KR100923086B1 - 다중층 거울로 동작하는 밀폐 구조 - Google Patents
다중층 거울로 동작하는 밀폐 구조 Download PDFInfo
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- KR100923086B1 KR100923086B1 KR1020047006780A KR20047006780A KR100923086B1 KR 100923086 B1 KR100923086 B1 KR 100923086B1 KR 1020047006780 A KR1020047006780 A KR 1020047006780A KR 20047006780 A KR20047006780 A KR 20047006780A KR 100923086 B1 KR100923086 B1 KR 100923086B1
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- oled
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- 238000005538 encapsulation Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 48
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 15
- 239000001301 oxygen Substances 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229920000058 polyacrylate Polymers 0.000 claims description 9
- 229920002313 fluoropolymer Polymers 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- -1 cyclotin Polymers 0.000 claims description 3
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 2
- CFAKWWQIUFSQFU-UHFFFAOYSA-N 2-hydroxy-3-methylcyclopent-2-en-1-one Chemical compound CC1=C(O)C(=O)CC1 CFAKWWQIUFSQFU-UHFFFAOYSA-N 0.000 claims 2
- 239000001837 2-hydroxy-3-methylcyclopent-2-en-1-one Substances 0.000 claims 1
- 230000004888 barrier function Effects 0.000 abstract description 14
- 239000010410 layer Substances 0.000 description 75
- 229920000642 polymer Polymers 0.000 description 9
- 150000002739 metals Chemical class 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000004811 fluoropolymer Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000636 poly(norbornene) polymer Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229920004439 Aclar® Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminum fluoride Inorganic materials F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910019015 Mg-Ag Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/876—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/878—Arrangements for extracting light from the devices comprising reflective means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K50/852—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
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- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
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Abstract
Description
Claims (32)
- OLED(Organic Light Emitting Device) 구조로서,기판과;상기 기판 위에 있는 OLED로서, 제 1 전극과, 상기 제 1 전극 위의 방출 구역과, 상기 방출 구역 위의 제 2 전극을 포함하고, 턴 온 되면 일정한 범위의 파장을 갖는 광을 방출하는, OLED와;상기 기판 위에 있는 다중층 거울로서, (a) 제 1 굴절률을 갖는 평면 층과, (b) 상기 제 1 굴절률과는 다른 제 2 굴절률을 갖고, 물과 산소의 확산을 방지하도록 충분히 조밀한 원자 간격을 갖는 고밀도 층이 교대로 놓인 일련의 층을 포함하는, 다중층 거울을포함하고,상기 평면 층과 상기 고밀도 층의 두께는, 상기 다중층 거울이 상기 일정한 범위의 파장 이내의 피크치 파장에서 광을 투과시키도록 튜닝되게 선택되며,상기 평면 층과 상기 고밀도 층은 물과 산소의 투과를 차단하도록 작용하는, OLED 구조.
- 제 1항에 있어서, 상기 다중층 거울은 1/4-파 적층(quarter-wave stack)인, OLED 구조.
- 제 2항에 있어서, 상기 평면 층은 플루오르화된 중합체(fluorinated polymer), 파릴렌(parylene), 시클로틴(cyclotene) 및 폴리아크릴레이트(polyacrylate) 중에서 선택된 재료를 포함하는, OLED 구조.
- 제 2항에 있어서, 상기 고밀도 층은 실리콘 산화물, 실리콘 질화물, 실리콘 옥시질화물, 알루미늄 산화물, 티타늄 산화물, 인듐주석 산화물, 아연인듐주석 산화물 및 금속 중에서 선택된 재료를 포함하는, OLED 구조.
- 제 2항에 있어서, 상기 평면 층은 폴리아크릴레이트를 포함하고, 상기 고밀도 층은 알루미늄산화물을 포함하는, OLED 구조.
- 제 2항에 있어서, 상기 제 1 전극은 애노드이고, 상기 제 2 전극은 캐쏘드인, OLED 구조.
- 제 2항에 있어서, 상기 OLED 디바이스는 상단-방출 디바이스(top-emitting device)인, OLED 구조.
- 제 2항에 있어서, 상기 OLED 디바이스는 하단-방출 디바이스(bottom-emitting device)인, OLED 구조.
- 제 2항에 있어서, 상기 OLED 디바이스는 투명 디바이스인, OLED 구조.
- 제 2항에 있어서, 상기 1/4-파 적층은 상기 OLED와 상기 기판 사이에 제공되며, 상기 제 1 전극은 투명 전극인, OLED 구조.
- 제 10항에 있어서, 상기 제 1 전극은 투명 애노드이고, 상기 제 2 전극은 캐쏘드인, OLED 구조.
- 제 11항에 있어서, 상기 제 2 전극은 반사성 캐쏘드인, OLED 구조.
- 제 10항에 있어서, 상기 제 2 전극은 투명 전극이고, 상기 제 2 전극 위에 제공된 추가적인 1/4-파 적층을 더 포함하는, OLED 구조.
- 제 13항에 있어서, 상기 제 1 전극은 투명 애노드이고, 상기 제 2 전극은 투명 캐쏘드인, OLED 구조.
- 제 2항에 있어서, 상기 1/4-파 적층은 상기 OLED 위에 제공되며, 상기 제 2 전극은 투명 전극인, OLED 구조.
- 제 15항에 있어서, 상기 제 1 전극은 애노드이고, 상기 제 2 전극은 투명 캐쏘드인, OLED 구조.
- 제 16항에 있어서, 상기 제 1 전극은 반사성 애노드인, OLED 구조.
