KR100970421B1 - 난연성 에폭시 수지 조성물 및 그의 경화물 - Google Patents

난연성 에폭시 수지 조성물 및 그의 경화물 Download PDF

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Publication number
KR100970421B1
KR100970421B1 KR1020057008443A KR20057008443A KR100970421B1 KR 100970421 B1 KR100970421 B1 KR 100970421B1 KR 1020057008443 A KR1020057008443 A KR 1020057008443A KR 20057008443 A KR20057008443 A KR 20057008443A KR 100970421 B1 KR100970421 B1 KR 100970421B1
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
group
component
composition according
Prior art date
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KR1020057008443A
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English (en)
Korean (ko)
Other versions
KR20050086543A (ko
Inventor
야스마사 아카츠카
시게루 모테키
마코토 우치다
가즈노리 이시카와
Original Assignee
니폰 가야꾸 가부시끼가이샤
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Publication of KR20050086543A publication Critical patent/KR20050086543A/ko
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Publication of KR100970421B1 publication Critical patent/KR100970421B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
KR1020057008443A 2002-11-28 2003-11-27 난연성 에폭시 수지 조성물 및 그의 경화물 KR100970421B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002346265 2002-11-28
JPJP-P-2002-00346265 2002-11-28
JP2003067584 2003-03-13
JPJP-P-2003-00067584 2003-03-13

Publications (2)

Publication Number Publication Date
KR20050086543A KR20050086543A (ko) 2005-08-30
KR100970421B1 true KR100970421B1 (ko) 2010-07-15

Family

ID=32396298

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057008443A KR100970421B1 (ko) 2002-11-28 2003-11-27 난연성 에폭시 수지 조성물 및 그의 경화물

Country Status (9)

Country Link
US (1) US20060058469A1 (ja)
EP (1) EP1566395B1 (ja)
JP (1) JP4616771B2 (ja)
KR (1) KR100970421B1 (ja)
AU (1) AU2003284462A1 (ja)
CA (1) CA2507630A1 (ja)
DE (1) DE60326634D1 (ja)
TW (1) TWI306867B (ja)
WO (1) WO2004048436A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2409837B (en) 2004-01-10 2006-09-06 Hexcel Composites Ltd Fibre reinforced resin assembly
JP2006310574A (ja) * 2005-04-28 2006-11-09 Nippon Kayaku Co Ltd 両面フレキシブルプリント基板の製造法及び両面フレキシブルプリント基板。
CN101208373B (zh) * 2005-07-21 2010-12-01 日本化药株式会社 聚酰胺树脂，环氧树脂组合物及其固化物
KR101312369B1 (ko) * 2005-10-31 2013-09-27 니폰 가야꾸 가부시끼가이샤 고무 변성 폴리아미드 수지, 에폭시 수지　조성물　및 그경화물
EP1953337A4 (en) * 2005-10-31 2011-03-30 Panasonic Corp EXPANDER AND HEAT PUMP USING THE SAME
WO2008072630A1 (ja) * 2006-12-13 2008-06-19 Nipponkayaku Kabushikikaisha ポリアミド樹脂、並びにそれを用いるエポキシ樹脂組成物及びその用途
JP4884298B2 (ja) * 2007-05-17 2012-02-29 日本化薬株式会社 樹脂層付き銅箔
WO2009028170A1 (ja) * 2007-08-27 2009-03-05 Nippon Kayaku Kabushiki Kaisha 熱硬化性樹脂組成物及びその硬化物
US20110093880A1 (en) * 2008-02-22 2011-04-21 Nokia Corporation Apparatus and method of providing an integrated rich media environment
JPWO2010058734A1 (ja) * 2008-11-19 2012-04-19 日本化薬株式会社 フェノール性水酸基含有芳香族ポリアミド樹脂およびその用途
JP5136573B2 (ja) 2009-02-24 2013-02-06 日立化成工業株式会社 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
CN109535926B (zh) * 2010-02-24 2021-06-22 昭和电工材料株式会社 清漆、预浸料片、含有树脂的膜、被覆金属箔的层叠板、印制电路布线板
JP2013100409A (ja) * 2011-11-09 2013-05-23 Nippon Kayaku Co Ltd 熱放射性塗料及び構造体
JP5360934B2 (ja) * 2012-02-07 2013-12-04 日本化薬株式会社 両面フレキシブルプリント基板の製造法及び両面フレキシブルプリント基板。
JP6212570B2 (ja) * 2012-12-26 2017-10-11 アクロン ポリマー システムズ，インク． 溶剤耐性フレキシブル基板のためのポリアミドフィルムを製造するためのポリアミド溶液、およびディスプレイ用素子、光学用素子、又は照明用素子の製造方法
US20160215630A1 (en) * 2013-07-15 2016-07-28 General Electric Company Coating, coated turbine component, and coating process
MX2021009283A (es) 2019-01-31 2021-09-08 Ecolab Usa Inc Controlador para un sistema de reutilizacion de agua de enjuague y metodos de uso.
US11572652B2 (en) 2019-01-31 2023-02-07 Ecolab Usa Inc. Controlling water levels and detergent concentration in a wash cycle
CN112898865B (zh) * 2021-01-12 2022-04-12 广东美涂士建材股份有限公司 一种金属闪光漆

