201011855 六、發明說明： 【發明所屬之技術領域】 本發明係關於對平面顯示器用基板（以下’稱爲FPD 用基板）等之大型被處理體執行處理之處理腔室（處理室 )等之腔室及處理裝置。 【先前技術】 e 就以在FPD生產工場中所使用之裝置而言，所知的有 在真空或減壓環境下對FPD用基板施予各種處理之處理裝 置，例如利用電漿對屬於被處理體之FPD用基板施予蝕刻 等之處理的電漿處理裝置" 電漿處理裝置係例如專利文獻1所記載般，具備有對 被處理體施予電漿處理之處理腔室（處理室）、具有搬運 被處理體之搬運機構的搬運腔室（搬運室），和裝載鎖定 腔室（裝載鎖定室）等之各種腔室。在處理腔室內，配設 Ο 有互相對向之上部電極，和兼作載置被處理體之載置台的 下部電極。對上部電極和下部電極之間施加高頻，使上部 電極和下部電極之間之處理空間產生電漿。 然而，被處理體尤其係FPD用基板日漸朝向大型化， 現在於實際之FPD製造中使用大槪2000 mm〜2400 mm方形 大小之基板。FPD用基板之尺寸今後也朝向大型化，最終 成爲大約3000mm方形，或超過此。FPD用基板之大型化因 可以增加自一片基板所取得之FPD面板數，故有謀求降低 成本之優點。 -5- 201011855 並且’於專利文獻2記載著即使在設置腔室之後，亦 可以依據使用者之要求簡易變更腔室之形狀或大小的腔室 〇 [專利文獻1]日本特開2007-67218號公報 [專利文獻2]日本特開2004-335743號公報 【發明內容】 (發明所欲解決之課題） _ FPD用基板之大型化導致對FPD用基板執行處理之處 理腔室等之腔室本身之大型化，隨此處理裝置全體也大型 化。通常FPD用基板之處理裝置係將處理裝置分成每個腔 室，從處理裝置製造工場運送至FPD生產工場。但是，因 當腔室本身變大時，腔室本身最終超過運送尺寸之界限， 故要將處理裝置從其製造工場運送至FPD生產工場則有困 難。 本發明之目的係提供即使超過運送尺寸之界限亦可以 @ 運送之腔室，及使用該腔室之處理裝置。 (用以解決課題之手段） 爲了解決上述課題，本發明之第1態樣所涉及之腔室 ，具備開放至少一個之側面的長方體狀之本體，和裝卸自 如地被安裝在上述本體之被開放之側面的側板。 本發明之第2態樣所涉及之腔室，具備開放至少一個 之側面的長方體之本體，和被安裝在上述本體之被開放之 -6- 201011855 側面，持有與上述本體之開口形狀一致之開口的間隔物， 和裝卸自如地被安裝在上述間隔物之側板。 本發明之第3態樣所涉及之處理裝置係對被處理體施 予處理的處理室，使用上述第1或第2態樣所涉及之腔室。 [發明效果] 若藉由本發明時，則可以提供即使超過運送尺寸之界 〇 限亦可以運送之腔室，及使用該腔室之處理裝置。 【實施方式】 以下參照圖面說明本發明之實施型態。在整個參照圖 面全部，針對相同部份賦予相同參照符號。 (第1實施型態） 第1圖A爲表示使本發明之第1實施型態所涉及之腔室 Ο 適應於處理腔室之一例的斜視圖，第1圖B爲第1圖A所示之 處理腔室之分解斜視圖。 如第1圖A及第1圖B所示般，處理腔室la具備開放至少 一個之側面的長方體狀之本體2，和裝卸自如地被安裝在 該本體2之被開放之側面的側板3a、3b。 本體2爲例如鋁製。在本例中，4個側面2a至2d中，側 面2a成爲用於搬入搬出被處理體在本例中爲FPD用基板之 搬入搬出口（閘閥開口）4之第1側壁5。並且，在本例中 ，開放鄰接於側面2a之兩個側面2b、2c，相對於側面2a之 201011855 一個側面2d成爲第2側壁6。本體2之上部成爲安裝有電極 等之開口 7的天板8，下部成爲形成有將配線等插通於載置 台等之開口或排氣口（在第1圖A及第1圖B中無圖式）的底 板10。即是，處理腔室la係由藉由第1側壁5、第2側壁6、 天板8及底板10所構成之角筒形狀之本體2、和阻塞該角筒 之被開放的兩端部的側板3a、3b而構成。 側板3a、3b在本例中，經密封構件11例如Ο型環等， 使用能夠裝卸之固定構件12，例如螺栓等裝卸自如地安裝 @ 在側面2b、2c。 本體2之寬度w、高度h、深度I，在本例中，雖然各被 限於運送尺寸之界限以內，但是在本體2安裝側板3之狀態 下，沿著側板安裝方向之寬度wl，超過運送尺寸之界限。 如此之大小之處理腔室la如以往般，於藉由溶接接合 鋁製之板材，執行機械加工製作成箱型形狀之時，則不可 以運送。 但是，第1實施型態所涉及之處理腔室la被分割成本 ❹ 體2和側板3a、3b。本體2之各邊長度限定在運送尺寸之界 限以內，並將本體2及側板3a、3b運送至生產工場例如FPD 生產工場，在生產工場中，將側板3a、3b安裝於本體2。 依此，即使爲不可能運送之大小的處理腔室la，亦可設置 在生產工場。 如此一來，若藉由第一實施形態，則可以提供即使超 過運送尺寸之界限亦可以運送之處理腔室。 第2圖A爲槪略性表示第1圖A所示之處理腔室的剖面 -8- 201011855 圖。並且，第2圖A所示之剖面相當於沿著第1圖A之2A-2A 線的剖面。 第2圖A所示之處理腔室la係以電容耦合型平行平板電 漿蝕刻處理腔室而被構成。在此’就以FPD而言例示有液 晶顯示器（LCD)、電激發光（Electro Luminescence : EL )顯示器，電漿顯不面板（PDP)等。 在處理腔室la之底板10上，設置有被處理體，例如用 φ 以載置FPD用基板G之載置台21。載置台21係經絕緣構件 22被支撐在處理腔室la之底板10。載置台21經被形成在底 板10之開口 9連接有用以供給高頻電力之供電線23，在該 供電線23連接有整合器24及高頻電源25。自高頻電源25供 給例如13.56MHz之高論電力至載置台21。依此，載置台21 係當作下部電極而發揮功能。 在載置台21之天板8之開口 7上，安裝有上部電極基座 26,在該上部電極基座26支撐著當作上部電極而發揮功能 © 之噴淋頭27。在噴淋頭27經氣體供給管28a連接有氣體供 給源29。在噴淋頭27之與載置台21之對向之面形成有吐出 處理氣體之無圖式的多數吐出孔。電漿處理，例如電槳蝕 刻用之處理氣體係自處理氣體供給源29經無圖式之吐出孔 而被供給至處理腔室la之內部。噴淋頭27係與當作下部電 極而發揮功能之載置台21—起構成一對平行平板電極。再 者，開口 7之尺寸也大於載置台21之尺寸。載置台21例如 可以藉由開口 7而被放入處理腔室la之內部。 側板3a、3b係裝卸自如地被安裝在本體2之側面2b、 201011855 2c。在本例中，側板3a、3b經鉸鏈30開關自如地被安裝在 本體2。 在處理腔室la中，例如被處理體爲具有矩形之平面形 狀的FPD用基板G。再者，矩形之FPD用基板G爲大約 3 000m方形或超過此之大型基板。如此大型之FPD用基板G 之最短邊之長度大約3000mm例如2800mm以上。處理如此 大型之FPD用基板G之處理腔室la之例如側板3a、3b之安 裝方向之寬度wl已經超過運送尺寸之界限。 參 但是，在本例中，腔室la之側板3a、3b裝卸自如地連 接於被限定在運送尺寸之界限以內之本體2。因此，可以 在分割本體2和側板3a、3b之狀態，從製造處理腔室la之 製造工場運送至生產FPD之生產工場。被輸送之本體2和側 板3a、3b係藉由在生產工場內安裝，即使持有超過運送尺 寸之界限之腔室la的處理腔室la，亦可以設置在生產工場 〇 並且，在本例中，本體2和側板3a、3b裝卸自如地連 〇 接。在本例中，尤其經鉸鏈3 0開關自如地被安裝。 若藉由如此之處理腔室la時，例如第2圖B所示般，側 板3a、3b之全體開關，可以使腔室la之內部全體性露出於 外界。若藉由側板3a、3b全體性開關之腔室la時，例如比 起原本僅經由在腔室la部分性打開之開口 7、9而執行腔室 la之內部之維修的裝置，可以取得容易執行腔室la之內部 之維修的優點。 -10- 201011855 (第2實施型態） 第3圖A爲表示使本發明之第2實施型態所涉及之腔室 適應於處理腔室之一例的斜視圖，第3圖B爲第3圖A所示之 腔室之分解斜視圖。 如第3圖A及第3圖B所示般，第2實施型態所涉及之腔 室lb與第1實施型態所涉及之腔室ia不同的係在本體2之被 開放的側面2b、2c，和在側板3a、3b之間，又具備間隔物 .31a、31b。其他與腔室la幾乎相同。 間隔物31a、31b被安裝於本體2之被開放之側面2b、 2c，在本例中，持有與本體2之側面2b、2c之開口形狀一 致之開口 32。 第4圖A爲表示使用第3圖A所示之腔室之基板處理裝 置之一例。並且，第4圖A所示之剖面相當於沿著第3圖A 之4A-4A線的剖面。 第4圖A所示之處理腔室lb係與第2圖A所示之處理腔 ® 室la相同’以電容耦合型平行平板電漿蝕刻處理腔室而被 構成。 處理腔室lb與處理腔室la不同的係在腔室ib之本體2 的被開放之側面2 b、2 c，和側板3 a、3 b之間又具備間隔物 31a、31b’和FPD用基板G之尺寸大於處理腔室ia。其他 與腔室la幾乎相同。 第5圖A至第5圖C爲藉由本發明之實施型態所涉及之處 理腔室1 a及1 b所產生之優點之一例的水平剖面圖。 第5圖A爲持有藉由溶接接合板材，且執行機械加工以 -11 - 201011855 一體型製作成箱型形狀之處理腔室lc的比較例。於FPD用 基板G0之尺寸小時，即使處理腔室lc爲一體型，處理腔室 lc之大小也限定在運送尺寸之界限以內。 第5圖B爲持有第1實施型態所涉及之處理腔室la之實 施例。當FPD用基板G1之尺寸變大，以一體型製作處理腔 室la時，則在超過運送尺寸之界限之時，如第5圖B所示般 ，分割本體2和側板3a、3b，將本體2限定在運送尺寸之界 限以內。