- OLED 구조로서,투명 기판과;상기 투명 기판 위에 있는 OLED로서, 투명 애노드와, 상기 투명 애노드 위의 방출 구역과, 상기 방출 구역 위의 반사성 캐쏘드를 포함하고, 턴 온 되면 일정한 범위의 파장을 갖는 광을 방출하는, OLED와;상기 OLED와 상기 기판 사이에 제공되는 1/4-파 적층으로서, (a) 제 1 굴절률을 갖는 평면 층과, (b) 상기 제 1 굴절률과는 다른 제 2 굴절률을 갖는 고밀도 층이 교대로 놓인 일련의 층을 포함하는, 1/4-파 적층을포함하고,상기 평면 층과 상기 고밀도 층의 두께는, 상기 1/4-파 적층이 상기 일정한 범위의 파장 이내의 피크치 파장에서 광을 투과시키도록 튜닝되게 선택되며,상기 평면 층과 상기 고밀도 층은 물과 산소의 투과를 차단하도록 작용하는, OLED 구조.
- OLED 구조로서,기판과;상기 기판 위에 있는 OLED로서, 반사성 애노드와, 상기 반사성 애노드 위의 방출 구역과, 상기 방출 구역 위의 투명 캐쏘드를 포함하고, 턴 온 되면 일정한 범위의 파장을 갖는 광을 방출하는, OLED와;상기 OLED 위에 있는 1/4-파 적층으로서, (a) 제 1 굴절률을 갖는 평면 층과, (b) 상기 제 1 굴절률과는 다른 제 2 굴절률을 갖는 고밀도 층이 교대로 놓인 일련의 층을 포함하는, 1/4-파 적층을포함하고,상기 평면 층과 상기 고밀도 층의 두께는, 상기 1/4-파 적층이 상기 일정한 범위의 파장 이내의 피크치 파장에서 광을 투과시키도록 튜닝되게 선택되며,상기 평면 층과 상기 고밀도 층은 물과 산소의 투과를 차단하도록 작용하는, OLED 구조.
- 제 1항에 있어서, 상기 평면 층은 플루오르화된 중합체, 파릴렌, 시클로틴 및 폴리아크릴레이트로부터 선택된 재료를 포함하는, OLED 구조.
- 제 1항에 있어서, 상기 고밀도 층은 실리콘산화물, 실리콘질화물, 실리콘옥시질화물, 알루미늄산화물, 티타늄산화물, 인듐주석산화물, 아연인듐주석산화물 및 금속으로부터 선택된 재료를 포함하는, OLED 구조.
- 제 1항에 있어서, 상기 평면 층은 폴리아크릴레이트를 포함하고, 상기 고밀도 층은 알루미늄산화물을 포함하는, OLED 구조.
- 제 1항에 있어서, 상기 제 1 전극은 애노드이며, 제 2 전극은 캐쏘드인, OLED 구조.
- 제 1항에 있어서, 상기 OLED 디바이스는 상단-방출 디바이스인, OLED 구조.
- 제 1항에 있어서, 상기 OLED 디바이스는 하단-방출 디바이스인, OLED 구조.
- 제 1항에 있어서, 상기 OLED 디바이스는 투명 디바이스인, OLED 구조.
- 제 1항에 있어서, 상기 제 1 전극은 투명 전극인, OLED 구조.
- 제 1항에 있어서, 상기 제 2 전극은 투명 전극인, OLED 구조.
- 제 1항에 있어서, 상기 OLED 구조는 유연한, OLED 구조.
- 제 2항에 있어서, 상기 OLED 구조는 유연한, OLED 구조.
- 제 18항에 있어서, 상기 OLED 구조는 유연한, OLED 구조.
- 제 19항에 있어서, 상기 OLED 구조는 유연한, OLED 구조.
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US09/992,437 | 2001-11-06 | ||
US09/992,437 US6888305B2 (en) | 2001-11-06 | 2001-11-06 | Encapsulation structure that acts as a multilayer mirror |
PCT/US2002/035671 WO2003052842A2 (en) | 2001-11-06 | 2002-11-06 | Encapsulation structure that acts as a multilayer mirror |
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US (1) | US6888305B2 (ko) |
EP (1) | EP1442488B1 (ko) |
JP (2) | JP5143996B2 (ko) |
KR (1) | KR100923086B1 (ko) |
CN (1) | CN100435376C (ko) |
AT (1) | ATE384340T1 (ko) |
AU (1) | AU2002365092A1 (ko) |
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WO (1) | WO2003052842A2 (ko) |
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Also Published As
Publication number | Publication date |
---|---|
JP5379287B2 (ja) | 2013-12-25 |
US20030085652A1 (en) | 2003-05-08 |
EP1442488A2 (en) | 2004-08-04 |
JP2006505092A (ja) | 2006-02-09 |
CN1582504A (zh) | 2005-02-16 |
ATE384340T1 (de) | 2008-02-15 |
CN100435376C (zh) | 2008-11-19 |
DE60224698D1 (de) | 2008-03-06 |
WO2003052842A3 (en) | 2004-01-22 |
JP5143996B2 (ja) | 2013-02-13 |
US6888305B2 (en) | 2005-05-03 |
KR20040065554A (ko) | 2004-07-22 |
JP2012253046A (ja) | 2012-12-20 |
DE60224698T2 (de) | 2009-01-15 |
AU2002365092A1 (en) | 2003-06-30 |
EP1442488B1 (en) | 2008-01-16 |
WO2003052842A2 (en) | 2003-06-26 |
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