KR100856145B1 - 진공 챔버 및 진공 처리 장치 - Google Patents

진공 챔버 및 진공 처리 장치 Download PDF

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Publication number
KR100856145B1
KR100856145B1 KR1020060083845A KR20060083845A KR100856145B1 KR 100856145 B1 KR100856145 B1 KR 100856145B1 KR 1020060083845 A KR1020060083845 A KR 1020060083845A KR 20060083845 A KR20060083845 A KR 20060083845A KR 100856145 B1 KR100856145 B1 KR 100856145B1
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South Korea
Prior art keywords
frame body
main frame
vacuum chamber
vacuum
reinforcing
Prior art date
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Expired - Fee Related
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KR1020060083845A
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English (en)
Korean (ko)
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KR20070026215A (ko
Inventor
세이지 오카베
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도쿄엘렉트론가부시키가이샤
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Publication of KR20070026215A publication Critical patent/KR20070026215A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020060083845A 2005-09-02 2006-08-31 진공 챔버 및 진공 처리 장치 Expired - Fee Related KR100856145B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005255294A JP4791110B2 (ja) 2005-09-02 2005-09-02 真空チャンバおよび真空処理装置
JPJP-P-2005-00255294 2005-09-02

Publications (2)

Publication Number Publication Date
KR20070026215A KR20070026215A (ko) 2007-03-08
KR100856145B1 true KR100856145B1 (ko) 2008-09-03

Family

ID=37817679

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060083845A Expired - Fee Related KR100856145B1 (ko) 2005-09-02 2006-08-31 진공 챔버 및 진공 처리 장치

Country Status (4)

Country Link
JP (1) JP4791110B2 (enExample)
KR (1) KR100856145B1 (enExample)
CN (1) CN100421212C (enExample)
TW (1) TWI406332B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200095164A (ko) 2019-01-31 2020-08-10 (주)에프티엘 진공챔버의 리브를 용접하기 위한 용접지그장치
KR102785109B1 (ko) 2024-08-30 2025-03-26 주식회사 창하이앤지 리브를 용접하기 위한 용접 테이블 장치
KR102785110B1 (ko) 2024-08-30 2025-03-26 주식회사 창하이앤지 용접용 지그

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100423179C (zh) 2002-06-21 2008-10-01 应用材料股份有限公司 用于真空处理系统的传送处理室
KR101101757B1 (ko) * 2005-11-07 2012-01-05 주성엔지니어링(주) 제조비용을 절감한 진공챔버
WO2009078351A1 (ja) * 2007-12-14 2009-06-25 Ulvac, Inc. チャンバ及び成膜装置
JP5551346B2 (ja) * 2008-06-10 2014-07-16 東京エレクトロン株式会社 チャンバ及び処理装置
CN102272350B (zh) * 2009-01-14 2014-12-24 株式会社爱发科 等离子cvd装置
FI122940B (fi) * 2009-02-09 2012-09-14 Beneq Oy Reaktiokammio
KR20110067939A (ko) * 2009-12-15 2011-06-22 주식회사 테스 로드락 챔버
KR101598176B1 (ko) * 2010-03-30 2016-02-26 주식회사 원익아이피에스 진공챔버
JP5526988B2 (ja) * 2010-04-28 2014-06-18 東京エレクトロン株式会社 基板処理装置及び基板処理システム
KR101363064B1 (ko) * 2012-05-22 2014-02-14 박종민 진공 챔버 구조
US9717147B2 (en) 2013-09-26 2017-07-25 Applied Materials, Inc. Electronic device manufacturing system
JP7023097B2 (ja) * 2016-12-28 2022-02-21 東京エレクトロン株式会社 真空チャンバおよび真空チャンバの扉の施錠方法
JP6625597B2 (ja) * 2017-11-13 2019-12-25 平田機工株式会社 搬送チャンバ
JP7277137B2 (ja) * 2018-12-28 2023-05-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および搬送モジュール
KR102720200B1 (ko) * 2019-10-10 2024-10-21 주성엔지니어링(주) 클러스터형 기판처리장치
WO2025047616A1 (ja) * 2023-08-31 2025-03-06 キヤノントッキ株式会社 真空チャンバ及び成膜装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077974A (ja) * 2001-08-31 2003-03-14 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2003188226A (ja) * 2001-12-18 2003-07-04 Anelva Corp 真空搬送処理装置
KR20040090496A (ko) * 2003-05-08 2004-10-25 가부시키가이샤 아루박 진공처리장치용 진공챔버
KR20040093408A (ko) * 2003-04-22 2004-11-05 에이에스엠엘 네델란즈 비.브이. 기판 캐리어 및 기판 캐리어 제조 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3608065B2 (ja) * 1996-10-31 2005-01-05 東京エレクトロン株式会社 縦型熱処理装置およびそのボートと保温筒のメンテナンス方法
US5914493A (en) * 1997-02-21 1999-06-22 Nikon Corporation Charged-particle-beam exposure apparatus and methods with substrate-temperature control
US6241117B1 (en) * 1997-11-26 2001-06-05 Steven R. Wickins Pressure differential containment structure
JP4253107B2 (ja) * 2000-08-24 2009-04-08 キヤノンアネルバ株式会社 基板処理装置及びその増設方法
JP4003412B2 (ja) * 2001-06-20 2007-11-07 株式会社島津製作所 真空チャンバ及びその真空チャンバを用いた液晶注入装置
JP2004089872A (ja) * 2002-08-30 2004-03-25 Tsukishima Kikai Co Ltd 真空装置
JP2004311640A (ja) * 2003-04-04 2004-11-04 Tokyo Electron Ltd 処理容器
KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
JP4833512B2 (ja) * 2003-06-24 2011-12-07 東京エレクトロン株式会社 被処理体処理装置、被処理体処理方法及び被処理体搬送方法
JP4767574B2 (ja) * 2005-03-31 2011-09-07 東京エレクトロン株式会社 処理チャンバおよび処理装置
JP4079157B2 (ja) * 2005-04-12 2008-04-23 東京エレクトロン株式会社 ゲートバルブ装置及び処理システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077974A (ja) * 2001-08-31 2003-03-14 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2003188226A (ja) * 2001-12-18 2003-07-04 Anelva Corp 真空搬送処理装置
KR20040093408A (ko) * 2003-04-22 2004-11-05 에이에스엠엘 네델란즈 비.브이. 기판 캐리어 및 기판 캐리어 제조 방법
KR20040090496A (ko) * 2003-05-08 2004-10-25 가부시키가이샤 아루박 진공처리장치용 진공챔버

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200095164A (ko) 2019-01-31 2020-08-10 (주)에프티엘 진공챔버의 리브를 용접하기 위한 용접지그장치
KR102785109B1 (ko) 2024-08-30 2025-03-26 주식회사 창하이앤지 리브를 용접하기 위한 용접 테이블 장치
KR102785110B1 (ko) 2024-08-30 2025-03-26 주식회사 창하이앤지 용접용 지그

Also Published As

Publication number Publication date
CN1925111A (zh) 2007-03-07
JP2007073542A (ja) 2007-03-22
TWI406332B (zh) 2013-08-21
CN100421212C (zh) 2008-09-24
KR20070026215A (ko) 2007-03-08
JP4791110B2 (ja) 2011-10-12
TW200731391A (en) 2007-08-16

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