依此，雖然如上述般，即使爲超過運送尺寸之界 ❹ 限的處理腔室la，亦可以運送。 第5圖C爲持有第2實施型態所涉及之處理腔室lb之實 施例。FPD用基板G2之尺寸變得更大之時，使間隔物31a 、3 lb介於側面2b、2c，和側板3a、3b之間，延伸本體2和 側板3a、3b之間的距離。依此，即使尺寸大之FPD用基板 G2，亦可以執行處理，並且可以取得亦能夠運送之處理腔 室lb。 再者，FPD用基板G之大小，即使爲同一規格，每FPD ❺ 製造廠商也有微小的尺寸差。在如此之情形下，若藉由第 2實施型態所涉及之處理腔室lb時，藉由利用間隔物31a、 31b，可以微調整處理腔室lb之大小。藉由微調整處理腔 室lb之大小，例如也可以取得即使尺寸差異不同之FPD基 板G亦可以使自玻璃基板G之邊緣到側板3a、3b爲止之距離 成爲一定，對於具有尺寸差異之FPD基板G亦能夠執行均 勻處理之處理腔室lb的優點。 並且，腔室la、lb例如如第2圖B、第4圖B所示般’開 -12- 201011855 關側板3a、3b之全體。 若藉由如此之腔室la、lb時，例如第6圖A及第6圖B所 不般，具有側板3和底板1〇成爲—體之本體2，比起天板8& 當作上蓋開關之腔室lc，取得容易存取至下部電極21，並 且容易進行維修之優點。 (第3實施型態） ❹ 第7圖爲表示使本發明之第3實施型態所涉及之腔室適 應於處理腔室之一例的分解斜視圖，第8圖爲表示本發明 第3實施型態所涉及之腔室之其他例的分解斜視圖。 如第7圖及第8圖所示般，第3實施型態所涉及之處理 腔室Id、le爲將天板8又設爲分割型。天板8在本例中成爲 箱型形狀’經密封構件1 1，例如0型環等，裝卸自如地當 作上蓋被安裝在在本體2之上面。第7圖所示之處理腔室id 係對第1實施型態所涉及之處理腔室la，又將天板8設爲分 Θ 割型，第8圖所示之處理腔室le係對第2實施型態所涉及之 處理腔室lb，又將天板8設爲分割型。 如此一來，不僅將側板3a、3b設爲分割型，即使又將 天板8分割，作爲上蓋裝卸自如地安裝在本體2亦可。 若藉由第3實施型態時，比起第1、第2實施型態，可 以取得即使於處理腔室之高度方向之大小超過運送尺寸之 界限之時亦可以對應之優點。 再者，藉由天板8爲裝卸自如，比起僅有側板3a、3b 裝卸自如之第1、第2實施型態，具有更容易執行維修之優 -13- 201011855 點。 並且，雖無特別圖式，但是不僅天板8，即使將第1圖 B或第3圖B所示之底板10又予以分割亦可，分割即使在天 板8及底板10皆僅針對平板部分亦可。 (第4實施型態） 第9圖A爲表示使本發明之第4實施型態所涉及之腔室 適應於處理腔室之一例的水平剖面圖，第9圖B爲表示第9 φ 圖A所示之9B-9B線所示之剖面圖，第9圖C爲第9圖A所示 之9C-9C線所示之剖面圖。 如第9圖A至第9圖C所示般，第4實施型態所涉及之處 理腔室If係將肋部33安裝在側板3a、3b，使側板3a、3b之 壁厚tl比第1至第3實施型態更薄。肋部33可以當作側板3a 、3b之補強材而發揮功能。因此，在本例中，例如可以使 側板3a、3b之壁厚tl比本體2之側壁5、6之壁厚t2、t3薄。 若藉由第4實施型態所涉及之處理腔室If，因可以薄 @ 化側板3a、3b之壁厚tl，故可以取得如減輕處理腔室If所 需之材料，例如鋁之使用量，並且可以下降處理腔室If所 涉及之成本之優點。 當然，即使壁厚tl爲薄之側板3a、3b，亦可以裝卸自 如，在本例中係經鉸鏈30而開關自如地安裝在本體2。因 此，也可以與第1至第3實施型態一樣取得良好之維修性。 第10圖A爲表示使本發明之第4實施型態所涉及之處理 腔室之其他例的水平剖面圖，第1〇圖B爲表示第1〇圖A所示 •14- 201011855 之10B-1 OB線所示之剖面圖，第10圖C爲第l〇圖A所示之 10C-10C線所示之剖面圖。 如第10圖A至第10圖C所示般，安裝有肋部33之側板3a 、3b亦可以適用於具有間隔物31a、31b之處理腔室lg。此 時，可以降低因處理腔室lg所涉及之成本。並且，具有肋 部33之側板3a、3b例如因亦可以經鉸鏈30開關自如地安裝 在間隔物3 1 a、3 1 b，故可以維持良好之維修性。 ❹ .以上，雖然藉由幾個實施型態說明本發明，但是本發 明並不限定於上述實施型態，可作各種變形。 例如，在上述實施形態中，雖然針對FPD用基板之處 理腔室表示本發明，但是即使適用於搬運腔室或裝載鎖定 腔室等之各種腔室亦可，還有亦可適用於對其他各種基板 執行處理之處理裝置的腔室。 再者，在上述實施型態中，雖然將側板3a、3b設爲一 片板狀構件，但是即使例如第11圖A及第11圖B所示般，設 Ο 爲在側板3a、3b朝向腔室lh之內部持有凹陷34之箱形構件 亦可。 再者，在上述實施型態中，雖然使側板3a、3b朝向底 板1〇側開關，但是即使如第12圖所示般，朝向天板8側開 關亦可。於使側板3a、3b朝向天板8側開關之時，則有例 如在維修等打開側板3a、3b之時，操作者容易接近腔室li 之優點。 再者，在上述實施型態中，雖然經鉸鏈30開關自如地 將側板3a、3b安裝在本體2之側面2b、2c，但是即使如第 -15- 201011855 13圖所示般，將側板3a、3b之全體以可以自本體2之側面 2b、2c拆下之狀態，安裝在側面2b、2c亦可。即使在如此 之腔室lj，因拆下側板3a、3b，故有於維修之時，操作者 容易接近腔室U之優點。 再者，在上述實施型態中，雖然將側板3a、3b裝卸自 如地分別安裝在兩個側面，但是即使側板裝卸自如地安裝 在至少一個側面即可。[Technical Field] The present invention relates to a processing chamber (processing chamber) or the like that performs processing on a large-sized object to be processed such as a substrate for a flat panel display (hereinafter referred to as a substrate for FPD). Room and treatment unit. [Prior Art] e For the device used in the FPD production plant, there is known a treatment device for applying various treatments to the substrate for FPD in a vacuum or a reduced pressure environment, for example, using a plasma pair to be processed. A plasma processing apparatus that applies a treatment such as etching to a substrate for FPD, and a plasma processing apparatus, as described in Patent Document 1, includes a processing chamber (processing chamber) for applying plasma treatment to a target object. There are various chambers such as a transfer chamber (transport chamber) for transporting a transport mechanism of the object to be processed, and a lock chamber (load lock chamber). In the processing chamber, there are disposed upper electrodes facing each other and a lower electrode serving as a mounting table on which the object to be processed is placed. A high frequency is applied between the upper electrode and the lower electrode to cause plasma in the processing space between the upper electrode and the lower electrode. However, the substrate to be processed, in particular, the substrate for FPD is gradually becoming larger, and a substrate having a square size of 2000 mm to 2400 mm is now used in actual FPD manufacturing. The size of the substrate for FPD is also increasing in size in the future, and eventually becomes approximately 