KR100882988B1 - 유기 피막의 제거 방법 - Google Patents
유기 피막의 제거 방법 Download PDFInfo
- Publication number
- KR100882988B1 KR100882988B1 KR1020020064786A KR20020064786A KR100882988B1 KR 100882988 B1 KR100882988 B1 KR 100882988B1 KR 1020020064786 A KR1020020064786 A KR 1020020064786A KR 20020064786 A KR20020064786 A KR 20020064786A KR 100882988 B1 KR100882988 B1 KR 100882988B1
- Authority
- KR
- South Korea
- Prior art keywords
- liquid
- ozone
- treatment
- treatment liquid
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- H10P50/613—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D9/00—Chemical paint or ink removers
- C09D9/005—Chemical paint or ink removers containing organic solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/266—Esters or carbonates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Emergency Medicine (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Materials Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001325516 | 2001-10-23 | ||
| JPJP-P-2001-00325516 | 2001-10-23 | ||
| JPJP-P-2002-00061096 | 2002-03-06 | ||
| JP2002061096 | 2002-03-06 | ||
| JPJP-P-2002-00229394 | 2002-08-07 | ||
| JP2002229394A JP3914842B2 (ja) | 2001-10-23 | 2002-08-07 | 有機被膜の除去方法および除去装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050111295A Division KR100806476B1 (ko) | 2001-10-23 | 2005-11-21 | 유기 피막의 제거 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20030033988A KR20030033988A (ko) | 2003-05-01 |
| KR100882988B1 true KR100882988B1 (ko) | 2009-02-12 |
Family
ID=27347717
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020020064786A Expired - Fee Related KR100882988B1 (ko) | 2001-10-23 | 2002-10-23 | 유기 피막의 제거 방법 |
| KR1020050111295A Expired - Fee Related KR100806476B1 (ko) | 2001-10-23 | 2005-11-21 | 유기 피막의 제거 장치 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050111295A Expired - Fee Related KR100806476B1 (ko) | 2001-10-23 | 2005-11-21 | 유기 피막의 제거 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6696228B2 (enExample) |
| JP (1) | JP3914842B2 (enExample) |
| KR (2) | KR100882988B1 (enExample) |
| CN (1) | CN1286154C (enExample) |
| TW (1) | TW584893B (enExample) |
Families Citing this family (85)
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| WO2004022658A1 (en) * | 2002-09-06 | 2004-03-18 | Basf Corporation | Method of removing coatings from plastic articles |
| KR100951898B1 (ko) * | 2002-12-09 | 2010-04-09 | 삼성전자주식회사 | 포토레지스트 제거용 스트리핑 조성물 및 이를 사용한액정 표시 장치의 박막 트랜지스터 기판의 제조방법 |
| US20080140379A1 (en) * | 2003-05-22 | 2008-06-12 | Xoomsys, Inc. | Approximations for simulations of systems |
| US7253092B2 (en) * | 2003-06-24 | 2007-08-07 | Nec Electronics America, Inc. | Tungsten plug corrosion prevention method using water |
| JP4397646B2 (ja) * | 2003-07-30 | 2010-01-13 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| US7052992B2 (en) * | 2003-10-28 | 2006-05-30 | Nec Electronics America, Inc. | Tungsten plug corrosion prevention method using ionized air |
| US6977215B2 (en) * | 2003-10-28 | 2005-12-20 | Nec Electronics America, Inc. | Tungsten plug corrosion prevention method using gas sparged water |
| DE10351689A1 (de) * | 2003-11-06 | 2005-06-16 | Khs Maschinen- Und Anlagenbau Ag | Verfahren zum Betreiben einer Pasteurisierungsanlage |
| US7202175B2 (en) * | 2003-11-07 | 2007-04-10 | Industrial Technology Research Institute | Method and apparatus for treating a substrate surface by bubbling |
