KR101018509B1 KR 101018509 B1 KR101018509 B1 KR 101018509B1 KR 1020057003123 A KR1020057003123 A KR 1020057003123A KR 20057003123 A KR20057003123 A KR 20057003123A KR 101018509 B1 KR101018509 B1 KR 101018509B1
Authority
KR
South Korea
Prior art keywords
substrate processing
processing apparatus
remote operation
permission setting
remote
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020057003123A
Other languages
English (en)
Korean (ko)
Other versions
KR20050058498A (ko
Inventor
타쿠야 모리
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20050058498A publication Critical patent/KR20050058498A/ko
Application granted granted Critical
Publication of KR101018509B1 publication Critical patent/KR101018509B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Control Or Security For Electrophotography (AREA)
KR1020057003123A 2002-08-27 2003-08-08 보수 시스템 기판 처리 장치 원격 조작 장치 및 통신 방법 Expired - Fee Related KR101018509B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00247525 2002-08-27
JP2002247525A JP4316210B2 (ja) 2002-08-27 2002-08-27 保守システム，基板処理装置及び遠隔操作装置

Publications (2)

Publication Number Publication Date
KR20050058498A KR20050058498A (ko) 2005-06-16
KR101018509B1 true KR101018509B1 (ko) 2011-03-03

Family

ID=31972472

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057003123A Expired - Fee Related KR101018509B1 (ko) 2002-08-27 2003-08-08 보수 시스템 기판 처리 장치 원격 조작 장치 및 통신 방법

Country Status (7)

Country Link
US (2) US7524378B2 (enExample)
EP (2) EP1536459B1 (enExample)
JP (1) JP4316210B2 (enExample)
KR (1) KR101018509B1 (enExample)
CN (1) CN100550298C (enExample)
AU (1) AU2003254901A1 (enExample)
WO (1) WO2004021417A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG155210A1 (en) * 2004-08-12 2009-09-30 Nikon Corp Substrate processing apparatus, use state ascertaining method, and false use preventing method
WO2007122902A1 (ja) * 2006-03-24 2007-11-01 Hitachi Kokusai Electric Inc. 基板処理装置の管理方法
JP5020605B2 (ja) * 2006-11-16 2012-09-05 東京エレクトロン株式会社 上位制御装置、下位制御装置、画面の操作権付与方法および画面の操作権付与プログラムを記憶した記憶媒体
JP4994874B2 (ja) * 2007-02-07 2012-08-08 キヤノン株式会社 処理装置
JP4774029B2 (ja) * 2007-10-17 2011-09-14 三菱電機株式会社 計装制御システム
JP4672073B2 (ja) * 2008-08-22 2011-04-20 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び基板処理装置の運用方法
KR101675857B1 (ko) * 2010-11-09 2016-11-14 엘지디스플레이 주식회사 무인 제어 시스템
JP6063902B2 (ja) * 2014-06-30 2017-01-18 株式会社日立国際電気 基板処理装置及びその制御方法並びにプログラム
JP6309176B2 (ja) * 2016-03-15 2018-04-11 三菱電機株式会社 遠隔作業支援装置、指示用端末及び現場用端末
JP6584356B2 (ja) * 2016-03-30 2019-10-02 東京エレクトロン株式会社 基板処理装置及び基板処理装置の処理方法
JP7061524B2 (ja) * 2018-06-28 2022-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置のメンテナンス装置およびメンテナンス方法
JP7529363B2 (ja) * 2020-08-31 2024-08-06 東京エレクトロン株式会社 半導体製造システム、制御装置、制御方法及びプログラム
TWI850056B (zh) * 2023-08-08 2024-07-21 中華電信股份有限公司 用於企業專網的即時告警狀態變更系統及其方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231595A (ja) * 2001-01-31 2002-08-16 Hitachi Ltd 半導体製造装置管理システム

