KR100921874B1 - 물품표면에의 전기도금 피막의 형성방법 - Google Patents
물품표면에의 전기도금 피막의 형성방법 Download PDFInfo
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- KR100921874B1 KR100921874B1 KR1020037012195A KR20037012195A KR100921874B1 KR 100921874 B1 KR100921874 B1 KR 100921874B1 KR 1020037012195 A KR1020037012195 A KR 1020037012195A KR 20037012195 A KR20037012195 A KR 20037012195A KR 100921874 B1 KR100921874 B1 KR 100921874B1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0253—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing permanent magnets
- H01F41/026—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing permanent magnets protecting methods against environmental influences, e.g. oxygen, by surface treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/032—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials
- H01F1/04—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials metals or alloys
- H01F1/047—Alloys characterised by their composition
- H01F1/053—Alloys characterised by their composition containing rare earth metals
- H01F1/055—Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5
- H01F1/057—Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5 and IIIa elements, e.g. Nd2Fe14B
- H01F1/0571—Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5 and IIIa elements, e.g. Nd2Fe14B in the form of particles, e.g. rapid quenched powders or ribbon flakes
- H01F1/0575—Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5 and IIIa elements, e.g. Nd2Fe14B in the form of particles, e.g. rapid quenched powders or ribbon flakes pressed, sintered or bonded together
- H01F1/0578—Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5 and IIIa elements, e.g. Nd2Fe14B in the form of particles, e.g. rapid quenched powders or ribbon flakes pressed, sintered or bonded together bonded together
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
- H01F41/26—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents, e.g. electroplating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Hard Magnetic Materials (AREA)
Abstract
Description
Claims (20)
- 물품표면에 제 1 금속의 분말을 분산시킨 수지로 이루어지는 수지피막을 형성한 후, 이 수지피막형성물품을 제 1 금속보다 귀한 전위(Noble ionization potential)를 가진 제 2 금속의 이온을 함유한 용액에 담금으로써 수지피막표면에 제 2 금속의 치환도금 피막을 형성하고, 더욱 치환도금 피막표면에 제 3 금속의 전기도금 피막을 형성하는 것을 특징으로 하는 물품표면에 전기도금 피막의 형성방법.
- 제 1 항에 있어서, 수지피막이 비도전성 피막인 것을 특징으로 하는 전기도금 피막의 형성방법.
- 제 2 항에 있어서, 물품이 희토류계 영구자석인 것을 특징으로 하는 전기도금 피막의 형성방법.
- 제 3 항에 있어서, 희토류계 영구자석이 본드자석인 것을 특징으로 하는 전기도금 피막의 형성방법.
- 제 2 항에 있어서, 비도전성 피막의 부피저항율이 1×1O4 Ω·cm 이상인 것을 특징으로 하는 전기도금 피막의 형성방법.
- 제 1 항에 있어서, 수지피막중에 있어서의 제 1 금속의 분말의 분산량이 50중량%∼99중량% 인 것을 특징으로 하는 전기도금 피막의 형성방법.
- 제 1 항에 있어서, 제 1 금속의 분말의 평균입자지름이 0.001㎛∼30㎛ 인 것을 특징으로 하는 전기도금 피막의 형성방법.
- 제 1 항에 있어서, 수지피막의 막두께가 1㎛∼100㎛ 인 것을 특징으로 하는 전기도금 피막의 형성방법.
- 제 1 항에 있어서, 제 1 금속이 아연이고 제 2 금속이 니켈 또는 주석인 것을 특징으로 하는 전기도금 피막의 형성방법.
- 제 1 항에 있어서, 제 1 금속이 니켈이고 제 2 금속이 구리인 것을 특징으로 하는 전기도금 피막의 형성방법.
- 제 1 항에 있어서, 제 2 금속과 제 3 금속이 같은 금속인 것을 특징으로 하는 전기도금 피막의 형성방법.