3000 mm square or more. Since the size of the FPD substrate can be increased by the number of FPD panels obtained from one substrate, there is an advantage in that cost reduction can be achieved. In the case of the case where the chamber is provided, the shape or size of the chamber can be easily changed according to the user's request. [Patent Document 1] JP-A-2007-67218 [Problem to be Solved by the Invention] _ The size of the substrate for FPD is increased by the processing chamber of the processing chamber for performing processing on the FPD substrate. With the increase in size, the entire processing device is also large. In general, a processing device for a substrate for an FPD divides the processing device into each chamber and transports it from the processing device manufacturing plant to the FPD production plant. However, since the chamber itself eventually exceeds the shipping size limit as the chamber itself becomes larger, it is difficult to transport the processing device from its manufacturing facility to the FPD production plant. It is an object of the present invention to provide a chamber that can be transported even beyond the limit of the transport size, and a processing device that uses the chamber. In order to solve the above problems, the chamber according to the first aspect of the present invention includes a rectangular parallelepiped body that opens at least one side surface, and is detachably attached to the main body. Side panels on the sides. A chamber according to a second aspect of the present invention includes a body having a rectangular parallelepiped opening at least one side surface, and is attached to a side surface of the main body that is opened -6-201011855, and has a shape conforming to an opening of the main body. The open spacers are detachably attached to the side plates of the spacers. In the processing apparatus according to the third aspect of the present invention, the processing chamber to be processed by the object to be processed is used in the chamber according to the first or second aspect. [Effect of the Invention] According to the present invention, it is possible to provide a chamber which can be transported even if it exceeds the limit of the transport size, and a processing apparatus using the chamber. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The same reference numerals are given to the same parts throughout the drawings. (First embodiment) FIG. 1A is a perspective view showing an example in which a chamber Ο according to a first embodiment of the present invention is applied to a processing chamber, and FIG. 1B is a first FIG. An exploded perspective view of the processing chamber. As shown in FIG. 1A and FIG. 1B, the processing chamber 1a has a rectangular parallelepiped body 2 that opens at least one side surface, and a side plate 3a that is detachably attached to the opened side of the body 2, 3b. The body 2 is made of, for example, aluminum. In the present embodiment, the side surface 2a is the first side wall 5 for loading and unloading the object to be processed (in this example, the loading/unloading port (gate valve opening) 4 of the FPD substrate in the fourth side surface 2a to 2d. Further, in this example, the two side faces 2b and 2c adjacent to the side surface 2a are opened, and the one side surface 2d of the side surface 2a is the second side wall 6 with respect to the side surface 2d. The upper portion of the main body 2 is a ceiling 8 to which an opening 7 such as an electrode is attached, and the lower portion is formed with an opening or an exhaust port through which a wiring or the like is inserted into a mounting table or the like (there is no picture in FIG. 1A and FIG. 1B). The bottom plate 10 of the formula). That is, the processing chamber la is a body 2 having a rectangular tube shape formed by the first side wall 5, the second side wall 6, the sky plate 8, and the bottom plate 10, and the open end portions of the corner tube are blocked. The side plates 3a and 3b are formed. In