| JP2005169287A (ja) * | 2003-12-11 | 2005-06-30 | Nomura Micro Sci Co Ltd | 有機被膜洗浄液の再生装置及び再生方法並びに有機被膜の洗浄装置及び洗浄方法 |
| JP2005236083A (ja) * | 2004-02-20 | 2005-09-02 | Toshiba Corp | 半導体装置の製造方法 |
| CN100397155C (zh) * | 2004-06-11 | 2008-06-25 | 鸿富锦精密工业(深圳)有限公司 | 基板处理装置及处理方法 |
| KR20050120914A (ko) * | 2004-06-21 | 2005-12-26 | 주식회사 동진쎄미켐 | 레지스트 제거용 조성물 |
| JP2006019575A (ja) | 2004-07-02 | 2006-01-19 | Sharp Corp | フォトレジストの現像方法及び現像装置 |
| JP4321815B2 (ja) * | 2004-07-30 | 2009-08-26 | 富士フイルム株式会社 | 感光材料処理装置 |
| US7632756B2 (en) * | 2004-08-26 | 2009-12-15 | Applied Materials, Inc. | Semiconductor processing using energized hydrogen gas and in combination with wet cleaning |
| US7235479B2 (en) * | 2004-08-26 | 2007-06-26 | Applied Materials, Inc. | Organic solvents having ozone dissolved therein for semiconductor processing utilizing sacrificial materials |
| US20060084260A1 (en) * | 2004-09-07 | 2006-04-20 | Boyers David G | Copper processing using an ozone-solvent solution |
| US8603258B2 (en) | 2004-09-14 | 2013-12-10 | Church & Dwight Co., Inc. | Paint and ink remover two-phase system |
| JP4883975B2 (ja) * | 2004-10-19 | 2012-02-22 | 株式会社レナテック | 基体表面上の付着物の除去方法、除去用処理液および除去装置 |
| KR100625486B1 (ko) * | 2004-11-04 | 2006-09-20 | 주식회사 디엠에스 | 평판 디스플레이용 기판처리장치 및 기판처리방법 |
| JP4503426B2 (ja) * | 2004-11-30 | 2010-07-14 | 野村マイクロ・サイエンス株式会社 | 洗浄装置 |
| JP2006173211A (ja) * | 2004-12-13 | 2006-06-29 | Sekisui Chem Co Ltd | レジスト除去方法及びレジスト除去装置 |
| JP2006310767A (ja) * | 2005-03-28 | 2006-11-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| KR100690347B1 (ko) * | 2005-04-09 | 2007-03-09 | 주식회사 엘지화학 | 박리액 조성물, 이를 이용한 박리 방법 및 그 박리 장치 |
| CN101199038A (zh) * | 2005-06-22 | 2008-06-11 | 东亚合成株式会社 | 基体表面上的有机被膜的除去方法及除去装置 |
| KR20080024485A (ko) * | 2005-07-05 | 2008-03-18 | 도아고세이가부시키가이샤 | 박리액 중의 유기물 농도를 관리한 기체의 제조 방법 |
| JP4413831B2 (ja) * | 2005-08-11 | 2010-02-10 | 株式会社日立ハイテクノロジーズ | ウェハ表面検査装置及びウェハ表面検査方法 |
| US20070095366A1 (en) * | 2005-11-02 | 2007-05-03 | Applied Materials, Inc. | Stripping and cleaning of organic-containing materials from electronic device substrate surfaces |
| US7402213B2 (en) * | 2006-02-03 | 2008-07-22 | Applied Materials, Inc. | Stripping and removal of organic-containing materials from electronic device substrate surfaces |
| US20070261718A1 (en) * | 2006-05-10 | 2007-11-15 | Rubinder Randhawa | Method and apparatus for ozone-enhanced cleaning of flat objects with pulsed liquid jet |
| KR100801149B1 (ko) * | 2006-05-18 | 2008-02-11 | (주)엠아이반도체 | 패키지된 반도체 및 전자부품의 몰딩 수지 제거장치 |
| CN1888878B (zh) * | 2006-07-14 | 2012-05-30 | 沪东中华造船(集团)有限公司 | 不燃型着色探伤清洗液及其制备方法 |
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| PL3218317T3 (pl) | 2014-11-13 | 2019-03-29 | Gerresheimer Glas Gmbh | Filtr cząstek urządzenia do wytwarzania szkła, jednostka tłoka, głowica dmuchu, wspornik głowicy dmuchu i urządzenie do wytwarzania szkła, przystosowane lub zawierające filtr |
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| CN108463437B (zh) | 2015-12-21 | 2022-07-08 | 德尔塔阀门公司 | 包括消毒装置的流体输送系统 |
| JP6439766B2 (ja) * | 2016-09-23 | 2018-12-19 | 東京エレクトロン株式会社 | 塗布、現像方法及び塗布、現像装置 |
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| JP2019126746A (ja) * | 2018-01-22 | 2019-08-01 | 株式会社ディスコ | 加工装置 |
| CN108831995B (zh) * | 2018-06-08 | 2022-07-29 | 东君新能源有限公司 | 一种柔性组件中有机层的分离方法 |