- 제 11 항에 있어서, 치환도금 피막을 형성하는 공정과 전기도금 피막을 형성하는 공정을 하나의 도금욕에서 행하는 것을 특징으로 하는 전기도금 피막의 형성방법.
- 제 1 항에 있어서, 치환도금 피막의 막두께가 0.05㎛∼2㎛인 것을 특징으로 하는 전기도금 피막의 형성방법.
- 제 1 항의 형성방법에 의해 표면에 전기도금 피막이 형성되어 있는 것을 특징으로 하는 물품.
- 물품표면에 제 1 금속의 분말을 분산시킨 수지로 이루어지는 수지피막을 형성한 후, 이 수지피막형성물품을 제 1 금속보다 귀한 전위(Noble ionization potential)를 가진 제 2 금속의 이온을 함유한 용액에 담금으로써 수지피막표면에 제 2 금속의 치환도금 피막을 형성하는 것을 특징으로 하는 물품표면에의 치환도금 피막의 형성방법.
- 제 15 항의 형성방법에 의해 표면에 치환도금 피막이 형성되어 있는 것을 특징으로 하는 물품.
- 희토류계 영구자석표면에 제 1 금속의 분말을 분산시킨 수지로 이루어지는 비도전성 피막을 형성한 후, 비도전성 피막형성자석을 제 1 금속보다 귀(Noble)한 제 2 금속의 이온을 함유한 용액에 담금으로써 비도전성 피막표면에 제 2 금속의 치환도금 피막을 형성하고, 더욱 치환도금피막표면에 제 3 금속의 전기도금 피막을 형성함으로써 제조되는 것을 특징으로 하는 전기도금피막을 표면에 가진 희토류계 영구자석.
- 희토류계 영구자석표면에 제 1 금속의 분말을 분산시킨 수지로 이루어지는 비도전성 피막이 형성되고, 다시 그 표면에 제 1 금속보다 귀(Noble)한 제 2 금속의 치환도금 피막을 사이에 두고 제 3 금속의 전기도금 피막이 형성되어 있는 것을 특징으로 하는 전기도금 피막을 표면에 가진 희토류계 영구자석.
- 희토류계 영구자석표면에 제 1 금속의 분말을 분산시킨 수지로 이루어지는 비도전성 피막이 형성되고, 더욱 그 표면에 제 1 금속보다 귀(Noble)한 제 2 금속의 치환도금 피막이 형성되어 있는 것을 특징으로 하는 치환도금 피막을 표면에 가진 희토류계 영구자석.
- 희토류계 영구자석표면에 제 1 금속의 분말을 분산시킨 수지로 이루어지는 비도전성 피막이 형성되어 있는 것을 특징으로 하는 비도전성 피막을 표면에 가진 희토류계 영구자석.
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2001-00330806 | 2001-10-29 | ||
JP2001330806 | 2001-10-29 | ||
JP2002017686 | 2002-01-25 | ||
JPJP-P-2002-00017686 | 2002-01-25 | ||
JPJP-P-2002-00052834 | 2002-02-28 | ||
JP2002052834 | 2002-02-28 | ||
JP2002220425A JP2004063806A (ja) | 2002-07-29 | 2002-07-29 | リング状ボンド磁石への液体燃料に対する耐久性付与方法 |
JPJP-P-2002-00220425 | 2002-07-29 | ||
PCT/JP2002/011096 WO2003038157A1 (fr) | 2001-10-29 | 2002-10-25 | Procede de formation d'un revetement depose par electrolyse sur la surface d'un article |
Publications (2)
Publication Number | Publication Date |
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KR20040051577A KR20040051577A (ko) | 2004-06-18 |
KR100921874B1 true KR100921874B1 (ko) | 2009-10-13 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020037012195A KR100921874B1 (ko) | 2001-10-29 | 2002-10-25 | 물품표면에의 전기도금 피막의 형성방법 |
Country Status (5)
Country | Link |
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US (1) | US7449100B2 (ko) |
EP (1) | EP1441047B1 (ko) |
KR (1) | KR100921874B1 (ko) |
CN (1) | CN1265028C (ko) |
WO (1) | WO2003038157A1 (ko) |
Families Citing this family (14)
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JP2005204480A (ja) * | 2004-01-19 | 2005-07-28 | Mitsubishi Electric Corp | 回転電機の回転子および回転電機 |