this example, the side plates 3a and 3b are detachably mounted on the side faces 2b and 2c by a detachable fixing member 12 such as a bolt or the like via a sealing member 11, for example, a Ο-shaped ring or the like. In the present example, the width w, the height h, and the depth I of the main body 2 are limited to the limit of the transport size. However, in the state in which the side panel 3 is attached to the main body 2, the width w1 along the mounting direction of the side panel exceeds the transport size. The limit. As in the prior art, the processing chamber la of such a size is not transportable when the aluminum plate is joined by fusion bonding and mechanically processed into a box shape. However, the processing chamber 1a according to the first embodiment is divided into the body 2 and the side plates 3a and 3b. The length of each side of the body 2 is limited to the limit of the transport size, and the body 2 and the side plates 3a, 3b are transported to a production plant such as an FPD production plant where the side plates 3a, 3b are mounted to the body 2. Accordingly, even a processing chamber la of a size that is impossible to transport can be installed in a production plant. As a result, according to the first embodiment, it is possible to provide a processing chamber that can be transported even beyond the limit of the transport size. Fig. 2A is a schematic view showing a section -8 - 201011855 of the processing chamber shown in Fig. 1A. Further, the cross section shown in Fig. 2 corresponds to a cross section taken along line 2A-2A of Fig. 1A. The processing chamber la shown in Fig. 2A is constructed by a capacitive coupling type parallel plate plasma etching processing chamber. Here, a liquid crystal display (LCD), an electroluminescence (EL) display, a plasma display panel (PDP), or the like is exemplified as the FPD. The substrate 10 of the processing chamber 1a is provided with a target object, for example, a mounting table 21 on which the FPD substrate G is placed by φ. The mounting table 21 is supported by the bottom plate 10 of the processing chamber la via the insulating member 22. The mounting table 21 is connected to an opening 9 for forming a high-frequency power via an opening 9 formed in the bottom plate 10, and an integrator 24 and a high-frequency power source 25 are connected to the power supply line 23. The high-frequency power source 25 supplies a high power of, for example, 13.56 MHz to the stage 21. Accordingly, the mounting table 21 functions as a lower electrode. The upper electrode base 26 is attached to the opening 7 of the top plate 8 of the mounting table 21, and the upper electrode base 26 supports a shower head 27 that functions as an upper electrode. A gas supply source 29 is connected to the shower head 27 via a gas supply pipe 28a. On the surface of the shower head 27 opposite to the mounting table 21, a plurality of discharge holes of a non-patterned discharge gas are formed. The plasma treatment, for example, the process gas system for electric paddle is supplied from the process gas supply source 29 to the inside of the process chamber la via the unillustrated discharge port. The shower head 27 constitutes a pair of parallel plate electrodes together with the mounting table 21 functioning as a lower electrode. Further, the size of the opening 7 is also larger than the size of the mounting table 21. The mounting table 21 can be placed inside the processing chamber la, for example, by the opening 7. The side plates 3a and 3b are detachably attached to the side faces 2b and 201011855 2c of the main body 2. In this example, the side plates 3a, 3b are detachably mounted to the body 2 via a hinge 30. In the processing chamber 1a, for example, the object to be processed is a substrate G for FPD having a rectangular planar shape. Further, the rectangular FPD substrate G is a large substrate of about 3 000 m square or more. The length of the shortest side of the substrate G of such a large FPD is about 3000 mm, for example, 