CN100550298C - 维修系统、基板处理装置、远程操作装置和通信方法 - Google Patents

维修系统、基板处理装置、远程操作装置和通信方法 Download PDF

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Publication number
CN100550298C
CN100550298C CNB038202832A CN03820283A CN100550298C CN 100550298 C CN100550298 C CN 100550298C CN B038202832 A CNB038202832 A CN B038202832A CN 03820283 A CN03820283 A CN 03820283A CN 100550298 C CN100550298 C CN 100550298C
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CN
China
Prior art keywords
board treatment
remote operation
substrate
substrate board
remote
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB038202832A
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English (en)
Chinese (zh)
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CN1679141A (zh
Inventor
森拓也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1679141A publication Critical patent/CN1679141A/zh
Application granted granted Critical
Publication of CN100550298C publication Critical patent/CN100550298C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Control Or Security For Electrophotography (AREA)
CNB038202832A 2002-08-27 2003-08-08 维修系统、基板处理装置、远程操作装置和通信方法 Expired - Lifetime CN100550298C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP247525/2002 2002-08-27
JP2002247525A JP4316210B2 (ja) 2002-08-27 2002-08-27 保守システム，基板処理装置及び遠隔操作装置

Publications (2)

Publication Number Publication Date
CN1679141A CN1679141A (zh) 2005-10-05
CN100550298C true CN100550298C (zh) 2009-10-14

Family

ID=31972472

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038202832A Expired - Lifetime CN100550298C (zh) 2002-08-27 2003-08-08 维修系统、基板处理装置、远程操作装置和通信方法

Country Status (7)

Country Link
US (2) US7524378B2 (enExample)
EP (2) EP1536459B1 (enExample)
JP (1) JP4316210B2 (enExample)
KR (1) KR101018509B1 (enExample)
CN (1) CN100550298C (enExample)
AU (1) AU2003254901A1 (enExample)
WO (1) WO2004021417A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG155210A1 (en) * 2004-08-12 2009-09-30 Nikon Corp Substrate processing apparatus, use state ascertaining method, and false use preventing method
WO2007122902A1 (ja) * 2006-03-24 2007-11-01 Hitachi Kokusai Electric Inc. 基板処理装置の管理方法
JP5020605B2 (ja) * 2006-11-16 2012-09-05 東京エレクトロン株式会社 上位制御装置、下位制御装置、画面の操作権付与方法および画面の操作権付与プログラムを記憶した記憶媒体
JP4994874B2 (ja) * 2007-02-07 2012-08-08 キヤノン株式会社 処理装置
JP4774029B2 (ja) * 2007-10-17 2011-09-14 三菱電機株式会社 計装制御システム
JP4672073B2 (ja) * 2008-08-22 2011-04-20 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び基板処理装置の運用方法
KR101675857B1 (ko) * 2010-11-09 2016-11-14 엘지디스플레이 주식회사 무인 제어 시스템
JP6063902B2 (ja) * 2014-06-30 2017-01-18 株式会社日立国際電気 基板処理装置及びその制御方法並びにプログラム
JP6309176B2 (ja) * 2016-03-15 2018-04-11 三菱電機株式会社 遠隔作業支援装置、指示用端末及び現場用端末
JP6584356B2 (ja) * 2016-03-30 2019-10-02 東京エレクトロン株式会社 基板処理装置及び基板処理装置の処理方法
JP7061524B2 (ja) * 2018-06-28 2022-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置のメンテナンス装置およびメンテナンス方法
JP7529363B2 (ja) * 2020-08-31 2024-08-06 東京エレクトロン株式会社 半導体製造システム、制御装置、制御方法及びプログラム
TWI850056B (zh) * 2023-08-08 2024-07-21 中華電信股份有限公司 用於企業專網的即時告警狀態變更系統及其方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1111388A (zh) * 1993-12-01 1995-11-08 松下电器产业株式会社 强电介质薄膜及其制造方法
US5559444A (en) * 1991-06-04 1996-09-24 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
US5562772A (en) * 1993-08-02 1996-10-08 Chartered Semiconductor Manufacturing Pte Ltd. Substrate coating apparatus
JP2002231595A (ja) * 2001-01-31 2002-08-16 Hitachi Ltd 半導体製造装置管理システム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
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US4390953A (en) * 1980-11-10 1983-06-28 Kearney & Trecker Corporation Unmanned diagnostic communications system for computer controlled machine tools
US5339074A (en) * 1991-09-13 1994-08-16 Fluoroware, Inc. Very low frequency tracking system
JPH06119090A (ja) * 1992-10-07 1994-04-28 Hitachi Ltd 省電力制御方式
TWI249760B (en) * 1996-07-31 2006-02-21 Canon Kk Remote maintenance system
JP2000155613A (ja) * 1998-11-19 2000-06-06 Nikko Co Ltd 生コンクリート製造プラントの遠隔保守管理装置
US6379465B1 (en) * 1999-09-17 2002-04-30 Nordson Corporation Coating system with centralized control panel and gun mapping
JP3595756B2 (ja) * 2000-06-01 2004-12-02 キヤノン株式会社 露光装置、リソグラフィ装置、ロードロック装置、デバイス製造方法およびリソグラフィ方法
JP4915033B2 (ja) 2000-06-15 2012-04-11 株式会社ニコン 露光装置、基板処理装置及びリソグラフィシステム、並びにデバイス製造方法
JP2002027567A (ja) * 2000-07-12 2002-01-25 Hitachi Kokusai Electric Inc 半導体製造装置のリモート操作システム、半導体製造装置および遠隔操作装置
JP3711237B2 (ja) * 2000-12-27 2005-11-02 東京エレクトロン株式会社 基板処理装置
TW559706B (en) * 2001-06-08 2003-11-01 Hon Hai Prec Ind Co Ltd Method and system for collecting and monitoring shop floor information

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559444A (en) * 1991-06-04 1996-09-24 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
US5562772A (en) * 1993-08-02 1996-10-08 Chartered Semiconductor Manufacturing Pte Ltd. Substrate coating apparatus
CN1111388A (zh) * 1993-12-01 1995-11-08 松下电器产业株式会社 强电介质薄膜及其制造方法
JP2002231595A (ja) * 2001-01-31 2002-08-16 Hitachi Ltd 半導体製造装置管理システム

Also Published As

Publication number Publication date
EP2006741A3 (en) 2009-02-18
EP2006741A2 (en) 2008-12-24
JP4316210B2 (ja) 2009-08-19
JP2004087839A (ja) 2004-03-18
KR101018509B1 (ko) 2011-03-03
CN1679141A (zh) 2005-10-05
US8171879B2 (en) 2012-05-08
EP1536459B1 (en) 2016-01-13
KR20050058498A (ko) 2005-06-16
US20060073654A1 (en) 2006-04-06
US7524378B2 (en) 2009-04-28
WO2004021417A1 (ja) 2004-03-11
EP2006741B1 (en) 2016-01-13
AU2003254901A1 (en) 2004-03-19
US20090157214A1 (en) 2009-06-18
EP1536459A4 (en) 2007-12-26
EP1536459A1 (en) 2005-06-01

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Granted publication date: 20091014