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5686557A (en) * 1994-09-21 1997-11-11 Tomoegawa Paper Co., Ltd. Polyamide resin which can be dissolved in alcohol solvent, composition thereof, and method of use thereof
WO2002000791A1 (fr) 2000-06-28 2002-01-03 Nippon Kayaku Kabushiki Kaisha Composition de resine epoxy et objet reticule fabrique a partir de ladite composition

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JP3051466B2 (ja) * 1991-01-28 2000-06-12 株式会社巴川製紙所 フッ素含有アラミドブロック共重合体およびその製造方法
JP3029385B2 (ja) * 1995-01-31 2000-04-04 株式会社巴川製紙所 芳香族ポリアミド樹脂と水溶性樹脂との複合体
JP2909878B2 (ja) * 1995-02-10 1999-06-23 株式会社巴川製紙所 耐熱性樹脂組成物
JP4201150B2 (ja) * 1999-04-14 2008-12-24 日本化薬株式会社 新規硬化性アラミド、重合性組成物およびその硬化物
JP2000313787A (ja) * 1999-04-30 2000-11-14 Tomoegawa Paper Co Ltd エポキシ樹脂組成物及びその硬化物
JP2002069270A (ja) * 2000-01-11 2002-03-08 Nippon Kayaku Co Ltd 難燃性非ハロゲンエポキシ樹脂組成物及びその用途
JP4104107B2 (ja) * 2000-10-05 2008-06-18 日本化薬株式会社 エポキシ樹脂組成物及びその用途
JP2002129101A (ja) * 2000-10-20 2002-05-09 Nippon Kayaku Co Ltd ポリアミド樹脂含有ワニス及びその用途
KR100842024B1 (ko) * 2000-10-20 2008-06-27 니폰 가야꾸 가부시끼가이샤 폴리아미드 수지 함유 조성물 및 그의 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5686557A (en) * 1994-09-21 1997-11-11 Tomoegawa Paper Co., Ltd. Polyamide resin which can be dissolved in alcohol solvent, composition thereof, and method of use thereof
WO2002000791A1 (fr) 2000-06-28 2002-01-03 Nippon Kayaku Kabushiki Kaisha Composition de resine epoxy et objet reticule fabrique a partir de ladite composition

Also Published As

Publication number Publication date
AU2003284462A1 (en) 2004-06-18
JP4616771B2 (ja) 2011-01-19
EP1566395B1 (en) 2009-03-11
EP1566395A4 (en) 2007-04-25
DE60326634D1 (de) 2009-04-23
CA2507630A1 (en) 2004-06-10
EP1566395A1 (en) 2005-08-24
WO2004048436A1 (ja) 2004-06-10
US20060058469A1 (en) 2006-03-16
KR20050086543A (ko) 2005-08-30
TW200415192A (en) 2004-08-16
TWI306867B (en) 2009-03-01
JPWO2004048436A1 (ja) 2006-03-23

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