2800 mm or more. The width w1 of the mounting direction of the processing chambers la, such as the side plates 3a, 3b, for processing the large-sized FPD substrate G has exceeded the limit of the transport size. In this example, the side plates 3a, 3b of the chamber la are detachably connected to the body 2 which is limited to the limit of the transport size. Therefore, it is possible to transport from the manufacturing plant manufacturing the processing chamber la to the production plant where the FPD is produced in the state of dividing the body 2 and the side plates 3a, 3b. The conveyed body 2 and the side plates 3a, 3b are installed in the production plant, and even if the processing chamber la of the chamber la which exceeds the limit of the transport size is held, it can be placed in the production plant and, in this example, The body 2 and the side plates 3a, 3b are detachably connected to each other. In this case, it is mounted freely, in particular via a hinge 30 switch. When the chamber la is processed as described above, for example, as shown in Fig. 2B, the entire switches of the side plates 3a and 3b can expose the entire interior of the chamber la to the outside. When the chambers la of the whole switch are provided by the side plates 3a, 3b, for example, it is easier to perform the device for performing maintenance of the inside of the chamber la only via the openings 7, 9 which are partially opened in the chamber la. The advantages of the maintenance of the interior of the chamber la. -10-201011855 (Second Embodiment) Fig. 3A is a perspective view showing an example in which a chamber according to a second embodiment of the present invention is adapted to a processing chamber, and Fig. 3B is a third view. An exploded perspective view of the chamber shown in A. As shown in FIG. 3A and FIG. 3B, the chamber lb according to the second embodiment is different from the chamber ia according to the first embodiment in the open side 2b of the body 2, 2c, and between the side plates 3a, 3b, further provided with spacers 31a, 31b. The other is almost the same as the chamber la. The spacers 31a, 31b are attached to the opened side faces 2b, 2c of the body 2, and in this example, have openings 32 that conform to the shape of the openings of the side faces 2b, 2c of the body 2. Fig. 4A is a view showing an example of a substrate processing apparatus using the chamber shown in Fig. 3A. Further, the cross section shown in Fig. 4A corresponds to a cross section taken along line 4A-4A of Fig. 3A. The processing chamber lb shown in Fig. 4A is identical to the processing chamber ® chamber 1a shown in Fig. 2, and is constructed by a capacitive coupling type parallel plate plasma etching processing chamber. The processing chamber lb is different from the processing chamber la by the spacers 31a, 31b' and the FPD between the open sides 2b, 2c of the body 2 of the chamber ib and the side plates 3a, 3b. The size of the substrate G is larger than the processing chamber ia. The other is almost the same as the chamber la. Fig. 5 to Fig. 5C are horizontal cross-sectional views showing an example of the advantages produced by the chambers 1a and 1b by the embodiment of the present invention. Fig. 5A is a comparative example of a processing chamber lc having a box shape formed by integrally bonding a -11 - 201011855 integrally formed by bonding a plate material by fusion bonding. When the size of the FPD substrate G0 is small, even if the processing chamber lc is of an integral type, the size of the processing chamber lc is limited to the limit of the transport size. Fig. 5B is an embodiment in which the processing chamber 1a according to the first embodiment is held. When the size of the FPD substrate G1 is increased to form the processing chamber la in an integrated manner, when the boundary of the transport size is exceeded, the body 2 and the side plates 3a and 3b are divided as shown in FIG. 2 is limited to the limit of the shipping size. Accordingly, as described above, even the