| US10663865B2 (en) * | 2018-06-29 | 2020-05-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photoresist recycling apparatus |
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| JP7314634B2 (ja) * | 2019-06-11 | 2023-07-26 | 東京エレクトロン株式会社 | 塗布装置及び塗布方法 |
| WO2022221641A1 (en) * | 2021-04-15 | 2022-10-20 | Zep Ip Holding Llc | System and method for assessing cleanliness |
| CN113600541B (zh) * | 2021-08-19 | 2022-06-21 | 富兰克科技(深圳)股份有限公司 | 一种低排放环保单工位智能水油通用清洗机 |
| CN113917806A (zh) * | 2021-10-15 | 2022-01-11 | 广州奥松电子股份有限公司 | 光刻胶清洗装置及其清洗方法 |
| CN113959045A (zh) * | 2021-10-27 | 2022-01-21 | 杭州树派环保科技有限公司 | 室内空气治理用除异味的装置及除异味装置用自清洁装置 |
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| CN117181694B (zh) * | 2023-05-31 | 2025-11-04 | 安徽富乐德科技发展股份有限公司 | 一种Faceplate部件清洗装置及清洗药水配方 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000150349A (ja) * | 1998-11-13 | 2000-05-30 | Mitsubishi Electric Corp | フォトレジスト膜除去方法および装置 |
| JP2001194806A (ja) * | 1999-10-25 | 2001-07-19 | Toray Ind Inc | レジスト剥離方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6007970A (en) * | 1992-02-07 | 1999-12-28 | Canon Kabushiki Kaisha | Lithographic developer containing surfactant |
| JP3150509B2 (ja) * | 1992-11-27 | 2001-03-26 | 株式会社日立製作所 | 有機物除去方法及びその方法を使用するための装置 |
| KR970053127A (ko) * | 1995-12-30 | 1997-07-29 | 김주용 | 반도체 기판의 세정방법 |
| US6277753B1 (en) * | 1998-09-28 | 2001-08-21 | Supercritical Systems Inc. | Removal of CMP residue from semiconductors using supercritical carbon dioxide process |
| JP3728945B2 (ja) | 1998-10-30 | 2005-12-21 | オルガノ株式会社 | フォトレジスト現像廃液からの現像液の回収再利用方法及び装置 |
| US6758938B1 (en) * | 1999-08-31 | 2004-07-06 | Micron Technology, Inc. | Delivery of dissolved ozone |
| US6372700B1 (en) * | 2000-03-31 | 2002-04-16 | 3M Innovative Properties Company | Fluorinated solvent compositions containing ozone |
| JP4695026B2 (ja) * | 2006-06-20 | 2011-06-08 | ヤンマー株式会社 | コンバイン |
-
2002
- 2002-08-07 JP JP2002229394A patent/JP3914842B2/ja not_active Expired - Fee Related
- 2002-10-18 TW TW091124051A patent/TW584893B/zh not_active IP Right Cessation
- 2002-10-21 US US10/274,153 patent/US6696228B2/en not_active Expired - Fee Related
- 2002-10-22 CN CNB021471231A patent/CN1286154C/zh not_active Expired - Lifetime
- 2002-10-23 KR KR1020020064786A patent/KR100882988B1/ko not_active Expired - Fee Related
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2003
- 2003-10-14 US US10/683,288 patent/US6851873B2/en not_active Expired - Lifetime
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2005
- 2005-11-21 KR KR1020050111295A patent/KR100806476B1/ko not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000150349A (ja) * | 1998-11-13 | 2000-05-30 | Mitsubishi Electric Corp | フォトレジスト膜除去方法および装置 |
| JP2001194806A (ja) * | 1999-10-25 | 2001-07-19 | Toray Ind Inc | レジスト剥離方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1414610A (zh) | 2003-04-30 |
| TW584893B (en) | 2004-04-21 |
| US6851873B2 (en) | 2005-02-08 |
| US20030108823A1 (en) | 2003-06-12 |
| CN1286154C (zh) | 2006-11-22 |
| KR20050115844A (ko) | 2005-12-08 |
| US20040076912A1 (en) | 2004-04-22 |
| KR20030033988A (ko) | 2003-05-01 |
| KR100806476B1 (ko) | 2008-02-21 |
| JP2003330206A (ja) | 2003-11-19 |
| JP3914842B2 (ja) | 2007-05-16 |
| US6696228B2 (en) | 2004-02-24 |
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