WO2009028170A1 - 熱硬化性樹脂組成物及びその硬化物 - Google Patents

熱硬化性樹脂組成物及びその硬化物 Download PDF

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Publication number
WO2009028170A1
WO2009028170A1 PCT/JP2008/002306 JP2008002306W WO2009028170A1 WO 2009028170 A1 WO2009028170 A1 WO 2009028170A1 JP 2008002306 W JP2008002306 W JP 2008002306W WO 2009028170 A1 WO2009028170 A1 WO 2009028170A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
skeleton
thermosetting resin
phenol
group
Prior art date
Application number
PCT/JP2008/002306
Other languages
English (en)
French (fr)
Inventor
Shigeru Moteki
Makoto Uchida
Koichi Kawai
Original Assignee
Nippon Kayaku Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kabushiki Kaisha filed Critical Nippon Kayaku Kabushiki Kaisha
Priority to TW097132481A priority Critical patent/TW200909519A/zh
Priority to CN200880104396A priority patent/CN101784580A/zh
Priority to JP2009529985A priority patent/JP5460322B2/ja
Publication of WO2009028170A1 publication Critical patent/WO2009028170A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/46—Amides together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Abstract

　本発明は、(i)反応性水酸基含有ポリアミド樹脂、(ii)ジシクロペンタジエンとフェノールの重縮合体骨格、フェノールアラルキル骨格及びビフェノールアラルキル骨格を有するエポキシ樹脂からなる群から選ばれる少なくとも１種のエポキシ樹脂、及び(iii)上記エポキシ樹脂と同じ骨格を有するフェノール化合物からなる群から選ばれる少なくとも１種のエポキシ樹脂硬化剤を含む熱硬化性樹脂組成物に関するものであり、低い熱処理温度で硬化することができ、しかもその硬化物は高い耐熱性と、広い温度範囲での高い接着強度を有する。従って、該樹脂組成物、フレキシブル配線基板、積層板等の電気、電子材料に使用される接着剤、絶縁保護材料等として有用である。
PCT/JP2008/002306 2007-08-27 2008-08-26 熱硬化性樹脂組成物及びその硬化物 WO2009028170A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW097132481A TW200909519A (en) 2007-08-27 2008-08-26 Thermosetting resin composition and hardened article thereof
CN200880104396A CN101784580A (zh) 2007-08-27 2008-08-26 热固性树脂组合物及其固化物
JP2009529985A JP5460322B2 (ja) 2007-08-27 2008-08-26 熱硬化性樹脂組成物及びその硬化物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-219545 2007-08-27
JP2007219545 2007-08-27

Publications (1)

Publication Number Publication Date
WO2009028170A1 true WO2009028170A1 (ja) 2009-03-05

Family

ID=40386911

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002306 WO2009028170A1 (ja) 2007-08-27 2008-08-26 熱硬化性樹脂組成物及びその硬化物

Country Status (5)

Country Link
JP (1) JP5460322B2 (ja)
KR (1) KR20100057777A (ja)
CN (1) CN101784580A (ja)
TW (1) TW200909519A (ja)
WO (1) WO2009028170A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011114665A1 (ja) * 2010-03-15 2011-09-22 日本化薬株式会社 耐熱用接着剤
JP2012025925A (ja) * 2010-07-28 2012-02-09 Nan Ya Plastics Corp 積層基板用低誘導電率樹脂ワニス組成物及びその製法
US9480154B2 (en) 2005-07-21 2016-10-25 Nippon Kayaku Kabushiki Kaisha Polyamide resin, epoxy resin compositions, and cured articles thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001049082A (ja) * 1999-06-04 2001-02-20 Nippon Kayaku Co Ltd エポキシ樹脂組成物、そのワニス、それを用いたフィルム状接着剤及びその硬化物
JP2004091735A (ja) * 2002-09-03 2004-03-25 Gun Ei Chem Ind Co Ltd 芳香族ポリアミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤
WO2004048436A1 (ja) * 2002-11-28 2004-06-10 Nippon Kayaku Kabushiki Kaisha 難燃性エポキシ樹脂組成物及びその硬化物
JP2004269615A (ja) * 2003-03-06 2004-09-30 Nippon Kayaku Co Ltd エポキシ樹脂組成物、及びその硬化物
JP2008138191A (ja) * 2006-11-07 2008-06-19 Nippon Kayaku Co Ltd ポリアミド樹脂ワニス、その硬化物、および物品。

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001106769A (ja) * 1999-10-06 2001-04-17 Nippon Kayaku Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2007204598A (ja) * 2006-02-01 2007-08-16 Nippon Kayaku Co Ltd 樹脂組成物およびその硬化物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001049082A (ja) * 1999-06-04 2001-02-20 Nippon Kayaku Co Ltd エポキシ樹脂組成物、そのワニス、それを用いたフィルム状接着剤及びその硬化物
JP2004091735A (ja) * 2002-09-03 2004-03-25 Gun Ei Chem Ind Co Ltd 芳香族ポリアミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤
WO2004048436A1 (ja) * 2002-11-28 2004-06-10 Nippon Kayaku Kabushiki Kaisha 難燃性エポキシ樹脂組成物及びその硬化物
JP2004269615A (ja) * 2003-03-06 2004-09-30 Nippon Kayaku Co Ltd エポキシ樹脂組成物、及びその硬化物
JP2008138191A (ja) * 2006-11-07 2008-06-19 Nippon Kayaku Co Ltd ポリアミド樹脂ワニス、その硬化物、および物品。

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9480154B2 (en) 2005-07-21 2016-10-25 Nippon Kayaku Kabushiki Kaisha Polyamide resin, epoxy resin compositions, and cured articles thereof
WO2011114665A1 (ja) * 2010-03-15 2011-09-22 日本化薬株式会社 耐熱用接着剤
CN102791819A (zh) * 2010-03-15 2012-11-21 日本化药株式会社 耐热用胶粘剂
JPWO2011114665A1 (ja) * 2010-03-15 2013-06-27 日本化薬株式会社 耐熱用接着剤
JP5738274B2 (ja) * 2010-03-15 2015-06-24 日本化薬株式会社 耐熱用接着剤
EP2548933A4 (en) * 2010-03-15 2016-09-07 Nippon Kayaku Kk HEAT RESISTANT ADHESIVE
JP2012025925A (ja) * 2010-07-28 2012-02-09 Nan Ya Plastics Corp 積層基板用低誘導電率樹脂ワニス組成物及びその製法

Also Published As

Publication number Publication date
CN101784580A (zh) 2010-07-21
KR20100057777A (ko) 2010-06-01
JP5460322B2 (ja) 2014-04-02
JPWO2009028170A1 (ja) 2010-11-25
TW200909519A (en) 2009-03-01

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