processing chamber la which is beyond the limit of the transport size can be transported. Fig. 5C is a view showing an embodiment in which the processing chamber lb according to the second embodiment is held. When the size of the FPD substrate G2 becomes larger, the spacers 31a, 3b are interposed between the side faces 2b, 2c and the side plates 3a, 3b, and the distance between the body 2 and the side plates 3a, 3b is extended. According to this, even if the substrate F2 for FPD having a large size can be processed, the processing chamber lb which can be transported can be obtained. Further, the size of the substrate G for the FPD has a small size difference per FPD 即使 manufacturer even if it is of the same specification. In such a case, when the processing chamber lb according to the second embodiment is used, the size of the processing chamber lb can be finely adjusted by using the spacers 31a and 31b. By slightly adjusting the size of the processing chamber lb, for example, even if the FPD substrate G having different dimensional differences can be obtained, the distance from the edge of the glass substrate G to the side plates 3a and 3b can be made constant, and the FPD substrate having the difference in size can be obtained. G is also capable of performing the processing chamber lb of uniform processing. Further, the chambers 1a, 1b are, for example, as shown in Fig. 2B and Fig. 4B, the entire side plates 3a and 3b are opened -12-201011855. If such a chamber la, lb, for example, FIG. 6A and FIG. 6B, the side plate 3 and the bottom plate 1 are formed into a body 2, which is used as an upper cover switch than the top plate 8& The chamber lc has an advantage of being easily accessible to the lower electrode 21 and being easy to perform maintenance. (Embodiment 3) FIG. 7 is an exploded perspective view showing an example in which a chamber according to a third embodiment of the present invention is applied to a processing chamber, and FIG. 8 is a view showing a third embodiment of the present invention. An exploded perspective view of another example of a chamber involved in the state. As shown in Figs. 7 and 8, the processing chambers Id and le according to the third embodiment are configured to divide the top plate 8 into a split type. In this example, the top plate 8 is in the shape of a box, and the sealing member 1 1, for example, a 0-ring or the like, is detachably attached to the upper surface of the main body 2 as an upper cover. The processing chamber id shown in Fig. 7 is for the processing chamber 1a according to the first embodiment, and the sky plate 8 is also divided into a splitting type, and the processing chamber shown in Fig. 8 is the first pair. 2 The processing chamber lb involved in the embodiment is further divided into the split type. In this way, not only the side plates 3a and 3b are divided into a split type, but the base plate 8 can be detachably attached to the main body 2 as an upper cover. According to the third embodiment, compared with the first and second embodiments, it is possible to obtain an advantage even when the size of the processing chamber in the height direction exceeds the limit of the transport size. Furthermore, the top plate 8 is detachable, and the first and second embodiments are more detachable than the side plates 3a and 3b, and it is easier to perform maintenance -13-201011855 points. Further, although there is no special pattern, not only the slab 8, but also the bottom plate 10 shown in FIG. 1B or FIG. 3B may be divided, and even the slab 8 and the bottom plate 10 are only for the flat plate portion. Also. (Fourth Embodiment) FIG. 9 is a horizontal cross-sectional view showing an example in which a chamber according to a fourth embodiment of the present invention is adapted to a processing chamber, and FIG. 9B shows a ninth φ diagram A. The cross-sectional view shown by the line 9B-9B is shown in Fig. 9, and the cross-sectional view shown by the 9C-9C line shown in Fig. 9A is shown. As shown in FIG. 9 to FIG. 9C, the