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390953A (en) * 1980-11-10 1983-06-28 Kearney & Trecker Corporation Unmanned diagnostic communications system for computer controlled machine tools
US5559444A (en) * 1991-06-04 1996-09-24 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
US5339074A (en) * 1991-09-13 1994-08-16 Fluoroware, Inc. Very low frequency tracking system
JPH06119090A (ja) * 1992-10-07 1994-04-28 Hitachi Ltd 省電力制御方式
US5429912A (en) * 1993-08-02 1995-07-04 Chartered Semiconductor Manufacturing Pte Ltd. Method of dispensing fluid onto a wafer
KR0147245B1 (ko) * 1993-12-01 1998-09-15 모리시타 요이찌 강유전체박막 및 그 제조방법
TWI249760B (en) * 1996-07-31 2006-02-21 Canon Kk Remote maintenance system
JP2000155613A (ja) * 1998-11-19 2000-06-06 Nikko Co Ltd 生コンクリート製造プラントの遠隔保守管理装置
US6379465B1 (en) * 1999-09-17 2002-04-30 Nordson Corporation Coating system with centralized control panel and gun mapping
JP3595756B2 (ja) * 2000-06-01 2004-12-02 キヤノン株式会社 露光装置、リソグラフィ装置、ロードロック装置、デバイス製造方法およびリソグラフィ方法
JP4915033B2 (ja) 2000-06-15 2012-04-11 株式会社ニコン 露光装置、基板処理装置及びリソグラフィシステム、並びにデバイス製造方法
JP2002027567A (ja) * 2000-07-12 2002-01-25 Hitachi Kokusai Electric Inc 半導体製造装置のリモート操作システム、半導体製造装置および遠隔操作装置
JP3711237B2 (ja) * 2000-12-27 2005-11-02 東京エレクトロン株式会社 基板処理装置
TW559706B (en) * 2001-06-08 2003-11-01 Hon Hai Prec Ind Co Ltd Method and system for collecting and monitoring shop floor information

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231595A (ja) * 2001-01-31 2002-08-16 Hitachi Ltd 半導体製造装置管理システム

Also Published As

Publication number Publication date
EP2006741A3 (en) 2009-02-18
EP2006741A2 (en) 2008-12-24
JP4316210B2 (ja) 2009-08-19
JP2004087839A (ja) 2004-03-18
CN1679141A (zh) 2005-10-05
CN100550298C (zh) 2009-10-14
US8171879B2 (en) 2012-05-08
EP1536459B1 (en) 2016-01-13
KR20050058498A (ko) 2005-06-16
US20060073654A1 (en) 2006-04-06
US7524378B2 (en) 2009-04-28
WO2004021417A1 (ja) 2004-03-11
EP2006741B1 (en) 2016-01-13
AU2003254901A1 (en) 2004-03-19
US20090157214A1 (en) 2009-06-18
EP1536459A4 (en) 2007-12-26
EP1536459A1 (en) 2005-06-01

Similar Documents

Publication Publication Date Title
US8171879B2 (en) Maintenance system, substrate processing apparatus, remote operation unit and communication method
KR100372955B1 (ko) 제조장치의조작시스템
US20010048865A1 (en) Substrate processing system and substrate processing method
JPWO2003007351A1 (ja) 基板の処理装置及び搬送装置調整システム
JP3913420B2 (ja) 基板処理装置およびそのメンテナンス方法
US6766209B2 (en) Managing system, managing method, host computer, and information collecting/transmitting unit
JPH1140469A (ja) リソグラフィシステム及びその作業管理方法
US6990380B2 (en) Substrate processing apparatus and information storage apparatus and method
JP2005085784A (ja) 半導体製造装置のメンテナンス操作時における操作端末の排他管理方法
JP2003005826A (ja) 管理システム及び管理方法
KR100954899B1 (ko) 인 라인 접속 설정 방법 및 장치 및 그리고 기판 처리 장치및 기판 처리 시스템
JP2007329284A (ja) 半導体製造装置、半導体製造装置の操作方法及び記憶媒体
JP2706793B2 (ja) 塗布現像装置
JPH08161008A (ja) デバイス製造装置および方法
JP4347558B2 (ja) 設備障害時の操作者呼び出しシステム
JP2003007605A (ja) 管理システム，ホストコンピュータ，情報収集送信装置及び管理方法
KR100293984B1 (ko) 공정이상상황발생시경고제어방법
JP2002353085A (ja) 半導体製造装置の管理システム及び半導体製造装置の管理方法
JPH10172903A (ja) 遠隔操作方法および半導体露光装置
JP3652085B2 (ja) 半導体露光装置およびオンライン操作方法
JPWO2003005423A1 (ja) 基板の処理装置
TW202505587A (zh) 控制裝置、半導體製造系統、半導體製造裝置的控制方法及電腦記錄媒體
JP2001338854A (ja) 半導体製造装置、半導体製造装置のコンソール部、半導体製造システムおよびデバイス製造方法
JP2003229914A (ja) 保守システム
KR20070020864A (ko) 반도체 제조설비의 공정관리방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20140204

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20150119

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20160119

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20170119

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20180219

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20190218

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20200218

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20230223

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20230223

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000