KR101003061B1 - 모노리식 집적 회로용 캐리어 장치 - Google Patents
모노리식 집적 회로용 캐리어 장치 Download PDFInfo
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- KR101003061B1 KR101003061B1 KR1020057006068A KR20057006068A KR101003061B1 KR 101003061 B1 KR101003061 B1 KR 101003061B1 KR 1020057006068 A KR1020057006068 A KR 1020057006068A KR 20057006068 A KR20057006068 A KR 20057006068A KR 101003061 B1 KR101003061 B1 KR 101003061B1
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- Engineering & Computer Science (AREA)
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- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (10)
- 캐리어 장치(1)로서, 모노리식 집적 회로(7)가 캐리어 장치 상으로 부착되고, 상기 캐리어 장치 상에 배열된 스탬핑된(stamped) 받침대(pedestal)들(2, 2')을 구비하고, 상기 스탬핑된 받침대들(2, 2') 중 적어도 하나는 결합선(bonding wire)에 의해 접촉(contact)되지 않는 캐리어 장치에 있어서,상기 스탬핑된 받침대들(2, 2')은 상기 캐리어 장치의 양쪽 마주보는 종방향 측면 상에 배열되고,상기 스탬핑된 받침대들(2, 2')은 상기 캐리어 장치의 평면에 대해 45도보다 크고 180도보다 작은 각(α)을 갖는 측면을 가지고, 상기 각(α)은 상기 스탬핑된 받침대들(2, 2')의 안쪽으로 이루어지는 것이며,상기 스탬핑된 받침대들(2, 2')은 상기 캐리어 장치의 칩 접속 영역 평면에 평행한 평면 표면을 각각 구비하는 것을 특징으로 하는 캐리어 장치.
- 삭제
- 삭제
- 제1항에 있어서, 상기 스탬핑된 받침대들(2, 2') 각각의 높이(hp)는 상기 캐리어 장치 자체의 높이의 1/10보다 크고 상기 캐리어 장치 자체의 높이보다 작은 것을 특징으로 하는 캐리어 장치.
- 제1항 또는 제4항에 있어서, 상기 캐리어 장치(1)는 상기 스탬핑된 받침대들(2, 2')의 영역에서만 은 또는 금 도금으로 마감되는 것을 특징으로 하는 캐리어 장치.
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10247075.8 | 2002-10-09 | ||
DE10247075A DE10247075A1 (de) | 2002-10-09 | 2002-10-09 | Trägereinrichtung für monolithisch integrierte Schaltungen |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050053747A KR20050053747A (ko) | 2005-06-08 |
KR101003061B1 true KR101003061B1 (ko) | 2010-12-22 |
Family
ID=32038391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057006068A KR101003061B1 (ko) | 2002-10-09 | 2003-10-06 | 모노리식 집적 회로용 캐리어 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060151772A1 (ko) |
EP (1) | EP1552558A1 (ko) |
JP (1) | JP4550580B2 (ko) |
KR (1) | KR101003061B1 (ko) |
DE (1) | DE10247075A1 (ko) |
WO (1) | WO2004036646A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7602050B2 (en) * | 2005-07-18 | 2009-10-13 | Qualcomm Incorporated | Integrated circuit packaging |
JP2010073830A (ja) * | 2008-09-17 | 2010-04-02 | Sumitomo Metal Mining Co Ltd | リードフレーム及びリードフレームの製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163024A (ja) * | 1997-11-28 | 1999-06-18 | Sumitomo Metal Mining Co Ltd | 半導体装置とこれを組み立てるためのリードフレーム、及び半導体装置の製造方法 |
WO2001009953A1 (en) | 1999-07-30 | 2001-02-08 | Amkor Technology, Inc. | Lead frame with downset die pad |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5647967Y2 (ko) * | 1976-05-11 | 1981-11-10 | ||
JPS59104148A (ja) * | 1982-12-06 | 1984-06-15 | Nec Corp | 半導体装置 |
JPS63202948A (ja) * | 1987-02-18 | 1988-08-22 | Mitsubishi Electric Corp | リ−ドフレ−ム |
JPS647626A (en) * | 1987-06-30 | 1989-01-11 | Nec Corp | Semiconductor device |
JPH02285665A (ja) * | 1989-04-26 | 1990-11-22 | Nec Corp | リードフレーム |
JPH04107961A (ja) * | 1990-08-29 | 1992-04-09 | Sumitomo Metal Mining Co Ltd | 多層リードフレーム |
JPH04280664A (ja) * | 1990-10-18 | 1992-10-06 | Texas Instr Inc <Ti> | 半導体装置用リードフレーム |
IT1252197B (it) * | 1991-12-12 | 1995-06-05 | Sgs Thomson Microelectronics | Dispositivo di protezione di circuiti integrati associati a relativi supporti. |
JPH0621132A (ja) * | 1992-07-06 | 1994-01-28 | Seiko Epson Corp | 半導体装置とその製造方法 |
US5365409A (en) * | 1993-02-20 | 1994-11-15 | Vlsi Technology, Inc. | Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe |
JPH0778926A (ja) * | 1993-09-07 | 1995-03-20 | Nec Kyushu Ltd | 樹脂封止型半導体装置 |
US5859387A (en) * | 1996-11-29 | 1999-01-12 | Allegro Microsystems, Inc. | Semiconductor device leadframe die attach pad having a raised bond pad |
JPH10247701A (ja) * | 1997-03-05 | 1998-09-14 | Hitachi Ltd | 半導体装置およびその製造に用いるリードフレーム |
US6365976B1 (en) * | 1999-02-25 | 2002-04-02 | Texas Instruments Incorporated | Integrated circuit device with depressions for receiving solder balls and method of fabrication |
JP2002076228A (ja) * | 2000-09-04 | 2002-03-15 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置 |
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2002
- 2002-10-09 DE DE10247075A patent/DE10247075A1/de not_active Withdrawn
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2003
- 2003-10-06 US US10/531,141 patent/US20060151772A1/en not_active Abandoned
- 2003-10-06 EP EP03775171A patent/EP1552558A1/de not_active Withdrawn
- 2003-10-06 JP JP2004544075A patent/JP4550580B2/ja not_active Expired - Lifetime
- 2003-10-06 WO PCT/EP2003/011006 patent/WO2004036646A1/de active Application Filing
- 2003-10-06 KR KR1020057006068A patent/KR101003061B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163024A (ja) * | 1997-11-28 | 1999-06-18 | Sumitomo Metal Mining Co Ltd | 半導体装置とこれを組み立てるためのリードフレーム、及び半導体装置の製造方法 |
WO2001009953A1 (en) | 1999-07-30 | 2001-02-08 | Amkor Technology, Inc. | Lead frame with downset die pad |
Also Published As
Publication number | Publication date |
---|---|
JP4550580B2 (ja) | 2010-09-22 |
KR20050053747A (ko) | 2005-06-08 |
WO2004036646A1 (de) | 2004-04-29 |
US20060151772A1 (en) | 2006-07-13 |
DE10247075A1 (de) | 2004-04-22 |
JP2006503427A (ja) | 2006-01-26 |
EP1552558A1 (de) | 2005-07-13 |
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