processing chamber If according to the fourth embodiment is such that the ribs 33 are attached to the side plates 3a and 3b, and the wall thicknesses of the side plates 3a and 3b are set to be 1st. It is thinner than the third embodiment. The ribs 33 can function as reinforcing materials for the side plates 3a and 3b. Therefore, in this example, for example, the wall thickness t1 of the side plates 3a, 3b can be made thinner than the wall thicknesses t2, t3 of the side walls 5, 6 of the main body 2. According to the processing chamber If according to the fourth embodiment, since the wall thickness t1 of the side plates 3a and 3b can be thinned, it is possible to obtain materials such as aluminum used for reducing the processing chamber If, for example, aluminum. And the advantage of the cost involved in the processing chamber If can be reduced. Of course, even if the wall thickness t1 is a thin side plate 3a, 3b, it can be detachably attached, and in this example, the main body 2 can be detachably attached via the hinge 30. Therefore, it is also possible to obtain good maintainability as in the first to third embodiments. Fig. 10A is a horizontal cross-sectional view showing another example of the processing chamber according to the fourth embodiment of the present invention, and Fig. 1B is a view showing 10B of the first diagram A shown in Fig. 14-201011855. 1 is a cross-sectional view shown by the OB line, and FIG. 10C is a cross-sectional view taken along line 10C-10C shown in FIG. As shown in Figs. 10A to 10C, the side plates 3a, 3b to which the ribs 33 are attached can also be applied to the processing chambers lg having the spacers 31a, 31b. At this time, the cost involved in the processing chamber lg can be reduced. Further, the side plates 3a and 3b having the ribs 33 can be attached to the spacers 3 1 a and 3 1 b via the hinge 30, for example, so that good maintainability can be maintained. The present invention has been described above by several embodiments, but the present invention is not limited to the above-described embodiments, and various modifications can be made. For example, in the above-described embodiment, the present invention is shown in the processing chamber of the FPD substrate. However, the present invention is also applicable to various other types of chambers such as a transfer chamber or a load lock chamber. The substrate performs a processing chamber of the processing device. Further, in the above embodiment, the side plates 3a and 3b are formed as a single plate-shaped member. However, as shown in, for example, FIGS. 11A and 11B, it is assumed that the side plates 3a and 3b face the chamber. The box-shaped member that holds the recess 34 inside may also be used. Further, in the above-described embodiment, the side plates 3a and 3b are opened and closed toward the bottom side of the bottom plate 1. However, as shown in Fig. 12, the side plate 8 may be opened or closed. When the side plates 3a, 3b are turned to the side of the top plate 8, there is an advantage that the operator can easily access the chamber li when the side plates 3a, 3b are opened, for example, during maintenance or the like. Further, in the above-described embodiment, although the side plates 3a, 3b are detachably attached to the side faces 2b, 2c of the body 2 via the hinge 30, the side plates 3a, as shown in Fig. -15-201011855, The whole of 3b may be attached to the side faces 2b and 2c in a state where it can be removed from the side faces 2b and 2c of the main body 2. Even in such a chamber lj, since the side plates 3a, 3b are removed, there is an advantage that the operator can easily access the chamber U at the time of maintenance. Further, in the above-described embodiment, the side plates 3a and 3b are detachably attached to the two side faces, respectively, but the side plates may be detachably attached to at least one side surface.
