JP5551346B2 - チャンバ及び処理装置 - Google Patents
チャンバ及び処理装置 Download PDFInfo
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- JP5551346B2 JP5551346B2 JP2008151533A JP2008151533A JP5551346B2 JP 5551346 B2 JP5551346 B2 JP 5551346B2 JP 2008151533 A JP2008151533 A JP 2008151533A JP 2008151533 A JP2008151533 A JP 2008151533A JP 5551346 B2 JP5551346 B2 JP 5551346B2
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- processing chamber
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- 238000012545 processing Methods 0.000 title claims description 102
- 125000006850 spacer group Chemical group 0.000 claims description 9
- 239000000758 substrate Substances 0.000 description 31
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000008901 benefit Effects 0.000 description 11
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- 238000012546 transfer Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
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- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
Description
図1Aはこの発明の第1の実施形態に係るチャンバを処理チャンバに適応させた一例を示す斜視図、図1Bは図1Aに示す処理チャンバの分解斜視図である。
図3Aはこの発明の第2の実施形態に係るチャンバを処理チャンバに適応させた一例を示す斜視図、図3Bは図3Aに示すチャンバの分解斜視図である。
図7はこの発明の第3の実施形態に係るチャンバを処理チャンバに適応させた一例を示す分解斜視図、図8はこの発明の第3の実施形態に係るチャンバの他例を示す分解斜視図である。
図9Aはこの発明の第4の実施形態に係るチャンバを処理チャンバに適応させた一例を示す水平断面図、図9Bは図9Aに示す9B−9B線に示す断面図、図9Cは図9Aに示す9C−9C線に示す断面図である。
Claims (7)
- 少なくとも一つの側面を開放した直方体状の本体と、
前記本体の開放された側面に着脱自在に取り付けられた、前記本体とともにチャンバを構成する側板と、
を具備し、
前記側板は前記側面に、脱着可能な固定部材により着脱自在に取り付けられ、かつ、前記本体にヒンジを介して全体的に開閉自在に取り付けられ、
前記本体の幅、高さ、奥行きがそれぞれ輸送サイズの限界以内に収まり、前記側板が取り付けられた本体の、側板取り付け方向に沿った幅が、輸送サイズの限界を超えることを特徴とするチャンバ。 - 前記本体は角筒形状を有し、該角筒の端部が前記側面に対応することを特徴とする請求項1に記載のチャンバ。
- 前記側板は前記本体内部に向かって窪みを持つ箱形の部材であることを特徴とする請求項1または請求項2に記載のチャンバ。
- 前記本体の開放された側面と前記側板の間に前記本体の開口形状に合致した開口を持つスペーサが存在することを特徴とする請求項1から請求項3のいずれか一項に記載のチャンバ。
- 前記側板にリブが取り付けられ、前記側板の肉厚が、前記本体の側壁の肉厚よりも薄いことを特徴とする請求項1から請求項4のいずれか一項に記載のチャンバ。
- 被処理体の平面形状が矩形であり、前記矩形の最も短い辺の長さが2800mm以上であることを特徴とする請求項1から請求項5のいずれか一項に記載のチャンバ。
- 前記請求項1から請求項6のいずれか一項に記載のチャンバを、被処理体に処理を行う処理室に使用したことを特徴とする処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008151533A JP5551346B2 (ja) | 2008-06-10 | 2008-06-10 | チャンバ及び処理装置 |
KR1020090051074A KR101148393B1 (ko) | 2008-06-10 | 2009-06-09 | 챔버 및 처리 장치 |
TW098119214A TWI505397B (zh) | 2008-06-10 | 2009-06-09 | Chamber and processing device |
CN2009101460317A CN101604610B (zh) | 2008-06-10 | 2009-06-10 | 腔室和处理装置 |
KR1020110041595A KR101514108B1 (ko) | 2008-06-10 | 2011-05-02 | 챔버 및 처리 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008151533A JP5551346B2 (ja) | 2008-06-10 | 2008-06-10 | チャンバ及び処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009302106A JP2009302106A (ja) | 2009-12-24 |
JP5551346B2 true JP5551346B2 (ja) | 2014-07-16 |
Family
ID=41470288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008151533A Active JP5551346B2 (ja) | 2008-06-10 | 2008-06-10 | チャンバ及び処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5551346B2 (ja) |
KR (2) | KR101148393B1 (ja) |
CN (1) | CN101604610B (ja) |
TW (1) | TWI505397B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102272350B (zh) * | 2009-01-14 | 2014-12-24 | 株式会社爱发科 | 等离子cvd装置 |
JP5158994B2 (ja) * | 2009-02-06 | 2013-03-06 | 株式会社アルバック | チャンバ |
US11049740B1 (en) | 2019-12-05 | 2021-06-29 | Applied Materials, Inc. | Reconfigurable mainframe with replaceable interface plate |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0521581A (ja) * | 1991-07-15 | 1993-01-29 | Tokyo Electron Ltd | 真空処理装置 |
JPH09129697A (ja) * | 1995-10-27 | 1997-05-16 | Sony Corp | 物品処理装置 |
JPH09209150A (ja) * | 1996-02-06 | 1997-08-12 | Tokyo Electron Ltd | 真空チャンバ及びその製造方法 |
JP2001073138A (ja) * | 1999-09-07 | 2001-03-21 | Shimadzu Corp | 基板処理装置 |
CN2445640Y (zh) * | 2000-10-11 | 2001-09-05 | 陈安军 | 能自由调节宽窄的家具 |
KR100595418B1 (ko) * | 2004-07-27 | 2006-07-03 | (주)아이씨디 | 알루미늄 플라즈마 챔버 및 그 제조 방법 |
KR100544896B1 (ko) * | 2004-07-27 | 2006-01-24 | (주)아이씨디 | 일체형 실링부재를 구비한 알루미늄 플라즈마 챔버 |
JP4587784B2 (ja) * | 2004-11-12 | 2010-11-24 | 株式会社アルバック | 真空チャンバ |
JP4791110B2 (ja) * | 2005-09-02 | 2011-10-12 | 東京エレクトロン株式会社 | 真空チャンバおよび真空処理装置 |
JP4903013B2 (ja) * | 2006-05-17 | 2012-03-21 | 東京エレクトロン株式会社 | 減圧容器、減圧処理装置および減圧容器の製造方法 |
-
2008
- 2008-06-10 JP JP2008151533A patent/JP5551346B2/ja active Active
-
2009
- 2009-06-09 KR KR1020090051074A patent/KR101148393B1/ko active IP Right Grant
- 2009-06-09 TW TW098119214A patent/TWI505397B/zh active
- 2009-06-10 CN CN2009101460317A patent/CN101604610B/zh active Active
-
2011
- 2011-05-02 KR KR1020110041595A patent/KR101514108B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201011855A (en) | 2010-03-16 |
KR101148393B1 (ko) | 2012-05-21 |
KR20090128339A (ko) | 2009-12-15 |
CN101604610B (zh) | 2013-02-13 |
TWI505397B (zh) | 2015-10-21 |
CN101604610A (zh) | 2009-12-16 |
KR101514108B1 (ko) | 2015-04-22 |
KR20110069748A (ko) | 2011-06-23 |
JP2009302106A (ja) | 2009-12-24 |
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