US7208056B2 (en) * | 2004-02-10 | 2007-04-24 | Tdk Corporation | Rare earth sintered magnet, and method for improving mechanical strength and corrosion resistance thereof |
WO2008044803A1 (en) * | 2006-10-13 | 2008-04-17 | Korea Institute Of Science And Technology | Method for manufacturing metal structure and carbon nano tube by using immersion plating |
CN101235500B (zh) * | 2007-02-02 | 2010-08-25 | 比亚迪股份有限公司 | 一种带镀层的壳体的制备方法 |
JP5358145B2 (ja) * | 2007-09-28 | 2013-12-04 | 富士フイルム株式会社 | 導電性材料の製造方法及び導電性材料の製造装置 |
JP5631775B2 (ja) * | 2011-02-24 | 2014-11-26 | 新光電気工業株式会社 | 複合めっき液 |
US20120295121A1 (en) * | 2011-05-20 | 2012-11-22 | S.T. Trading Company Limited | Fabrication of mirror-like coatings |
CZ2011732A3 (cs) * | 2011-11-15 | 2013-05-22 | Active Optix S.R.O. | Zpusob výroby výrobku z geopolymerního kompozitu |
CN103614754B (zh) * | 2013-12-06 | 2016-01-27 | 深圳市麦捷微电子科技股份有限公司 | 一种片式铁氧体产品在电镀前的处理方法 |
JP6090589B2 (ja) * | 2014-02-19 | 2017-03-08 | 信越化学工業株式会社 | 希土類永久磁石の製造方法 |
DE202016008419U1 (de) | 2015-12-23 | 2017-12-20 | Apple Inc. | Gehäuse mit metallischer lnnenflächenschicht |
US10447834B2 (en) | 2016-09-21 | 2019-10-15 | Apple Inc. | Electronic device having a composite structure |
EP3407468A1 (de) * | 2017-05-22 | 2018-11-28 | Ovalo GmbH | Rotor für einen elektromotor und herstellungsverfahren eines solchen rotors |
CN111270280B (zh) * | 2020-01-23 | 2021-03-30 | 北京麦戈龙科技有限公司 | 烧结钕铁硼磁体的镀层结构及其制备方法 |
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2002
- 2002-10-25 KR KR1020037012195A patent/KR100921874B1/ko active IP Right Grant
- 2002-10-25 CN CNB028073932A patent/CN1265028C/zh not_active Expired - Lifetime
- 2002-10-25 WO PCT/JP2002/011096 patent/WO2003038157A1/ja active Application Filing
- 2002-10-25 EP EP02777953.7A patent/EP1441047B1/en not_active Expired - Lifetime
- 2002-10-25 US US10/467,349 patent/US7449100B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11233324A (ja) | 1998-02-12 | 1999-08-27 | Sumitomo Special Metals Co Ltd | 高耐食性R−Fe−B系ボンド磁石とその製造方法 |
JPH11260614A (ja) | 1998-03-12 | 1999-09-24 | Sumitomo Special Metals Co Ltd | 高耐食性R−Fe−B系ボンド磁石とその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1441047A1 (en) | 2004-07-28 |
EP1441047A4 (en) | 2007-05-02 |
US7449100B2 (en) | 2008-11-11 |
KR20040051577A (ko) | 2004-06-18 |
EP1441047B1 (en) | 2016-01-20 |
WO2003038157A1 (fr) | 2003-05-08 |
CN1265028C (zh) | 2006-07-19 |
CN1500157A (zh) | 2004-05-26 |
US20040069650A1 (en) | 2004-04-15 |
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