再者，在上述實施型態中，雖然舉例對兩個側面設爲 A 分割構造之例，但是即使爲對所有之面設爲分割構造亦可 〇 並且’上述實施型態，及第11圖至第13圖所示之變形 例，亦可任意組合而加以實施。 【圖式簡單說明】 第1圖A爲表示使該發明之第1實施型態所涉及之腔室 之一例的斜視圖，第1圖B爲第1圖A所示之腔室之分解斜視 φ 圖。 第2圖A爲槪略性表示使用第1圖a所示之腔室的處理 腔室之剖面圖’第2圖B爲表示打開側板之狀態的剖面圖。 第3圖A爲表示使該發明之第2實施型態所涉及之腔室 之一例的斜視圖，第3圖B爲第3圖A所示之腔室之分解斜視 圖。 第4圖A爲槪略性表示使用第3圖a所示之腔室的處理 腔室之剖面圖’第4圖B爲表示打開側板之狀態的剖面圖。 -16- 201011855 第5圖A至第5圖C爲表示該發明之實施型態所涉及之腔 室所產生之優點之一例的水平剖面圖。 第6圖A爲表示比較例所涉及之處理腔室之剖面圖，第 6圖B爲表示打開上蓋之狀態的剖面圖。 第7圖爲表示該發明之第3實施型態所涉及之腔室之一 例的分解斜視圖。 第8圖爲表示該發明之第3實施型態所涉及之腔室之其 φ 他例的分解斜視圖。 第9圖A爲表示該發明之第4實施型態所涉及之處理腔 室之一例的水平剖面圖，第9圖B爲表示第9圖A所示之9B-9B線所示之剖面圖，第9圖C爲第9圖A所示之9C-9C線所示 之剖面圖。 第10圖A爲表示該發明之第4實施型態所涉及之處理腔 室之其他例的水平剖面圖，第10圖B爲表示第10圖A所示之 10B-10B線所示之剖面圖，第10圖C爲第10圖A所示之10C-Φ 10C線所示之剖面圖。 第11圖A爲槪略性表示該發明之實施型態之第1變形例 所涉及之處理腔室之剖面圖，第11圖B爲表示打開側板之 狀態的剖面圖。 第12圖爲槪略性表示該發明之實施型態之第2變形例 所涉及之處理腔室之剖面圖。 第13圖爲槪略性表示該發明之實施型態之第3變形例 所涉及之處理腔室之剖面圖。 -17- 201011855 【主要元件符號說明】 la至lg :腔室 2 :本體 2a至2d :側面 3 a、3 b :側板 1 2 :固定構件 3 0 :錢鍵Further, in the above-described embodiment, an example in which the two side faces are formed as an A-divided structure is used. However, even if all the faces are divided into a divided structure, the above-described embodiment and FIG. 11 to The modifications shown in Fig. 13 can also be implemented in any combination. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a perspective view showing an example of a chamber according to a first embodiment of the present invention, and Fig. 1B is an exploded perspective φ of a chamber shown in Fig. 1A. Figure. Fig. 2A is a cross-sectional view schematically showing a processing chamber in which the chamber shown in Fig. 1a is used. Fig. 2B is a cross-sectional view showing a state in which the side plates are opened. Fig. 3 is a perspective view showing an example of a chamber according to a second embodiment of the invention, and Fig. 3B is an exploded perspective view of the chamber shown in Fig. 3A. Fig. 4A is a cross-sectional view schematically showing a processing chamber using the chamber shown in Fig. 3'. Fig. 4B is a cross-sectional view showing a state in which the side plates are opened. -16- 201011855 Fig. 5 to Fig. 5C are horizontal cross-sectional views showing an example of the advantages of the chamber according to the embodiment of the present invention. Fig. 6A is a cross-sectional view showing a processing chamber according to a comparative example, and Fig. 6B is a cross-sectional view showing a state in which an upper lid is opened. Fig. 7 is an exploded perspective view showing an example of a chamber according to a third embodiment of the invention. Fig. 8 is an exploded perspective view showing the φ of the chamber according to the third embodiment of the present invention. FIG. 9 is a horizontal cross-sectional view showing an example of a processing chamber according to a fourth embodiment of the present invention, and FIG. 9B is a cross-sectional view showing a line 9B-9B shown in FIG. Fig. 9C is a cross-sectional view taken along line 9C-9C shown in Fig. 9A. Fig. 10A is a horizontal cross-sectional view showing another example of the processing chamber according to the fourth embodiment of the present invention, and Fig. 10B is a cross-sectional view showing the line 10B-10B shown in Fig. 10A. Fig. 10C is a cross-sectional view taken along line 10C-Φ 10C shown in Fig. 10A. Fig. 11 is a cross-sectional view schematically showing a processing chamber according to a first modification of the embodiment of the invention, and Fig. 11B is a cross-sectional view showing a state in which the side plates are opened. Fig. 12 is a cross-sectional view schematically showing a processing chamber according to a second modification of the embodiment of the invention. Figure 13 is a cross-sectional view schematically showing a processing chamber according to a third modification of the embodiment of the invention. -17- 201011855 [Description of main component symbols] la to lg: chamber 2: body 2a to 2d: side 3 a, 3 b: side plate 1 2 : fixing member 3 0 : money key
3 1 :間隔物 32 :開口 33 :肋部 34 :凹陷 G : FPD用基板（被處理體） w :寬度 h :高度 I :深度3 1 : spacer 32 : opening 33 : rib 34 : recess G : substrate for FPD (object to be processed) w : width h : height I : depth
-18--18-